CN213341075U - Laser convenient to installation chip power supply wire - Google Patents
Laser convenient to installation chip power supply wire Download PDFInfo
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- CN213341075U CN213341075U CN202022366206.XU CN202022366206U CN213341075U CN 213341075 U CN213341075 U CN 213341075U CN 202022366206 U CN202022366206 U CN 202022366206U CN 213341075 U CN213341075 U CN 213341075U
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- laser
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- conductive pin
- optical fiber
- chip power
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Abstract
The utility model relates to a laser instrument technical field especially provides a laser instrument convenient to installation chip power supply wire, including conductive pin, casing, apron and optical fiber coupling laser system, the casing is hollow structure, the apron encapsulation is in the top of casing, optical fiber coupling laser system arranges the inside at the casing, conductive pin sets up on the casing, conductive pin is located the inboard one end of casing and sets up the weld part, optical fiber coupling laser system's chip power supply wire welds on the weld part, conductive pin is located the part in the casing outside and sets up the clamping part. The utility model provides a laser instrument uses electrically conductive pin can guarantee inside and the accurate location when optical fiber coupling laser system welds, avoids appearing phenomena such as rosin joint or welding failure, reduces the bad product rate of laser instrument.
Description
Technical Field
The utility model relates to a laser instrument technical field especially relates to a laser instrument convenient to installation chip power supply wire.
Background
The laser is a device that can be used for transmitting laser, produces laser through the laser chip that sets up wherein, and the kind of laser generally includes solid laser, liquid laser, gas laser and semiconductor laser, but all lasers all need rely on external power input just can work, generally weld through wire and the inside PIN angle interface of laser with external power supply.
The current conductive pin of the laser is generally cylindrical, and when a plurality of chip power supply wires are welded on the conductive pin, the welding position of the chip power supply wires on the conductive pin is inaccurate due to the defect of a positioning surface, so that insufficient welding is caused, and the laser cannot work normally.
Disclosure of Invention
The above-mentioned defect to prior art, the utility model provides an aim at provides a laser instrument convenient to installation chip power supply wire can effectively avoid appearing rosin joint.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a laser instrument convenient to installation chip power supply wire, includes conductive pin, casing, apron and optical fiber coupling laser system, the casing is hollow structure, the apron encapsulation is in the top of casing, optical fiber coupling laser system arranges the inside at the casing, conductive pin sets up on the casing, conductive pin is located the inboard one end of casing and sets up the weld part, optical fiber coupling laser system's chip power supply wire welding is on the weld part, conductive pin is located the part in the casing outside and sets up the clamping part.
Further, the welding part and the clamping part are located on a plane which is parallel.
Furthermore, a through hole for leading out the conductive pin is formed in the side end of the shell, and sealant is coated in a gap between the through hole and the conductive pin.
Further, the number of the conductive pins is one or more.
Further, the fiber coupled laser system comprises a plurality of laser units, a fast axis focusing cylindrical lens, a slow axis focusing cylindrical lens and an output fiber; the laser unit comprises a semiconductor laser single tube, a fast axis collimating mirror, a slow axis collimating mirror and a reflecting mirror, and laser emitted by the semiconductor laser single tube passes through the fast axis collimating mirror, the slow axis collimating mirror and the reflecting mirror in sequence and then is spatially superposed in the fast axis direction; the superposed laser is coupled into an output optical fiber after being focused by the fast axis focusing cylindrical lens and the slow axis focusing cylindrical lens respectively.
The utility model provides a beneficial effect that technical scheme brought is: the utility model provides a laser instrument adopts the conductive pin who is provided with the clamping part, and in the laser instrument assembling process, when welding many chip power supply wires on conductive pin, can effectively guarantee that the location is accurate, avoid conductive pin's solder joint and the emergence of the rosin joint condition or the welding failure condition that the solder joint of optic fibre laser coupled system's solder joint did not laminate and lead to, can effectively reduce the bad product rate of laser instrument.
Drawings
Fig. 1 is a front view of the laser device of the present invention, which is convenient for installing a chip power supply wire.
Fig. 2 is a side view of the laser of the present invention for facilitating the installation of chip power supply wires.
Fig. 3 is an enlarged schematic view of the conductive pin of fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be further described below with reference to the accompanying drawings.
Please refer to fig. 1-3, an embodiment of the present invention provides a laser device convenient for installing a chip power supply wire, including conductive pin 1, a housing 2, an cover plate 3 and an optical fiber coupling laser system 4, the housing 2 is a hollow structure, the optical fiber coupling laser system 4 is disposed inside the housing 2, the cover plate 3 is packaged above the housing 2 by a sealant or a welding manner, the conductive pin 1 is disposed on the housing 2, a through hole 21 for leading out the conductive pin 1 is provided at a side end of the housing 2, and a sealant is coated at a gap between the through hole 21 and the conductive pin 1.
A plurality of chip power supply wires 5 for supplying power to the chip are arranged in the optical fiber coupling laser system 4, the chip power supply wires 5 are welded on the conductive pins 1, and the chip power supply wires 5 are connected with an external power supply through the conductive pins 1.
In this embodiment, a heat sink of a chip is disposed on the fiber coupled laser system 4, a flat welding portion 12 is disposed at one end of the conductive pin 1 located inside the housing 2, the plurality of chip power supply wires 5 of the fiber coupled laser system 4 are welded on the welding portion 12, a clamping portion 11 (see fig. 3) is disposed at a portion of the conductive pin 1 located outside the housing 2, the clamping portion 11 is a cylindrical milled flat structure, and planes where the welding portion 12 and the clamping portion 11 are located are parallel; the number of the conductive pins 1 may be one or more, as needed.
In this embodiment, the fiber-coupled laser system 4 includes a plurality of laser units 41, a fast-axis focusing cylindrical lens 42, a slow-axis focusing cylindrical lens 43, and an output fiber 44; the laser unit 41 comprises a semiconductor laser single tube 411, a fast axis collimating mirror 412, a slow axis collimating mirror 413 and a reflecting mirror 414, and laser emitted by the semiconductor laser single tube 411 passes through the fast axis collimating mirror 412, the slow axis collimating mirror 413 and the reflecting mirror 414 in sequence and is spatially superposed in the fast axis direction; the superposed laser beams are focused by the fast axis focusing cylindrical lens 42 and the slow axis focusing cylindrical lens 43, and then coupled into the output optical fiber 44.
The utility model provides a laser instrument convenient to installation chip power supply wire is in the assembling process, when welding chip power supply wire 5 on conductive pin 1, use the anchor clamps centre gripping on clamping part 11, and keep clamping part 11 to be located the horizontality, thereby guarantee that each solder joint of welding power supply wire 5 is located same level on the welding part 12, then the accessible sets up same vertical feeding stroke and welds when each solder joint on the automatic weld welding part 12, it avoids leading to partial solder joint to laminate because the locating surface disappearance to have guaranteed that each solder joint homoenergetic on the welding part 12 carries out good welding, and some solder joints have the clearance in addition and lead to the condition emergence of rosin joint.
In this document, the terms front, back, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are used for clarity and convenience of the technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.
The features of the embodiments and embodiments described herein above may be combined with each other without conflict.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (5)
1. The utility model provides a laser instrument convenient to installation chip power supply wire which characterized in that: including conductive pin, casing, apron and optical fiber coupling laser system, the casing is hollow structure, the apron encapsulation is in the top of casing, optical fiber coupling laser system arranges the inside at the casing, conductive pin sets up on the casing, conductive pin is located the inboard one end of casing and sets up the welding part, optical fiber coupling laser system's chip power supply wire welding is on the welding part, conductive pin is located the part in the casing outside and sets up the clamping part.
2. A laser for facilitating chip power lead mounting as claimed in claim 1, wherein: the welding part and the clamping part are positioned on the plane in parallel.
3. A laser for facilitating chip power lead mounting as claimed in claim 1, wherein: and a through hole for leading out the conductive pin is formed in the side end of the shell, and a sealant is coated in a gap between the through hole and the conductive pin.
4. A laser for facilitating chip power lead mounting as claimed in claim 1, wherein: the number of the conductive pins is one or more.
5. A laser for facilitating chip power lead mounting as claimed in claim 1, wherein: the optical fiber coupling laser system comprises a plurality of laser units, a fast axis focusing cylindrical lens, a slow axis focusing cylindrical lens and an output optical fiber; the laser unit comprises a semiconductor laser single tube, a fast axis collimating mirror, a slow axis collimating mirror and a reflecting mirror, and laser emitted by the semiconductor laser single tube passes through the fast axis collimating mirror, the slow axis collimating mirror and the reflecting mirror in sequence and then is spatially superposed in the fast axis direction; the superposed laser is coupled into an output optical fiber after being focused by the fast axis focusing cylindrical lens and the slow axis focusing cylindrical lens respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022366206.XU CN213341075U (en) | 2020-10-21 | 2020-10-21 | Laser convenient to installation chip power supply wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022366206.XU CN213341075U (en) | 2020-10-21 | 2020-10-21 | Laser convenient to installation chip power supply wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213341075U true CN213341075U (en) | 2021-06-01 |
Family
ID=76073678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022366206.XU Active CN213341075U (en) | 2020-10-21 | 2020-10-21 | Laser convenient to installation chip power supply wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213341075U (en) |
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2020
- 2020-10-21 CN CN202022366206.XU patent/CN213341075U/en active Active
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