CN214193436U - Metal target welding structure - Google Patents
Metal target welding structure Download PDFInfo
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- CN214193436U CN214193436U CN202023137859.7U CN202023137859U CN214193436U CN 214193436 U CN214193436 U CN 214193436U CN 202023137859 U CN202023137859 U CN 202023137859U CN 214193436 U CN214193436 U CN 214193436U
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Abstract
The utility model provides a metal target welding structure, which comprises a target and a back plate; a positioning groove is formed in the welding surface of the back plate, and a welding flux groove is formed in the positioning groove; and the welding surface and the side surface of the target are respectively and independently provided with a nickel layer, and the height of the nickel layer on the side surface of the target is not more than the depth of the positioning groove. The utility model discloses a setting of positioning groove and solder groove, the installation location of the solder of being convenient for and target, and through the setting of nickel layer, effectively improved the welding bonding rate of target and backplate.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor, a welded structure is related to, especially, relate to a metal target welded structure.
Background
Sputtering is one of the common processes in the field of semiconductor manufacturing, and with the increasing development of sputtering technology, sputtering targets play an increasingly important role in sputtering, and the quality of the sputtering targets directly influences the film-forming quality of subsequent sputtering.
The target material component is composed of a target blank according with sputtering performance and a back plate combined with the target blank through welding. During the sputtering process, the target assembly is in a severe working environment. For example: one side of a back plate of the target material assembly is forced to cool by cooling water with certain pressure, and one side of a target blank is in a high-temperature vacuum environment, so that huge pressure difference is formed between the two opposite layers of the target material assembly; one side of the target blank is bombarded by each particle in the high-voltage electric field and the strong magnetic field, and a large amount of heat is generated. In order to ensure the quality stability of the film and the quality of the target assembly, the requirements on the quality of the target blank and the backing plate and the welding bonding rate are higher and higher, otherwise, the target assembly is easy to deform, crack and the like under the heated condition, so that the film forming quality is influenced, and even the sputtering base station is damaged.
CN 206622765U discloses a target welded structure, including target blank and backplate, be equipped with the boss around the edge of the face of weld of target blank or backplate, form location portion, backplate or target blank can just imbed between the location portion, can realize the convenient, quick location of target blank and backplate. Furthermore, bosses are arranged on the welding surface of the target blank or the back plate along the circumference of the inner side of the positioning part to form an edge supporting part, and the edge supporting part is lower than the positioning part. The groove on the inner side of the edge supporting part is a solder accommodating area, and the thickness of the solder can be ensured under the condition of no wire padding.
However, in the case of soldering, before the target material and the back plate are fastened, the soldering surface of the target material and the back plate needs to be subjected to wetting treatment, that is, solder is attached to the soldering surface of the target material by external force. However, some metal target substrates are not easily wetted with solder due to the special characteristics of the materials.
CN 107570826a discloses a method for manufacturing a target assembly, comprising: providing a titanium target blank and a back plate, wherein the surface to be welded of the titanium target blank is a first welding surface, and the surface to be welded of the back plate is a second welding surface; coating a first solder layer on the first welding surface, wherein the material of the first solder layer is a used recycled material; coating a second solder layer on the first solder layer, wherein the material of the second solder layer is an unused material, and the material of the second solder layer is the same as that of the first solder layer; and arranging and attaching the first welding surface coated with the first welding material layer and the second welding material layer to the second welding surface oppositely, and welding the target blank to the back plate through a welding process to form the target assembly. But the welding bonding rate is influenced by the purity of the first solder layer material, and the impurities existing in the first solder layer material can hardly ensure the stability of the welding bonding rate.
CN 111041431a discloses a method for manufacturing a target assembly, comprising: providing a silicon dioxide target and a metal back plate, wherein the silicon dioxide target is provided with a target welding surface, and the metal back plate is provided with a back plate welding surface; forming a nickel layer on the welding surface of the silicon dioxide target by adopting a plasma spraying process; and welding the nickel layer on the welding surface of the silicon dioxide target and the welding surface of the metal back plate to form the target assembly. The nickel material is a metal which is easy to be infiltrated by solder, the nickel layer can be welded with the metal target material by arranging the nickel layer, but the specific composition and the structure of the nickel layer need to be defined in detail, otherwise, the bonding force between the nickel layer and the substrate is relatively poor.
In view of the above, it is desirable to provide a metal target welding structure that has a simple structure and can achieve a high welding bonding rate.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a metal target welded structure, metal target welded structure's constitution is simple, is convenient for realize, and has higher welding bonding rate when being used for brazing.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a metal target welded structure, metal target welded structure includes target and backplate.
The welding surface of the back plate is provided with a positioning groove, and a welding flux groove is arranged in the positioning groove.
And the welding surface and the side surface of the target are respectively and independently provided with a nickel layer, and the height of the nickel layer on the side surface of the target is not more than the depth of the positioning groove.
The method for respectively and independently arranging the nickel layer on the welding surface and the side surface of the target material comprises the conventional chemical nickel plating and/or electroplating nickel in the field. The nickel layer is arranged on the welding surface and the side surface of the target, the positioning groove and the welding groove are arranged on the welding surface of the back plate, and the welding combination rate of the target and the back plate is improved through the positioning groove, the welding groove and the nickel layer. Moreover, the utility model provides a metal target welded structure's constitution is simple, the machining processing among the practical application of being convenient for.
The target material of the utility model comprises any one of a W target material, a WTi target material, a Ta target material, a Ti target material, a WSi target material, a TaSi target material or a CrSi target material; the backplane includes, but is not limited to, a copper backplane or an aluminum backplane.
Preferably, the positioning groove comprises a circular positioning groove or a square positioning groove.
The shape of the positioning groove corresponds to the shape of the target.
When the target is a circular target, the positioning groove is a circular positioning groove.
When the target is a square target, the positioning groove is a square positioning groove.
Preferably, the target sidewall is spaced from the positioning groove sidewall by a distance of 0.5-1mm, such as 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, but not limited to the values recited, and other values not recited in the range of values are equally applicable.
Preferably, the solder bath comprises a circular solder bath or a square solder bath.
The utility model discloses a set up the solder groove of specific thickness inside positioning groove, can effectively improve the welding bonding rate of target and backplate.
Preferably, the depth of the positioning groove is 1.5-2mm, and may be, for example, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm or 2mm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
Preferably, the depth of the solder bath is 0.2-0.3mm, and may be, for example, 0.2mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm or 0.3mm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
Preferably, the nickel layer has a thickness of 6 to 10 μm, which may be, for example, 6 μm, 7 μm, 8 μm, 9 μm or 10 μm, but is not limited to the values recited, and other values not recited within the range of values are equally applicable.
Preferably, the nickel layer on the side of the target has a height of 1-1.5mm, for example, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm or 1.5mm, but not limited to the values listed, and other values not listed in the numerical range are also applicable.
Preferably, the target sidewall is spaced from the positioning groove sidewall by a distance of 0.5-1mm, such as 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm or 1mm, but not limited to the values recited, and other values not recited in the range of values are equally applicable.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model improves the welding combination rate of the target material and the backboard to more than 97 percent through the arrangement of the positioning groove, the solder groove and the nickel layer; moreover, the utility model provides a metal target welded structure's constitution is simple, the machining processing among the practical application of being convenient for.
Drawings
Fig. 1 is a schematic structural diagram of a backing plate in a metal target welding structure provided in embodiment 1;
fig. 2 is a schematic structural diagram of a target in a metal target welding structure provided in embodiment 1;
fig. 3 is a schematic structural diagram of a metal target welding structure provided in embodiment 4.
Wherein: 1, a back plate; 2, positioning a groove; 3, a solder groove; 4, a target material; 5, nickel layer.
Detailed Description
It is to be understood that in the description of the present invention, the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for the purpose of convenience and simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention.
It should be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected" and "connected" in the description of the present invention are to be construed broadly, and may for example be fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
Example 1
The embodiment provides a metal target welding structure, which includes a target 4 and a back plate 1; the structural schematic diagram of the backing plate 1 is shown in fig. 1, and the structural schematic diagram of the target 4 is shown in fig. 2.
The back plate 1 is a square copper back plate, and the target 4 is a square Ti target.
The welding surface of backplate 1 is provided with positioning groove 2, be provided with solder groove 3 in the positioning groove 2.
The welding surface and the side surface of the target 4 are respectively and independently provided with a nickel layer 5, and the height of the nickel layer 5 on the side surface of the target 4 is not more than the depth of the positioning groove 2.
The positioning groove 2 is a square positioning groove, and the solder groove 3 is a square solder groove.
The depth of the positioning groove 2 is 1.8mm, and the height of the nickel layer 5 on the side surface of the target 4 is 1.2 mm.
The nickel layer 5 has a thickness of 8 μm.
The thickness of the solder groove 3 is 0.25 mm.
The distance between the side wall of the target 4 and the side wall of the positioning groove 2 is 0.8 mm.
In the embodiment, the nickel layer 5 is arranged on the welding surface and the side surface of the target 4, the positioning groove 2 and the solder groove 3 are arranged on the welding surface of the back plate 1, and the welding bonding rate is up to more than 98.6% by arranging the positioning groove 2, the solder groove 3 and the nickel layer 5.
Example 2
The embodiment provides a metal target welding structure, which includes a target 4 and a back plate 1.
The back plate 1 is a square aluminum back plate, and the target 4 is a square W target.
The welding surface of backplate 1 is provided with positioning groove 2, be provided with solder groove 3 in the positioning groove 2.
The welding surface and the side surface of the target 4 are respectively and independently provided with a nickel layer 5, and the height of the nickel layer 5 on the side surface of the target 4 is not more than the depth of the positioning groove 2.
The positioning groove 2 is a square positioning groove, and the solder groove 3 is a square solder groove.
The depth of the positioning groove 2 is 1.5mm, and the height of the nickel layer 5 on the side surface of the target 4 is 1 mm.
The nickel layer 5 has a thickness of 6 μm.
The thickness of the solder groove 3 is 0.2 mm.
The distance between the side wall of the target 4 and the side wall of the positioning groove 2 is 0.5 mm.
In the embodiment, the nickel layer 5 is arranged on the welding surface and the side surface of the target 4, the positioning groove 2 and the solder groove 3 are arranged on the welding surface of the back plate 1, and the welding bonding rate is up to more than 98.8% by arranging the positioning groove 2, the solder groove 3 and the nickel layer 5.
Example 3
The embodiment provides a metal target welding structure, which includes a target 4 and a back plate 1.
The back plate 1 is a square copper back plate, and the target 4 is a square WTi target.
A positioning groove 2 is formed in the welding surface of the back plate 1, and a welding flux groove 3 is formed in the positioning groove 2;
the welding surface and the side surface of the target 4 are respectively and independently provided with a nickel layer 5, and the height of the nickel layer 5 on the side surface of the target 4 is not more than the depth of the positioning groove 2.
The positioning groove 2 is a square positioning groove, and the solder groove 3 is a square solder groove.
The depth of the positioning groove 2 is 2mm, and the height of the nickel layer 5 on the side surface of the target 4 is 1.5 mm.
The nickel layer 5 has a thickness of 10 μm.
The thickness of the solder groove 3 is 0.3 mm.
The distance between the side wall of the target 4 and the side wall of the positioning groove 2 is 1 mm.
In the embodiment, the nickel layer 5 is arranged on the welding surface and the side surface of the target 4, the positioning groove 2 and the solder groove 3 are arranged on the welding surface of the back plate 1, and the welding bonding rate is up to more than 98.5% by arranging the positioning groove 2, the solder groove 3 and the nickel layer 5.
Example 4
The embodiment provides a metal target welding structure, which includes a target 4 and a back plate 1; a schematic structural diagram of the welded structure of the metal target 4 is shown in fig. 3.
The back plate 1 is a circular copper back plate, and the target 4 is a circular Ti target.
A positioning groove 2 is formed in the welding surface of the back plate 1, and a welding flux groove 3 is formed in the positioning groove 2;
the welding surface and the side surface of the target 4 are respectively and independently provided with a nickel layer 5, and the height of the nickel layer 5 on the side surface of the target 4 is not more than the depth of the positioning groove 2.
The positioning groove 2 is a circular positioning groove, and the solder groove 3 is a circular solder groove.
The depth of the positioning groove 2 is 1.8mm, and the height of the nickel layer 5 on the side surface of the target 4 is 1.2 mm.
The nickel layer 5 has a thickness of 8 μm.
The thickness of the solder groove 3 is 0.25 mm.
The distance between the side wall of the target 4 and the side wall of the positioning groove 2 is 0.8 mm.
In the embodiment, the nickel layer 5 is arranged on the welding surface and the side surface of the target 4, the positioning groove 2 and the solder groove 3 are arranged on the welding surface of the back plate 1, and the welding bonding rate is up to more than 99.1% by arranging the positioning groove 2, the solder groove 3 and the nickel layer 5.
In summary, the nickel layer is arranged on the welding surface and the side surface of the target material, the positioning groove and the solder groove are arranged on the welding surface of the back plate, and the welding combination rate of the target material and the back plate is improved to more than 97% by the arrangement of the positioning groove, the solder groove and the nickel layer; moreover, the utility model provides a metal target welded structure's constitution is simple, the machining processing among the practical application of being convenient for.
The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.
Claims (10)
1. A metal target welding structure is characterized by comprising a target and a back plate;
a positioning groove is formed in the welding surface of the back plate, and a welding flux groove is formed in the positioning groove;
and the welding surface and the side surface of the target are respectively and independently provided with a nickel layer, and the height of the nickel layer on the side surface of the target is not more than the depth of the positioning groove.
2. The metal target welding structure according to claim 1, wherein the positioning groove comprises a circular positioning groove or a square positioning groove.
3. The metal target soldering structure according to claim 1 or 2, wherein the solder bath comprises a circular solder bath or a square solder bath.
4. The metal target welding structure according to claim 2, wherein the depth of the positioning groove is 1.5-2 mm.
5. The metal target soldering structure according to claim 3, wherein the depth of the solder groove is 0.2-0.3 mm.
6. The metal target weld structure of claim 1, wherein the nickel layer has a thickness of 6 to 10 μm.
7. The metal target welding structure according to claim 4, wherein the height of the nickel layer on the side face of the target is 1-1.5 mm.
8. The metal target welding structure according to claim 2, wherein the target is a circular target and the positioning groove is a circular positioning groove.
9. The metal target welding structure according to claim 2, wherein the target is a square target and the positioning groove is a square positioning groove.
10. The metal target welding structure according to claim 8 or 9, wherein the distance between the target side wall and the positioning groove side wall is 0.5-1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023137859.7U CN214193436U (en) | 2020-12-23 | 2020-12-23 | Metal target welding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023137859.7U CN214193436U (en) | 2020-12-23 | 2020-12-23 | Metal target welding structure |
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| Publication Number | Publication Date |
|---|---|
| CN214193436U true CN214193436U (en) | 2021-09-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202023137859.7U Active CN214193436U (en) | 2020-12-23 | 2020-12-23 | Metal target welding structure |
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| CN (1) | CN214193436U (en) |
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