CN214159510U - Homogenizer heat sink - Google Patents

Abstract

The utility model discloses a cooling device of a homogenizer, which comprises a homogenizing cavity, a cooling jacket and a water tank, wherein the outer wall of the homogenizing cavity is wrapped by the cooling jacket, the outer wall of the cooling jacket is fixedly provided with a plurality of rows of semiconductor refrigerating sheets, the inside of the cooling jacket is of a cavity structure, a spiral blade is arranged in the cavity structure from bottom to top, the spiral blade divides the inside of the cooling jacket into a spiral channel, the cooling jacket is communicated with the water tank through a water inlet pipe and a water outlet pipe, one end of the water inlet pipe close to the cooling jacket is provided with a communicated first branch pipe, one end of the water outlet pipe close to the cooling jacket is provided with a communicated second branch pipe, and spiral water pipes surrounding the surfaces of the plurality of rows of semiconductor refrigerating sheets are arranged between the first branch pipe and the second branch pipe; the utility model discloses simple structure, radiating efficiency are high, take away the heat that the homogeneity chamber produced through cooling jacket collocation water tank and semiconductor refrigeration piece.

Description

Homogenizer heat sink

Technical Field

The utility model relates to an isotropic symmetry heat sink belongs to isotropic symmetry technical field.

Background

The homogenizer is a device for homogenizing/emulsifying liquid materials (liquid-liquid phase or liquid-solid phase) with the viscosity of less than 0.2Pa.s and the temperature of less than 80 ℃, and is mainly applied to the food or chemical industry, such as the homogenizing and emulsifying procedures in the production process of products such as dairy products, beverages, cosmetics, medicines and the like; in the homogenizing process of the homogenizing cavity, materials moving at high speed can generate violent friction and collision with the internal structure of the homogenizing cavity, a large amount of heat accumulation is generated locally, and the quality of a product is influenced by overhigh temperature; the traditional cooling mode has the problem that the whole homogenizing cavity is soaked in cold water or even liquid nitrogen, but the high-temperature generating part is positioned in the homogenizing cavity, and the heat exchange performance of the non-flowing soaking liquid is poor, so that the expected effect cannot be achieved frequently, and the service life of equipment is shortened.

Disclosure of Invention

For solving prior art's not enough, the utility model provides an isotropic symmetry heat sink, including utilizing cooling jacket collocation semiconductor refrigeration piece and water tank to take away the heat that the homogeneity chamber produced, have high reliability, solved the problem of proposing among the above-mentioned background art.

The utility model discloses the technical scheme who adopts does:

a cooling device of a homogenizer comprises a homogenizing cavity, a cooling jacket and a water tank, wherein the upper end of the homogenizing cavity is communicated with a feeding hole, the lower end of the homogenizing cavity is communicated with a discharging hole, the outer wall of the homogenizing cavity is wrapped by the cooling jacket, a plurality of rows of semiconductor refrigerating sheets are fixedly arranged on the outer wall of the cooling jacket, each row of semiconductor refrigerating sheets are uniformly distributed in the circumferential direction, the inside of the cooling jacket is of a cavity structure, a spiral blade is arranged in the cavity structure from bottom to top and is connected with the inner walls of the two sides of the cooling jacket, the spiral blade divides the inside of the cooling jacket into a spiral channel, the cooling jacket is communicated with the water tank through a water inlet pipe and a water outlet pipe, one end of the water inlet pipe is communicated with the spiral channel at the bottom of the left side of the cooling jacket, the other end of the water inlet pipe is connected with one end of a water pump, and the other end of the water pump is connected with the water tank, one end of the water outlet pipe is communicated with the spiral channel at the upper part of the right side of the cooling jacket, the other end of the water outlet pipe is connected with the water tank, one end of the water inlet pipe, which is close to the cooling jacket, is provided with a first branch pipe communicated with the water inlet pipe, one end of the water outlet pipe, which is close to the cooling jacket, is provided with a second branch pipe communicated with the water outlet pipe, and spiral water pipes surrounding the surfaces of a plurality of rows of semiconductor refrigerating sheets are arranged between the first branch pipe and the second branch pipe.

In order to further realize the utility model, the semiconductor refrigeration piece is electrically connected with the power supply through a wire; the semiconductor refrigerating plate is a heat transfer tool, and when current flows through the semiconductor refrigerating plate, heat is transferred from one end to the other end, so that temperature difference is generated to form a cold end and a hot end.

In order to further realize the utility model, one end of the semiconductor refrigeration piece facing the cooling jacket is a refrigeration end; the cooling water in the cooling jacket absorbs the heat generated by the homogenizing cavity, and the refrigerating end of the semiconductor refrigerating piece cools the cooling water in the cooling jacket to take away the heat.

In order to further realize the utility model, one end of the semiconductor refrigeration piece, which is tightly attached to the spiral water pipe, is a heating end; the spiral water pipe takes away the heat that the semiconductor refrigeration piece transferred from the refrigeration end, prevents that semiconductor refrigeration piece self from carrying out reverse heat transfer, and through the initiative heat dissipation of spiral water pipe to the heating end, the temperature of refrigeration end also can drop, has guaranteed refrigerated effect.

The beneficial effects of the utility model reside in that: compared with the traditional cooling mode, the effect of the mode that the cooling jacket is matched with the semiconductor refrigerating sheet to cool the homogeneous cavity is more obvious, the cooling water in the cooling jacket primarily cools the homogeneous cavity, after the semiconductor refrigerating sheet is powered on, the cooling water absorbing heat in the cooling jacket is cooled by the refrigerating end, so that the heat absorbed by the cooling water is taken away, the heat transferred from the refrigerating end of the semiconductor refrigerating sheet is taken away by the spiral water pipe, reverse heat transfer of the semiconductor refrigerating sheet is prevented from being carried out by the semiconductor refrigerating sheet, active heat dissipation of the heating end is realized through the spiral water pipe, the temperature of the refrigerating end is also reduced, and the refrigerating effect is ensured; the spiral channel in the cooling jacket can increase the residence time of the cooling water in the cooling jacket, and the refrigerating effect of the semiconductor refrigerating sheet on the cooling water is increased; the cooling water slowly and circularly flows between the cooling jacket and the water tank under the action of the water pump, when the heat absorbed by the cooling water is excessive, the refrigerating effect of the semiconductor refrigerating sheet is not obvious, and the absorbed heat can be taken out from the cooling jacket through the flowing of the cooling water to cool; the device has the advantages of simple structure, convenient use and high heat dissipation efficiency, and improves the production quality of products.

Drawings

Fig. 1 is a cross-sectional view of the present invention;

fig. 2 is a front view of the present invention.

1. Homogeneous cavity, 2, cooling jacket, 3, water tank, 4, feed inlet, 5, discharge gate, 6, semiconductor refrigeration piece, 7, helical blade, 8, inlet tube, 9, outlet pipe, 10, water pump, 11, branch pipe one, 12, branch pipe two, 13, spiral water pipe.

Detailed Description

The present invention will be described in detail with reference to the accompanying drawings and examples.

As shown in fig. 1-2, this embodiment is a cooling device for a homogenizer, which includes a homogenizing chamber 1, a cooling jacket 2 and a water tank 3, the upper end of the homogenizing chamber 1 is communicated with a feeding port 4, the lower end of the homogenizing chamber 1 is communicated with a discharging port 5, the outer wall of the homogenizing chamber 1 is wrapped with the cooling jacket 2, a plurality of rows of semiconductor cooling fins 6 are fixedly installed on the outer wall of the cooling jacket 2, each row of semiconductor cooling fins 6 are circumferentially and uniformly distributed, the inside of the cooling jacket 2 is a cavity structure, a helical blade 7 is arranged in the cavity structure from bottom to top, the helical blade 7 is connected with the inner walls of two sides of the cooling jacket 2, the helical blade 7 partitions the inside of the cooling jacket 2 into a helical channel, the cooling jacket 2 is communicated with the water tank 3 through a water inlet pipe 8 and a water outlet pipe 9, one end of the water inlet pipe 8 is communicated with the helical channel at the bottom of the left side of the cooling jacket 2, the other end of the water inlet pipe 8 is connected with one end of a water pump 10, the other end of the water pump 10 is connected with the water tank 3, one end of the water outlet pipe 9 is communicated with the spiral channel at the upper part of the right side of the cooling jacket 2, the other end of the water outlet pipe 9 is connected with the water tank 3, one end of the water inlet pipe 8 close to the cooling jacket 2 is provided with a first branch pipe 11 which is communicated with the spiral channel, one end of the water outlet pipe 9 close to the cooling jacket 2 is provided with a second branch pipe 12 which is communicated with the spiral channel, and spiral water pipes 13 which surround the surfaces of a plurality of rows of semiconductor refrigerating fins 6 are arranged between the first branch pipe 11 and the second branch pipe 12.

In the embodiment, the semiconductor refrigerating sheet 6 is electrically connected with the power supply through a lead; the semiconductor cooling plate 6 is a heat transfer means, and when current flows, heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end and a hot end.

In this embodiment, one end of the semiconductor cooling plate 6 facing the cooling jacket 2 is a cooling end; the cooling water in the cooling jacket 2 absorbs the heat generated by the homogenizing cavity 1, and the cooling end of the semiconductor cooling plate 6 cools the cooling water in the cooling jacket 2 to take away the heat.

In the embodiment, one end of the semiconductor refrigerating sheet 6, which is tightly attached to the spiral water pipe 13, is a heating end; spiral water pipe 13 takes away the heat that semiconductor refrigeration piece 6 transferred from the refrigeration end, prevents that semiconductor refrigeration piece 6 self from carrying out reverse heat transfer, through spiral water pipe 13 to the initiative heat dissipation in heating end, the temperature of refrigeration end also can drop, has guaranteed refrigerated effect.

The working principle is as follows: the water pump 10 is started, cooling water in the water tank 3 is input into the cooling jacket 2, the temperature of the homogenizing cavity 1 is gradually increased along with the raw materials entering the homogenizing cavity 1 from the feeding hole 4, the cooling water in the cooling jacket 2 firstly carries out primary cooling on the homogenizing cavity 1 to absorb heat of the homogenizing cavity 1, the semiconductor refrigerating sheet 6 is electrically connected with a power supply through a lead, the semiconductor refrigerating sheet 6 is a heat transfer tool, when current flows, the heat is transferred from one end to the other end to generate temperature difference to form a cold-hot end, the refrigerating end of the semiconductor refrigerating sheet 6 faces the cooling jacket 2, the heating end faces outwards, after the semiconductor refrigerating sheet 6 is powered on, the refrigerating end of the semiconductor refrigerating sheet 6 cools the cooling water in the cooling jacket 2 again to take away the heat, the spiral water pipe 13 is closely attached to the heating end of the semiconductor refrigerating sheet 6 in a surrounding manner, and active heat dissipation is carried out through the spiral water pipe 13, the temperature of the refrigerating end can also be reduced, so that the refrigerating effect is ensured; under the action of the water pump 10, cooling water slowly and circularly flows between the cooling jacket 2 and the water tank 3, and the spiral channel in the cooling jacket 2 can prolong the retention time of the cooling water in the cooling jacket 2 and increase the refrigerating effect of the semiconductor refrigerating sheet 6 on the cooling water; when the heat emitted by the homogenizing cavity 1 is too high, the cooling effect is not obvious only by cooling the refrigerating end of the semiconductor refrigerating sheet 6, and the unabsorbed heat can be taken out from the cooling jacket 2 by flowing cooling water for cooling; the temperature of the homogenizing cavity 6 can be reduced more rapidly by matching a plurality of cooling methods.

The utility model discloses a cooling jacket cooperation semiconductor refrigeration piece cools down the mode of handling to the homogeneity chamber more obvious than traditional cooling mode effect, the cooling water in the cooling jacket carries out primary cooling to the homogeneity chamber earlier, the semiconductor refrigeration piece is behind the switch-on, the cooling end cools down the cooling water that has absorbed heat in the cooling jacket, make the heat that the cooling water absorbed be taken away, the spiral pipe takes away the heat that the semiconductor refrigeration piece shifted from the refrigeration end again, prevent that semiconductor refrigeration piece self from carrying out reverse heat transfer, through the initiative heat dissipation of spiral pipe to the heating end, the temperature of refrigeration end also can drop, refrigerated effect has been guaranteed; the spiral channel in the cooling jacket can increase the residence time of the cooling water in the cooling jacket, and the refrigerating effect of the semiconductor refrigerating sheet on the cooling water is increased; the cooling water slowly and circularly flows between the cooling jacket and the water tank under the action of the water pump, when the heat absorbed by the cooling water is excessive, the refrigerating effect of the semiconductor refrigerating sheet is not obvious, and the absorbed heat can be taken out from the cooling jacket through the flowing of the cooling water to cool; the device has the advantages of simple structure, convenient use and high heat dissipation efficiency, and improves the production quality of products.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims (4)

1. The utility model provides a isotropic symmetry heat sink which characterized in that: the device comprises a homogenizing cavity (1), a cooling jacket (2) and a water tank (3), wherein the upper end of the homogenizing cavity (1) is communicated with a feed inlet (4), the lower end of the homogenizing cavity (1) is communicated with a discharge outlet (5), the outer wall of the homogenizing cavity (1) is wrapped with the cooling jacket (2), a plurality of rows of semiconductor refrigerating sheets (6) are fixedly arranged on the outer wall of the cooling jacket (2), each row of semiconductor refrigerating sheets (6) are circumferentially and uniformly distributed, the inside of the cooling jacket (2) is of a cavity structure, a spiral blade (7) is arranged in the cavity structure from bottom to top, the spiral blade (7) is connected with the inner walls of two sides of the cooling jacket (2), the spiral blade (7) partitions the inside of the cooling jacket (2) into a spiral channel, and the cooling jacket (2) is communicated with the water tank (3) through a water inlet pipe (8) and a water outlet pipe (9), one end of the water inlet pipe (8) is communicated with a spiral channel at the bottom of the left side of the cooling jacket (2), the other end of the water inlet pipe (8) is connected with one end of a water pump (10), the other end of the water pump (10) is connected with the water tank (3), one end of the water outlet pipe (9) is communicated with the spiral channel at the upper part of the right side of the cooling jacket (2), the other end of the water outlet pipe (9) is connected with the water tank (3), a first branch pipe (11) communicated with the water inlet pipe (8) is arranged at one end close to the cooling jacket (2), a second branch pipe (12) communicated with the water outlet pipe (9) is arranged at one end close to the cooling jacket (2), and a spiral water pipe (13) surrounding the surfaces of a plurality of rows of semiconductor refrigerating fins (6) is arranged between the first branch pipe (11) and the second branch pipe (12).

2. The cooling device for the homogenizer according to claim 1, wherein the semiconductor cooling plate (6) is electrically connected with a power supply through a wire.

3. A cooling device for a homogenizer according to claim 1, wherein the end of the semiconductor cooling fin (6) facing the cooling jacket (2) is a cooling end.

4. The cooling device for the homogenizer according to claim 1, wherein one end of the semiconductor refrigeration sheet (6) and the spiral water pipe (13) which are tightly attached to each other is a heating end.

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