CN112367760B - Overcurrent structure, capacitor module and converter - Google Patents
Overcurrent structure, capacitor module and converter Download PDFInfo
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- CN112367760B CN112367760B CN202011184707.4A CN202011184707A CN112367760B CN 112367760 B CN112367760 B CN 112367760B CN 202011184707 A CN202011184707 A CN 202011184707A CN 112367760 B CN112367760 B CN 112367760B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M5/00—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases
- H02M5/40—Conversion of ac power input into ac power output, e.g. for change of voltage, for change of frequency, for change of number of phases with intermediate conversion into dc
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
Abstract
The invention relates to an overcurrent structure, a capacitor module and a current transformation device, wherein the overcurrent structure comprises: a substrate and a current carrier; the substrate defines a plurality of first overcurrent paths and a third overcurrent path; the current-carrying piece is fixedly connected with the substrate and defines a second overcurrent path; the current-carrying piece is electrically connected with the substrate and enables each first overflowing path to be communicated with the third overflowing path through the second overflowing path; the current-carrying piece is provided with a plate-shaped overflowing part which is perpendicular to the substrate and defines at least part of the second overflowing path. The over-current structure can improve the over-current capability of the on-board structure under the condition of maintaining higher density of devices on the board, has better process aesthetic property, and is further suitable for equalizing the current of the parallel devices.
Description
Technical Field
The invention relates to the technical field of printed circuit boards and current transformation, in particular to an overcurrent structure, a capacitor module and a current transformation device.
Background
In a converter device such as a UPS and a photovoltaic inverter, which relates to dc conversion, a capacitor bus is usually disposed between a front module (such as a rectifier module and a boost module) and a rear module (such as an inverter module) and used as a dc bus to connect dc sides of the front module and the rear module to achieve energy flow, and the capacitor bus is actually an on-board capacitor structure.
Along with the increasing power demand of the converter device, the current required to pass through the direct current bus is also increasing, which brings the following problems to the design and production of the capacitor busbar:
on one hand, in order to facilitate the wiring of the capacitor bus bar with the front module and the rear module, the input and output terminals of the capacitor bus bar are generally required to be arranged on the same side of the PCB; on the other hand, the industry generally adopts more capacitors connected in parallel to realize the power expansion of the direct current bus. The combination of the two aspects not only brings the current sharing problem of the parallel capacitor, but also leads the PCB to have a part which must pass through large current because the parallel capacitor network relates to the confluence and the shunting, and the overcurrent routing of the part needs to occupy larger device arrangement space, thereby reducing the density of devices on the PCB, reducing the power expansion capability and simultaneously increasing the current sharing difficulty of the parallel capacitor. Under the condition that the parallel capacitors are not uniform, the service life of the device is shortened due to overlarge current of part of the capacitors, and the waste of the device is caused due to the overlarge current of part of the capacitors.
Disclosure of Invention
It is an object of the present invention to overcome at least one of the disadvantages or problems of the background art and to provide a current-carrying structure, a capacitive module and a current transformer arrangement, which improves the current-carrying capacity of an on-board structure while maintaining a high on-board device density. In addition, the overcurrent structure has better process aesthetic property, and is further suitable for solving the current sharing problem of devices of a capacitor module and a current transformer.
In order to achieve the above object, a first aspect of the present invention provides: an over-current structure, comprising: the substrate defines a plurality of first overcurrent paths and a third overcurrent path; the current-carrying piece is fixedly connected with the substrate and defines a second overcurrent path; the current-carrying piece is electrically connected with the substrate and enables each first overcurrent path to be communicated with the third overcurrent path through the second overcurrent path; the current-carrying piece is provided with a plate-shaped overflowing part, the overflowing part is perpendicular to the substrate, and at least part of the second overflowing path is defined in the overflowing part.
In the first technical scheme, each first overflowing path of the substrate is communicated to a third overflowing path of the substrate through a second overflowing path of the current-carrying piece to form an overflowing structure, the current-carrying piece is provided with an overflowing part which is of a plate-shaped structure and is perpendicular to the substrate, and at least part of the second overflowing path is defined in the overflowing part, so that the current-carrying piece only occupies a very small part of space in an area, corresponding to the overflowing part, on the substrate after being fixedly connected with the substrate, and the height space of the substrate is fully utilized for wiring, so that the overflowing structure integrally forms a three-dimensional wiring structure, the problem of occupying the device arrangement space on the plane of the substrate is avoided, and higher device density can be maintained on the substrate.
In addition, it can be seen that, the above-mentioned over-current structure avoids that when higher device density needs to be maintained, the over-current cross section can be increased only by adopting a high-cost way of increasing the number of board layers for the whole substrate so as to pass large current, but the passing of large current is realized by introducing the current-carrying piece at lower wiring cost, and the over-current structure is suitable for enabling the substrate to maintain higher device density by configuring the current-carrying piece with the over-current part, so that the power expansion capability of the over-current structure is further improved.
It should be noted that although the substrate of the above-mentioned overcurrent structure still has the third overcurrent path through which a large current passes, the second overcurrent path and the third overcurrent path through which a large current passes can be flexibly configured due to the current-carrying element, so that the on-board routing corresponding to the third overcurrent path is located in the edge region of the substrate where no device is required to be disposed, and thus the problem of occupying the device layout space does not exist. In other words, the overcurrent structure avoids the situation that wiring is arranged on a board which is used for passing large current and occupies the device arrangement space, so that a parallel network of devices can be intensively arranged in the area corresponding to the first overcurrent path on the substrate, and a circuit which needs to pass large current is jointly realized by the second overcurrent path in a current-carrying piece which occupies a small substrate space and the third overcurrent path which is configured to be positioned at the edge of the substrate, the space on the board is reasonably and efficiently utilized, and the power expansion capability of the overcurrent structure is greatly improved.
In addition, because the current-carrying piece is in a plate shape, when different installers fixedly mount the current-carrying piece on the substrate, the problems of poor mounting consistency and easy electromagnetic interference do not exist, and the process is attractive.
Based on the first technical scheme, the invention also has a second technical scheme: the current-carrying member is entirely in a plate-like configuration, and is disposed perpendicular to the substrate.
In the second technical scheme, the current-carrying part is integrally formed into a plate-shaped structure and is arranged perpendicular to the substrate, the whole current-carrying part only occupies a small part of space in one dimension of the plane of the substrate, and the current-carrying part has the advantages of simple structure and easiness in manufacturing.
Based on the second technical scheme, the invention also has a third technical scheme: each first overcurrent path has the same impedance.
In the third technical scheme, because the impedances of the first overcurrent paths are the same, when the devices are correspondingly configured on the first overcurrent paths and the parallel network is established for the devices, the currents passing through the devices need to pass through the first overcurrent paths with the same impedances, the second overcurrent paths and the third overcurrent paths, the overall overcurrent impedances are the same, the current equalization of the devices of the parallel network is realized, the utilization rate of the devices is high, and the service life is longer.
Based on the second or third technical scheme, the invention also has a fourth technical scheme: the substrate is provided with a first connecting terminal and a second connecting terminal; the first connecting terminals are positioned at the same end of each first overcurrent path and establish a confluence or shunting relation with each first overcurrent path; the second connecting terminal is positioned at one end of the third overcurrent path; the current-carrying piece is provided with a first connecting point and a second connecting point which are respectively positioned at two ends of the second overcurrent path; the first connecting point and the second connecting point are respectively and directly electrically connected with the first connecting terminal and the second connecting terminal so as to realize that each first overcurrent path is communicated with the third overcurrent path through the second overcurrent path.
In the fourth technical scheme, the substrate is provided with the first connecting terminal and the second connecting terminal, the current-carrying piece is correspondingly provided with the first connecting point and the second connecting point, and the current-carrying piece and the substrate are directly and electrically connected through the terminals and the connecting points so as to realize the communication of corresponding overcurrent paths, avoid intermediate circuits and have a simple structure.
Based on the fourth technical scheme, the invention also has a fifth technical scheme: the first connecting terminal establishes a confluence relation with each first overcurrent path; the substrate further defines a plurality of fourth overcurrent paths, and the first connecting terminal is further located at the same end of each fourth overcurrent path and establishes a shunt relationship with the same end so that the third overcurrent paths are communicated with the fourth overcurrent paths through the second overcurrent paths.
In the fifth technical scheme, a plurality of fourth overcurrent paths are defined through the substrate, and the current relationships among the first connection terminal, the first overcurrent path and the fourth overcurrent path are respectively configured to be converged and shunted, so that the overcurrent structure in the technical scheme is expanded to be suitable for application in a three-level power topology under the condition of sharing one current-carrying piece, and the applicability of the overcurrent structure is improved.
Based on the fourth technical scheme, the invention also has a sixth technical scheme that: the substrate is provided with a first lead terminal and a second lead terminal which are respectively used for loading different electric potentials; the first lead terminal is positioned at one end of each first overcurrent path opposite to the first connecting terminal and establishes a shunting or converging relationship with each first overcurrent path; the second lead terminal is located at an end of the third overcurrent path opposite to the second connection terminal.
In the sixth technical scheme, the substrate is provided with the first lead terminals communicated with the first overcurrent paths and the second lead terminals communicated with the third overcurrent paths so as to establish an electric connection relation with an external module, so that electric energy is introduced, the current trend of the overcurrent paths communicated with each other can be controlled by loading different electric potentials to the two lead terminals, and the use is more flexible.
Based on the sixth technical scheme, the invention also has a seventh technical scheme: a plurality of wiring lines are printed on the substrate; a plurality of independent sub-overcurrent paths are defined in each wire, the sub-overcurrent paths on different wires are in one-to-one correspondence, and the sub-overcurrent paths corresponding to each other are suitable for being mutually communicated through a power device, so that the sub-overcurrent paths corresponding to each other on different wires jointly form the first overcurrent path; the first lead terminal and the first connecting terminal are respectively positioned on a wire and communicated with all sub overcurrent paths on the wire, so that each first overcurrent path is defined between the first lead terminal and the first connecting terminal.
The seventh technical scheme provides a specific forming mode of the first overcurrent paths, and each first overcurrent path is formed by corresponding sub overcurrent paths on different wires between the first lead terminal and the first connecting terminal, so that a plurality of wires can be arranged on the first lead terminal and the first connecting terminal to arrange enough power devices on the first overcurrent path, and the first overcurrent path is suitable for power expansion.
Based on the seventh technical scheme, the invention also has an eighth technical scheme: each routing wire extends along the length direction of the substrate approximately; the first lead terminal and the second lead terminal are positioned at the same side of each wire, the first lead terminal and the first connecting terminal are respectively positioned at the opposite sides of each wire, and the second connecting terminal is arranged close to the second lead terminal; the current-carrying piece is arranged along the length direction of the substrate, and each first overcurrent path and each second overcurrent path have approximately opposite overcurrent directions.
The technical scheme eight shows that the overcurrent structure is formed when the first lead terminal and the second lead terminal are located on the same side of the substrate, the substrate wiring and the current-carrying part are arranged along the length direction of the substrate, and the first lead terminal and the first connecting terminal are respectively arranged on different sides of each wiring, so that the current directions of the first overcurrent path and the second overcurrent path are approximately opposite in actual space, the planar space of the substrate is well utilized to arrange more power devices, and the device density of the substrate is improved. In addition, the second connecting terminal is arranged close to the second lead terminal, so that a third overcurrent path defined by the second connecting terminal and the second lead terminal is short, and the corresponding on-board routing can be configured to be positioned at the edge of the substrate where no device is required to be arranged, and the device arrangement space on the board is not influenced.
In order to achieve the above object, a second aspect of the present invention provides a solution nine: a capacitive module, comprising: the overcurrent structure is as described in any one of the third to eighth technical schemes; the capacitor units are the same and each capacitor unit comprises one capacitor or more than two capacitors connected in series; the capacitor units are borne on the substrate, and each capacitor unit corresponds to one first overcurrent path respectively to establish a parallel network on the substrate.
In a ninth technical scheme, the capacitor module adopts the overcurrent structure of the second technical scheme, and each capacitor unit corresponds to a first overcurrent path respectively to establish a parallel network on the substrate, so that each capacitor unit can realize current sharing.
In order to achieve the above object, a third aspect of the present invention provides: a deflector, comprising: a first power module and a second power module; the capacitance module is as described in claim nine; the capacitance module is used for electrically connecting the first power module to the second power module; the first power module is a rectifying module or a boosting module, and the second power module is an inverting module.
In the tenth technical scheme, the converter device adopts the capacitor module to connect the power module, so that all advantages of the converter device are inherited, and the converter device is suitable for power expansion.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram of an overcurrent structure according to embodiment 1 of the present invention;
fig. 2 is a schematic diagram of an overcurrent structure according to embodiment 2 of the present invention;
fig. 3 is a perspective view of a capacitor module according to embodiment 2 of the present invention;
FIG. 4 is a perspective view of a current carrying member according to embodiment 1 or 2 of the present invention;
fig. 5 is a wiring diagram of the substrate in embodiment 2 of the present invention.
The main reference numbers:
a substrate 10, a first overcurrent path 11, a third overcurrent path 12, a fourth overcurrent path 13, a first lead terminal 14A, a second lead terminal 14B, a third lead terminal 14C, a first connection terminal 15A, a second connection terminal 15B, a trace 16, and an electrical connection point 161;
the current carrier 20, the second overcurrent path 21, the first connection point 22A, the second connection point 22B, the through hole 23, and the support point 24;
a power device (capacitor) 30.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are presently preferred embodiments of the invention and are not to be taken as an exclusion of other embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the claims, the specification and the drawings of the present invention, unless otherwise expressly limited, the terms "first", "second" or "third", etc. are used for distinguishing between different items and not for describing a particular sequence.
In the claims, the specification and the drawings of the present invention, unless otherwise expressly limited, directional terms such as "central", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inner", "outer", "upper", "lower", "front", "rear", "left", "right", "clockwise", "counterclockwise", "high", "low", etc., are used for indicating the orientation or positional relationship based on that shown in the drawings and are used for convenience of description and simplicity of description only, and do not indicate or imply that the referenced device or element must have a particular orientation or be constructed and operated in a particular orientation and therefore should not be construed as limiting the scope of the present invention.
In the claims, the description and the drawings of the present application, unless otherwise expressly limited, the terms "fixedly connected" or "fixedly connected" should be interpreted broadly, that is, any connection between the two that does not have a relative rotational or translational relationship, that is, non-detachably fixed, integrally connected, and fixedly connected by other devices or elements.
In the claims, the specification and the drawings of the present invention, the terms "including", "having" and their variants, if used, are intended to be inclusive and not limiting.
Referring to fig. 1, embodiment 1 of the present invention provides a overcurrent structure, which is characterized by including a substrate 10 and a current carrier 20.
The substrate 10 is a PCB board having a first lead terminal 14A, a second lead terminal 14B, a first connection terminal 15A and a second connection terminal 15B. The first lead terminal 14A and the second lead terminal 14B are used for being wired with an external module to introduce electric energy and for being loaded with different electric potentials.
The substrate 10 defines a plurality of first overcurrent paths 11 between the first lead terminals 14A and the first connection terminals 15A, in other words, the first connection terminals 15A are located at the same end of each first overcurrent path 11 and establish a converging or diverging relationship with each first overcurrent path 11, and the first lead terminals 14A are located at the opposite end of each first overcurrent path 11 from the first connection terminals 15A and establish a diverging or converging relationship with each first overcurrent path 11. In this embodiment, each of the first overcurrent paths 11 can be used to arrange the power devices 30 in a series relationship, and each of the first overcurrent paths 11 has the same impedance. In the present invention, the power device 30 is exemplarily shown as the capacitor 30, but is not limited thereto.
The substrate 10 defines a third overcurrent path 12 between the second connection terminal 15B and the second lead terminal 14B, in other words, the second connection terminal 15B is located at one end of the third overcurrent path 12, and the second lead terminal 14B is located at the opposite end of the third overcurrent path 12 from the second connection terminal 15B.
The current-carrying member 20 is fixedly connected to the substrate 10 and has a plate-shaped structure and a flow-through portion perpendicular to the substrate 10. In this embodiment, the current carrying member 20 is a plate-shaped structure, which may be a PCB board or a plate-shaped copper bar and is disposed perpendicular to the substrate 10, so that the current carrying member as a whole constitutes the current passing portion. Specifically, the current carrier 20 has a first connection point 22A and a second connection point 22B for electrically connecting the first connection terminal 15A and the second connection terminal 15B, respectively, and defines a second overcurrent path 21 between the first connection point 22A and the second connection point 22B. In other words, the first connection point 22A and the second connection point 22B are respectively located at two ends of the second overcurrent path 21, the current carrying member 20 is electrically connected with the first connection terminal 15A and the second connection terminal 15B through the first connection point 22A and the second connection point 22B to establish an electrical connection relationship with the substrate 10, and each first overcurrent path 11 is made to communicate with the third overcurrent path 12 through the second overcurrent path 21. In other embodiments, the current-carrying part 20 may also be formed only partially in the plate-shaped flow-through portion and arranged perpendicular to the base plate 10, which flow-through portion defines at least part of the second flow-through path 21. In the embodiment, the current carrying element 20 is soldered to the substrate 10 and electrically connected to the substrate 10, which avoids an intermediate circuit, and has a simple structure and a reliable connection relationship.
Through the above-mentioned overflowing structure, each first overflowing path 11 of the substrate 10 is communicated to the third overflowing path 12 of the substrate 10 through the second overflowing path 21 of the current carrying piece 20 to form an overflowing structure, because the current carrying piece 20 has an overflowing part which is in a plate-shaped structure and is arranged perpendicular to the substrate 10, and at least part of the second overflowing path 21 is defined in the overflowing part, after the current carrying piece 20 is fixedly connected to the substrate 10, only a very small part of space is occupied in the area corresponding to the overflowing part on the substrate 10, and the height space of the substrate 10 is fully utilized for wiring, so that the overflowing structure integrally forms a three-dimensional wiring structure, the problem of occupying the device arrangement space on the plane of the substrate 10 is avoided, and thus higher device density can be maintained on the substrate 10.
In addition, it can be seen that the above-mentioned over-current structure avoids that the over-current cross section of the substrate 10 can be increased only by a high-cost method of increasing the number of board layers to pass a large current when a high device density needs to be maintained, but achieves the passing of the large current at a low wiring cost by introducing the current carrier 20, and is suitable for enabling the substrate 10 to maintain the high device density by configuring the current carrier 20 with the over-current portion, thereby further improving the power expansion capability of the over-current structure.
It should be noted that although the substrate 10 of the above-mentioned overcurrent structure still has the third overcurrent path 12 for passing a large current, due to the current carrier 20, the second overcurrent path 21 and the third overcurrent path 12 that need to pass a large current can be flexibly configured, so that the on-board trace corresponding to the third overcurrent path 12 is located in the edge area of the substrate 10 where no device is needed, and thus the problem of occupying the device layout space is not present. In other words, the above-mentioned overcurrent structure avoids having to provide on-board wiring for passing large current and occupying the device arrangement space on the substrate 10, so that the parallel network of devices can be intensively arranged in the area corresponding to the first overcurrent path 11 on the substrate 10, and the circuit that needs to pass large current is realized by the second overcurrent path 21 in the current carrier 20 occupying a smaller substrate space and the third overcurrent path 12 configured to be located at the edge of the substrate 10, and the on-board space utilization is reasonable and efficient, thereby greatly improving the power expansion capability thereof.
In addition, since the current-carrying member 20 is plate-shaped, when different installers fixedly mount the current-carrying member to the substrate 10, the problems of poor mounting consistency and easy electromagnetic interference do not exist, and the process is beautiful.
It can be understood that, since the first lead terminal 14A and the second lead terminal 14B can be loaded with different electric potentials, the current trend of each connected overcurrent path can be controlled, and the use is more flexible. For example, when the potential of the first lead terminal 14A is higher than that of the second lead terminal 14B, the current direction is sequentially from each first overcurrent path 11 to the second overcurrent path 21 and the third overcurrent path 12, and correspondingly, the current relationship between the first connection terminal 15A and the first lead terminal 14A and each first overcurrent path 11 is respectively the confluence or the shunt; when the potential of the first lead terminal 14A is lower than that of the second lead terminal 14B, the current flows from the third overcurrent path 12 to the second overcurrent path 21 and the first overcurrent paths 11 in sequence, and correspondingly, the current relationship between the first connection terminal 15A and the first lead terminal 14A and the first overcurrent paths 11 is divided or converged.
Furthermore, each of the first overcurrent paths 11 has the same impedance, so that when devices are correspondingly configured on each of the first overcurrent paths 11 and a parallel network is established for the devices, the current passing through each device needs to pass through the first overcurrent path 11, the second overcurrent path 21 and the third overcurrent path 12, which have the same impedance, so that the overall overcurrent impedances are the same, the device current equalization of the parallel network is realized, the device utilization rate is high, and the service life is longer.
With reference to the upper half portion or the lower half portion of fig. 5, in a specific structure, a plurality of traces 16 are printed on the substrate 10, each trace 16 defines a plurality of independent sub-overcurrent paths, the sub-overcurrent paths on different traces 16 are in one-to-one correspondence, and the sub-overcurrent paths corresponding to each other are suitable for being communicated with each other through the power device 30, so that the sub-overcurrent paths corresponding to each other on different traces 16 jointly form the first overcurrent path 11. More specifically, each trace 16 is provided with a plurality of pairs of electrical connection points 161 independent of each other, the electrical connection points 161 are adapted to be electrically connected to the power device 30, and each pair of electrical connection points 161 defines one of the sub-overcurrent paths. The first lead terminal 14A and the first connection terminal 15A are respectively located on a trace 16 and communicate with all sub overcurrent paths on the trace 16, so as to define each of the first overcurrent paths 11 between the first lead terminal 14A and the first connection terminal 15A. With the above-described structure to form the plurality of first excessive current paths 11, it is possible to arrange the plurality of traces 16 at the first lead terminal 14A and the first connection terminal 15A to arrange a sufficient number of power devices 30 suitable for power spreading on the first excessive current paths 11.
In addition, in order to facilitate wiring of the overcurrent structure with an external module, the first lead terminal 14A and the second lead terminal 14B are located on the same side of the substrate 10. Specifically, each of the traces 16 extends substantially along the length direction of the substrate 10, the first lead terminal 14A and the second lead terminal 14B are located on the same side of each of the traces 16, the first lead terminal 14A and the first connection terminal 15A are located on different sides of each of the traces 16, and the second connection terminal 15B is disposed close to the second lead terminal 14B. The current carrying member 20 is disposed along a length direction of the substrate 10, and each of the first and second flow paths 11 and 21 has a substantially opposite flow direction.
In the above structure, the substrate trace 16 and the current carrying element 20 are both arranged along the length direction of the substrate 10, and the first lead terminal 14A and the first connection terminal 15A are respectively arranged at different sides of each trace 16, so that the current directions of the first overcurrent path 11 and the second overcurrent path 21 are substantially opposite in actual space, and the planar space of the substrate 10 is better utilized to arrange more power devices 30, thereby improving the device density of the substrate 10. Further, the second connection terminal 15B is disposed close to the second lead terminal 14B so that the third excess current path 12 defined by the two is short, so that the corresponding on-board trace thereof can be configured to be located on the edge of the substrate 10 where no device is disposed, without affecting the device arrangement space on the board.
Further, referring to fig. 4, in the present embodiment, the current carrying member 20 is a PCB, and in addition to the first connection point 22A and the second connection point 22B, the current carrying member 20 further has two through holes 23 and three support points 24. The two through holes 23 are used for fixing the insulating material, and the three supporting points 24 are used for correspondingly welding with the substrate 10, so that the fixed connection relationship between the current carrying member 20 and the substrate 10 is more stable.
Correspondingly, the embodiment 1 of the invention also provides a corresponding capacitance module and a corresponding converter device.
The capacitor module comprises the overcurrent structure and a plurality of same capacitor units, wherein each capacitor unit in the plurality of same capacitor units comprises one capacitor 30 or more than two capacitors 30 connected in series. The capacitor units are carried on the substrate 10, and each capacitor unit corresponds to one of the first overcurrent paths 11 respectively to establish a parallel network on the substrate 10. It can be understood that the capacitor module adopts the foregoing overcurrent structure, and each capacitor unit corresponds to one first overcurrent path 11 respectively to establish a parallel network on the substrate 10, so that each capacitor unit can not only realize current sharing, but also inherit all the advantages thereof due to the adoption of the foregoing overcurrent structure, has higher overcurrent capacity and capacity expansion capacity, and can adapt to the power expansion requirement of the converter device.
The deflector comprises: a first power module, a second power module, and the capacitive module. The capacitance module is used for electrically connecting the first power module to the second power module. The first power module is a rectifying module or a boosting module, and the second power module is an inverting module, so that the capacitor module forms a direct-current bus of the converter device. Because the converter device adopts the capacitor module to connect the power module, the converter device inherits all the advantages and is suitable for power expansion.
Referring to fig. 2, embodiment 2 of the present invention shows an expanded overcurrent structure based on embodiment 1, which is different from embodiment 1 in that the substrate 10 further includes a third lead terminal 14C, and the substrate 10 further defines a plurality of fourth overcurrent paths 13 between the first connection terminal 15A and the third lead terminal 14C.
In embodiment 2, the first lead terminal 14A and the first connection terminal 15A establish a shunting and converging relationship with each first overcurrent path 11, respectively, and the third lead terminal 14C and the first connection terminal 15A establish a converging and shunting relationship with each fourth overcurrent path 13, respectively, so that the third overcurrent path 12 communicates with each fourth overcurrent path 13 through the second overcurrent path 21. It can be seen that in embodiment 2, two states formed by different potentials of the first lead terminal 14A and the second lead terminal 14B in embodiment 1 are combined, and a mirror image structure based on a current direction is added on the basis of embodiment 1, so that the overcurrent structure in embodiment 1 is expanded to be suitable for application in a three-level power topology under the condition of sharing one current carrier 20, and the applicability of the overcurrent structure is improved. It goes without saying that, when a multilevel power topology needs to be built, only the common current carrier 20 needs to be correspondingly added.
Correspondingly, fig. 3 and fig. 5 respectively show a perspective view of the capacitor module of embodiment 2 and a wiring schematic diagram of the substrate 10, and since the main structures of embodiment 2 and embodiment 1 are basically the same, corresponding reference numerals are referred to for understanding thereof, and no further description is given.
The description of the above specification and examples is intended to be illustrative of the scope of the present invention and is not intended to be limiting. Modifications, equivalents and other improvements which may occur to those skilled in the art and which may be made to the embodiments of the invention or portions thereof through a reasonable analysis, inference or limited experimentation, in light of the common general knowledge, the common general knowledge in the art and/or the prior art, are intended to be within the scope of the invention.
Claims (10)
1. The structure of overflowing, its characterized in that includes:
the substrate defines a plurality of first overcurrent paths and a third overcurrent path;
the current-carrying piece is fixedly connected with the substrate and defines a second overcurrent path; the current-carrying piece is electrically connected with the substrate and enables each first overcurrent path to be communicated with the third overcurrent path through the second overcurrent path;
the current-carrying piece is provided with a plate-shaped overflowing part, the overflowing part is perpendicular to the substrate, and at least part of the second overflowing path is defined in the overflowing part.
2. The overcurrent structure as recited in claim 1, wherein: the current-carrying member is entirely in a plate-like configuration, and is disposed perpendicular to the substrate.
3. The overcurrent structure as recited in claim 2, wherein: each first overcurrent path has the same impedance.
4. The overcurrent structure as recited in claim 2 or 3, wherein:
the substrate is provided with a first connecting terminal and a second connecting terminal; the first connecting terminals are positioned at the same end of each first overcurrent path and establish a confluence or shunting relation with each first overcurrent path; the second connecting terminal is positioned at one end of the third overcurrent path;
the current-carrying piece is provided with a first connecting point and a second connecting point which are respectively positioned at two ends of the second overcurrent path; the first connecting point and the second connecting point are respectively and directly electrically connected with the first connecting terminal and the second connecting terminal so as to realize that each first overcurrent path is communicated with the third overcurrent path through the second overcurrent path.
5. The overcurrent structure as recited in claim 4, wherein: the first connecting terminal establishes a confluence relation with each first overcurrent path;
the substrate further defines a plurality of fourth overcurrent paths, and the first connecting terminal is further located at the same end of each fourth overcurrent path and establishes a shunting relationship with the same end so that the third overcurrent path is communicated with each fourth overcurrent path through the second overcurrent path.
6. The overcurrent structure as recited in claim 4, wherein: the substrate is provided with a first lead terminal and a second lead terminal which are respectively used for loading different electric potentials;
the first lead terminal is positioned at one end of each first overcurrent path opposite to the first connecting terminal and establishes a shunting or converging relationship with each first overcurrent path;
the second lead terminal is located at an end of the third overcurrent path opposite to the second connection terminal.
7. The overcurrent structure as recited in claim 6, wherein: a plurality of wiring lines are printed on the substrate;
a plurality of independent sub-overcurrent paths are defined in each wire, the sub-overcurrent paths on different wires are in one-to-one correspondence, and the sub-overcurrent paths corresponding to each other are suitable for being mutually communicated through a power device, so that the sub-overcurrent paths corresponding to each other on different wires jointly form the first overcurrent path;
the first lead terminal and the first connecting terminal are respectively positioned on a wire and communicated with all sub overcurrent paths on the wire, so that each first overcurrent path is defined between the first lead terminal and the first connecting terminal.
8. The overcurrent structure as recited in claim 7, wherein: each routing wire extends along the length direction of the substrate approximately;
the first lead terminal and the second lead terminal are positioned at the same side of each wire, the first lead terminal and the first connecting terminal are respectively positioned at the opposite sides of each wire, and the second connecting terminal is arranged close to the second lead terminal;
the current-carrying piece is arranged along the length direction of the substrate, and each first overcurrent path and each second overcurrent path have approximately opposite overcurrent directions.
9. A capacitive module, comprising:
a flow-through structure as claimed in any one of claims 3 to 8;
the capacitor units are the same and each capacitor unit comprises one capacitor or more than two capacitors connected in series; the capacitor units are borne on the substrate, and each capacitor unit corresponds to one first overcurrent path respectively to establish a parallel network on the substrate.
10. Deflector, characterized by, includes:
a first power module and a second power module;
a capacitive module as claimed in claim 9; the capacitance module is used for electrically connecting the first power module to the second power module;
the first power module is a rectifying module or a boosting module, and the second power module is an inverting module.
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| CN202011184707.4A CN112367760B (en) | 2020-10-29 | 2020-10-29 | Overcurrent structure, capacitor module and converter |
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