CN111455384A - Copper-clad plate with heat dissipation function and manufacturing method thereof - Google Patents
Copper-clad plate with heat dissipation function and manufacturing method thereof Download PDFInfo
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- CN111455384A CN111455384A CN202010352205.1A CN202010352205A CN111455384A CN 111455384 A CN111455384 A CN 111455384A CN 202010352205 A CN202010352205 A CN 202010352205A CN 111455384 A CN111455384 A CN 111455384A
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/02—Light metals
- C23F3/03—Light metals with acidic solutions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/026—Anodisation with spark discharge
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/34—Anodisation of metals or alloys not provided for in groups C25D11/04 - C25D11/32
Abstract
The invention discloses a copper-clad plate with a heat dissipation function and a manufacturing method thereof, relating to the technical field of electronic heat dissipation; the problem that a substrate containing glass cloth is poor in heat conduction effect is solved; the copper-clad plate with the heat dissipation function comprises a base material, wherein an insulating layer is coated on the outer wall of the base material, and a conductor layer is sprayed on the outer wall of the insulating layer; the manufacturing method of the copper-clad plate with the heat dissipation function comprises the following steps: cutting to prepare a base material with any required shape, and selecting the required material of the base material according to the actual requirement, wherein the base material with any shape can be prepared according to the requirement of the prepared product when the base material is prepared, and the base material can be prepared into 2D and 3D shapes. The copper-clad plate can be used for manufacturing plates with any shapes, has good flatness, can quickly conduct and dissipate generated heat, improves the heat conduction rate, does not contain any high-thermal-resistance reinforced fiber material, and has good thermal stability, excellent heat conduction capability and electrical property.
Description
Technical Field
The invention relates to the technical field of electronic heat dissipation, in particular to a copper-clad plate with a heat dissipation function and a manufacturing method thereof.
Background
With the rapid development of electronic and electrical technologies, smart electronic devices such as tablet computers and touch screen mobile phones have increasingly powerful functions, smaller sizes and lighter weight, so that the heat productivity and temperature of the electronic devices are increased, the running stability and speed of the devices are affected, the battery capacity is limited by heat, and the service life of the devices is shortened; particularly for the chip, along with the increase of the running speed of the chip, the heat productivity of the chip increases in a geometric grade manner, and the early heat dissipation adopts active heat dissipation, such as a fan, which is eliminated due to larger volume; the existing main method is to adopt heat-conducting glue and heat-conducting grease to conduct heat to an external metal heat sink, but because the heat conductivity of the heat-conducting glue is lower and is less than 5W/mK, and the metal heat sink is far away from a heating point, the heat dissipation function cannot be well realized.
Through search, the patent with the Chinese patent application number of CN201310630175.6 discloses a copper-clad plate with a heat dissipation function and a manufacturing method thereof. The copper-clad plate with the heat dissipation function and the manufacturing method thereof in the patent have the following defects: the insulating medium layer of the product has high thermal resistance and poor heat conduction effect because the insulating medium layer contains reinforcing materials such as glass cloth and the like with high thermal resistance.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a copper-clad plate with a heat dissipation function and a manufacturing method thereof.
In order to achieve the purpose, the invention adopts the following technical scheme:
the copper-clad plate with the heat dissipation function comprises a base material, wherein an insulating layer is coated on the outer wall of the base material, a conductor layer is sprayed on the outer wall of the insulating layer, the base material is made of any one of aluminum, aluminum alloy, copper alloy and stainless steel with good heat conduction performance, and the thickness of the base material is not less than 0.5 mm; the thickness of the insulating layer is 40-125 μm; the conductor layer is composed of copper foil and a nickel-plated layer arranged on the copper foil.
A method for manufacturing a copper-clad plate with a heat dissipation function comprises the following steps:
s1: cutting to prepare a base material with any required shape, and selecting the required material of the base material according to the actual requirement, wherein the base material with any shape can be prepared according to the requirement of the prepared product when the base material is prepared, and the base material can be prepared into 2D and 3D shapes so as to achieve the optimal heat dissipation effect;
s2: removing burrs and removing sharp corners of the selected base material, and then performing surface sand blasting treatment on the base material by adopting sand with the granularity of more than 250 meshes;
s3: then putting the base material into concentrated phosphoric acid, concentrated nitric acid and glacial acetic acid, wherein the mass ratio of the base material to the glacial acetic acid is 85%: 5%: carrying out chemical polishing in 10% of mixed liquid, keeping the temperature of the chemical polishing at 120 ℃, and taking out the substrate after about 3 minutes;
s4: putting the substrate into 15-20% sulfuric acid solution, taking an aluminum plate as an anode and a carbon rod as a cathode, carrying out anodic oxidation at a voltage of 20V, and then putting the substrate into inorganic pigment aqueous solution at the temperature of 70 ℃ for coloring hole sealing treatment to obtain a ceramic insulating layer wrapped with the substrate;
s5: cleaning and drying by using plasma water, directly performing a plasma spraying process on the ceramic insulating layer, coating an insulating layer with the thickness of 5-25um, and then curing the insulating layer at the temperature of 450 ℃;
s6: placing the substrate with the cured insulating layer into vacuum magnetron sputtering coating equipment, spraying a conductor layer on the outer surface of the insulating layer, wherein the conductor layer comprises a metal layer which is sputtered on the surface of the insulating layer in sequence to serve as a transition layer, a copper alloy layer which is sputtered on the transition layer to serve as a barrier layer, and a main conducting layer which is sputtered on the barrier layer to obtain a finished workpiece;
s7: and carrying out surface treatment on the workpiece, wherein the surface treatment is chemical conversion treatment.
Preferably: the thickness of the sand blasting surface in the S2 is 10-500 nm.
Preferably: the thickness of the ceramic insulating layer in the S4 is 5-20 um, the ceramic insulating layer is completed by adopting one process of micro-arc oxidation, ion spraying, sputtering, evaporation, sol or gel method, and the ceramic insulating layer is metal oxide or metal nitride.
Preferably: the insulating layer is made of Teflon.
Preferably: in the step S6, the metal layer is made of any one of titanium, chromium, nickel, titanium alloy, chromium alloy and nickel alloy, the barrier layer is made of any one of nickel, copper or nickel, and the main conductive layer is made of copper or silver.
Preferably: the transition layer in the S6 is made of metal, alloy and conductive material with stronger activity, such as one of titanium, aluminum, chromium, nickel, titanium alloy, aluminum alloy, chromium alloy and nickel alloy, and the thickness is 100-500A.
Preferably: the barrier layer in the S6 is made of one of nickel, copper or nickel-copper alloy and is deposited by a sputtering process, and the thickness of the barrier layer is 0.3-0.9 um.
Preferably: the main conductive layer is made of copper or silver with good conductivity as a surface manufacturing material and is deposited by a sputtering process, and the thickness of the main conductive layer is 0.2-0.9 um.
Preferably: and the step of S7, namely, forming a protective film for enhancing the corrosion resistance of the magnesium alloy by using magnesium alloy forming treatment liquid.
The invention has the beneficial effects that: the copper clad laminate has the advantages of being capable of manufacturing boards in any shapes, good in flatness, capable of conducting and distributing generated heat as soon as possible, capable of improving heat conduction rate, increasing heat dissipation area and beneficial to heat dissipation of products, thereby improving reliability and service life of terminal products, capable of adapting to various welding modes such as low-temperature welding, high-temperature welding and aluminum wire ultrasonic welding, free of any high-thermal-resistance reinforced fiber material, good in thermal stability, heat conduction capability and electrical performance, high in insulating property, heat dissipation performance, reliability, heat conduction, light in weight, low in cost and the like, capable of manufacturing printed circuits by adopting a conventional solution corrosion process, and low in processing difficulty.
Drawings
FIG. 1 is a schematic diagram of a cross-sectional structure of a copper-clad plate with a heat dissipation function according to the present invention;
FIG. 2 is a schematic view of the flow structure of embodiment 1 of a copper-clad plate with heat dissipation function and manufacturing method thereof according to the present invention;
fig. 3 is a schematic view of the flow structure of embodiment 2 of the copper-clad plate with heat dissipation function and the manufacturing method thereof provided by the invention.
In the figure: 1 substrate, 2 insulating layers, 3 conductor layers.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.
In the description of this patent, it is to be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for the convenience of describing the patent and for the simplicity of description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the patent.
In the description of this patent, it is noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "disposed" are to be construed broadly and can include, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in this patent may be understood by those of ordinary skill in the art as appropriate.
Example 1:
a copper-clad plate with a heat dissipation function is shown in figure 1 and comprises a substrate 1, wherein an insulating layer 2 is coated on the outer wall of the substrate 1, a conductor layer 3 is sprayed on the outer wall of the insulating layer 2, the substrate 1 is made of any one of aluminum, aluminum alloy, copper alloy and stainless steel with good heat conduction performance, and the thickness of the substrate 1 is not less than 0.5 mm; the thickness of the insulating layer 2 is 40-125 μm; the conductor layer 3 is composed of copper foil and a nickel plating layer, a zinc plating layer or a brass plating layer arranged on the copper foil.
A manufacturing method of a copper-clad plate with a heat dissipation function is shown in figure 2 and comprises the following steps:
s1: cutting to prepare a base material 1 with any required shape, and selecting the required material of the base material 1 according to the actual requirement, wherein the base material 1 with any shape can be prepared into any shape of base materials 1, 2D and 3D according to the requirement of the prepared product when the base material 1 is prepared, so that the optimal heat dissipation effect can be achieved;
s2: removing burrs and trimming sharp corners of the selected base material 1, and then performing surface sand blasting treatment on the base material 1 by adopting sand with the granularity of more than 250 meshes;
s3: then putting the base material 1 into concentrated phosphoric acid, concentrated nitric acid and glacial acetic acid, wherein the mass ratio of the base material to the glacial acetic acid is 85%: 5%: carrying out chemical polishing in 10% of mixed liquid, keeping the temperature of the chemical polishing at about 120 ℃, and taking out the substrate 1 after about 3 minutes;
s4: putting the substrate 1 into 15-20% sulfuric acid solution, taking an aluminum plate as an anode and a carbon rod as a cathode, carrying out anodic oxidation at a voltage of 20V, and then putting the substrate into 70 ℃ inorganic pigment aqueous solution for coloring hole sealing treatment to obtain a ceramic insulating layer wrapped with the substrate 1;
s5: cleaning and drying by using plasma water, directly performing a plasma spraying process on the ceramic insulating layer, coating a layer of insulating layer 2 with the thickness of 5-25um, and then curing the insulating layer 2 at the temperature of 450 ℃;
s6: placing the substrate 1 with the insulating layer 2 solidified into vacuum magnetron sputtering coating equipment, spraying a conductor layer 3 on the outer surface of the insulating layer 2, wherein the conductor layer 3 comprises a metal layer sputtered on the surface of the insulating layer 2 in sequence as a transition layer, a copper alloy layer sputtered on the transition layer as a barrier layer, and a main conducting layer sputtered on the barrier layer to obtain a finished workpiece;
s7: and carrying out surface treatment on the workpiece, wherein the surface treatment is chemical conversion treatment.
The thickness of the sand blasting surface in the S2 is 10-500 nm.
The thickness of the ceramic insulating layer in the S4 is 5-20 um, the ceramic insulating layer is completed by adopting one process of micro-arc oxidation, ion spraying, sputtering, evaporation, sol or gel method, and the ceramic insulating layer is metal oxide or metal nitride.
The insulating layer 2 is made of Teflon.
In the step S6, the metal layer is made of any one of titanium, chromium, nickel, titanium alloy, chromium alloy and nickel alloy, the barrier layer is made of any one of nickel, copper or nickel, and the main conductive layer is made of copper or silver.
The transition layer in the S6 is made of metal, alloy and conductive material with strong activity, such as one of titanium, aluminum, chromium, nickel, titanium alloy, aluminum alloy, chromium alloy and nickel alloy, the thickness is 100-500A, the expansion coefficient of the metal and Teflon can be well matched, and the internal stress is reduced.
The barrier layer in the S6 is made of one of nickel, copper or nickel-copper alloy and is deposited by a sputtering process, the thickness of the barrier layer is 0.3-0.9 um, and the corrosion of the high-temperature lead-free solder is effectively blocked.
The main conductive layer is made of copper or silver with good conductivity as a surface manufacturing material and is deposited by a sputtering process, and the thickness of the main conductive layer is 0.2-0.9 um.
The S7 neutralization treatment is to use magnesium alloy neutralization treatment liquid to form a protective film for enhancing the corrosion resistance of the magnesium alloy, thereby preventing the magnesium alloy from generating corrosion in the atmosphere.
| Serial number | Performance of | Unit of | Examples |
| 1 | Thermal conductivity | W/(m·K) | 2.5 |
| 2 | Dielectric constant 750MHZ | C^2/(N*M^2) | 4.7 |
| 3 | Dielectric loss 750MHZ | / | 0.0164 |
| 4 | Dip soldering resistance of 300 DEG C | s | 25 |
| 5 | Flatness of the steel sheet | / | Uniformity |
The copper-clad plate manufactured by the embodiment has good flatness, does not contain any high-thermal-resistance reinforced fiber material, has high thermal conductivity, increases the heat dissipation area, and is beneficial to heat dissipation of products, thereby improving the reliability and the service life of terminal products, maintaining the dielectric property of the copper-clad plate, having high insulativity, having long dip-soldering resistant time of the material at 300 ℃ in experiments, and being capable of adapting to various welding modes.
Example 2:
a copper-clad plate with a heat dissipation function is shown in figure 1 and comprises a substrate 1, wherein an insulating layer 2 is coated on the outer wall of the substrate 1, a conductor layer 3 is sprayed on the outer wall of the insulating layer 2, the substrate 1 is made of any one of aluminum, aluminum alloy, copper alloy and stainless steel with good heat conduction performance, and the thickness of the substrate 1 is not less than 0.5 mm; the thickness of the insulating layer 2 is 40-125 μm; the conductor layer 3 is composed of copper foil and a nickel plating layer, a zinc plating layer or a brass plating layer arranged on the copper foil.
A manufacturing method of a copper-clad plate with a heat dissipation function is shown in figure 3 and comprises the following steps:
s1: cutting to prepare a base material 1 with any required shape, and selecting the required material of the base material 1 according to the actual requirement, wherein the base material 1 with any shape can be prepared into any shape of base materials 1, 2D and 3D according to the requirement of the prepared product when the base material 1 is prepared, so that the optimal heat dissipation effect can be achieved;
s2: removing burrs and trimming sharp corners of the selected base material 1, and then performing surface sand blasting treatment on the base material 1 by adopting sand with the granularity of more than 250 meshes;
s3: then putting the base material 1 into concentrated phosphoric acid, concentrated nitric acid and glacial acetic acid, wherein the mass ratio of the base material to the glacial acetic acid is 85%: 5%: carrying out chemical polishing in 10% of mixed liquid, keeping the temperature of the chemical polishing at about 120 ℃, and taking out the substrate 1 after about 3 minutes;
s4: putting the substrate 1 into 15-20% sulfuric acid solution, taking an aluminum plate as an anode and a carbon rod as a cathode, carrying out anodic oxidation at a voltage of 20V, and then putting the substrate into 70 ℃ inorganic pigment aqueous solution for coloring hole sealing treatment to obtain a ceramic insulating layer wrapped with the substrate 1;
s5: cleaning and drying by using plasma water, directly performing a plasma spraying process on the ceramic insulating layer, coating a layer of insulating layer 2 with the thickness of 5-25um, and then curing the insulating layer 2 at the temperature of 450 ℃;
s6: placing the substrate 1 with the insulating layer 2 solidified into vacuum magnetron sputtering coating equipment, spraying a conductor layer 3 on the outer surface of the insulating layer 2, wherein the conductor layer 3 comprises a metal layer sputtered on the surface of the insulating layer 2 in sequence as a transition layer, a copper alloy layer sputtered on the transition layer as a barrier layer, and a main conducting layer sputtered on the barrier layer;
s7: plating a copper or silver layer with the thickness of 1-3um on the main conductive layer by adopting an electroplating process to be used as a surface conductive layer to obtain a finished workpiece;
s8: and carrying out surface treatment on the workpiece, wherein the surface treatment is chemical conversion treatment.
The thickness of the sand blasting surface in the S2 is 10-500 nm.
The thickness of the ceramic insulating layer in the S4 is 5-20 um, the ceramic insulating layer is completed by adopting one process of micro-arc oxidation, ion spraying, sputtering, evaporation, sol or gel method, and the ceramic insulating layer is metal oxide or metal nitride.
The insulating layer 2 is made of Teflon.
In the step S6, the metal layer is made of any one of titanium, chromium, nickel, titanium alloy, chromium alloy and nickel alloy, the barrier layer is made of any one of nickel, copper or nickel, and the main conductive layer is made of copper or silver.
The transition layer in the S6 is made of metal, alloy and conductive material with strong activity, such as one of titanium, aluminum, chromium, nickel, titanium alloy, aluminum alloy, chromium alloy and nickel alloy, the thickness is 100-500A, the expansion coefficient of the metal and Teflon can be well matched, and the internal stress is reduced.
The barrier layer in the S6 is made of one of nickel, copper or nickel-copper alloy and is deposited by a sputtering process, the thickness of the barrier layer is 0.3-0.9 um, and the corrosion of the high-temperature lead-free solder is effectively blocked.
The main conductive layer is made of copper or silver with good conductivity as a surface manufacturing material and is deposited by a sputtering process, and the thickness of the main conductive layer is 0.2-0.9 um.
In the step S7, a copper or silver layer with the thickness of 1-3um is further plated by a magnetron sputtering method under the same vacuum condition to serve as a surface conductive layer, so that the conductive capability of the composite conductive metal layer is improved.
The S8 neutralization treatment is to use magnesium alloy neutralization treatment liquid to form a protective film for enhancing the corrosion resistance of the magnesium alloy, thereby preventing the magnesium alloy from generating corrosion in the atmosphere.
| Serial number | Performance of | Unit of | Examples |
| 1 | Thermal conductivity | W/(m·K) | 2.3 |
| 2 | Dielectric constant 750MHZ | C^2/(N*M^2) | 4.67 |
| 3 | Dielectric loss 750MHZ | / | 0.0163 |
| 4 | Dip soldering resistance of 300 DEG C | s | 23 |
| 5 | Flatness of the steel sheet | / | Uniformity |
When the copper clad laminate is used, plates in any shapes can be manufactured, the manufactured copper clad laminate is good in flatness, generated heat can be conducted and distributed as soon as possible, the heat conduction rate is improved, the heat dissipation area is increased, and the heat dissipation of the product is facilitated, so that the reliability and the service life of a terminal product are improved, the dip-soldering resistant time of the material at 300 ℃ in an experiment is long, the copper clad laminate can adapt to various welding modes such as low-temperature welding, high-temperature welding and aluminum wire ultrasonic welding, does not contain any high-thermal-resistance reinforced fiber material, has good thermal stability, good heat conduction capability and electrical performance, has the advantages of being high in insulating property, good in heat dissipation performance, good in reliability, good in heat conduction, light in weight, low in cost and the like, a printed circuit can be manufactured by adopting a conventional solution corrosion process.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (10)
1. The copper-clad plate with the heat dissipation function comprises a base material (1), and is characterized in that an insulating layer (2) is coated on the outer wall of the base material (1), a conductor layer (3) is sprayed on the outer wall of the insulating layer (2), the base material (1) is made of any one of aluminum, aluminum alloy, copper alloy and stainless steel with good heat conduction performance, and the thickness of the base material (1) is not less than 0.5 mm; the thickness of the insulating layer (2) is 40-125 μm; the conductor layer (3) is composed of copper foil and a nickel-plated layer arranged on the copper foil.
2. A manufacturing method of a copper-clad plate with a heat dissipation function is characterized by comprising the following steps:
s1: cutting to prepare a base material (1) with any required shape, and selecting the required material of the base material (1) according to the actual requirement, wherein the base material (1) with any shape can be prepared according to the requirement of the prepared product when the base material (1) is prepared, and the 2D shape and the 3D shape can be both used, so that the optimal heat dissipation effect can be achieved;
s2: removing burrs and trimming sharp corners of the selected base material (1), and then performing surface sand blasting treatment on the base material (1) by adopting sand with the granularity of more than 250 meshes;
s3: then putting the base material (1) into concentrated phosphoric acid, concentrated nitric acid and glacial acetic acid according to the mass ratio of 85%: 5%: carrying out chemical polishing in 10% mixed liquid, wherein the temperature of the chemical polishing is kept at 120 ℃, and taking out the substrate (1) after about 3 minutes;
s4: putting the substrate (1) into 15-20% sulfuric acid solution, using an aluminum plate as an anode and a carbon rod as a cathode, carrying out anodic oxidation at a voltage of 20V, and then putting the substrate into 70 ℃ inorganic pigment aqueous solution for coloring and hole sealing treatment to obtain a ceramic insulating layer coated with the substrate (1);
s5: cleaning and drying by using plasma water, directly performing a plasma spraying process on the ceramic insulating layer, coating an insulating layer (2) with the thickness of 5-25um, and then curing the insulating layer (2) at the temperature of 450 ℃;
s6: placing the substrate (1) with the insulating layer (2) solidified into vacuum magnetron sputtering coating equipment, spraying a conductor layer (3) on the outer surface of the insulating layer (2), wherein the conductor layer (3) comprises a metal layer which is sputtered on the surface of the insulating layer (2) in sequence to serve as a transition layer, a copper alloy layer which is sputtered on the transition layer to serve as a barrier layer, and a main conductive layer which is sputtered on the barrier layer to obtain a finished workpiece;
s7: and carrying out surface treatment on the workpiece, wherein the surface treatment is chemical conversion treatment.
3. The method for manufacturing the copper-clad plate with the heat dissipation function according to claim 2, wherein the thickness of the sand blasting surface in the step S2 is 10-500 nm.
4. The method for manufacturing the copper-clad plate with the heat dissipation function according to claim 3, wherein the thickness of the ceramic insulating layer in S4 is 5-20 μm, the ceramic insulating layer is formed by one of micro-arc oxidation, ion spraying, sputtering, evaporation, sol or gel method, and the ceramic insulating layer is metal oxide or metal nitride.
5. The manufacturing method of the copper-clad plate with the heat dissipation function according to claim 4, wherein the insulating layer (2) is made of Teflon.
6. The method for manufacturing the copper-clad plate with the heat dissipation function according to claim 2, wherein the metal layer in S6 is made of any one of titanium, chromium, nickel, titanium alloy, chromium alloy and nickel alloy, the barrier layer is made of any one of nickel, copper or nickel, and the main conductive layer is made of copper or silver.
7. The method for manufacturing the copper-clad plate with the heat dissipation function according to claim 6, wherein the transition layer in S6 is made of a metal, an alloy and a conductive material with high activity, such as one of titanium, aluminum, chromium, nickel, a titanium alloy, an aluminum alloy, a chromium alloy and a nickel alloy, and has a thickness of 100-500A.
8. The method for manufacturing the copper-clad plate with the heat dissipation function according to claim 7, wherein the barrier layer in S6 is made of one of nickel, copper or nickel-copper alloy and deposited by a sputtering process, and the thickness is 0.3-0.9 um.
9. The method for manufacturing the copper-clad plate with the heat dissipation function according to claim 8, wherein the main conductive layer is made of a surface manufacturing material of copper or silver with good conductivity by a sputtering process, and the thickness of the main conductive layer is 0.2-0.9 um.
10. The method for manufacturing the copper-clad plate with the heat dissipation function according to claim 5, wherein the chemical conversion treatment in S7 is magnesium alloy chemical conversion treatment liquid to form a protective film for enhancing the corrosion resistance of magnesium alloy.
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|---|---|---|---|
| CN202010352205.1A CN111455384A (en) | 2020-04-28 | 2020-04-28 | Copper-clad plate with heat dissipation function and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010352205.1A CN111455384A (en) | 2020-04-28 | 2020-04-28 | Copper-clad plate with heat dissipation function and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111485192A (en) * | 2020-05-15 | 2020-08-04 | 上海大学 | Preparation method of composite coating |
| WO2023272492A1 (en) * | 2021-06-28 | 2023-01-05 | 沈伟 | Vapor chamber having high heat absorption properties and preparation method therefor |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06101043A (en) * | 1992-09-21 | 1994-04-12 | Sumitomo Metal Ind Ltd | Al alloy plated metallic material excellent in corrosion resistance in edge face and its production |
| CN200941382Y (en) * | 2006-08-31 | 2007-08-29 | 焦作市恒元电子材料有限公司 | High heat transferring metal-base copper coated board |
| CN101521988A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Preparation method of metal base copper-clad plate and copper-clad sectional material |
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2020
- 2020-04-28 CN CN202010352205.1A patent/CN111455384A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06101043A (en) * | 1992-09-21 | 1994-04-12 | Sumitomo Metal Ind Ltd | Al alloy plated metallic material excellent in corrosion resistance in edge face and its production |
| CN200941382Y (en) * | 2006-08-31 | 2007-08-29 | 焦作市恒元电子材料有限公司 | High heat transferring metal-base copper coated board |
| CN101521988A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Preparation method of metal base copper-clad plate and copper-clad sectional material |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111485192A (en) * | 2020-05-15 | 2020-08-04 | 上海大学 | Preparation method of composite coating |
| WO2023272492A1 (en) * | 2021-06-28 | 2023-01-05 | 沈伟 | Vapor chamber having high heat absorption properties and preparation method therefor |
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Application publication date: 20200728 |