CN214132926U - Wafer brushing device and crystal processing equipment - Google Patents
Wafer brushing device and crystal processing equipment Download PDFInfo
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- CN214132926U CN214132926U CN202120008274.0U CN202120008274U CN214132926U CN 214132926 U CN214132926 U CN 214132926U CN 202120008274 U CN202120008274 U CN 202120008274U CN 214132926 U CN214132926 U CN 214132926U
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Abstract
The utility model provides a wafer brushing device and crystal processing equipment relates to wafer processing technology field. The wafer brushing device comprises a wafer carrier and a brushing assembly. The wafer carrier comprises a rotating rod and a vacuum chuck. The vacuum chuck is used for adsorbing the wafer and is arranged on the rotating rod. The brushing assembly includes a drive assembly, a first brushing roller, and a second brushing roller. The first brushing roller and the second brushing roller are parallel to each other and arranged at intervals. The drive assembly is configured to drive the first and second brush rollers to rotate in opposite directions. The driving assembly is arranged on one side of the wafer carrier, so that the wafer on the vacuum chuck extends into the space between the first brushing roller and the second brushing roller. The utility model also provides a crystal processing equipment, it has adopted foretell wafer brushing device. The utility model provides a wafer brushing device and crystal processing equipment simple structure, the cleaning performance is good, the scratch rate that causes when reducing the polishing.
Description
Technical Field
The utility model relates to a wafer processing technology field particularly, relates to a wafer brushing device and crystal processing equipment.
Background
Silicon carbide (SiC) is a key semiconductor material for a new generation of microelectronic devices and circuits due to its superior properties of wide bandgap, high breakdown field, large thermal conductivity, high electron saturation drift velocity, strong radiation resistance and good chemical stability. The Si C crystal material has obvious advantages in the aspects of manufacturing high-power microwave devices and high-temperature resistant devices, and is a key basic material in industries such as electronic information, energy conservation and emission reduction, national defense construction and the like. Meanwhile, the SiC has very good matching degree with the important material GaN for manufacturing high-power microwave, power electronics and photoelectric devices, and is an important substrate material for the new-generation broadband semiconductor device. In practical application, the surface of the SiC wafer is required to be ultra-smooth, defect-free and damage-free, the surface roughness value reaches below a nanometer level, and the quality and the precision of surface processing directly influence the quality and the performance of a device.
The processing of the SiC substrate wafer comprises the processes of wire cutting, grinding, chamfering, annealing, wax pasting, copper polishing, polishing and the like of a crystal bar. After the wafer is subjected to line cutting, a larger damage layer and residual stress are left on the surface of the wafer, and processes such as grinding, annealing, copper polishing, polishing and the like are needed; the repair is performed gradually. The grinding is used as an intermediate process of a processing section, and is mainly used for removing a damaged layer on the surface of the wafer after wire cutting and repairing the flatness of the wafer. Si C debris is remained on the surface of the wafer after grinding and is adhered to the surface of the wafer more closely, the Si C debris is difficult to remove through common ultrasonic cleaning, and the subsequent polishing process can cause the problems of scratching and cracking if the debris is not cleaned completely.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wafer brushing device, for example, its simple structure, the cleaning performance is good, the scratch rate that causes when reducing the polishing.
The utility model discloses an aim still includes, provides a crystal processing equipment, its simple structure, and the cleaning performance is good, the scratch rate that causes when reducing the polishing.
The embodiment of the utility model discloses a can realize like this:
an embodiment of the utility model provides a wafer brushing device for scrub the wafer, wafer brushing device includes the wafer microscope carrier and scrubs the subassembly.
The wafer carrier comprises a rotating rod and a vacuum chuck. Vacuum chuck is used for adsorbing the wafer, vacuum chuck sets up on the dwang, just the dwang configures to and drives under the pivoted condition vacuum chuck rotates.
The brushing assembly includes a drive assembly, a first brushing roller, and a second brushing roller. The first brushing roller and the second brushing roller are connected to the driving assembly, and the first brushing roller and the second brushing roller are parallel to each other and arranged at intervals. The drive assembly is configured to drive the first and second brush rollers to rotate in opposite directions.
The driving assembly is arranged on one side of the wafer carrier, and the driving assembly is further configured to drive the first brushing roller and the second brushing roller to selectively move close to the vacuum chuck so that the wafer on the vacuum chuck extends between the first brushing roller and the second brushing roller.
The utility model provides a wafer scrubbing device includes for prior art's beneficial effect:
when the wafer brushing device brushes the wafer, the first brushing roller and the second brushing roller can be driven by the driving assembly to move close to the vacuum chuck, so that the wafer on the vacuum chuck can extend between the first brushing roller and the second brushing roller. Under the condition that the wafer stretches into between the first brushing roller and the second brushing roller, the first brushing roller and the second brushing roller are driven to operate through the driving assembly, the wafer can be brushed by the first brushing roller and the second brushing roller, the two side faces of the wafer are brushed by the first brushing roller and the second brushing roller simultaneously, the wafer brushing efficiency can be improved, and the brushing effect is improved. After the first brushing roller and the second brushing roller complete the brushing of the wafer, the first brushing roller and the second brushing roller can be driven by the driving assembly to move away from the wafer, so that the wafer is convenient to detach. Due to the brushing of the first brushing roller and the second brushing roller, the scratching rate of the wafer can be reduced when the wafer is polished. As mentioned above, the wafer brushing device has simple structure and good cleaning effect, and reduces the scratching rate caused during polishing.
Optionally, a moving direction of a tangential direction of a side where the first brushing roller and the second brushing roller approach each other is a first direction, and a moving direction of a side where the vacuum chuck approaches the first brushing roller and the second brushing roller is a second direction, and the first direction and the second direction are opposite.
Optionally, the drive assembly comprises a carrier body, a first drive member, a second drive member, a first adjustment member and a second adjustment member.
The first brushing roller is connected to the first driving part, and the first driving part is configured to drive the first brushing roller to rotate. The second brushing roller is connected to the second driving member, and the second driving member is configured to drive the second brushing roller to rotate. The first driving piece and the second driving piece are movably mounted in the bearing main body. The first adjusting piece and the second adjusting piece are movably mounted on the bearing main body. The first adjusting member is connected with the first driving member, and the first adjusting member is configured to drive the first driving member to approach or depart from the wafer carrier. The second adjusting member is connected with the second driving member, and the second adjusting member is configured to drive the second driving member to approach or depart from the wafer carrier.
Optionally, the first adjusting element includes a first lead screw and a first moving portion, the first lead screw is rotatably mounted on the bearing main body, and the first moving portion is in threaded fit with the first lead screw and is connected to the first driving element.
And/or the second adjusting piece comprises a second screw rod and a second moving part, the second screw rod is rotatably arranged on the bearing main body, and the second moving part is in threaded fit with the second screw rod and is connected with the second driving piece.
Optionally, the first adjusting part further includes a first micrometer structure, and the first micrometer structure is mounted on the bearing main body and configured to record a moving distance of the first moving part.
And/or the second adjusting piece comprises a second micrometer structure, and the second micrometer structure is arranged on the bearing main body and is configured to record the moving distance of the second moving part.
Optionally, the first driving member includes a first connecting member and a first rotating member. One end of the first connecting piece is movably arranged on the bearing main body and is connected with the first adjusting piece. The first rotating member is rotatably connected to the other end of the first connecting member, the first brushing roller is connected to the first rotating member, and the first rotating member is configured to drive the first brushing roller to rotate.
And/or the second driving piece comprises a second connecting piece and a second rotating piece. One end of the second connecting piece is movably arranged on the bearing main body and is connected with the second adjusting piece. The second rotating part is rotatably connected to the other end of the second connecting part, the second brushing roller is connected to the second rotating part, and the second rotating part is configured to drive the second brushing roller to rotate.
Optionally, the first brushing roller is cylindrical, and the first rotating member is detachably sleeved with the first brushing roller.
And/or the second brushing roller is cylindrical, and the second rotating part is sleeved with the second brushing roller in a detachable mode.
Optionally, the wafer brushing apparatus further comprises a water storage apparatus.
The first connector is at least partially disposed in the water reservoir and configured to selectively draw the first brush roller back into or out of the water reservoir.
And/or the second connector is at least partially disposed in the water storage device and configured to selectively bring the second brushing roller to retract into or extend out of the water storage device.
Optionally, the first brushing roller is located above the second brushing roller.
A crystal processing apparatus includes a wafer brushing device. The wafer brushing device comprises a wafer carrier and a brushing assembly.
The wafer carrier comprises a rotating rod and a vacuum chuck. Vacuum chuck is used for adsorbing the wafer, vacuum chuck sets up on the dwang, just the dwang configures to and drives under the pivoted condition vacuum chuck rotates.
The brushing assembly includes a drive assembly, a first brushing roller, and a second brushing roller. The first brushing roller and the second brushing roller are connected to the driving assembly, and the first brushing roller and the second brushing roller are parallel to each other and arranged at intervals. The drive assembly is configured to drive the first and second brush rollers to rotate in opposite directions.
The driving assembly is arranged on one side of the wafer carrier, and the driving assembly is further configured to drive the first brushing roller and the second brushing roller to selectively move close to the vacuum chuck so that the wafer on the vacuum chuck extends between the first brushing roller and the second brushing roller.
The embodiment of the utility model provides a crystal processing equipment has still provided a crystal processing equipment, and this crystal processing equipment has adopted foretell wafer brushing device, and this crystal processing equipment is the same for prior art's beneficial effect with the wafer brushing device that the aforesaid provided for prior art's beneficial effect, no longer gives unnecessary details here.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a wafer brushing apparatus provided in an embodiment of the present application;
fig. 2 is a schematic view of a first brush roller and a second brush roller provided in an embodiment of the present application brushing a wafer;
fig. 3 is a schematic structural diagram of a first brushing roller, a second brushing roller and a vacuum chuck provided in an embodiment of the present application;
fig. 4 is a partial structural schematic view of the first adjusting member in the embodiment of the present application.
Icon: 10-wafer brushing means; 11-a wafer; 100-a wafer stage; 110-vacuum chuck; 120-rotating rod; 200-a brushing assembly; 201-a first scrub roller; 202-a second scrub roller; 203-a drive assembly; 210-a carrier body; 220-a first drive member; 221-a first connector; 222-a first rotating member; 230-a second driver; 231-a second connector; 232-a second rotating member; 240-a first adjustment member; 241-a first screw rod; 242 — a first moving part; 250-second adjustment member.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", etc. indicate the position or positional relationship based on the position or positional relationship shown in the drawings, or the position or positional relationship which is usually placed when the products of the present invention are used, the description is only for convenience of description and simplification, but the indication or suggestion that the indicated device or element must have a specific position, be constructed and operated in a specific orientation, and thus, should not be interpreted as a limitation of the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
Referring to fig. 1, in an embodiment of the present invention, a wafer brushing apparatus 10 is provided, in which the wafer brushing apparatus 10 is used for brushing and cleaning a wafer 11 to brush and remove particles or impurities adhering to a surface of the wafer 11, so as to prevent the wafer 11 from being scratched during a polishing process, thereby reducing a scratching rate of the wafer 11 during the polishing process.
Optionally, in an embodiment of the present application, the wafer brushing apparatus 10 includes a wafer carrier 100 and a brushing assembly 200. The wafer carrier 100 is used for carrying the wafer 11, so as to provide a carrying function for the wafer 11, and ensure the stability of the wafer 11 in the cleaning process, so as to facilitate the cleaning of the wafer 11. The brush assembly 200 is disposed on one side of the wafer carrier 100, and the brush assembly 200 is used for brushing the wafer 11.
The wafer stage 100 includes a rotating shaft 120 and a vacuum chuck 110. The vacuum chuck 110 is used to suck the wafer 11, in other words, the wafer 11 may be disposed on the vacuum chuck 110 by vacuum suction, thereby ensuring stability of the wafer 11 during the cleaning process. In addition, the vacuum chuck 110 is disposed on the rotating lever 120, and the rotating lever 120 is configured to rotate the vacuum chuck 110.
Referring to fig. 1 and 2, the brushing assembly 200 includes a driving assembly 203, a first brushing roller 201, and a second brushing roller 202. The first brushing roller 201 and the second brushing roller 202 are both connected to the driving assembly 203, and the first brushing roller 201 and the second brushing roller 202 are parallel to each other and arranged at intervals. The drive assembly 203 is configured to drive the first and second brush rollers 201, 202 to rotate in opposite directions. Further, the driving unit 203 is disposed at one side of the wafer stage 100, and the driving unit 203 is further configured to drive the first brush roller 201 and the second brush roller 202 to selectively move close to the vacuum chuck 110, so that the wafer 11 on the vacuum chuck 110 is inserted between the first brush roller 201 and the second brush roller 202.
When the wafer 11 extends between the first brush roller 201 and the second brush roller 202, the first brush roller 201 and the second brush roller 202 are driven by the driving assembly 203 to operate, so that the wafer 11 is brushed by the first brush roller 201 and the second brush roller 202, and the two sides of the wafer 11 are brushed by the first brush roller 201 and the second brush roller 202 simultaneously, so that the wafer 11 is brushed more efficiently and the brushing effect is improved. After the first and second brush rollers 201 and 202 complete the brushing of the wafer 11, the first and second brush rollers 201 and 202 may be driven by the driving assembly 203 to move away from the wafer 11, thereby facilitating the detachment of the wafer 11. The wafer 11 may be polished at a reduced scratching rate due to the brushing by the first and second brush rollers 201 and 202. As described above, the wafer brushing device 10 has a simple structure and a good cleaning effect, and reduces the scratching rate during polishing.
Alternatively, in order to facilitate handling of the wafer 11 and to facilitate viewing of the wafer 11, in the embodiment of the present application, the vacuum chuck 110 is substantially parallel to a horizontal plane, and thus, in order to facilitate extending the wafer 11 between the first and second brush rollers 201 and 202, the first brush roller 201 is located above the second brush roller 202, and thus, extending the wafer 11 between the first and second brush rollers 201 and 202 may be facilitated. Of course, it should be understood that, in other embodiments, the first brushing roller 201 and the second brushing roller 202 may be respectively disposed in the front-back direction of the horizontal plane or the left-right direction of the horizontal plane, in other words, the heights of the first brushing roller 201 and the second brushing roller 202 relative to the same horizontal plane are the same, and at this time, the vacuum chuck 110 may be disposed in a manner perpendicular to the horizontal plane, so that the wafer 11 may be conveniently inserted between the first brushing roller 201 and the second brushing roller 202.
In addition, in the embodiment of the present application, in order to improve the cleaning effect on the wafer 11, optionally, a moving direction of a tangential direction of a side where the first and second brush rollers 201 and 202 are close to each other is a first direction, and a moving direction of a side where the vacuum chuck 110 is close to the first and second brush rollers 201 and 202 is a second direction, and the first direction and the second direction are opposite. In fig. 3, point A, B is taken as an example, where the arrow in fig. 3 indicates the moving direction of the corresponding point, point a is a point on the first brush roller 201 close to the second brush roller 202, and point B is a point on the second brush roller 202 close to the first brush roller 201; at this time, the straight line of the moving direction of the point a is tangent to the point a with the first brushing roller 201, in other words, the moving direction of the point a is the moving direction of the first brushing roller 201 in the tangential direction of the side close to the second brushing roller 202; similarly, the straight line of the moving direction of the point B is tangent to the point B with the second brushing roller 202, in other words, the moving direction of the point B is the moving direction of the second brushing roller 202 in the tangential direction of the side close to the first brushing roller 201. It can be considered that the moving direction of the point a and the moving direction of the point B are the first direction. In fig. 3, point C is a point on the side of the vacuum cup 110 close to the first brushing roller 201 and the second brushing roller 202, and a straight line of the moving direction at point C is a tangent line of the vacuum cup 110 at point C, in other words, the moving direction of point C can be regarded as the moving direction of the vacuum cup 110 close to the first brushing roller 201 and the second brushing roller 202, that is, the moving direction of point C is the second direction.
Since the first direction and the second direction are opposite, the moving direction of the wafer 11 contacting the first and second brush rollers 201 and 202 may be opposite to the moving direction of the first and second brush rollers 201 and 202 contacting the wafer 11, and the cleaning effect of the first and second brush rollers 201 and 202 on the wafer 11 may be improved.
In an embodiment of the present application, the driving assembly 203 may include a carrier body 210, a first driving member 220, a second driving member 230, a first adjustment member 240, and a second adjustment member 250. The first brushing roller 201 is connected to the first driving member 220, and the first driving member 220 is configured to drive the first brushing roller 201 to rotate. The second brushing roller 202 is connected to a second driving member 230, and the second driving member 230 is configured to drive the second brushing roller 202 to rotate. The first driving member 220 and the second driving member 230 are movably mounted to the main carrying body 210. The first and second adjusters 240 and 250 are movably mounted to the carrying main body 210. The first adjusting member 240 is connected to the first driving member 220, and the first adjusting member 240 is configured to drive the first driving member 220 to move closer to or away from the wafer carrier 100. The second adjusting member 250 is connected to the second driving member 230, and the second adjusting member 250 is configured to drive the second driving member 230 to move closer to or away from the wafer carrier 100.
The first adjusting member 240 can drive the first driving member 220 to move toward the wafer 11 carrier, so that the first driving member 220 can drive the first brushing roller 201 to move toward the wafer carrier 100, so as to facilitate the first brushing roller 201 to clean the wafer 11; similarly, the second driving member 230 can be driven by the second adjusting member 250 to move toward the wafer stage 100, so that the second driving member 230 can drive the second brushing roller 202 to move toward the wafer stage 100, so as to facilitate the second brushing roller 202 to clean the wafer 11. In addition, after the wafer 11 is cleaned, the first driving member 220 is driven by the first adjusting member 240 to move away from the wafer carrier 100, so that the first driving member 220 drives the first brushing roller 201 to move away from the wafer 11; similarly, the second driving member 230 can be driven by the second adjusting member 250 to move away from the wafer carrier 100, so that the second driving member 230 drives the second brush roller 202 to move away from the wafer 11; thus, the first brush roller 201 and the second brush roller 202 can be moved away from the wafer 11, and the wafer 11 can be easily detached.
Alternatively, in some embodiments of the present application, please refer to fig. 1 and 4 in combination, the first adjusting element 240 may include a first lead screw 241 and a first moving portion 242, the first lead screw 241 is rotatably installed on the bearing main body 210, and the first moving portion 242 is in threaded fit with the first lead screw 241 and is connected with the first driving element 220. And/or, the second adjusting member 250 includes a second lead screw (not shown) rotatably installed on the bearing body 210 and a second moving portion (not shown) in threaded engagement with the second lead screw and connected with the second driving member 230.
It should be noted that, in some embodiments, only the first adjusting member 240 may be disposed by using the first lead screw 241 and the first moving portion 242; alternatively, only the second adjusting member 250 may adopt the manner and value of the second lead screw and the second moving portion; alternatively, as in the embodiment of the present application, the first adjusting member 240 is provided in the form of a first lead screw 241 and a first moving portion 242, and the second adjusting member 250 is provided in the form of a second lead screw and a second moving portion.
Here, since the first adjusting member 240 and the second adjusting member 250 have the same structure, the structure of the first adjusting member 240 will be described. In order to cooperate with the first lead screw 241, the first moving part 242 is provided with a thread adapted to the first lead screw 241, so that the first lead screw 241 and the first moving part 242 are in threaded cooperation. When the first lead screw 241 rotates, the first moving portion 242 moves along the first lead screw 241, thereby driving the first driving element 220 to move, so that the first driving element 220 can reciprocate in a linear direction, and the first driving element 220 can be selectively moved closer to or away from the wafer stage 100. Since the first screw rod 241 and the first moving part 242 form a screw rod structure, the user can conveniently operate the first screw rod 241, the operability is improved, the user can conveniently grasp the moving distance of the first driving part 220, and the first brushing roller 201 can be conveniently moved to a designated position.
It should be understood that in other embodiments, the movement of the first driving member 220 can be realized in other manners, for example, in a motor-driven manner, or in a rack-and-pinion manner, or in a hydraulic cylinder-driven manner or a pneumatic cylinder-driven manner, and the details are not repeated herein.
In order to conveniently record the moving distance of the first driving member 220 and the second driving member 230, in other words, to conveniently record the moving distance of the first brushing roller 201 and the second brushing roller 202, optionally, in an embodiment of the present application, the first adjusting member 240 further includes a first micrometer structure (not shown), which is mounted on the bearing main body 210 and configured to record the moving distance of the first moving part 242. And/or, the second adjusting member 250 includes a second micrometer structure (not shown), which is installed on the bearing main body 210 and configured to record the moving distance of the second moving part. It should be noted that, among them, "and/or" refers to: in some embodiments, only the first micrometer structure may be provided, or only the second micrometer structure may be provided; or, as in the embodiment of the present application, the first micrometer structure and the second micrometer structure are provided on the bearing main body 210, so as to record the moving distance of the first brushing roller 201 and the second brushing roller 202 conveniently, and facilitate the operation of the user.
Optionally, in the embodiment of the present application, the first driving member 220 optionally includes a first connecting member 221 and a first rotating member 222. One end of the first connecting member 221 is movably disposed on the main carrying body 210 and connected to the first adjusting member 240, that is, one end of the first connecting member 221 is connected to the first moving portion 242, so as to drive the first connecting member 221 to move through the first moving portion 242. The first rotating member 222 is rotatably connected to the other end of the first connecting member 221, the first brushing roller 201 is connected to the first rotating member 222, and the first rotating member 222 is configured to rotate the first brushing roller 201. And/or, the second driving member 230 includes a second connecting member 231 and a second rotating member 232. One end of the second connecting member 231 is movably disposed on the bearing main body 210 and connected to the second adjusting member 250, that is, one end of the second connecting member 231 is connected to the second moving portion, so that the second connecting member 231 is not driven to move by the second movement. The second rotating member 232 is rotatably connected to the other end of the second connecting member 231, the second brushing roller 202 is connected to the second rotating member 232, and the second rotating member 232 is configured to drive the second brushing roller 202 to rotate.
Here, "and/or" indicates that, in some embodiments, only the first driving member 220 may be disposed by using the first connecting member 221 and the first rotating member 222, or only the second driving member 230 may be disposed by using the second connecting member 231 and the second rotating member 232; alternatively, as in the embodiment of the present application, the first driving member 220 is disposed in the form of the first connecting member 221 and the first rotating member 222, and the second driving member 230 is disposed in the form of the second connecting member 231 and the second rotating member 232.
In order to facilitate the detachment and installation of the first brushing roller 201 and the second brushing roller 202, optionally, in the embodiment of the present application, the first brushing roller 201 and the second brushing roller 202 are both cylindrical, and the first brushing roller 201 is detachably sleeved on the first rotating member 222, and the second brushing roller 202 is detachably sleeved on the second rotating member 232. It should be understood that in other embodiments of the present application, the first brushing roller 201 or the second brushing roller 202 may be disposed in other manners, for example, in an adhesive manner, a welding manner, an integral molding manner, or the like. In other words, in the present application, the first brushing roller 201 is cylindrical, and the first brushing roller 201 is detachably sleeved on the first rotating member 222. And/or the second brushing roller 202 is cylindrical, and the second brushing roller 202 is detachably sleeved on the second rotating member 232.
Additionally, in embodiments of the present application, wafer brushing apparatus 10 may further include a water reservoir (not shown) that may be used to hold the cleaning fluid. The first connector 221 is at least partially disposed in the water reservoir and is configured to selectively draw the first brush roller 201 back into or out of the water reservoir. And/or, the second connector 231 is at least partially disposed in the water storage device and is configured to selectively draw the second brush roller 202 back into or out of the water storage device. In other words, "and/or" means that, in some embodiments of the present application, only a portion of the first connector 221 may be disposed in the water storage device, or only a portion of the second connector 231 may be disposed in the water storage device; alternatively, as in the embodiment of the present application, a portion of the first connector 221 is disposed in the water storage device and a portion of the second connector 231 is disposed in the water storage device. Because the first connecting piece 221 and the second connecting piece 231 are both partially arranged in the water storage device, the first brushing roller 201 can be driven to selectively retract or extend out of the water storage device through the contraction of the first connecting piece 221, so that the cleaning liquid can be attached to the first brushing roller 201, and the cleaning effect on the wafer 11 can be improved; similarly, the cleaning liquid may be attached to the second brushing roller 202, thereby improving the cleaning effect of the second brushing roller 202 on the lens.
In order to achieve the contraction of the first connection member 221 and the second connection member 231, the first connection member 221 and the second connection member 231 may adopt a hydraulic cylinder or an air cylinder, and the like, which is not described herein again.
In summary, the wafer brushing apparatus 10 provided in the embodiment of the present application may drive the first brushing roller 201 and the second brushing roller 202 to move close to the vacuum chuck 110 through the driving assembly 203 when the wafer 11 is brushed, so that the wafer 11 on the vacuum chuck 110 may extend between the first brushing roller 201 and the second brushing roller 202. When the wafer 11 extends between the first brush roller 201 and the second brush roller 202, the first brush roller 201 and the second brush roller 202 are driven by the driving assembly 203 to operate, so that the wafer 11 is brushed by the first brush roller 201 and the second brush roller 202, and the two sides of the wafer 11 are brushed by the first brush roller 201 and the second brush roller 202 simultaneously, so that the wafer 11 is brushed more efficiently and the brushing effect is improved. After the first and second brush rollers 201 and 202 complete the brushing of the wafer 11, the first and second brush rollers 201 and 202 may be driven by the driving assembly 203 to move away from the wafer 11, thereby facilitating the detachment of the wafer 11. The wafer 11 may be polished at a reduced scratching rate due to the brushing by the first and second brush rollers 201 and 202. As described above, the wafer brushing device 10 has a simple structure and a good cleaning effect, and reduces the scratching rate during polishing.
In addition, the embodiment of the present application further provides a crystal processing apparatus (not shown), the crystal processing apparatus employs the wafer brushing device 10, and the crystal processing apparatus has a simple structure, a good cleaning effect, and a reduced scratching rate during polishing.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A wafer brushing device is used for brushing wafers and is characterized by comprising a wafer carrier and a brushing assembly;
the wafer carrying platform comprises a rotating rod and a vacuum chuck; the vacuum chuck is used for adsorbing a wafer, the vacuum chuck is arranged on the rotating rod, and the rotating rod drives the vacuum chuck to rotate under the condition of being configured to rotate;
the brushing assembly comprises a driving assembly, a first brushing roller and a second brushing roller; the first brushing roller and the second brushing roller are connected to the driving assembly and are parallel to each other and arranged at intervals; the drive assembly is configured to drive the first and second brush rollers to rotate in opposite directions;
the driving assembly is arranged on one side of the wafer carrier, and the driving assembly is further configured to drive the first brushing roller and the second brushing roller to selectively move close to the vacuum chuck so that the wafer on the vacuum chuck extends between the first brushing roller and the second brushing roller.
2. The wafer scrubbing apparatus as defined in claim 1, wherein a direction of movement of a tangential direction of a side of said first scrubbing roller and said second scrubbing roller adjacent to each other is a first direction, and a direction of movement of a side of said vacuum chuck adjacent to said first scrubbing roller and said second scrubbing roller is a second direction, said first direction and said second direction being opposite.
3. The wafer scrubbing apparatus of claim 1, wherein said drive assembly comprises a carrier body, a first drive member, a second drive member, a first adjustment member and a second adjustment member;
the first brushing roller is connected to the first driving part, and the first driving part is configured to drive the first brushing roller to rotate; the second brushing roller is connected to the second driving member, and the second driving member is configured to drive the second brushing roller to rotate; the first driving piece and the second driving piece are movably arranged on the bearing main body; the first adjusting piece and the second adjusting piece are movably arranged on the bearing main body; the first adjusting piece is connected with the first driving piece, and the first adjusting piece is configured to drive the first driving piece to be close to or far away from the wafer carrier; the second adjusting member is connected with the second driving member, and the second adjusting member is configured to drive the second driving member to approach or depart from the wafer carrier.
4. The wafer scrubbing apparatus as defined in claim 3, wherein said first adjustment member includes a first lead screw rotatably mounted to said carrier body and a first moving portion threadedly engaged with said first lead screw and connected to said first driving member;
and/or the second adjusting piece comprises a second screw rod and a second moving part, the second screw rod is rotatably arranged on the bearing main body, and the second moving part is in threaded fit with the second screw rod and is connected with the second driving piece.
5. The wafer scrubbing apparatus of claim 4, wherein said first adjustment member further comprises a first micrometer structure mounted on said carrier body and configured to record a distance moved by said first moving portion;
and/or the second adjusting piece comprises a second micrometer structure, and the second micrometer structure is arranged on the bearing main body and is configured to record the moving distance of the second moving part.
6. The wafer scrubbing apparatus of claim 3, wherein said first drive member comprises a first link and a first rotating member; one end of the first connecting piece is movably arranged on the bearing main body and is connected with the first adjusting piece; the first rotating part is rotatably connected to the other end of the first connecting part, the first brushing roller is connected to the first rotating part, and the first rotating part is configured to drive the first brushing roller to rotate;
and/or the second driving piece comprises a second connecting piece and a second rotating piece; one end of the second connecting piece is movably arranged on the bearing main body and is connected with the second adjusting piece; the second rotating part is rotatably connected to the other end of the second connecting part, the second brushing roller is connected to the second rotating part, and the second rotating part is configured to drive the second brushing roller to rotate.
7. The wafer scrubbing apparatus according to claim 6, wherein said first scrubbing roller is cylindrical and detachably fitted over said first rotating member;
and/or the second brushing roller is cylindrical, and the second rotating part is sleeved with the second brushing roller in a detachable mode.
8. The wafer scrubbing apparatus of claim 6, further comprising a water reservoir;
the first connector is at least partially arranged in the water storage device and is configured to selectively drive the first brushing roller to retract or extend out of the water storage device;
and/or the second connector is at least partially disposed in the water storage device and configured to selectively bring the second brushing roller to retract into or extend out of the water storage device.
9. The wafer scrubbing apparatus of any one of claims 1 to 8, wherein said first scrubbing roller is positioned above said second scrubbing roller.
10. A crystal processing apparatus comprising a wafer brushing device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120008274.0U CN214132926U (en) | 2021-01-04 | 2021-01-04 | Wafer brushing device and crystal processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120008274.0U CN214132926U (en) | 2021-01-04 | 2021-01-04 | Wafer brushing device and crystal processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214132926U true CN214132926U (en) | 2021-09-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120008274.0U Active CN214132926U (en) | 2021-01-04 | 2021-01-04 | Wafer brushing device and crystal processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214132926U (en) |
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2021
- 2021-01-04 CN CN202120008274.0U patent/CN214132926U/en active Active
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