CN214256748U - Overcurrent structure, capacitor module and converter device - Google Patents

Abstract

The utility model discloses an overcurrent structure, a capacitor module and a converter, wherein the overcurrent structure comprises a substrate and a current-carrying piece; the substrate defines a plurality of first overcurrent paths and a third overcurrent path; the current-carrying piece has a rigid structure and is fixedly connected with the substrate; the current-carrying piece defines a second overcurrent path which is electrically connected with the substrate and enables each first overcurrent path to be communicated with the third overcurrent path through the second overcurrent path. The utility model discloses a flow structure can improve the ability of overflowing of board year structure and be suitable for to maintain higher on-board device density with lower cost, and it still has better technology aesthetic property to be suitable for further making parallel device flow equalize.

Description

Overcurrent structure, capacitor module and converter device

Technical Field

The utility model relates to a printed circuit board and conversion technical field especially relate to an overflow structure, electric capacity module and conversion equipment.

Background

In a converter device such as a UPS and a photovoltaic inverter, which relates to dc conversion, a capacitor bus is usually disposed between a front module (such as a rectifier module and a boost module) and a rear module (such as an inverter module) and used as a dc bus to connect dc sides of the front module and the rear module to achieve energy flow, and the capacitor bus is actually an on-board capacitor structure.

Along with the increasing power requirement of the converter device, the current required to pass through the capacitor busbar is also increased, and correspondingly, the wiring on the board needs to have a larger overcurrent section. If the overcurrent cross section is increased by increasing the width of the routing, a larger device arrangement space is occupied, and the power expansion capability is influenced; if the number of board layers is increased to increase the overcurrent cross section, the cost of the PCB board is greatly increased, and it is difficult to balance the two problems of the density of devices on the board and the wiring cost.

In addition, power expansion of the direct-current bus is usually realized by connecting more capacitors in parallel in the industry, but the problem of uneven current of the capacitors connected in parallel is difficult to solve due to the increase of the number of the capacitors, the service life of a device is shortened due to the fact that part of the capacitor current is too large, and the device is wasted due to the fact that part of the capacitor current is too small.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome at least a defect or problem that exists among the background art, provide an overflow structure, electric capacity module and deflector, overflow the structure and can improve the ability of overflowing of board year structure and be suitable for and maintain higher on-board device density with lower cost. In addition, the overcurrent structure has better process aesthetic property, and is further suitable for solving the current sharing problem of the capacitor module and the converter device.

In order to achieve the above object, the first aspect of the present invention provides a technical solution: an over-current structure, comprising: the substrate defines a plurality of first overcurrent paths and a third overcurrent path; a current-carrying member having a rigid structure and fixedly connected to the substrate; the current-carrying piece defines a second overcurrent path which is electrically connected with the substrate and enables each first overcurrent path to be communicated with the third overcurrent path through the second overcurrent path.

In the first technical solution, each first overcurrent path of the substrate is communicated to a third overcurrent path of the substrate through a second overcurrent path of the current-carrying member to form an overcurrent structure, so that the current-carrying member can be adapted to pass a large current by configuring a large overcurrent section. When the flow cross section of the current carrier is configured, the structure size (such as thickness size) parallel to the substrate plane can be set to be small, and the size (such as height size) perpendicular to the substrate plane can be set to be large, so that the current carrier has small space occupation on the substrate plane in at least one dimension, and high device density can be maintained on the substrate. It can be seen that, the above-mentioned over-current structure avoids that when higher device density needs to be maintained, the over-current cross section can only be increased by adopting a high-cost way of increasing the number of board layers to the whole substrate so as to pass large current, but the passing of large current is realized by introducing the current-carrying piece at lower wiring cost, and the over-current structure is suitable for correspondingly configuring the over-current cross section of the current-carrying piece so that the substrate can maintain higher device density, and further improves the power expansion capability of the over-current structure.

It should be noted that although the substrate of the above-mentioned overcurrent structure still has the third overcurrent path through which a large current passes, the second overcurrent path and the third overcurrent path through which a large current passes can be flexibly configured due to the current-carrying element, so that the on-board routing corresponding to the third overcurrent path is located in the edge area of the substrate where no device is required to be disposed, and thus the problem of occupying the device layout space is avoided. In other words, the overcurrent structure avoids the situation that wiring is arranged on a board which is used for passing large current and occupies the device arrangement space, so that a parallel network of devices can be intensively arranged in the area corresponding to the first overcurrent path on the substrate, and a circuit which needs to pass large current is jointly realized by the second overcurrent path in a current-carrying piece which occupies a small substrate space and the third overcurrent path which is configured to be positioned at the edge of the substrate, the space on the board is reasonably and efficiently utilized, and the power expansion capability of the overcurrent structure is greatly improved.

In addition, because the current-carrying piece is of a rigid structure, when different installers fixedly connect the current-carrying piece with the substrate, the problems of poor installation consistency and easy electromagnetic interference do not exist, and the process attractiveness is high.

Based on technical scheme one, the utility model discloses technical scheme two still has: each first overcurrent path has the same impedance.

In the second technical scheme, because the impedances of the first overcurrent paths are the same, when devices are correspondingly configured on the first overcurrent paths and parallel networks are established for the devices, the currents passing through the devices need to pass through the first overcurrent paths with the same impedances, the second overcurrent paths and the third overcurrent paths, the overall overcurrent impedances are the same, the current sharing of the devices of the parallel networks is realized, the utilization rate of the devices is high, and the service life is longer.

Based on technical scheme one or two, the utility model discloses technical scheme three still has: the substrate is provided with a first connecting terminal and a second connecting terminal; the first connecting terminals are positioned at the same end of each first overcurrent path and establish a confluence or shunting relation with each first overcurrent path; the second connecting terminal is positioned at one end of the third overcurrent path; the current-carrying piece is provided with a first connecting point and a second connecting point which are respectively positioned at two ends of the second overcurrent path; the first connecting point and the second connecting point are respectively and directly electrically connected with the first connecting terminal and the second connecting terminal so as to realize that each first overcurrent path is communicated with the third overcurrent path through the second overcurrent path.

In the third technical scheme, the substrate is provided with the first connecting terminal and the second connecting terminal, the current-carrying piece is correspondingly provided with the first connecting point and the second connecting point, and the current-carrying piece and the substrate are directly and electrically connected through the terminals and the connecting points so as to realize the communication of corresponding overcurrent paths, avoid intermediate circuits and have a simple structure.

Based on technical scheme three, the utility model discloses technical scheme four still has: the first connecting terminal establishes a confluence relation with each first overcurrent path; the substrate further defines a plurality of fourth overcurrent paths, and the first connecting terminal is further located at the same end of each fourth overcurrent path and establishes a shunting relationship with the same end so that the third overcurrent path is communicated with each fourth overcurrent path through the second overcurrent path.

According to the technical scheme, a plurality of fourth overcurrent paths are defined through the substrate, and the current relations among the first connecting terminal, the first overcurrent path and the fourth overcurrent path are respectively configured into confluence and shunting, so that the overcurrent structure of the technical scheme is expanded to be suitable for application in a three-level power topology under the condition of sharing one current-carrying piece, and the applicability of the overcurrent structure is improved.

Based on technical scheme three, the utility model discloses technical scheme five still has: the substrate is provided with a first lead terminal and a second lead terminal which are respectively used for loading different electric potentials; the first lead terminal is positioned at one end of each first overcurrent path opposite to the first connecting terminal and establishes a shunting or converging relationship with each first overcurrent path; the second lead terminal is located at an end of the third overcurrent path opposite to the second connection terminal.

In the fifth technical scheme, the substrate is provided with the first lead terminals communicated with the first overcurrent paths and the second lead terminals communicated with the third overcurrent paths so as to establish an electric connection relation with an external module, so that electric energy is introduced, the current trend of the communicated overcurrent paths can be controlled by loading different electric potentials to the two lead terminals, and the use is more flexible.

Based on technical scheme five, the utility model discloses technical scheme six still has: a plurality of wiring lines are printed on the substrate; a plurality of independent sub-overcurrent paths are defined in each wire, the sub-overcurrent paths on different wires are in one-to-one correspondence, and the sub-overcurrent paths corresponding to each other are suitable for being mutually communicated through a power device, so that the sub-overcurrent paths corresponding to each other on different wires jointly form the first overcurrent path; the first lead terminal and the first connecting terminal are respectively positioned on a wire and communicated with all sub overcurrent paths on the wire, so that each first overcurrent path is defined between the first lead terminal and the first connecting terminal.

The sixth technical scheme provides a specific forming mode of the first overcurrent paths, and each first overcurrent path is formed by corresponding sub overcurrent paths on different wires between the first lead terminal and the first connecting terminal, so that a plurality of wires can be arranged on the first lead terminal and the first connecting terminal to arrange enough power devices on the first overcurrent path, and the first overcurrent path is suitable for power expansion.

Based on technical scheme six, the utility model discloses technical scheme seven still has: each routing wire extends along the length direction of the substrate approximately; the first lead terminal and the second lead terminal are positioned at the same side of each wire, the first lead terminal and the first connecting terminal are respectively positioned at the opposite sides of each wire, and the second connecting terminal is arranged close to the second lead terminal; the current-carrying piece is arranged along the length direction of the substrate, and each first overcurrent path and each second overcurrent path have approximately opposite overcurrent directions.

The seventh technical scheme shows that the overcurrent structure is characterized in that the first lead terminal and the second lead terminal are located on the same side of the substrate, the substrate wiring and the current-carrying element are arranged along the length direction of the substrate, and the first lead terminal and the first connecting terminal are respectively arranged on different sides of the wiring, so that the current directions of the first overcurrent path and the second overcurrent path are approximately opposite in actual space, the planar space of the substrate is well utilized to arrange more power devices, and the device density of the substrate is improved. In addition, the second connecting terminal is arranged close to the second lead terminal, so that a third overcurrent path defined by the second connecting terminal and the second lead terminal is short, and the corresponding on-board routing can be configured to be positioned at the edge of the substrate where no device is required to be arranged, and the device arrangement space on the board is not influenced.

Based on technical scheme one, the utility model discloses technical scheme eight still has: the current-carrying piece is welded on the substrate and is electrically connected with the substrate.

In the eighth technical scheme, the current-carrying piece is mechanically and electrically connected with the substrate by welding, and the structure is simple and the connection relationship is reliable.

In order to achieve the above object, a second aspect of the present invention provides a technical solution nine: a capacitive module, comprising: an overcurrent structure as set forth in any one of claims two to eight above; the capacitor units are the same and each capacitor unit comprises one capacitor or more than two capacitors connected in series; the capacitor units are borne on the substrate, and each capacitor unit corresponds to one first overcurrent path respectively to establish a parallel network on the substrate.

In a ninth technical scheme, the capacitor module adopts the overcurrent structure of the second technical scheme, and each capacitor unit corresponds to a first overcurrent path respectively to establish a parallel network on the substrate, so that each capacitor unit can realize current sharing.

In order to achieve the above object, a third aspect of the present invention provides the following technical solution: a deflector, comprising: a first power module and a second power module; the capacitance module is as described in claim nine; the capacitance module is used for electrically connecting the first power module to the second power module; the first power module is a rectifying module or a boosting module, and the second power module is an inverting module.

In the tenth technical scheme, the converter device adopts the capacitor module to connect the power module, so that all advantages of the converter device are inherited, and the converter device is suitable for power expansion.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic diagram of an embodiment 1 of the present invention;

fig. 2 is a schematic diagram of the embodiment 2 of the present invention;

fig. 3 is a perspective view of a capacitor module according to embodiment 2 of the present invention;

fig. 4 is a perspective view of a current-carrying member according to embodiment 1 or 2 of the present invention;

fig. 5 is a schematic wiring diagram of a substrate according to embodiment 2 of the present invention.

The main reference numbers:

a substrate 10, a first overcurrent path 11, a third overcurrent path 12, a fourth overcurrent path 13, a first lead terminal 14A, a second lead terminal 14B, a third lead terminal 14C, a first connection terminal 15A, a second connection terminal 15B, a trace 16, and an electrical connection point 161;

the current carrier 20, the second overcurrent path 21, the first connection point 22A, the second connection point 22B, the through hole 23, and the support point 24;

a power device (capacitor) 30.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are preferred embodiments of the invention and should not be considered as excluding other embodiments. Based on the embodiment of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention.

In the claims, the specification and the drawings, unless otherwise expressly limited, the terms "first," "second," or "third," etc. are used for distinguishing between different elements and not for describing a particular sequence.

In the claims, the description and the drawings of the present invention, unless otherwise expressly limited, the terms "central", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise", "high", "low", and the like, are used to indicate the orientation or positional relationship based on the orientation and positional relationship shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore, the scope of protection of the present invention should not be limited.

In the claims, the description and the drawings of the present application, unless otherwise expressly limited, the term "fixedly connected" or "fixedly connected" is used, which is to be understood broadly, that is, any connection mode without displacement relation or relative rotation relation between the two, that is, including non-detachably fixed connection, integrated connection and fixed connection through other devices or elements.

In the claims, the specification and the drawings, the terms "including", "comprising" and variations thereof, if used, are intended to be inclusive and not limiting.

Referring to fig. 1, embodiment 1 of the present invention provides an overcurrent structure, which includes a substrate 10 and a current-carrying member 20.

The substrate 10 is a PCB board having a first lead terminal 14A, a second lead terminal 14B, a first connection terminal 15A and a second connection terminal 15B. The first lead terminal 14A and the second lead terminal 14B are used for being wired with an external module to introduce electric energy and for being loaded with different electric potentials.

The substrate 10 defines a plurality of first overcurrent paths 11 between the first lead terminals 14A and the first connection terminals 15A, in other words, the first connection terminals 15A are located at the same end of each first overcurrent path 11 and establish a converging or diverging relationship with each first overcurrent path 11, and the first lead terminals 14A are located at the opposite end of each first overcurrent path 11 from the first connection terminals 15A and establish a diverging or converging relationship with each first overcurrent path 11. In this embodiment, each of the first overcurrent paths 11 can be used to arrange the power devices 30 in a series relationship, and each of the first overcurrent paths 11 has the same impedance. In the present invention, the power device 30 is exemplarily shown as the capacitor 30, but is not limited thereto.

The substrate 10 defines a third overcurrent path 12 between the second connection terminal 15B and the second lead terminal 14B, in other words, the second connection terminal 15B is located at one end of the third overcurrent path 12, and the second lead terminal 14B is located at the opposite end of the third overcurrent path 12 from the second connection terminal 15B.

The current-carrying member 20 may be configured as a PCB board or a copper bar, which has a rigid configuration and is fixedly connected to the substrate 10. The current carrier 20 has a first connection point 22A and a second connection point 22B for electrically connecting the first connection terminal 15A and the second connection terminal 15B, respectively, and defines a second overcurrent path 21 between the first connection point 22A and the second connection point 22B. In other words, the first connection point 22A and the second connection point 22B are respectively located at two ends of the second overcurrent path 21, the current carrying member 20 is electrically connected with the first connection terminal 15A and the second connection terminal 15B through the first connection point 22A and the second connection point 22B to establish an electrical connection relationship with the substrate 10, and each first overcurrent path 11 is made to communicate with the third overcurrent path 12 through the second overcurrent path 21. In this embodiment, the current carrying element 20 is soldered to the substrate 10 and electrically connected to the substrate 10, which avoids an intermediate circuit, and has a simple structure and a reliable connection relationship.

With the above-described overcurrent structure, each first overcurrent path 11 of substrate 10 is communicated to third overcurrent path 12 of substrate 10 through second overcurrent path 21 of current carrier 20 and forms an overcurrent structure, and thus can be adapted to pass a large current by providing current carrier 20 with a large overcurrent cross section. In configuring the flow cross section of the current carrier 20, the dimension (e.g., thickness dimension) of the structure parallel to the plane of the substrate 10 may be set to be small, and the dimension (e.g., height dimension) perpendicular to the plane of the substrate 10 may be set to be large, so that the current carrier 20 has a small space occupation in at least one dimension in the plane of the substrate 10, thereby maintaining a high device density on the substrate 10.

It can be seen that, the above-mentioned over-current structure avoids that when higher device density needs to be maintained, the over-current cross section of the substrate 10 can only be increased by adopting a high-cost manner of increasing the number of board layers to pass large current, but the current carrying member 20 is introduced to pass large current at a lower wiring cost, and the over-current structure is suitable for correspondingly configuring the over-current cross section of the current carrying member 20 to enable the substrate 10 to maintain higher device density, so as to further improve the power expansion capability of the over-current structure.

It should be noted that although the substrate 10 of the above-mentioned overcurrent structure still has the third overcurrent path 12 for passing a large current, due to the current carrier 20, the second overcurrent path 21 and the third overcurrent path 12 that need to pass a large current can be flexibly configured, so that the on-board trace corresponding to the third overcurrent path 12 is located in the edge area of the substrate 10 where no device is needed, and thus the problem of occupying the device layout space is not present. In other words, the above-mentioned overcurrent structure avoids having to provide on-board wiring for passing large current and occupying the device arrangement space on the substrate 10, so that the parallel network of devices can be intensively arranged in the area corresponding to the first overcurrent path 11 on the substrate 10, and the circuit needing to pass large current is realized by the second overcurrent path 21 in the current carrier 20 occupying the smaller space of the substrate 10 and the third overcurrent path 12 configured to be located at the edge of the substrate 10, and the on-board space utilization is reasonable and efficient, and the power expansion capability thereof is greatly improved.

In addition, since the current carrier 20 has a rigid structure, when different installers fixedly attach the current carrier to the substrate 10, the problems of poor installation consistency and easy electromagnetic interference do not exist, and the process is beautiful.

It can be understood that, since the first lead terminal 14A and the second lead terminal 14B can be loaded with different electric potentials, the current trend of each connected overcurrent path can be controlled, and the use is more flexible. For example, when the potential of the first lead terminal 14A is higher than that of the second lead terminal 14B, the current direction is sequentially from each first overcurrent path 11 to the second overcurrent path 21 and the third overcurrent path 12, and correspondingly, the current relationship between the first connection terminal 15A and the first lead terminal 14A and each first overcurrent path 11 is respectively the confluence or the shunt; when the potential of the first lead terminal 14A is lower than that of the second lead terminal 14B, the current flows from the third overcurrent path 12 to the second overcurrent path 21 and the first overcurrent paths 11 in sequence, and correspondingly, the current relationship between the first connection terminal 15A and the first lead terminal 14A and the first overcurrent paths 11 is divided or converged.

Furthermore, each of the first overcurrent paths 11 has the same impedance, so that when devices are correspondingly configured on each of the first overcurrent paths 11 and a parallel network is established for the devices, the current passing through each device needs to pass through the first overcurrent path 11, the second overcurrent path 21 and the third overcurrent path 12, which have the same impedance, so that the overall overcurrent impedances are the same, the device current equalization of the parallel network is realized, the device utilization rate is high, and the service life is longer.

With reference to the upper half portion or the lower half portion of fig. 5, in a specific structure, a plurality of traces 16 are printed on the substrate 10, each trace 16 defines a plurality of independent sub-overcurrent paths, the sub-overcurrent paths on different traces 16 are in one-to-one correspondence, and the sub-overcurrent paths corresponding to each other are suitable for being communicated with each other through the power device 30, so that the sub-overcurrent paths corresponding to each other on different traces 16 jointly form the first overcurrent path 11. More specifically, each trace 16 is provided with a plurality of pairs of electrical connection points 161 independent of each other, the electrical connection points 161 are adapted to be electrically connected to the power device 30, and each pair of electrical connection points 161 defines one of the sub-overcurrent paths. The first lead terminal 14A and the first connection terminal 15A are respectively located on a trace 16 and communicate with all sub overcurrent paths on the trace 16, so as to define each of the first overcurrent paths 11 between the first lead terminal 14A and the first connection terminal 15A. With the above-described structure to form the plurality of first excessive current paths 11, it is possible to arrange the plurality of traces 16 at the first lead terminal 14A and the first connection terminal 15A to arrange a sufficient number of power devices 30 suitable for power spreading on the first excessive current paths 11.

In addition, in order to facilitate wiring of the overcurrent structure with an external module, the first lead terminal 14A and the second lead terminal 14B are located on the same side of the substrate 10. Specifically, each of the traces 16 extends substantially along the length direction of the substrate 10, the first lead terminal 14A and the second lead terminal 14B are located on the same side of each of the traces 16, the first lead terminal 14A and the first connection terminal 15A are located on different sides of each of the traces 16, and the second connection terminal 15B is disposed close to the second lead terminal 14B. The current carrying member 20 is disposed along a length direction of the substrate 10, and each of the first and second flow paths 11 and 21 has a substantially opposite flow direction.

In the above structure, the substrate trace 16 and the current carrying element 20 are both arranged along the length direction of the substrate 10, and the first lead terminal 14A and the first connection terminal 15A are respectively arranged at different sides of each trace 16, so that the current directions of the first overcurrent path 11 and the second overcurrent path 21 are substantially opposite in actual space, and the planar space of the substrate 10 is better utilized to arrange more power devices 30, thereby improving the device density of the substrate 10. Further, the second connection terminal 15B is disposed close to the second lead terminal 14B so that the third excess current path 12 defined by the two is short, so that the corresponding on-board trace thereof can be configured to be located on the edge of the substrate 10 where no device is disposed, without affecting the device arrangement space on the board.

Further, referring to fig. 4, in the present embodiment, the current carrying member 20 is a PCB, and in addition to the first connection point 22A and the second connection point 22B, the current carrying member 20 further has two through holes 23 and three support points 24. The two through holes 23 are used for fixing the insulating material, and the three supporting points 24 are used for correspondingly welding with the substrate 10, so that the fixed connection relationship between the current carrying member 20 and the substrate 10 is more stable.

Correspondingly, the embodiment of the present invention provides a corresponding capacitor module and a converter apparatus in embodiment 1.

The capacitor module comprises the overcurrent structure and a plurality of same capacitor units, wherein each capacitor unit in the plurality of same capacitor units comprises one capacitor 30 or more than two capacitors 30 connected in series. The capacitor units are carried on the substrate 10, and each capacitor unit corresponds to one of the first overcurrent paths 11 respectively to establish a parallel network on the substrate 10. It can be understood that the capacitor module adopts the foregoing overcurrent structure, and each capacitor unit corresponds to one first overcurrent path 11 respectively to establish a parallel network on the substrate 10, so that each capacitor unit can not only realize current sharing, but also inherit all the advantages thereof due to the adoption of the foregoing overcurrent structure, has higher overcurrent capacity and capacity expansion capacity, and can adapt to the power expansion requirement of the converter device.

The deflector comprises: a first power module, a second power module, and the capacitance module. The capacitance module is used for electrically connecting the first power module to the second power module. The first power module is a rectifying module or a boosting module, and the second power module is an inverting module, so that the capacitor module forms a direct-current bus of the converter device. Because the converter device adopts the capacitor module to connect the power module, the converter device inherits all the advantages and is suitable for power expansion.

Referring to fig. 2, embodiment 2 of the present invention shows an expanded overcurrent structure based on embodiment 1, and the difference from embodiment 1 is that the substrate 10 further includes a third lead terminal 14C, and the substrate 10 further defines a plurality of fourth overcurrent paths 13 between the first connection terminal 15A and the third lead terminal 14C.

In embodiment 2, the first lead terminal 14A and the first connecting terminal 15A establish a shunting and converging relationship with each first overcurrent path 11, respectively, and the third lead terminal 14C and the first connecting terminal 15A establish a converging and shunting relationship with each fourth overcurrent path 13, respectively, so that the third overcurrent path 12 communicates with each fourth overcurrent path 13 through the second overcurrent path 21. It can be seen that in embodiment 2, two states formed by different potentials of the first lead terminal 14A and the second lead terminal 14B in embodiment 1 are combined, and a mirror image structure based on a current direction is added on the basis of embodiment 1, so that the overcurrent structure in embodiment 1 is expanded to be suitable for application in a three-level power topology under the condition of sharing one current carrier 20, and the applicability of the overcurrent structure is improved. It goes without saying that, when a multilevel power topology needs to be built, only the common current carrier 20 needs to be correspondingly added.

Correspondingly, fig. 3 and fig. 5 respectively show a perspective view of the capacitor module of embodiment 2 and a wiring schematic diagram of the substrate 10, and since the main structures of embodiment 2 and embodiment 1 are basically the same, corresponding reference numerals are referred to for understanding thereof, and no further description is given.

The description of the above specification and examples is intended to illustrate the scope of the invention, but should not be construed as limiting the scope of the invention. Modifications, equivalents and other improvements which may be made to the embodiments of the invention or to some of the technical features thereof by a person of ordinary skill in the art through logical analysis, reasoning or limited experimentation in light of the above teachings of the invention or the above embodiments are intended to be included within the scope of the invention.

Claims (10)

1. An overcurrent structure, comprising:

the substrate defines a plurality of first overcurrent paths and a third overcurrent path;

a current-carrying member having a rigid structure and fixedly connected to the substrate; the current-carrying piece defines a second overcurrent path which is electrically connected with the substrate and enables each first overcurrent path to be communicated with the third overcurrent path through the second overcurrent path.

2. A flow structure as claimed in claim 1, wherein: each first overcurrent path has the same impedance.

3. A flow structure as claimed in claim 1 or 2, wherein:

the substrate is provided with a first connecting terminal and a second connecting terminal; the first connecting terminals are positioned at the same end of each first overcurrent path and establish a confluence or shunting relation with each first overcurrent path; the second connecting terminal is positioned at one end of the third overcurrent path;

the current-carrying piece is provided with a first connecting point and a second connecting point which are respectively positioned at two ends of the second overcurrent path; the first connecting point and the second connecting point are respectively and directly electrically connected with the first connecting terminal and the second connecting terminal so as to realize that each first overcurrent path is communicated with the third overcurrent path through the second overcurrent path.

4. A flow structure as claimed in claim 3, wherein: the first connecting terminal establishes a confluence relation with each first overcurrent path;

the substrate further defines a plurality of fourth overcurrent paths, and the first connecting terminal is further located at the same end of each fourth overcurrent path and establishes a shunting relationship with the same end so that the third overcurrent path is communicated with each fourth overcurrent path through the second overcurrent path.

5. A flow structure as claimed in claim 3, wherein: the substrate is provided with a first lead terminal and a second lead terminal which are respectively used for loading different electric potentials;

the first lead terminal is positioned at one end of each first overcurrent path opposite to the first connecting terminal and establishes a shunting or converging relationship with each first overcurrent path;

the second lead terminal is located at an end of the third overcurrent path opposite to the second connection terminal.

6. A flow structure as claimed in claim 5, wherein: a plurality of wiring lines are printed on the substrate;

a plurality of independent sub-overcurrent paths are defined in each wire, the sub-overcurrent paths on different wires are in one-to-one correspondence, and the sub-overcurrent paths corresponding to each other are suitable for being mutually communicated through a power device, so that the sub-overcurrent paths corresponding to each other on different wires jointly form the first overcurrent path;

the first lead terminal and the first connecting terminal are respectively positioned on a wire and communicated with all sub overcurrent paths on the wire, so that each first overcurrent path is defined between the first lead terminal and the first connecting terminal.

7. The overcurrent structure as recited in claim 6, wherein: each routing wire extends along the length direction of the substrate approximately;

the first lead terminal and the second lead terminal are positioned at the same side of each wire, the first lead terminal and the first connecting terminal are respectively positioned at the opposite sides of each wire, and the second connecting terminal is arranged close to the second lead terminal;

the current-carrying piece is arranged along the length direction of the substrate, and each first overcurrent path and each second overcurrent path have approximately opposite overcurrent directions.

8. A flow structure as claimed in claim 1, wherein: the current-carrying piece is welded on the substrate and is electrically connected with the substrate.

9. A capacitive module, comprising:

a flow-through structure as claimed in any one of claims 2 to 8;

the capacitor units are the same and each capacitor unit comprises one capacitor or more than two capacitors connected in series; the capacitor units are borne on the substrate, and each capacitor unit corresponds to one first overcurrent path respectively to establish a parallel network on the substrate.

10. A deflector device, comprising:

a first power module and a second power module;

a capacitive module according to claim 9; the capacitance module is used for electrically connecting the first power module to the second power module;

the first power module is a rectifying module or a boosting module, and the second power module is an inverting module.

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