CN214228335U - Camera shooting module - Google Patents
Camera shooting module Download PDFInfo
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- CN214228335U CN214228335U CN202120368444.6U CN202120368444U CN214228335U CN 214228335 U CN214228335 U CN 214228335U CN 202120368444 U CN202120368444 U CN 202120368444U CN 214228335 U CN214228335 U CN 214228335U
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- circuit board
- camera module
- mounting
- printed circuit
- hole
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Abstract
The invention relates to a camera module which comprises a lens (1) and a circuit board, wherein the circuit board comprises a circuit board part (2) and a reinforcing flat plate (3) fixed on the circuit board part (21), a mounting boss (11) is arranged at the lower end of the lens (1), a mounting through hole (2a) matched with the mounting boss (11) is formed in the circuit board part (2), and the mounting boss (11) penetrates through the mounting through hole (2a) to be fixedly connected with the reinforcing flat plate (3). According to the camera module, the mounting boss is arranged at the lower end of the lens, the mounting through hole is formed in the circuit board, and the mounting boss of the lens penetrates through the mounting through hole to be directly fixed on the surface of the reinforcing flat plate, so that the assembly mode of the traditional camera module is changed, the temperature drift problem caused by deformation of the circuit board due to temperature influence can be solved, and the resolution and reliability of the camera module are improved.
Description
Technical Field
The invention relates to the technical field of optics, in particular to a camera module.
Background
At present, the market has higher and higher requirements for various camera modules. For example, with the improvement of the intelligent driving registration, the requirements for the resolution, temperature drift stability and reliability of the ADAS (advanced driving assistance system) camera module are also more stringent, and the lens of the existing ADAS camera module is usually directly connected to the circuit board, in this case, because the expansion coefficient difference of the circuit board materials (such as FR4, BT, polyimide, and the like) is large, the deformation is caused by the influence of the operating temperature and the deformation amount is often different, and further the problems of excessive temperature drift of the camera module or difficult compensation of the temperature drift are caused, and finally the consistency of the resolution of the camera module is poor.
Disclosure of Invention
The invention aims to solve the problems and provides a camera module to solve the temperature drift problem caused by different circuit board materials.
In order to achieve the above object, the present invention provides a camera module, which includes a lens and a circuit board, wherein the circuit board includes a circuit board portion and a reinforcing flat plate fixed on the circuit board portion, a mounting boss is disposed at a lower end of the lens, a mounting through hole matched with the mounting boss is disposed on the circuit board portion, and the mounting boss penetrates through the mounting through hole and is fixedly connected with the reinforcing flat plate.
According to an aspect of the present invention, the circuit board portion includes an upper printed circuit board, an upper flexible substrate, a lower flexible substrate, and a lower printed circuit board, which are arranged in this order;
the mounting through hole penetrates through the upper printed circuit board, the upper flexible substrate, the lower flexible substrate and the lower printed circuit board.
According to one embodiment of the present invention, the circuit board portion is provided with a groove, and the groove extends from the upper surface of the upper printed circuit board to the direction of the lower printed circuit board to the upper surface of the lower flexible substrate.
According to one aspect of the invention, the camera module further comprises an image sensor mounted in the recess.
According to one aspect of the invention, the circuit board portion is provided with a blind hole, and the blind hole is cut off from the lower surface of the lower printed circuit board to the lower surface of the lower flexible substrate in the direction of the upper printed circuit board.
According to one aspect of the present invention, the circuit board portion is further provided with a heat dissipation through hole, and the heat dissipation through hole penetrates through the upper printed circuit board, the upper flexible substrate, the lower flexible substrate, and the lower printed circuit board.
According to one aspect of the present invention, the flat stiffener is a steel plate.
According to one aspect of the invention, the mounting boss is adhesively secured to the reinforcement panel.
The invention also provides a manufacturing method of the camera module circuit board, which comprises the following steps:
s1, forming a mounting through hole on the circuit board part;
and S2, fixedly connecting the circuit board part with the mounting through hole with the reinforcing flat plate.
According to the camera module, the mounting boss is arranged at the lower end of the lens, the mounting through hole is formed in the circuit board part, the mounting boss of the lens penetrates through the mounting through hole to be directly fixed on the surface of the reinforcing flat plate, the assembly mode of the traditional camera module is changed, the temperature drift problem caused by deformation of the circuit board due to temperature influence can be solved, and the resolution and reliability of the camera module are improved.
Drawings
FIG. 1 schematically shows a block diagram of a camera module according to an embodiment of the invention;
FIG. 2 is a schematic diagram of a lens and a circuit board in the prior art;
FIG. 3 schematically illustrates a top view of a circuit board section according to one embodiment of the present invention;
fig. 4 schematically shows a top view of a circuit board section according to a second embodiment of the invention;
fig. 5 schematically shows a top view of a circuit board section according to a third embodiment of the invention;
fig. 6 schematically shows a top view of a circuit board section according to a fourth embodiment of the invention;
FIG. 7 is a schematic representation of a block diagram of a wiring board according to the present invention;
fig. 8 schematically shows a top view of a wiring board according to the present invention.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
The present invention is described in detail below with reference to the drawings and the specific embodiments, which are not repeated herein, but the embodiments of the present invention are not limited to the following embodiments.
As shown in fig. 2, the lens support in the prior art is connected to the circuit board on the circuit board, and the disadvantages of this connection method are as follows: due to the fact that materials of the circuit boards are different, deformation quantity of the circuit boards is different due to the influence of working temperature, and further the lens is inclined, so that the center of the lens is not overlapped with the center of the image sensor, and imaging quality is affected.
As shown in fig. 1, the present invention provides a camera module for solving the above problems, which comprises a lens 1 and a circuit board, wherein the circuit board comprises a circuit board portion 2 and a reinforcement plate 3 fixed on the circuit board portion 2.
According to one embodiment of the present invention, the reinforcing plate 3 is adhesively fixed to the lower surface of the circuit board 2, the circuit board portion 2 is provided with a mounting through hole 2a, and the lens 1 is provided at its lower end with a mounting boss 11. The mounting boss 11 of the lens 1 of the present invention passes through the mounting through hole 2a on the circuit board 2 and contacts the surface of the reinforcing plate 3 to be fixedly connected with the reinforcing plate 3.
According to the camera module, the mounting boss 11 is arranged at the lower end of the lens 1, the mounting through hole 2a is arranged on the circuit board 2, so that the mounting boss 11 of the lens 1 penetrates through the mounting through hole 2a to be directly fixed on the surface of the reinforcing flat plate 3, the assembly mode of the traditional camera module is changed, the temperature drift problem caused by deformation of the circuit board 2 due to temperature influence can be solved, and the resolution and reliability of the camera module are improved.
As shown in fig. 3, according to one embodiment of the present invention, the mounting boss 11 of the present invention is provided in a cylindrical structure, the mounting through-hole 2a is provided as a circular through-hole, four mounting through-holes 2a are provided on the wiring board 2, and the four mounting through-holes 2a are provided at four corner positions.
As shown in fig. 4, according to the second embodiment of the present invention, the mounting boss 11 of the present invention is provided in a rectangular parallelepiped structure, the mounting through-hole 2a is provided as a rectangular hole, two mounting through-holes 2a are provided on the wiring board 2, and the two mounting through-holes 2a are provided extending in the width direction of the wiring board 2.
As shown in fig. 5, according to the third embodiment of the present invention, the mounting boss 11 of the present invention is provided in a rectangular parallelepiped structure, the mounting through-hole 2a is provided as a rectangular hole, two mounting through-holes 2a are provided on the wiring board 2, and the two mounting through-holes 2a are provided extending in the longitudinal direction of the wiring board 2.
As shown in fig. 6, according to the fourth embodiment of the present invention, the mounting boss is provided with an L-shaped cross section, and the mounting through hole 2a is adapted to the shape of the mounting boss 11. The four mounting through holes 2a are provided, and are respectively provided at four corners. According to the concept of the present invention, the shapes of the mounting bosses 11 and the mounting through-holes 2a are not limited, and may be, for example, triangular, rhombic, circular truncated, or other irregular shapes.
According to one embodiment of the present invention, the mounting boss 11 of the present invention is fixed to the stiffening plate 3 by bonding, for example, the mounting boss 11 is fixed to the upper surface of the stiffening plate 3 by bonding with an epoxy resin adhesive. The reinforcing flat plate 3 is a steel plate. So set up, the roughness of reinforcement flat plate 3 is better, makes the radiating effect of reinforcement flat plate 3 better simultaneously, can effectively reduce operating temperature and lead to the fact the deformation influence to it.
Referring to fig. 7 and 8, according to one embodiment of the present invention, the wiring board section 2 of the present invention includes an upper printed circuit board 21, an upper flexible substrate 22, a lower flexible substrate 23, and a lower printed circuit board 24, which are arranged in this order. The mounting through-hole 2a of the present invention penetrates the upper printed circuit board 21, the upper flexible substrate 22, the lower flexible substrate 23, and the lower printed circuit board 24.
According to one embodiment of the invention, the circuit board part 2 of the invention is provided with a recess 5, the recess 25 ending from the upper surface of the upper printed circuit board 21 towards the lower printed circuit board 24 to the upper surface of said lower flexible substrate 23. An image sensor is mounted in the recess 25. According to the camera module disclosed by the invention, the image sensor is arranged in the groove 25, so that the axial size of the camera module is favorably reduced.
In addition, the circuit board portion 2 is provided with a blind hole 26, and the blind hole 26 is stopped by the lower surface of the lower printed circuit board 24 extending from the direction of the upper printed circuit board 21 to the lower surface of the lower flexible substrate 23. The blind holes 26 prevent the underfill from overflowing from the bottom of the surface, and further prevent the circuit board from deforming.
The circuit board portion 2 of the present invention is further provided with a heat dissipating through-hole which penetrates the upper printed circuit board 21, the upper flexible substrate 22, the lower flexible substrate 23 and the lower printed circuit board 24. The circuit board is provided with the heat dissipation through holes, so that the circuit board part 2 can be effectively dissipated, and the deformation problem of the circuit board part 2 is reduced.
The invention also provides a preparation method of the camera module circuit board, which comprises the following steps: s1, forming a mounting through-hole 2a in the wiring board part 2; s2, the circuit board 2 having the mounting through hole 2a is fixedly connected to the reinforcing flat plate 3.
Of course, according to the concept of the present invention, the selection of the circuit board portion 2 is not limited, and may be novel for any one of the existing circuit boards, and the circuit boards of different forms are selected according to the method of firstly preparing the installation through hole 2a matched with the installation boss 11, and then fixedly connecting the circuit board portion 2 after the installation through hole 2a is prepared with the reinforcing flat plate 3.
The above description is only one embodiment of the present invention, and is not intended to limit the present invention, and it is apparent to those skilled in the art that various modifications and variations can be made in the present invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a camera module, includes camera lens (1) and circuit board the circuit board includes circuit board portion (2) and fixes reinforcement flat board (3) on the circuit board portion (2), its characterized in that, camera lens (1) lower extreme is equipped with installation base (11), circuit board portion (2) be equipped with installation base (11) assorted mounting hole (2a), installation base (11) pass mounting hole (2a) with reinforcement flat board (3) fixed connection.
2. The camera module according to claim 1, wherein the circuit board portion (2) comprises an upper printed circuit board (21), an upper flexible substrate (22), a lower flexible substrate (23), and a lower printed circuit board (24) arranged in this order;
the mounting through hole (2a) penetrates through the upper printed circuit board (21), the upper flexible substrate (22), the lower flexible substrate (23) and the lower printed circuit board (24).
3. Camera module according to claim 2, characterized in that the circuit board section (2) is provided with a recess (25), which recess (25) ends in the upper surface of the lower flexible substrate (23) from the upper surface of the upper printed circuit board (21) in the direction of the lower printed circuit board (24).
4. The camera module according to claim 3, characterized in that it further comprises an image sensor mounted in the recess (25).
5. The camera module according to claim 2, characterized in that the circuit board portion (2) is provided with blind holes, and the blind holes extend from the lower surface of the lower printed circuit board (24) to the direction of the upper printed circuit board (21) to the lower surface of the lower flexible substrate (23) to be stopped.
6. The camera module according to claim 2, wherein the circuit board portion (2) is further provided with a heat dissipating through hole, and the heat dissipating through hole penetrates through the upper printed circuit board (21), the upper flexible substrate (22), the lower flexible substrate (23), and the lower printed circuit board (24).
7. The camera module according to claim 1, characterized in that the stiffening plate (3) is a steel plate.
8. The camera module according to claim 1 or 7, characterized in that the mounting boss (11) is adhesively fixed to the stiffening flat (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120368444.6U CN214228335U (en) | 2021-02-08 | 2021-02-08 | Camera shooting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120368444.6U CN214228335U (en) | 2021-02-08 | 2021-02-08 | Camera shooting module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214228335U true CN214228335U (en) | 2021-09-17 |
Family
ID=77693297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120368444.6U Active CN214228335U (en) | 2021-02-08 | 2021-02-08 | Camera shooting module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214228335U (en) |
-
2021
- 2021-02-08 CN CN202120368444.6U patent/CN214228335U/en active Active
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