CN202053164U - Cleaning device for polishing pad and polishing device - Google Patents
Cleaning device for polishing pad and polishing device Download PDFInfo
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- CN202053164U CN202053164U CN2011201231749U CN201120123174U CN202053164U CN 202053164 U CN202053164 U CN 202053164U CN 2011201231749 U CN2011201231749 U CN 2011201231749U CN 201120123174 U CN201120123174 U CN 201120123174U CN 202053164 U CN202053164 U CN 202053164U
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- polishing pad
- polishing
- snorkel
- air intake
- intake duct
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Abstract
The utility model discloses a cleaning device for a polishing pad and a polishing device, which comprises a cleaning arm and a plurality of nozzles. The cleaning arm is arranged above the polishing pad and can move relative to the polishing pad, the inside of the cleaning arm is provided with at least one air delivery pipe and one air suction pipe, and the plurality of nozzles are positioned the bottom surface of the cleaning arm close to the polishing pad and respectively communicated with the air delivery pipes or the air suction pipes. After air is delivered into the air delivery pipes, the nozzles communicated with the air delivery pipes blow up technological byproducts on the polishing pad. The cleaning device is simple in structure, convenient to operate, suitable for various polishing processes and capable of cleaning up the technological byproducts on the polishing pad, keeping stability of polishing rate of chips, reducing polishing defects, improving polishing performance and technological efficiency of the chips, and simultaneously prolonging service life of the polishing pad and a trimmer.
Description
Technical field
The utility model relates to the chemical-mechanical polisher field, and is particularly related to a kind of cleaning device and burnishing device that is used for process byproducts on the chemical mechanical polishing manufacture procedure cleaning polishing pad.
Background technology
Develop rapidly along with integrated circuit (IC) manufacturing technology, machining accuracy and surface quality to silicon chip are had higher requirement, chemically mechanical polishing (CMP) is the at present unique practical technique and core technology that can realize silicon chip part and overall planarization, just is being widely used in the IC manufacturing.
Fig. 1 is the burnishing device that present CMP adopts, in the CMP processing procedure, rubbing head (not shown) bearing wafer 12 rotatablely moves, and press down wafer 12 to the polishing pad 10 with polishing pad 10 relative rotations, polishing fluid dispensing device 11 sprays polishing fluid or polishing slurries or spreads upon on the polishing pad 10, wafer 12 and polishing pad 10 are carried out fricting movement relative to each other under polishing slurries (for common polishing pad) or the effect of polishing pad 10 unique characteristics abrasive material pieces (for concretion abrasive polishing pad), thereby the surface of wafer 12 is flattened, and in order to improve the material removing rate of wafer, can use polishing pad corrector 13, in polishing process, polishing pad 10 surfaces are repaired, strengthen the performance of feature abrasive material piece (for concretion abrasive polishing pad) or groove (for common polishing pad).
As shown in Figure 2, the graininess or the block process byproducts (for example cupric oxide in copper-CMP processing procedure) 14 that produce during wafer 12 polishings, accumulate in clear area (for concretion abrasive polishing pad) or groove (for common polishing pad) 100 bottoms between the feature abrasive material piece of polishing pad 10 easily, though in polishing process, the centrifugal force of polishing fluid or polishing slurries and polishing pad trimmer can be removed part process byproducts 14, but elimination efficiency is not high enough, particularly in the long polishing process of polishing time, process byproducts 14 can be cumulative, hinder polishing fluid or polishing slurries flowing on polishing pad 10, influence the stability of polishing speed, cause wafer 12 polishing cut equivalent damage generation of defects, seriously reduced the homogeneity of wafer 12 polished surfaces.
Therefore need a kind of polishing pad cleaning device and burnishing device, can in the polishing processing procedure, the process byproducts thing on the polishing pad be cleaned out, keep the stability of wafer polishing speed, reduce polishing defect, improve the wafer polishing performance.
The utility model content
The utility model proposes a kind of polishing pad cleaning device and burnishing device, can in the polishing processing procedure, the process byproducts thing on the polishing pad be cleaned out, keep the stability of wafer polishing speed, reduce polishing defect, improve the wafer polishing performance.
In order to achieve the above object, the utility model proposes a kind of polishing pad cleaning device, be used to clean polishing pad, comprising:
The cleaning arm is located at described polishing pad top and also can be moved by described relatively polishing pad, and its inside is provided with at least one road snorkel and at least one road air intake duct;
A plurality of nozzles are located on the bottom surface of the nearly described polishing pad of described cleaning arm rest, and communicate with described snorkel or air intake duct respectively.
Further, clean arm inside and be provided with 1～4 road snorkel.
Further, described cleaning arm inside is provided with 1～4 road air intake duct.
Further, the quantity of the nozzle that communicates with every road snorkel or air intake duct is 6～20.
Further, described snorkel and air intake duct are the pipeline of an end opening, other end sealing.
Further, described snorkel and air intake duct and described cleaning arm are one-body molded.
Further, described a plurality of nozzle and described snorkel or air intake duct are one-body molded or be tightly connected.
The present invention also provides a kind of burnishing device, comprises polishing pad and polishing pad cleaning device, and described polishing pad cleaning device is used to clean described polishing pad, and described polishing pad cleaning device comprises:
The cleaning arm is located at described polishing pad top and also can be moved by described relatively polishing pad, and its inside is provided with at least one road snorkel and at least one road air intake duct;
A plurality of nozzles are located on the bottom surface of the nearly described polishing pad of described cleaning arm rest, and communicate with described snorkel or air intake duct respectively.
Further, the arm inside of cleaning is provided with 1～4 road snorkel, and described cleaning arm inside is provided with 1～4 road air intake duct.
Further, the quantity of the nozzle that communicates with every road snorkel or air intake duct is 6～20.
Further, described snorkel and air intake duct are the pipeline of an end opening, other end sealing.
Further, described snorkel and air intake duct and described cleaning arm are one-body molded.
Further, described a plurality of nozzle and described snorkel or air intake duct are one-body molded or be tightly connected.
Further, described burnishing device also comprises rotating shaft, and described polishing pad cleaning device is located at described polishing pad top by described rotating shaft.
Further, described burnishing device also comprises polishing pad trimmer and rotating shaft, and described polishing pad cleaning device and described polishing pad trimmer all are located at described polishing pad top by described rotating shaft.
Compared with prior art, polishing pad cleaning device of the present utility model and burnishing device, after snorkel supplied gas, the nozzle that communicates with snorkel can blow afloat the process byproducts on the polishing pad, simultaneously to air intake duct air-breathing after, the nozzle that communicates with air intake duct can siphon away the process byproducts that is blown afloat, this cleaning device is simple in structure, easy to operate, can in the polishing processing procedure, the process byproducts thing on the polishing pad be cleaned out, the stability that keeps wafer polishing speed reduces polishing defect, improves the wafer polishing performance.
Description of drawings
Figure 1 shows that the burnishing device structural representation of prior art;
Figure 2 shows that the polishing pad structure schematic diagram of prior art;
Figure 3 shows that the vertical view of polishing pad cleaning device structure of the present utility model;
Figure 4 shows that the stereogram of polishing pad cleaning device structure of the present utility model;
Figure 5 shows that burnishing device structural representation of the present utility model.
The specific embodiment
In order more to understand technology contents of the present utility model, especially exemplified by specific embodiment and cooperate appended illustrate as follows.
Please refer to Fig. 3 and Fig. 4, the utility model provides a kind of polishing pad cleaning device 25, is used to clean polishing pad, comprising:
A plurality of nozzles 253 are located at described cleaning arm 250 near on the bottom surface of described polishing pad 20, and are communicated with snorkel 251 or air intake duct 252 respectively, and wherein, the quantity of the nozzle 253 that communicates with every road snorkel 251 or air intake duct 252 is 6～20.Optionally, described a plurality of nozzle 253 and described snorkel 251 or air intake duct 252 are one-body molded or be tightly connected.In the present embodiment, the quantity of the nozzle 253 that communicates with every road snorkel 251 or air intake duct 252 is 6.
Please refer to Fig. 5, the present invention also provides a kind of burnishing device, comprises polishing pad 20 and polishing pad cleaning device 25, and described polishing pad cleaning device 25 is used to clean described polishing pad 20, and described polishing pad cleaning device 25 comprises:
A plurality of nozzles 253 are located at described cleaning arm 250 near on the bottom surface of described polishing pad 20, and are communicated with described snorkel 251 or air intake duct 252 respectively, and described snorkel and air intake duct are the pipeline of an end opening, other end sealing.Preferably, the quantity of the nozzle that communicates with every road snorkel or air intake duct is 6～20, all with one-body molded with described snorkel 251 or air intake duct 252 or be tightly connected.
Further, described burnishing device also comprises rotating shaft (not shown), and described polishing pad cleaning device 25 is located at described polishing pad 20 tops by described rotating shaft, optionally, described burnishing device also comprises polishing pad trimmer 23, also by described rotating shaft setting and described polishing pad 20 tops.
Please refer to Fig. 4 and Fig. 5, polishing pad cleaning device 25 of the present utility model is applied in the burnishing device, connects described burnishing device by rotating shaft (not shown).In the CMP processing procedure, rubbing head (not shown) bearing wafer 22 rotatablely moves, and press down wafer 22 to the polishing pad 20 with polishing pad 20 relative rotations, polishing fluid dispensing device 21 sprays polishing fluid or polishing slurries or spreads upon on the polishing pad 20, repair on 23 pairs of polishing pad 20 surfaces of polishing pad corrector, strengthen the feature abrasive material piece (for concretion abrasive polishing pad) of polishing pad 20 or the performance of groove (for common polishing pad) 200, wafer 22 and polishing pad 20 are carried out the polishing that fricting movement carries out wafer 22 relative to each other under polishing slurries (for common polishing pad) or the effect of polishing pad 10 unique characteristics abrasive material pieces (for concretion abrasive polishing pad), the polishing of wafer 22 can produce graininess or block process byproducts 24.
In the CMP processing procedure, in the snorkel 251 of polishing pad cleaning device 25, feed gas, as helium, nitrogen, hydrogen, argon gas etc., the nozzle 253 that communicates with snorkel 251 can blow afloat clear area (for concretion abrasive polishing pad) between the feature abrasive material piece of polishing pad 20 or the process byproducts 24 in the groove 200, simultaneously air-breathing in the air intake duct 252 of polishing pad cleaning device 25, the process byproducts that the nozzle 253 that communicates with air intake duct 252 can will be blown afloat siphons away, improved the clearance rate of process byproducts, the stability that keeps wafer polishing speed, reduce polishing defect, improve wafer polishing performance and process efficiency, prolong the service life of polishing pad and trimmer simultaneously.
In sum, polishing pad cleaning device of the present utility model and burnishing device, after snorkel supplied gas, the nozzle that communicates with snorkel can blow afloat the process byproducts on the polishing pad, simultaneously to air intake duct air-breathing after, the nozzle that communicates with air intake duct can siphon away the process byproducts that is blown afloat, this cleaning device is simple in structure, easy to operate, can in the polishing processing procedure, the process byproducts thing on the polishing pad be cleaned out, the stability that keeps wafer polishing speed, reduce polishing defect, improve wafer polishing performance and process efficiency, prolong the service life of polishing pad and trimmer simultaneously, be applicable to copper, oxide, aluminium, tungsten, high K medium, inter-level dielectric, various polishing processing procedures such as shallow groove isolation structure.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; have in the technical field under any and know the knowledgeable usually; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection domain of the present utility model is as the criterion when looking claims person of defining.
Claims (15)
1. a polishing pad cleaning device is used to clean polishing pad, it is characterized in that, comprising:
The cleaning arm is located at described polishing pad top and also can be moved by described relatively polishing pad, and its inside is provided with at least one road snorkel and at least one road air intake duct;
A plurality of nozzles are located on the bottom surface of the nearly described polishing pad of described cleaning arm rest, and communicate with described snorkel or air intake duct respectively.
2. polishing pad cleaning device as claimed in claim 1 is characterized in that the arm inside of cleaning is provided with 1～4 road snorkel.
3. polishing pad cleaning device as claimed in claim 1 or 2 is characterized in that, described cleaning arm inside is provided with 1～4 road air intake duct.
4. polishing pad cleaning device as claimed in claim 1 is characterized in that, the quantity of the nozzle that communicates with every road snorkel or air intake duct is 6～20.
5. polishing pad cleaning device as claimed in claim 1 is characterized in that, described snorkel and air intake duct are the pipeline of an end opening, other end sealing.
6. as claim 1 or 5 described polishing pad cleaning devices, it is characterized in that described snorkel and air intake duct and described cleaning arm are one-body molded.
7. as claim 1 or 5 described polishing pad cleaning devices, it is characterized in that described a plurality of nozzles and described snorkel or air intake duct are one-body molded or be tightly connected.
8. a burnishing device comprises polishing pad and polishing pad cleaning device, and described polishing pad cleaning device is used to clean described polishing pad, it is characterized in that, described polishing pad cleaning device comprises:
The cleaning arm is located at described polishing pad top and also can be moved by described relatively polishing pad, and its inside is provided with at least one road snorkel and at least one road air intake duct;
A plurality of nozzles are located on the bottom surface of the nearly described polishing pad of described cleaning arm rest, and communicate with described snorkel or air intake duct respectively.
9. burnishing device as claimed in claim 8 is characterized in that the arm inside of cleaning is provided with 1～4 road snorkel, and described cleaning arm inside is provided with 1～4 road air intake duct.
10. the clean device of polishing as claimed in claim 9 is characterized in that, the quantity of the nozzle that communicates with every road snorkel or air intake duct is 6～20.
11. burnishing device as claimed in claim 8 is characterized in that, described snorkel and air intake duct are the pipeline of an end opening, other end sealing.
12., it is characterized in that described snorkel and air intake duct and described cleaning arm are one-body molded as claim 8 or 11 described polishing pad cleaning devices.
13., it is characterized in that described a plurality of nozzles and described snorkel or air intake duct are one-body molded or be tightly connected as claim 8 or 11 described polishing pad cleaning devices.
14. burnishing device as claimed in claim 8 is characterized in that, also comprises rotating shaft, described polishing pad cleaning device is located at described polishing pad top by described rotating shaft.
15. burnishing device as claimed in claim 8 is characterized in that, also comprises polishing pad trimmer and rotating shaft, described polishing pad cleaning device and described polishing pad trimmer all are located at described polishing pad top by described rotating shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201231749U CN202053164U (en) | 2011-04-25 | 2011-04-25 | Cleaning device for polishing pad and polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201231749U CN202053164U (en) | 2011-04-25 | 2011-04-25 | Cleaning device for polishing pad and polishing device |
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| Publication Number | Publication Date |
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| CN202053164U true CN202053164U (en) | 2011-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201231749U Expired - Fee Related CN202053164U (en) | 2011-04-25 | 2011-04-25 | Cleaning device for polishing pad and polishing device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722486A (en) * | 2012-10-11 | 2014-04-16 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical polishing method and device |
| CN106141905A (en) * | 2016-08-22 | 2016-11-23 | 上海华力微电子有限公司 | A kind of grinding wafer head cleans device and cleaning method |
| CN108214286A (en) * | 2016-12-21 | 2018-06-29 | 罗门哈斯电子材料Cmp控股股份有限公司 | The method for cleaning CMP pad |
| CN110977709A (en) * | 2018-09-28 | 2020-04-10 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing method and apparatus |
| US11275024B2 (en) | 2018-03-13 | 2022-03-15 | Nippon Telegraph And Telephone Corporation | Method for estimating production location |
| CN115634882A (en) * | 2022-10-24 | 2023-01-24 | 湖北鼎锐半导体有限公司 | CMP polishing pad cleaning device and cleaning method |
| CN117564917A (en) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
-
2011
- 2011-04-25 CN CN2011201231749U patent/CN202053164U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103722486B (en) * | 2012-10-11 | 2016-10-05 | 中芯国际集成电路制造(上海)有限公司 | A kind of chemical and mechanical grinding method and device |
| CN103722486A (en) * | 2012-10-11 | 2014-04-16 | 中芯国际集成电路制造(上海)有限公司 | Chemical mechanical polishing method and device |
| CN106141905A (en) * | 2016-08-22 | 2016-11-23 | 上海华力微电子有限公司 | A kind of grinding wafer head cleans device and cleaning method |
| CN106141905B (en) * | 2016-08-22 | 2018-06-29 | 上海华力微电子有限公司 | A kind of grinding wafer head cleaning device and cleaning method |
| CN108214286A (en) * | 2016-12-21 | 2018-06-29 | 罗门哈斯电子材料Cmp控股股份有限公司 | The method for cleaning CMP pad |
| CN108214286B (en) * | 2016-12-21 | 2020-03-20 | 罗门哈斯电子材料Cmp控股股份有限公司 | Method for cleaning CMP polishing pad |
| US11275024B2 (en) | 2018-03-13 | 2022-03-15 | Nippon Telegraph And Telephone Corporation | Method for estimating production location |
| CN110977709A (en) * | 2018-09-28 | 2020-04-10 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing method and apparatus |
| CN110977709B (en) * | 2018-09-28 | 2021-07-30 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing method and apparatus |
| TWI782235B (en) * | 2018-09-28 | 2022-11-01 | 台灣積體電路製造股份有限公司 | Chemical mechanical polishing method and apparatus |
| CN115634882A (en) * | 2022-10-24 | 2023-01-24 | 湖北鼎锐半导体有限公司 | CMP polishing pad cleaning device and cleaning method |
| CN117564917A (en) * | 2024-01-15 | 2024-02-20 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
| CN117564917B (en) * | 2024-01-15 | 2024-04-02 | 北京芯美达科技有限公司 | Polycrystalline diamond polishing equipment |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130515 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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| TR01 | Transfer of patent right |
Effective date of registration: 20130515 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111130 Termination date: 20180425 |
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| CF01 | Termination of patent right due to non-payment of annual fee |