CN214176407U - Laser chip packaging structure - Google Patents
Laser chip packaging structure Download PDFInfo
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- CN214176407U CN214176407U CN202120002788.5U CN202120002788U CN214176407U CN 214176407 U CN214176407 U CN 214176407U CN 202120002788 U CN202120002788 U CN 202120002788U CN 214176407 U CN214176407 U CN 214176407U
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Abstract
The utility model discloses a laser chip packaging structure, through the pin subassembly is electrically conductive, the encapsulation subassembly sends laser, fixed connection on the laser tube seat the spacing collar, cap edge block advances in the spacing collar, and then fixes on the laser tube seat, seal the encapsulation subassembly, the welding union coupling the cap, and run through the laser tube seat is injectd the cap position, lens are fixed on the cap, and with the encapsulation subassembly keeps coaxial, sees through lens send laser, can directly dismantle after having tested the axiality down the cap is fixed again the position of LD chip adjusts the axiality, and the adjustment is accomplished the back through the heating the welding pipe is fixed the cap need not to dismantle the good laser of welding with regard to adjustable axiality completely, reduces intensity of labour.
Description
Technical Field
The utility model relates to a chip package technical field especially relates to laser chip packaging structure.
Background
The coaxiality of the laser optical waveguide and the packaging tube cap lens is higher, the optical power coupled into the optical fiber is higher, the using effect is better, the product is directly placed on a resistance welding machine to be welded in the prior art, the coaxiality is guaranteed through the mechanical precision of a welding clamp, therefore, the accuracy of the coaxiality cannot be directly determined, and a conclusion needs to be obtained after the test.
If the laser needs to be debugged after testing, the pipe cap needs to be disassembled, and the welded laser is difficult to disassemble, so that the labor intensity is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a laser instrument chip packaging structure aims at solving the laser instrument dismantlement difficulty after the welding among the prior art, leads to intensity of labour's increase's technical problem.
In order to achieve the above object, the present invention provides a laser chip package structure, which includes a laser tube seat, a spacing ring, a welding tube, a tube cap, a lens, a package assembly and a pin assembly;
the laser tube base is provided with a transitional heat sink, the transitional heat sink is positioned on one side of the laser tube base, the limiting ring is fixedly connected with the laser tube base and positioned on one side of the laser tube base away from the transitional heat sink, an accommodating space is formed between the limiting ring and the laser tube base, the tube cap is clamped with the limiting ring and positioned in the accommodating space, one side of the welded tube is fixedly connected with the tube cap, the other side of the welded tube penetrates through the laser tube base, the lens is fixedly connected with the tube cap and positioned on one side of the laser tube base away from the tube cap, the tube cap penetrates through the tube cap, the packaging assembly is fixedly connected with the laser tube base, and the pin assembly is fixedly connected with the laser tube base.
Wherein, the spacing collar has the spout, the spout is located the spacing collar is close to one side of pipe cap.
The packaging assembly comprises an LD chip, a ceramic gasket and an MPD chip, the LD chip is fixedly connected with the transition heat sink and is positioned on one side of the transition heat sink far away from the laser tube seat, the ceramic gasket is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat far away from the transition heat sink, and the MPD chip is fixedly connected with the ceramic gasket and is positioned on one side of the ceramic gasket far away from the laser tube seat.
The pin assembly comprises a first LD pin, a second LD pin, a first MPD pin, a second MPD pin and a grounding pin, the first LD pin is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat close to the transitional heat sink, the second LD pin is fixedly connected with the laser tube seat and is symmetrically arranged in parallel relative to the first LD pin, the first MPD pin is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat close to the ceramic gasket, the second MPD pin is fixedly connected with the laser tube seat and is symmetrically arranged in parallel relative to the first MPD pin, and the grounding pin is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat far away from the MPD chip.
The laser tube seat is provided with a welding groove, and the welding groove is positioned on one side, far away from the tube cap, of the laser tube seat.
The tube cap is provided with an adjusting hole, and the adjusting hole is positioned on one side, close to the lens, of the tube cap.
The tube cap is provided with a positioning hole, and the positioning hole is positioned on one side, far away from the lens, of the tube cap.
The utility model discloses a laser chip packaging structure, through the pin subassembly is electrically conductive, the encapsulation subassembly sends laser, fixed connection on the laser tube seat the spacing collar, cap edge block advances in the spacing collar, and then fixes on the laser tube seat, seal the encapsulation subassembly, the welding union coupling the cap, and run through the laser tube seat is injectd the cap position, lens are fixed on the cap, and with the encapsulation subassembly keeps coaxial, sees through lens send laser, can directly dismantle after having tested the axiality down the cap is fixed again the position of LD chip adjusts the axiality, and the adjustment is accomplished the back through the heating the welding pipe is fixed the cap need not to dismantle the laser instrument that welds well with regard to adjustable axiality completely, reduces intensity of labour.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of the laser chip package structure of the present invention.
Fig. 2 is a schematic view of the internal structure of the pipe cap of the present invention.
Fig. 3 is a schematic bottom view of the laser chip package structure of the present invention.
Fig. 4 is a top view of the interior of the cap of the present invention.
The laser chip packaging structure comprises a 1-laser tube seat, a 2-limiting ring, a 3-tube cap, a 4-welding tube, a 5-lens, a 10-packaging assembly, an 11-LD chip, a 12-ceramic gasket, a 13-MPD chip, a 20-pin assembly, a 21-first LD pin, a 22-second LD pin, a 23-first MPD pin, a 24-second MPD pin, a 25-grounding pin, a 100-laser chip packaging structure, a 101-transition heat sink, a 102-welding groove, a 201-containing space, a 202-sliding groove, a 301-adjusting hole and a 302-adjusting hole.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The first embodiment is as follows:
referring to fig. 1 to 4, the present invention provides a laser chip package structure 100, which includes a laser tube seat 1, a limiting ring 2, a tube cap 3, a welding tube 4, a lens 5, a package assembly 10 and a pin assembly 20;
the laser tube seat 1 is provided with a transition heat sink 101, the transition heat sink 101 is positioned at one side of the laser tube seat 1, the limiting ring 2 is fixedly connected with the laser tube seat 1, and is positioned at one side of the laser tube seat 1 far away from the transitional heat sink 101, and forms an accommodating space 201 with the laser tube seat 1, the tube cap 3 is clamped with the spacing ring 2, and is positioned in the accommodating space 201, one side of the welding pipe 4 is fixedly connected with the pipe cap 3, the other side of the welding tube 4 penetrates through the laser tube seat 1, the lens 5 is fixedly connected with the tube cap 3, and is positioned on one side of the tube cap 3 far away from the laser tube seat 1 and penetrates through the tube cap 3, the packaging assembly 10 is fixedly connected with the laser tube seat 1, and the pin assembly 20 is fixedly connected with the laser tube seat 1.
In this embodiment, the package assembly 10 is mounted on the laser tube base 1, the pin assembly 20 penetrates through the laser tube base 1 and is electrically connected to the package assembly 10, the package assembly 10 is driven to emit laser light by conduction, the spacing ring 2 is fixedly connected to the laser tube base 1 and is made of rubber, the spacing ring 2 surrounds the package assembly 10, the edge of the tube cap 3 is clamped into the spacing ring and is further fixed on the laser tube base 1 to seal the package assembly 10, the welding tube 4 is connected to the tube cap 3 and penetrates through the laser tube base 1 to strengthen and limit the position of the tube cap 3, the lens 5 is fixed on the tube cap 3 to allow the package assembly 10 to transmit laser light through the lens 5, and after mounting, testing is performed, if debugging is required, the tube cap 3 is directly dismounted, conveniently adjust the position of encapsulation subassembly 10 makes lens 5 with the axiality of encapsulation subassembly 10 is more accurate, and the test is accomplished the back, welding pipe 4 adopts silver material to make, and the heating melts the back direct will cap with pipe 3 welding is in on the laser tube seat 1, the encapsulation is simple and convenient, need not hard when guaranteeing to adjust the axiality during the time spent and dismantles down cap with pipe 3 reduces intensity of labour.
Further, referring to fig. 2, the retainer 2 has a sliding groove 202, and the sliding groove 202 is located on a side of the retainer 2 close to the pipe cap 3.
In this embodiment, the sliding groove 202 on the limiting ring 2 is matched with the pipe cap 3, so that the edge of the pipe cap 3 is clamped into the limiting ring 2, and then coaxial detection can be performed after direct installation, when a chip in the pipe cap 3 needs to be adjusted, the pipe cap 3 can be directly disassembled, the operation is simple and convenient, and the labor intensity is reduced.
Further, referring to fig. 2, the package assembly 10 includes an LD chip 11, a ceramic pad 12 and an MPD chip 13, the LD chip 11 is fixedly connected to the transition heat sink 101 and is located on a side of the transition heat sink 101 away from the laser tube holder 1, the ceramic pad 12 is fixedly connected to the laser tube holder 1 and is located on a side of the laser tube holder 1 away from the transition heat sink 101, and the MPD chip 13 is fixedly connected to the ceramic pad 12 and is located on a side of the ceramic pad 12 away from the laser tube holder 1.
In this embodiment, the LD chip 11 is welded to the transition heat sink 101 and connected to the transition heat sink 101 through a wire, the transition heat sink 101 has a heat conducting effect, which is beneficial to prolonging the service life of the LD chip 11, and meanwhile, the transition heat sink 101 is connected to the laser tube base 1 without being mounted like a 10G laser package, which is convenient to package, the MPD chip 13 is mounted on the laser tube base 1 through the ceramic gasket 12, the ceramic gasket 12 is used to adjust the height of the MPD chip 13, which is beneficial to improving the coaxiality, and meanwhile, the MPD chip 13 has a heat dissipation function, which prolongs the service life of the MPD chip 13.
Further, referring to fig. 2 and 4, the pin assembly 20 includes a first LD pin 21, a second LD pin 22, a first MPD pin 23, a second MPD pin 24 and a ground pin 25, where the first LD pin 21 is fixedly connected to the laser tube holder 1 and located on one side of the laser tube holder 1 close to the transition heat sink 101, the second LD pin 22 is fixedly connected to the laser tube holder 1 and symmetrically disposed in parallel with respect to the first LD pin 21, the first MPD pin 23 is fixedly connected to the laser tube holder 1 and located on one side of the laser tube holder 1 close to the ceramic pad 12, and the second MPD pin 24 is fixedly connected to the laser tube holder 1 and located opposite to the first MPD pin23Arranged in parallel and symmetrically, the grounding pin 25 is fixedly connected with the laser tube seat 1 and is positioned on the laser tube seat 1 away from the MPD chip 13To one side of (a).
In this embodiment, the first LD lead21 and the second LD pin22The first MPD pin 23 and the second MPD pin 24 are respectively and electrically connected with the LD chip 11, the MPD chip 13 and the grounding pin 25 penetrate through the laser tube seat 1, and a pin is added compared with 1.25G, 2.5G and 10G laser packages, so that high-frequency interference is reduced.
Further, referring to fig. 3, the laser tube holder 1 further has a welding groove 102, and the welding groove 102 is located on a side of the laser tube holder 1 away from the cap 3.
In this embodiment, the welding groove 102 is arranged opposite to the welding pipe 4 and is located on the ground of the laser pipe seat 1, the welding pipe 4 is connected with the pipe cap 3 and penetrates through the laser pipe seat 1, the pipe cap 3 is limited on the laser, the welding pipe 4 is made of silver materials, the welding pipe 4 is melted after the lens 5 and the LD chip 11 are kept coaxial, the pipe cap 3 is directly welded on the laser pipe seat 1, the operation is simple, the melted silver is placed in the welding groove 102, and the attractiveness of the laser pipe seat 1 is guaranteed.
Example two:
referring to fig. 1 to 4, the present invention provides a laser chip package structure 100, which includes a laser tube seat 1, a limiting ring 2, a tube cap 3, a welding tube 4, a lens 5, a package assembly 10 and a pin assembly 20;
the laser tube seat 1 is provided with a transition heat sink 101, the transition heat sink 101 is positioned at one side of the laser tube seat 1, the limiting ring 2 is fixedly connected with the laser tube seat 1, and is positioned at one side of the laser tube seat 1 far away from the transitional heat sink 101, and forms an accommodating space 201 with the laser tube seat 1, the tube cap 3 is clamped with the spacing ring 2, and is positioned in the accommodating space 201, one side of the welding pipe 4 is fixedly connected with the pipe cap 3, the other side of the welding tube 4 penetrates through the laser tube seat 1, the lens 5 is fixedly connected with the tube cap 3, and is positioned on one side of the tube cap 3 far away from the laser tube seat 1 and penetrates through the tube cap 3, the packaging assembly 10 is fixedly connected with the laser tube seat 1, and the pin assembly 20 is fixedly connected with the laser tube seat 1.
Further, referring to fig. 1, the cap 3 has an adjusting hole 301, and the adjusting hole 301 is located on a side of the cap 3 close to the lens 5.
In this embodiment, be used for the installation in regulation hole 301 on cap for pipe 3 lens 5, lens 5 passes through the resin to be fixed regulation hole 301 department, and the heating makes the resin melt, and then it is convenient right the mounted position of lens 5 is adjusted, is favorable to improving lens 5's axiality to dismantle simple to operate, make user experience feel better.
Example three:
referring to fig. 1 to 4, the present invention provides a laser chip package structure 100, which includes a laser tube seat 1, a limiting ring 2, a tube cap 3, a welding tube 4, a lens 5, a package assembly 10 and a pin assembly 20;
the laser tube seat 1 is provided with a transition heat sink 101, the transition heat sink 101 is positioned at one side of the laser tube seat 1, the limiting ring 2 is fixedly connected with the laser tube seat 1, and is positioned at one side of the laser tube seat 1 far away from the transitional heat sink 101, and forms an accommodating space 201 with the laser tube seat 1, the tube cap 3 is clamped with the spacing ring 2, and is positioned in the accommodating space 201, one side of the welding pipe 4 is fixedly connected with the pipe cap 3, the other side of the welding tube 4 penetrates through the laser tube seat 1, the lens 5 is fixedly connected with the tube cap 3, and is positioned on one side of the tube cap 3 far away from the laser tube seat 1 and penetrates through the tube cap 3, the packaging assembly 10 is fixedly connected with the laser tube seat 1, and the pin assembly 20 is fixedly connected with the laser tube seat 1.
Further, referring to fig. 1, the cap 3 has an alignment hole 302, and the alignment hole 302 is located on a side of the cap 3 away from the lens 5.
In this embodiment, the positioning hole 302 is used for passing the pipe cap 3, and is convenient right the position is adjusted to chip in the pipe cap 3, is favorable to improving the axiality, adopts resin to seal after the adjustment finishes, and convenient to use avoids dismantling completely pipe cap 3 reduces the work degree, makes user experience feel better.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (7)
1. The laser chip packaging structure is characterized by comprising a laser tube seat, a limiting ring, a tube cap, a welding tube, a lens, a packaging assembly and a pin assembly;
the laser tube base is provided with a transitional heat sink, the transitional heat sink is positioned on one side of the laser tube base, the limiting ring is fixedly connected with the laser tube base and positioned on one side of the laser tube base away from the transitional heat sink, an accommodating space is formed between the limiting ring and the laser tube base, the tube cap is clamped with the limiting ring and positioned in the accommodating space, one side of the welded tube is fixedly connected with the tube cap, the other side of the welded tube penetrates through the laser tube base, the lens is fixedly connected with the tube cap and positioned on one side of the laser tube base away from the tube cap, the tube cap penetrates through the tube cap, the packaging assembly is fixedly connected with the laser tube base, and the pin assembly is fixedly connected with the laser tube base.
2. The laser chip package of claim 1,
the limiting ring is provided with a sliding groove, and the sliding groove is positioned on one side, close to the pipe cap, of the limiting ring.
3. The laser chip package of claim 1,
the packaging assembly comprises an LD chip, a ceramic gasket and an MPD chip, the LD chip is fixedly connected with the transition heat sink and is positioned on one side of the transition heat sink far away from the laser tube seat, the ceramic gasket is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat far away from the transition heat sink, and the MPD chip is fixedly connected with the ceramic gasket and is positioned on one side of the ceramic gasket far away from the laser tube seat.
4. The laser chip package of claim 3,
the pin component comprises a first LD pin, a second LD pin, a first MPD pin, a second MPD pin and a grounding pin, the first LD pin is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat close to the transitional heat sink, the second LD pin is fixedly connected with the laser tube seat and is symmetrically arranged in parallel relative to the first LD pin, the first MPD pin is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat close to the ceramic gasket, the second MPD pin is fixedly connected with the laser tube seat and is symmetrically arranged in parallel relative to the first MPD pin, and the grounding pin is fixedly connected with the laser tube seat and is positioned on one side of the laser tube seat far away from the MPD chip.
5. The laser chip package of claim 1,
the laser tube seat is further provided with a welding groove, and the welding groove is located on one side, away from the tube cap, of the laser tube seat.
6. The laser chip package of claim 1,
the tube cap is provided with an adjusting hole, and the adjusting hole is positioned on one side, close to the lens, of the tube cap.
7. The laser chip package of claim 1,
the pipe cap is provided with a positioning hole, and the positioning hole is positioned on one side, far away from the lens, of the pipe cap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120002788.5U CN214176407U (en) | 2021-01-04 | 2021-01-04 | Laser chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120002788.5U CN214176407U (en) | 2021-01-04 | 2021-01-04 | Laser chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214176407U true CN214176407U (en) | 2021-09-10 |
Family
ID=77592798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120002788.5U Active CN214176407U (en) | 2021-01-04 | 2021-01-04 | Laser chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214176407U (en) |
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2021
- 2021-01-04 CN CN202120002788.5U patent/CN214176407U/en active Active
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