CN220821563U - LED display module and LED display screen - Google Patents
LED display module and LED display screen Download PDFInfo
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- CN220821563U CN220821563U CN202322139782.4U CN202322139782U CN220821563U CN 220821563 U CN220821563 U CN 220821563U CN 202322139782 U CN202322139782 U CN 202322139782U CN 220821563 U CN220821563 U CN 220821563U
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- 229910052760 oxygen Inorganic materials 0.000 abstract description 11
- 239000001301 oxygen Substances 0.000 abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
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Abstract
The application provides an LED display module and an LED display screen, wherein the LED display module comprises a substrate, a limiting structure and a packaging layer, and a plurality of luminous elements are arranged on the substrate; the first end of the limiting structure is connected with the substrate, the second end of the limiting structure is away from the substrate, and the projection area of the first end of the limiting structure projected on the substrate is smaller than the projection area of the second end of the limiting structure projected on the substrate; the packaging layer is connected to the substrate, and the packaging layer and the limiting structure are connected in a clamping mode. When the encapsulation layer will be peeled off towards the opposite base plate of the direction that deviates from the base plate, because limit structure's big end and encapsulation layer block, limit structure can provide effort to offset the stress that receives on the encapsulation layer, prevent the encapsulation layer to peel off from the base plate, thereby make the cohesion of encapsulation layer and base plate stronger, external water oxygen is more difficult to invasion. The LED display screen comprises the LED display module, so that the LED display screen also has the advantage of the LED display module.
Description
Technical Field
The application belongs to the technical field of display equipment, and particularly relates to an LED display module and an LED display screen.
Background
Light Emitting Diodes (LEDs) are solid-state active light sources with the advantages of high brightness, long service life, quick response, environmental protection and the like, and are widely applied to the fields of illumination, display and the like. Along with the combination of the semiconductor micro-nano manufacturing technology and the LED technology, the Mini-LED technology has the advantages that the LED size can be reduced to the micron level, and the LED has a plurality of excellent characteristics, such as high resolution, high color saturation, low energy consumption and the like, and has wide application prospects in the fields of displays, high-definition televisions and the like.
However, mini-LED displays have some problems in practical applications. Since the display itself is assembled from a plurality of cases, smaller dot spacing represents more chip pixels, while more chips means that the probability of chip failure due to water oxygen intrusion will be greater. In addition, the traditional packaging structure is in plane fit with the substrate in a connection mode, so that the problem of falling easily occurs when stress is encountered, and the reliability of the module is affected.
Disclosure of utility model
The embodiment of the application aims to provide an LED display module and an LED display screen, which are used for solving the technical problems that the bonding force between an LED packaging structure and a substrate is insufficient, and the chip is invalid due to water oxygen invasion easily caused in the prior art.
In order to achieve the above purpose, the application adopts the following technical scheme:
The LED display module comprises a substrate, a limiting structure and a packaging layer, wherein a plurality of luminous elements are arranged on the substrate; the first end of the limiting structure is connected with the substrate, the second end of the limiting structure is away from the substrate, and the projection area of the first end of the limiting structure projected on the substrate is smaller than the projection area of the second end of the limiting structure projected on the substrate; the packaging layer is connected to the substrate, and the packaging layer and the limiting structure are in clamping connection with each other.
As a further improvement of the above technical scheme:
Optionally, the limit structure is a limit protrusion connected to the substrate, a first end of the limit protrusion is connected to the substrate, a second end of the limit protrusion is away from the substrate, and a projection area of the first end of the limit protrusion is smaller than a projection area of the limit protrusion on the substrate.
Optionally, the second end of the limiting protrusion is provided with a hook portion, and the projection of the hook portion projected on the substrate is projected outside the projection of the first end of the limiting protrusion.
Optionally, the hook portion is disposed on at least one side of the limit protrusion in a width direction of the limit protrusion.
Optionally, the cross section of the limiting protrusion along the width direction is trapezoidal.
Optionally, the height of the limiting protrusion protruding from the substrate is smaller than the height of the light emitting element protruding from the substrate.
Optionally, the limiting structure and the substrate are of an integrated structure.
Optionally, the number of the limiting structures is multiple, and each limiting structure is arranged on the substrate at intervals.
Optionally, the limiting structure is disposed between each of the light emitting elements.
The application further provides an LED display screen, which comprises the LED display module.
The LED display module and the LED display screen provided by the application have the beneficial effects that:
The application provides an LED display module, which comprises a substrate, a limiting structure and a packaging layer, wherein a plurality of luminous elements are arranged on the substrate; the first end of the limiting structure is connected with the substrate, the second end of the limiting structure is away from the substrate, and the projection area of the first end of the limiting structure projected on the substrate is smaller than the projection area of the second end of the limiting structure projected on the substrate; the packaging layer is connected to the substrate, and the packaging layer and the limiting structure are connected in a clamping mode.
The substrate is a bottom plate of the LED display module, and the substrate specifically comprises a PCB (printed circuit board), a PCBA (printed circuit board assembly) and the like. The light emitting element is mounted on the substrate and bonded to an electrical connection location on the substrate. The limiting structure is connected to the substrate and used for limiting the movement of the packaging layer relative to the substrate. The packaging layer is a layer of coating paved on the surfaces of the substrate, the limiting structure and the luminous piece. The packaging layer is made of one of epoxy resin, organic silicon resin and PP, PET, PVC; the encapsulation layer may be formed by molding, film coating, or dispensing processes. The packaging layer isolates the substrate, the limiting structure and the light emitting piece from the outside, so that the effect of preventing water and oxygen from invading the light emitting piece is achieved.
When the encapsulation layer is subjected to stress and peeled from the substrate, the encapsulation layer will move relative to the substrate in a direction away from the substrate. Because the projection area of the first end of the limiting structure projected on the substrate is smaller, the projection area of the second end of the limiting structure projected on the substrate is larger, namely the first end of the limiting structure is a small end, and the second end of the limiting structure is a large end. When the encapsulation layer will be peeled off towards the opposite substrate of the direction that deviates from the base plate, because limit structure's big end and encapsulation layer block, limit structure can provide effort to offset the stress that receives on the encapsulation layer, prevent the encapsulation layer to peel off from the base plate. The packaging layer is difficult to peel from the substrate under the clamping of the limiting structure, so that the bonding force between the packaging layer and the substrate is stronger, and the light-emitting part is disabled due to the fact that external water and oxygen are more difficult to invade.
The LED display screen provided by the application comprises the LED display module, a shell, a driving module, a heat dissipation structure and the like. The LED display screen provided by the application has the advantages of the LED display module, as a result, the LED display screen also has the advantages of the LED display module.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic cross-sectional structure of an LED display module provided by the present application;
Fig. 2 is a schematic diagram of a partial cross-sectional structure of an LED display module according to the present application;
fig. 3 is a schematic diagram of a partial cross-sectional structure of an LED display module according to the present application;
FIG. 4 is an enlarged partial cross-sectional schematic view of the structure of FIG. 3;
fig. 5 is a schematic diagram of a partial cross-sectional structure of an LED display module according to the present application;
Fig. 6 is a flowchart of manufacturing an LED display module according to the present application.
Wherein, each reference sign in the figure:
1. A substrate; 2. A limit structure;
21. a hook portion; 3. An encapsulation layer;
4. a light emitting member.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the production manufacturing process of the traditional LED display module, as the connection mode between the packaging structure and the substrate is plane lamination, the problem of falling easily occurs when the stress is encountered, and the reliability of the module is affected. Particularly in a Mini-LED display screen, as the display screen is assembled by a plurality of boxes, smaller dot spacing represents more chip pixels, and more chips means that the probability of chip failure caused by water oxygen invasion is larger.
As shown in fig. 1, the application provides an LED display module, which includes a substrate 1, a limiting structure 2 and a packaging layer 3, wherein a plurality of light emitting elements 4 are mounted on the substrate 1; the first end of the limiting structure 2 is connected with the substrate 1, the second end of the limiting structure 2 is away from the substrate 1, and the projection area of the first end of the limiting structure 2 projected on the substrate 1 is smaller than the projection area of the second end of the limiting structure 2 projected on the substrate 1; the packaging layer 3 is connected to the substrate 1, and the packaging layer 3 and the limiting structure 2 are in clamping connection with each other.
The substrate 1 is a bottom plate of an LED display module, and the substrate 1 is specifically a PCB board, a PCBA board, or the like. The light emitting element 4 is mounted on the substrate 1 and bonded to an electrical connection position on the substrate 1. The limiting structure 2 is connected to the substrate 1 and is used for limiting the movement of the encapsulation layer 3 relative to the substrate 1. The packaging layer 3 is a layer of coating paved on the surfaces of the substrate 1, the limiting structure 2 and the luminous element 4. The packaging layer 3 is made of one of epoxy resin, organic silicon resin and PP, PET, PVC; the encapsulation layer 3 may be formed by molding, film coating, dispensing, or the like. The packaging layer isolates the substrate 1, the limiting structure 2 and the light emitting piece 4 from the outside, and plays a role in preventing water and oxygen from invading the light emitting piece 4.
When the encapsulation layer 3 is subjected to stress and peeled off the substrate 1, the encapsulation layer 3 will move relative to the substrate 1 in a direction away from the substrate 1. Since the projection area of the first end of the limiting structure 2 projected on the substrate 1 is smaller, the projection area of the second end of the limiting structure 2 projected on the substrate 1 is larger, that is, the first end of the limiting structure 2 is a small end, and the second end of the limiting structure 2 is a large end. When the encapsulation layer 3 will be peeled off from the substrate 1 in a direction away from the substrate 1, the large end of the limit structure 2 is engaged with the encapsulation layer 3, so that the limit structure 2 can provide an acting force to counteract the stress on the encapsulation layer 3, and prevent the encapsulation layer 3 from peeling off from the substrate 1. The packaging layer 3 is difficult to peel from the substrate 1 under the clamping of the limiting structure 2, so that the bonding force between the packaging layer 3 and the substrate 1 is stronger, and the light emitting piece 4 is more difficult to be disabled due to invasion of external water and oxygen.
As shown in fig. 1, in one embodiment of the present application, the limiting structure 2 is a limiting protrusion connected to the substrate 1, a first end of the limiting protrusion is connected to the substrate 1, a second end of the limiting protrusion faces away from the substrate 1, and a projection area of the first end of the limiting protrusion projected onto the substrate 1 is smaller than a projection area of the limiting protrusion projected onto the substrate 1.
The limiting protrusion is used for being connected with the packaging layer 3 in a clamping mode. Because the projection area of the first end of the limiting boss on the substrate 1 is smaller, the projection area of the second end of the limiting boss on the substrate 1 is larger, i.e. the first end of the limiting boss is a small end, and the second end of the limiting boss is a large end. When the encapsulation layer 3 will be peeled off from the substrate 1 in a direction away from the substrate 1, the large end of the limiting protrusion is engaged with the encapsulation layer 3, so that the limiting protrusion can provide an acting force to counteract the stress on the encapsulation layer 3, and the encapsulation layer 3 is prevented from being peeled off from the substrate 1. The packaging layer 3 is difficult to peel from the substrate 1 under the clamping of the limiting bulge, so that the bonding force between the packaging layer 3 and the substrate 1 is stronger, and the light emitting element 4 is more difficult to be disabled due to invasion of external water and oxygen.
In another embodiment of the present application, the limiting structure 2 may also be a groove disposed on the substrate 1, where an opening end of the groove is located on the surface of the substrate 1, and a bottom end of the groove is recessed in the substrate 1. The projection area of the opening end of the groove projected on the surface of the substrate 1 is smaller than the projection area of the bottom end of the groove projected on the surface of the substrate 1. The packaging layer 3 is blocked by the opening end of the groove and is difficult to peel from the substrate 1, so that the bonding force between the packaging layer 3 and the substrate 1 is stronger, and the light emitting element 4 is more difficult to be disabled due to invasion of external water and oxygen.
As shown in fig. 1 and 4, in one embodiment of the present application, the second end of the limiting protrusion has a hook portion 21, and the projection of the hook portion 21 onto the substrate 1 is projected beyond the projection of the first end of the limiting protrusion onto the substrate 1.
Wherein the hook portion 21 is a portion of the limit projection protruding outward. In the projection direction of projection on the substrate 1, the projection of the hook portion 21 extends out of the projection of the first end of the limiting protrusion, so that the hook portion 21 is clamped against the packaging layer 3.
As shown in fig. 1 and 4, in one embodiment of the present application, the hook portion 21 is disposed on at least one side of the limit projection in the width direction of the limit projection.
The hook portion 21 is disposed on one side or two sides of the limiting protrusion along a width direction of the limiting protrusion, so as to clamp one or two positions of the packaging layer 3.
As shown in fig. 3 and 4, in one embodiment of the present application, the sectional shape of the stopper protrusion in the width direction is a trapezoid.
Wherein the shorter side of the trapezoid is positioned on the surface of the substrate 1, and the longer side of the trapezoid is away from the surface of the substrate 1. The two acute angles of the trapezoid are respectively hook parts 21 arranged at two sides of the limiting bulge. When the cut-off section is in the shape of a right trapezoid, the acute angle of the trapezoid is the hook portion 21 arranged on one side of the limit projection.
In other embodiments, the cut-off shape of the limit projection in the width direction may be T-shaped, L-shaped, V-shaped, Y-shaped, or the like.
As shown in fig. 1, in one embodiment of the present application, since the light emitting element 4 is a main element playing a role in displaying in the LED display module, the height of the limiting protrusion protruding from the substrate 1 should be smaller than the height of the light emitting element 4 protruding from the substrate 1 on the premise of playing a role in limiting, so as to avoid the limiting protrusion from shielding the light emitted by the light emitting element 4.
In one embodiment of the present application, the limiting structure 2 and the base plate 1 are integrally formed.
In order to improve the structural strength between the limiting structure 2 and the substrate 1, the limiting structure 2 and the substrate 1 are arranged into an integrated structure, so that the limiting structure 2 can bear larger acting force, and the bonding effect of the packaging layer 3 and the substrate 1 is better. The limiting structure 2 may be formed on the surface of the substrate 1 by casting or machining.
As shown in fig. 2 and 3, in one embodiment of the present application, the number of the limiting structures 2 is plural, and the limiting structures 2 are arranged on the substrate 1 at intervals from each other.
By arranging a plurality of limit structures 2 to share the acting force received on each limit structure 2, the limit structures 2 are ensured not to be stripped from the substrate 1 due to concentrated pressure, so that the limit structures fail. Meanwhile, the plurality of limiting structures 2 can also increase the clamping area of the packaging layer 3 and the limiting structures 2, so that the clamping connection of the packaging layer 3 and the limiting structures 2 is more stable.
As shown in fig. 1 and 5, in one embodiment of the present application, the limiting structure 2 is disposed between the light emitting members 4. In order to avoid that the peeling stress of the encapsulation layer 3 and the substrate 1 is concentrated between the light emitting pieces 4, a limiting structure 2 is arranged between the light emitting pieces 4 to counteract the stress through the limiting structure 2, so that water oxygen is prevented from invading to the light emitting pieces 4 through gaps between the light emitting pieces 4.
As shown in fig. 2 and 6, in a method for manufacturing an LED display module of the present application, the method includes the steps of:
s1: preparing a planar multilayer circuit board substrate;
S2: the pattern of the limit structure 2 is manufactured on a film negative, the film pattern is transferred to a stuck dry film from exposure angles of different angles by a manufacturing method of a production process of alignment and exposure, and the limit structure 2 is manufactured by a photosensitive principle; the thickness of the limiting structure 2 is 20 mu m, and the material is black acrylic resin;
S3: adopting a printing die bonding mode to fix the LED chip with the size of 4 x 8mil on the solder paste in the functional area; the circuit conduction between the LED chip and the substrate is realized through reflow soldering with the peak temperature of 235 ℃; the circuit conduction between the IC surface component and the substrate is realized through printing, a surface mounting process and reflow soldering;
s4: and (3) mould pressing black packaging adhesive: preparing black resin for encapsulation, adding 20 weight of epoxy material into 1 weight of carbon black, stirring for 10min at a stirring speed of 800rpm by using a magnetic stirrer until the mixture is uniformly stirred, and defoaming the mixture by using a vacuum defoaming machine; pressing a black packaging layer with the thickness of 250 mu m by a mould pressing process, wherein the working temperature is 110 ℃, the pressure is 2500 kg; baking in oven at 150deg.C for 3 hr; cutting redundant process edges on the substrate; the LED display module with high reliability and high contrast can be obtained.
In another manufacturing method of the LED display module of the application, the method comprises the following steps:
s1: preparing a planar multilayer circuit board substrate;
S2: the limiting structure 2 is processed by using an inverted cone milling cutter through a computer numerical control machine tool; the thickness of the limiting structure 2 is 60 mu m, and the material is epoxy glass cloth laminated board;
S3: adopting a printing die bonding mode to fix the LED chip with the size of 4 x 8mil on the solder paste in the functional area; the circuit conduction between the LED chip and the substrate is realized through reflow soldering with the peak temperature of 235 ℃; the circuit conduction between the IC surface component and the substrate is realized through printing, a surface mounting process and reflow soldering;
s4: and (3) mould pressing black packaging adhesive: preparing black resin for encapsulation, adding 20 weight of epoxy material into 1 weight of carbon black, stirring for 10min at a stirring speed of 800rpm by using a magnetic stirrer until the mixture is uniformly stirred, and defoaming the mixture by using a vacuum defoaming machine; pressing a black packaging layer with the thickness of 250 mu m by a mould pressing process, wherein the working temperature is 110 ℃, the pressure is 2500 kg; baking in oven at 150deg.C for 3 hr; cutting redundant process edges on the substrate; the LED display module with high reliability and high contrast can be obtained.
The application also provides an LED display screen, which comprises the LED display module in the embodiment, a shell, a driving module, a heat dissipation structure and the like.
The LED display module is a core component of the LED display screen and is used for emitting light, displaying images and the like. The shell is used for protecting internal components and parts and providing waterproof, dustproof and other functions. The driving module is electrically connected with a light emitting part (LED lamp wick) in the LED display module, provides electric energy for the light emitting part, and is also used for controlling the brightness, color, display content and the like of the display screen. The heat radiation structure is used for discharging heat on the LED display module and preventing the LED display module from overheating.
The LED display screen has the advantages of the LED display module, as the LED display screen has the LED display module.
The foregoing description of the preferred embodiments of the application is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the application.
Claims (10)
1. The LED display module is characterized by comprising a substrate (1), a limiting structure (2) and a packaging layer (3), wherein a plurality of luminous elements (4) are arranged on the substrate (1); the first end of the limiting structure (2) is connected with the substrate (1), the second end of the limiting structure (2) is away from the substrate (1), and the projection area of the first end of the limiting structure (2) projected on the substrate (1) is smaller than the projection area of the second end of the limiting structure (2) projected on the substrate (1); the packaging layer (3) is connected to the substrate (1), and the packaging layer (3) and the limit structure (2) are in clamping connection with each other.
2. The LED display module according to claim 1, wherein the limiting structure (2) is a limiting protrusion connected to the substrate (1), a first end of the limiting protrusion is connected to the substrate (1), a second end of the limiting protrusion is away from the substrate (1), and a projection area of the first end of the limiting protrusion projected onto the substrate (1) is smaller than a projection area of the limiting protrusion projected onto the substrate (1).
3. The LED display module according to claim 2, wherein the second end of the limiting protrusion has a hook portion (21), and the projection of the hook portion (21) projected onto the substrate (1) is projected beyond the projection of the first end of the limiting protrusion projected onto the substrate (1).
4. A LED display module according to claim 3, wherein the hook portion (21) is arranged on at least one side of the limit projection in a width direction of the limit projection.
5. The LED display module of claim 2, wherein the stop protrusion has a trapezoid cross-sectional shape in a width direction.
6. The LED display module according to claim 2, wherein the height of the limit protrusion protruding from the substrate (1) is smaller than the height of the light emitting element (4) protruding from the substrate (1).
7. The LED display module according to any one of claims 1 to 6, wherein the limiting structure (2) is of unitary construction with the substrate (1).
8. The LED display module according to any one of claims 1 to 6, wherein the number of the limiting structures (2) is plural, and the limiting structures (2) are arranged on the substrate (1) at intervals from each other.
9. An LED display module according to claim 8, wherein the limiting structure (2) is arranged between the light emitting members (4).
10. An LED display screen comprising an LED display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322139782.4U CN220821563U (en) | 2023-08-09 | 2023-08-09 | LED display module and LED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322139782.4U CN220821563U (en) | 2023-08-09 | 2023-08-09 | LED display module and LED display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220821563U true CN220821563U (en) | 2024-04-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322139782.4U Active CN220821563U (en) | 2023-08-09 | 2023-08-09 | LED display module and LED display screen |
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| Country | Link |
|---|---|
| CN (1) | CN220821563U (en) |
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- 2023-08-09 CN CN202322139782.4U patent/CN220821563U/en active Active
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