CN214122898U - Intelligent cooling mainboard - Google Patents
Intelligent cooling mainboard Download PDFInfo
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- CN214122898U CN214122898U CN202120256420.1U CN202120256420U CN214122898U CN 214122898 U CN214122898 U CN 214122898U CN 202120256420 U CN202120256420 U CN 202120256420U CN 214122898 U CN214122898 U CN 214122898U
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- heat dissipation
- mainboard
- water tank
- passageway
- intercommunication
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Abstract
The utility model discloses an intelligence cooling mainboard, including water tank and mainboard, mainboard horizontal installation is in the water tank top, and the open slot has been seted up at the water tank top, the inside first heat dissipation mechanism that is used for the mainboard heat dissipation that is equipped with of open slot, and the mainboard side sets up the passageway that runs through, the passageway has four and even mainboard side of having seted up, and four passageway intercommunications, four the inside inlaying of passageway has same coil pipe, and four passageway shape size looks adaptations of coil pipe and intercommunication, the coil pipe both ends are equipped with the intercommunication mechanism that is used for the intercommunication water tank, and water tank one side horizontal installation has the mounting panel, mounting panel one side is equipped with the second heat dissipation mechanism, and the second heat dissipation mechanism has a plurality ofly and evenly distributed in the mounting panel side, mainboard top horizontal installation has temperature sensor. The utility model discloses avoided present mainboard to all be the drawback that relies on a fan to cool down alone, and then improved the radiating effect and the life of this mainboard.
Description
Technical Field
The utility model relates to a mainboard cooling technical field especially relates to intelligence cooling mainboard.
Background
The motherboard may be called a main board (main board), a system board (system board), or a motherboard (mother board). It is installed in the cabinet, and is one of the most basic and important parts of the microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is installed, and generally includes elements such as a BIOS chip, an I/O control chip, a keyboard and a panel control switch interface, an indicator light plug-in, an expansion slot, a main board, and a direct current power supply plug-in of a plug-in card.
The cooling of the existing mainboard usually depends on natural heat dissipation or fan blowing heat dissipation, however, the heat dissipation effect of the two heat dissipation modes is not good, the temperature of the mainboard is still too high, and the service life of the mainboard is reduced.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing an intelligent cooling mainboard.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
intelligence cooling mainboard, including water tank and mainboard, mainboard horizontal installation is at the water tank top, and the water tank top has seted up the open slot, the inside first heat dissipation mechanism that is used for the mainboard heat dissipation that is equipped with of open slot, and the mainboard side sets up the passageway that runs through, the passageway has four and even mainboard side of having seted up, and four passageway intercommunications, four the inside inlaying of passageway has same coil pipe, and four passageway shape size looks adaptations of coil pipe and intercommunication, the coil pipe both ends are equipped with the intercommunication mechanism that is used for the intercommunication water tank, and water tank one side horizontal installation has the mounting panel, mounting panel one side is equipped with second heat dissipation mechanism, and second heat dissipation mechanism has a plurality ofly and evenly distributed in the mounting panel side, mainboard top horizontal installation has temperature sensor.
Preferably, the first heat dissipation mechanism comprises a plurality of heat dissipation fins, the heat dissipation fins are uniformly and horizontally arranged at the bottom of the open slot mainboard, and the side surfaces of the heat dissipation fins are provided with heat accelerating and dissipating mechanisms.
Preferably, the communicating mechanism comprises a first communicating pipe and a second communicating pipe, the top end of the first communicating pipe is communicated with one end of the coil pipe, and the tail end of the first communicating pipe is communicated with the inside of the water tank.
Preferably, the second is connected the top of communicating pipe and is linked together in the coil pipe other end, and the second is connected the end of communicating pipe and is linked together inside the water tank, the inside coolant liquid that is equipped with of water tank, and water tank internally mounted have the water pump, the second is connected the end of communicating pipe and is linked together in water pump output shaft, and water pump and temperature sensor electricity are connected.
Preferably, the second heat dissipation mechanism includes the circular slot, and the circular slot has seted up mounting panel one side and has run through the mounting panel, circular slot internally mounted has the fan, and the fan outlet is towards the open slot, fan and temperature sensor electricity are connected.
Preferably, the heat dissipation accelerating mechanism comprises a plurality of heat dissipation holes, the heat dissipation holes are formed in the side faces of the heat dissipation fins and penetrate through the heat dissipation fins, and the heat dissipation holes are multiple and evenly formed in the side faces of the heat dissipation fins.
Preferably, the heat accelerating and radiating mechanism comprises a radiating groove, the radiating groove is formed in the side face of the radiating fin and penetrates through the radiating fin, and the radiating groove is provided with a plurality of radiating fin side faces which are uniformly formed.
The utility model has the advantages that:
1. the utility model discloses, through the setting of a plurality of fin, can give off to the external world to the heat dissipation that produces on the mainboard is whole, and the setting through the louvre, the area of contact of multiplicable fin and ambient air, thereby the radiating effect to the mainboard has been improved, in addition through fan and temperature sensor's setting, when the mainboard high temperature, can blow to the fin, not only the gas flow velocity on multiplicable fin surface, still can blow the cooling to the mainboard, avoided present mainboard all be the drawback that relies on a fan to cool down alone, and then improved the radiating effect and the life of this mainboard.
2. The utility model discloses, through the setting of temperature sensor and water pump, when the high temperature on the mainboard, accessible water pump is through second communicating pipe, coil pipe and first communicating pipe to the water in the water tank to can carry out the water-cooling to the mainboard, and the fin still can dispel the heat to the water tank, has improved water-cooled effect, in addition through the setting of coil pipe, makes the dwell time of coolant liquid in the mainboard become long, further improvement the radiating effect of this mainboard.
3. The utility model discloses, setting through a plurality of radiating grooves, can give off to the external world to the heat dissipation that produces on the mainboard is whole, and the setting through the louvre, the area of contact of multiplicable fin and ambient air, thereby the radiating effect to the mainboard has been improved, in addition through fan and temperature sensor's setting, when the mainboard high temperature, can blow to the fin, not only the gas flow velocity on multiplicable fin surface, still can blow the cooling to the mainboard, avoided present mainboard all be the drawback that relies on a fan to cool down alone, and then improved the radiating effect and the life of this mainboard.
Drawings
Fig. 1 is a schematic structural diagram of an intelligent cooling motherboard according to embodiment 1 of the present invention;
fig. 2 is a sectional view of the inside of the water tank of the intelligent cooling mainboard according to the embodiment of the present invention;
fig. 3 is an internal cross-sectional view of an intelligent cooling motherboard according to embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of an intelligent cooling mainboard according to the utility model discloses embodiment 2.
In the figure: the heat dissipation device comprises a main board 1, a temperature sensor 2, a first communication pipe 3, a second communication pipe 4, a water tank 5, heat dissipation fins 6, heat dissipation holes 7, a circular groove 8, an open groove 9, a fan 10, a mounting plate 11, a coil pipe 12, a water pump 13, a channel 14 and a heat dissipation groove 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Example 1
Referring to fig. 1-3, intelligence cooling mainboard, including water tank 5 and mainboard 1, 1 horizontal installation of mainboard is at 5 tops of water tank, and open slot 9 has been seted up at 5 tops of water tank, the inside first heat dissipation mechanism that is used for 1 radiating to the mainboard that is equipped with of open slot 9, and mainboard 1 side has seted up the passageway 14 that runs through, passageway 14 has four and even 1 sides of mainboard of having seted up, and 14 intercommunications of four passageways, 14 inside inlays of four passageways have same coil pipe 12, and 14 shape looks adaptations of four passageways of coil pipe 12 and intercommunication, 12 both ends of coil pipe are equipped with the intercommunication mechanism that is used for intercommunication water tank 5, and 5 one side horizontal installation of water tank have mounting panel 11, 11 one side of mounting panel is equipped with the second heat dissipation mechanism, and the second heat dissipation mechanism has a plurality ofly and evenly distributed in 11 sides of mounting panel, 1 top horizontal installation of mainboard has temperature sensor 2.
The utility model discloses, the first heat dissipation mechanism includes fin 6, and fin 6 has a plurality of and even horizontal installations in open slot 9 mainboard 1 bottom, the side of a plurality of fins 6 all is equipped with the heat and dispels the mechanism with higher speed, the communicating mechanism includes first communicating pipe 3 and second communicating pipe 4, and the top of first communicating pipe 3 communicates with one end of coil pipe 12, the end of first communicating pipe 3 communicates inside water tank 5, the top of second communicating pipe 4 communicates with the other end of coil pipe 12, and the end of second communicating pipe 4 communicates inside water tank 5, the inside of water tank 5 is equipped with the coolant liquid, and water tank 5 internally mounted has water pump 13, the end of second communicating pipe 4 communicates with the output shaft of water pump 13, and water pump 13 and temperature sensor 2 are electrically connected, the second heat dissipation mechanism includes circular groove 8, and circular groove 8 has one side of mounting panel 11 and runs through mounting panel 11, circular groove 8 internally mounted has fan 10, and the air outlet of the fan 10 faces the open slot 9, the fan 10 is electrically connected with the temperature sensor 2, the heat accelerated dissipation mechanism comprises a heat dissipation hole 7, the heat dissipation hole 7 is arranged on the side surface of the heat dissipation fin 6 and penetrates through the heat dissipation fin 6, and the heat dissipation holes 7 are provided with a plurality of and uniformly arranged side surfaces of the heat dissipation fin 6.
The working principle of the embodiment is as follows: in actual use, through the arrangement of the plurality of radiating fins 6, all the heat generated on the mainboard 1 can be radiated to the outside, and through the arrangement of the radiating holes 7, the contact area between the radiating fins 6 and the outside air can be increased, so that the heat radiating effect on the mainboard 1 is improved, in addition, through the arrangement of the fan 10 and the temperature sensor 2, when the temperature of the mainboard 1 is overhigh, the radiating fins 6 can be blown, the gas flow rate on the surfaces of the radiating fins 6 can be increased, the mainboard 1 can be blown for cooling, the defect that the traditional mainboard 1 is cooled by only depending on one fan 10 is avoided, further, the heat radiating effect and the service life of the mainboard 1 are improved, through the arrangement of the temperature sensor 2 and the water pump 13, when the temperature on the mainboard 1 is overhigh, the water in the water tank 5 can pass through the second communicating pipe 4, the coil pipe 12 and the first communicating pipe 3 through the water pump 1, thereby can carry out water-cooling to mainboard 1, and fin 6 still can dispel the heat to water tank 5, has improved water-cooled effect, in addition through the setting of coil pipe 12 for the dwell time of coolant liquid in mainboard 1 lengthens, further improvement this mainboard 1's radiating effect.
Example 2
Referring to fig. 4, intelligence cooling mainboard, including water tank 5 and mainboard 1, 1 horizontal installation in 5 tops of water tank of mainboard, and open slot 9 has been seted up at 5 tops of water tank, the inside first heat dissipation mechanism that is used for 1 radiating of mainboard that is equipped with of open slot 9, and mainboard 1 side sets up the passageway 14 that runs through, passageway 14 has four and even 1 sides of mainboard of having seted up, and 14 intercommunications of four passageways, 14 inside inlays of four passageways have same coil pipe 12, and 14 shape size looks adaptations of four passageways of coil pipe 12 and intercommunication, 12 both ends of coil pipe are equipped with the intercommunication mechanism that is used for intercommunication water tank 5, and 5 one side horizontal installation of water tank have mounting panel 11, 11 one side of mounting panel is equipped with the second heat dissipation mechanism, and second heat dissipation mechanism has a plurality ofly and evenly distributed in 11 sides of mounting panel, 1 top horizontal installation of mainboard has temperature sensor 2.
The utility model discloses, the first heat dissipation mechanism includes fin 6, and fin 6 has a plurality of and even horizontal installations in open slot 9 mainboard 1 bottom, the side of a plurality of fins 6 all is equipped with the heat and dispels the mechanism with higher speed, the communicating mechanism includes first communicating pipe 3 and second communicating pipe 4, and the top of first communicating pipe 3 communicates with one end of coil pipe 12, the end of first communicating pipe 3 communicates inside water tank 5, the top of second communicating pipe 4 communicates with the other end of coil pipe 12, and the end of second communicating pipe 4 communicates inside water tank 5, the inside of water tank 5 is equipped with the coolant liquid, and water tank 5 internally mounted has water pump 13, the end of second communicating pipe 4 communicates with the output shaft of water pump 13, and water pump 13 and temperature sensor 2 are electrically connected, the second heat dissipation mechanism includes circular groove 8, and circular groove 8 has one side of mounting panel 11 and runs through mounting panel 11, circular groove 8 internally mounted has fan 10, and the air outlet of the fan 10 faces the open slot 9, the fan 10 is electrically connected with the temperature sensor 2, the heat accelerating and radiating mechanism comprises a heat radiating groove 15, the heat radiating groove 15 is arranged on the side surface of the heat radiating fin 6 and penetrates through the heat radiating fin 6, and the heat radiating groove 15 is provided with a plurality of heat radiating fins 6 which are uniformly arranged on the side surface.
The working principle of the embodiment is as follows: when in actual use, through the setting of a plurality of radiating grooves 15, can give off to the external world to the heat dissipation that produces on mainboard 1 is whole, and the setting through louvre 7, the area of contact of multiplicable fin 6 and outside air, thereby the radiating effect to mainboard 1 has been improved, in addition through fan 10 and temperature sensor 2's setting, when mainboard 1 high temperature, can blow to fin 6, not only the gas flow rate on 6 surfaces of multiplicable fin, still can blow the cooling to mainboard 1, avoided present mainboard 1 all to rely on a fan 10 alone to carry out the drawback of cooling, and then improved the radiating effect and the life of this mainboard 1.
Having shown and described the basic principles and essential features of the invention and advantages thereof, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof, and it is therefore intended that the embodiments be considered as exemplary and not limiting in any way, since the scope of the invention is defined by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein and are therefore not to be embraced therein by any reference numerals in the claims.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. Intelligent cooling mainboard, including water tank (5) and mainboard (1), its characterized in that, mainboard (1) horizontal installation is at water tank (5) top, and water tank (5) top has seted up open slot (9), open slot (9) inside is equipped with and is used for the radiating first heat dissipation mechanism of mainboard (1), and mainboard (1) side sets up passageway (14) that runs through, passageway (14) have four and even seted up mainboard (1) side, and four passageway (14) intercommunication, four passageway (14) inside is inlayed and is had same coil pipe (12), and coil pipe (12) and the big or small looks adaptation of four passageway (14) shapes of intercommunication, coil pipe (12) both ends are equipped with the intercommunication mechanism that is used for intercommunication water tank (5), and water tank (5) one side horizontal installation has mounting panel (11), mounting panel (11) one side is equipped with second heat dissipation mechanism, and the second heat dissipation mechanism has a plurality of and evenly distributed in mounting panel (11) side, mainboard (1) top horizontal installation has temperature sensor (2).
2. The intelligent cooling mainboard of claim 1, wherein the first heat dissipation mechanism comprises a plurality of heat dissipation fins (6), the plurality of heat dissipation fins (6) are uniformly and horizontally arranged at the bottom of the open slot (9) mainboard (1), and the heat dissipation accelerating mechanism is arranged on the side surface of each of the plurality of heat dissipation fins (6).
3. The intelligent cooling main board of claim 2, wherein the communication mechanism comprises a first communication pipe (3) and a second communication pipe (4), the top end of the first communication pipe (3) is communicated with one end of the coil (12), and the tail end of the first communication pipe (3) is communicated with the inside of the water tank (5).
4. The intelligent cooling mainboard of claim 3, wherein the top end of the second communicating pipe (4) is communicated with the other end of the coil pipe (12), the tail end of the second communicating pipe (4) is communicated with the inside of the water tank (5), the inside of the water tank (5) is provided with cooling liquid, the inside of the water tank (5) is provided with a water pump (13), the tail end of the second communicating pipe (4) is communicated with an output shaft of the water pump (13), and the water pump (13) is electrically connected with the temperature sensor (2).
5. The intelligent cooling mainboard of claim 4, wherein the second heat dissipation mechanism comprises a circular groove (8), the circular groove (8) is provided with one side of the mounting plate (11) and penetrates through the mounting plate (11), a fan (10) is mounted inside the circular groove (8), an air outlet of the fan (10) faces the open groove (9), and the fan (10) is electrically connected with the temperature sensor (2).
6. The intelligent cooling mainboard of claim 5, wherein the heat dissipation accelerating mechanism comprises heat dissipation holes (7), the heat dissipation holes (7) are formed in the side surfaces of the heat dissipation fins (6) and penetrate through the heat dissipation fins (6), and the heat dissipation holes (7) are formed in a plurality of and uniformly distributed in the side surfaces of the heat dissipation fins (6).
7. The intelligent cooling mainboard of claim 5, wherein the heat dissipation accelerating mechanism comprises a heat dissipation groove (15), the heat dissipation groove (15) is formed in the side surface of the heat dissipation fin (6) and penetrates through the heat dissipation fin (6), and the heat dissipation groove (15) has a plurality of and uniformly formed side surfaces of the heat dissipation fin (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120256420.1U CN214122898U (en) | 2021-01-29 | 2021-01-29 | Intelligent cooling mainboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120256420.1U CN214122898U (en) | 2021-01-29 | 2021-01-29 | Intelligent cooling mainboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214122898U true CN214122898U (en) | 2021-09-03 |
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ID=77496188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120256420.1U Active CN214122898U (en) | 2021-01-29 | 2021-01-29 | Intelligent cooling mainboard |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214122898U (en) |
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2021
- 2021-01-29 CN CN202120256420.1U patent/CN214122898U/en active Active
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