CN214014280U

CN214014280U - Semiconductor pure metal conduction radiator

Info

Publication number: CN214014280U
Application number: CN202120326916.1U
Authority: CN
Inventors: 胡爱国
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-02-05
Filing date: 2021-02-05
Publication date: 2021-08-20
Anticipated expiration: 2031-02-05

Abstract

The utility model discloses a pure metal conduction radiator of semiconductor belongs to metal radiator equipment technical field, and the volume and the area ratio of the metal radiating piece of having solved current radiator are smaller, and the cooling surface is big enough, leads to the problem that refrigeration effect does not reach the ideal effect, and its technical essential is: including leading cold aluminum plate, lead cold aluminum plate left side and install preceding shell, lead cold aluminum plate fixed connection preceding shell, install slide switch on the preceding shell, slide switch swing joint preceding shell, the PCB circuit board is installed to the preceding shell, PCB circuit board circuit connection slide switch, metal conduction radiating piece is installed in preceding shell left side, metal conduction radiating piece fixed connection preceding shell has the advantage that the radiating effect is good.

Description

Semiconductor pure metal conduction radiator

Technical Field

The utility model relates to a metal radiator equipment technical field specifically relates to a pure metal conduction radiator of semiconductor.

Background

The mobile phone radiator is an external fan device which directly blows air towards the back of a mobile phone, increases the air circulation quantity on the back of the mobile phone and introduces air with relatively low temperature, so that all heating elements in the mobile phone are cooled.

The existing semiconductor mobile phone cooling radiator is limited in space, the outer layer of the radiator is wrapped by plastic and other materials, and a fan and an electronic device occupy space, so that the size and the area of a metal radiating piece are small, the radiating surface is not large enough, the refrigerating effect cannot reach the optimal effect, and the radiator is difficult to popularize and apply.

Therefore, it is desirable to provide a pure metal conductive heat sink for semiconductor, aiming at solving the above problems.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a not enough to prior art exists, the utility model provides a pure metal conduction radiator of semiconductor to solve the problem among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a pure metal conduction radiator of semiconductor, is including leading cold aluminum plate, lead cold aluminum plate left side and install preceding shell, lead cold aluminum plate fixed connection preceding shell, install slide switch on the preceding shell, slide switch swing joint preceding shell, the PCB circuit board is installed to the preceding shell, PCB circuit board circuit connection slide switch, metal conduction radiating part is installed in preceding shell left side, metal conduction radiating part fixed connection preceding shell, through leading cold aluminum plate and metal conduction radiating part of installation, under mutually supporting between them, can effectual absorption cell-phone be at the heat that the in-process produced that uses to timely conduction is walked, dispels the heat to the cell-phone.

As the utility model discloses a further scheme, the symmetry is provided with movable hook frame iron axle in the preceding shell, shell before the activity hook frame iron axle swing joint, activity hook frame iron off-axial is equipped with movable hook frame spring, shell before the activity hook frame spring coupling, movable hook frame is installed to preceding shell below, shell and metal conduction radiating piece before the activity hook frame fixed connection can make the installation of device firm more through setting up movable hook frame, and the effectual in-process that prevents using produces not hard up.

As the utility model discloses further scheme, install the PET pottery refrigeration piece in the preceding shell, the shell before the PET pottery refrigeration piece fixed connection promotes the radiating effect through setting up promotion radiating effect that the PET pottery refrigeration piece can be further, promotes initiative radiating effect.

As a further scheme of the utility model, movable hook frame silica gel pad is installed on movable hook frame right side, through setting up the cell-phone of placing that movable hook frame silica gel pad can be better, increases the in-service use effect of device.

As a further scheme of the utility model, shell hook silica gel pad before installing on the preceding shell can make leading cold aluminum plate and the connection of preceding shell hook silica gel pad inseparabler through shell hook silica gel pad before setting up.

As the utility model discloses further scheme, install the silence fan in the metal conduction radiating piece, the silence fan is equipped with metal fan lid outward, metal fan lid fixed connection metal conduction radiating piece through setting up the silence fan, can increase the speed of the circulation of air, simultaneously through setting up the noise that the reduction device work that the silence fan can be better produced, the reinforcing is used and is experienced.

To sum up, compared with the prior art, the embodiment of the utility model has the following beneficial effects:

the utility model discloses a cold aluminum plate and the metal conduction radiating piece of leading of installation, under mutually supporting between them, can be effectual the heat that the absorption cell-phone produced at the in-process that uses, and timely conduction is walked, dispel the heat to the cell-phone, can make installation of device more firm through setting up movable hook frame, effectually prevent to produce not hard up at the in-process that uses, the appearance piece is made in the whole expansion of metal conduction radiating piece, the cancellation is outer, whole product almost all becomes the heat dissipation conduction device promptly, thereby unrestricted solution space restriction problem, very big improvement heat dissipation and refrigeration effect.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a schematic structural view of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an exploded view in an embodiment of the present invention.

Reference numerals: 1-cold guide aluminum plate, 2-front shell hook silica gel pad, 3-front shell, 4-sliding switch, 5-PCB circuit board, 6-movable hook frame iron shaft, 7-movable hook frame spring, 8-movable hook frame, 9-PET ceramic refrigeration sheet, 10-metal conduction heat sink, 11-silent fan, 12-metal fan cover and 13-movable hook frame silica gel pad.

Detailed Description

In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are used merely for convenience of description and simplification of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The following detailed description is provided for the specific embodiments of the present invention.

Example 1

Referring to fig. 1-2, a pure metal conduction radiator of semiconductor, is including leading cold aluminum plate 1, lead cold aluminum plate 1 left side and install preceding shell 3, lead cold aluminum plate 1 fixed connection preceding shell 3, install slide switch 4 on the preceding shell 3, slide switch 4 swing joint preceding shell 3, PCB circuit board 5 is installed to preceding shell 3, PCB circuit board 5 circuit connection slide switch 4, metal conduction radiating piece 10 is installed in preceding shell 3 left side, metal conduction radiating piece 10 fixed connection preceding shell 3, through leading cold aluminum plate 1 and metal conduction radiating piece 10 of installation, under the mutually supporting of the two, can effectual absorption cell-phone in the in-process heat that produces of using to timely conduction is walked, dispels the heat to the cell-phone.

Preceding shell 3 interior symmetry is provided with movable hook frame iron axle 6, shell 3 before 6 swing joint of activity hook frame iron axle, activity hook frame iron axle 6 is equipped with movable hook frame spring 7 outward, shell 3 before activity hook frame spring 7 connects, movable hook frame 8 is installed to preceding shell 3 below, shell 3 and metal conduction radiating piece 10 before 8 fixed connection of activity hook frame can make the installation of device more firm through setting up movable hook frame 8, and the effectual in-process that prevents using produces not hard up.

Preferably, in this embodiment, install PET ceramic refrigeration piece 9 in the preceding shell 3, shell 3 before 9 fixed connection of PET ceramic refrigeration piece promotes the radiating effect that initiative radiating effect can be further through setting up PET ceramic refrigeration piece 9, promotes.

Preferably, in this embodiment, activity hook frame silica gel pad 13 is installed on activity hook frame 8 right side, through setting up the mobile phone of placing that activity hook frame silica gel pad 13 can be better, increases the actual use effect of device.

Preferably, in this embodiment, preceding shell hook silica gel pad 2 is installed on preceding shell 3, can make the connection of leading cold aluminum plate 1 and preceding shell hook silica gel pad 2 inseparabler through setting up preceding shell hook silica gel pad 2.

Example 2

Referring to fig. 1 to 2, a semiconductor pure metal conduction radiator includes a cold-conducting aluminum plate 1, a mute fan 11 and a metal fan cover 12, wherein a front shell 3 is installed on the left side of the cold-conducting aluminum plate 1, the cold-conducting aluminum plate 1 is fixedly connected to the front shell 3, a slide switch 4 is installed on the front shell 3, the slide switch 4 is movably connected to the front shell 3, a PCB circuit board 5 is installed on the front shell 3, the PCB circuit board 5 is electrically connected to the slide switch 4, a metal conduction heat dissipation member 10 is installed on the left side of the front shell 3, the metal conduction heat dissipation member 10 is fixedly connected to the front shell 3, and by the mutual cooperation of the cold-conducting aluminum plate 1 and the metal conduction heat dissipation member 10, heat generated by a mobile phone in the use process can be effectively absorbed and timely conducted away to dissipate heat of the mobile phone.

Different from embodiment 1, install silent fan 11 in the metal conduction radiating piece 10, be equipped with metal fan lid 12 outside silent fan 11, metal fan lid 12 fixed connection metal conduction radiating piece 10 through setting up silent fan 11, can increase the speed of the circulation of air, and the noise that produces through setting up silent fan 11 reduction device work that can be better simultaneously, the reinforcing is used and is experienced.

The rest of the structure of this example is the same as example 1.

The utility model discloses a theory of operation is:

this product carries out the heat absorption refrigeration and releases heat through the work of PET pottery refrigeration piece 9, and heat conduction silicone grease piece is hugged closely to the heat absorption refrigeration face, conducts and leads cold aluminum plate 1 on and use the cell-phone, reaches refrigeration cooling's effect, and the face of releasing heat simultaneously is cooled down for PET pottery refrigeration piece 9 through metal conduction radiating piece 10 and silent fan 11 to reach the effect of continuously cooling.

It should be noted that, in this application, through cold conduction aluminum plate 1 and the metal conduction radiating piece 10 of installation, under the mutually supporting of both, can effectual absorption cell-phone be at the heat that the in-process produced of use, and timely conduction is walked, dispel the heat to the cell-phone, can make the installation of device more firm through setting up movable hook frame 8, the effectual in-process that prevents to use produces not hard up, the whole expansion of metal conduction radiating piece 10 is made into outward appearance piece, cancel the skin, whole product almost all becomes the heat dissipation conduction device promptly, thereby unrestrained solution space restriction problem, very big improvement heat dissipation and refrigeration effect.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a pure metal conduction radiator of semiconductor, is including leading cold aluminum plate (1), its characterized in that, lead cold aluminum plate (1) left side and install preceding shell (3), lead cold aluminum plate (1) fixed connection preceding shell (3), install slide switch (4) on preceding shell (3), shell (3) before slide switch (4) swing joint, PCB circuit board (5) are installed in preceding shell (3), PCB circuit connection slide switch (4) in PCB circuit connection (5), metal conduction radiating part (10) is installed in preceding shell (3) left side, shell (3) before metal conduction radiating part (10) fixed connection.

2. The pure metal conductive radiator of claim 1, characterized in that a movable hook frame iron shaft (6) is symmetrically arranged in the front shell (3), the movable hook frame iron shaft (6) is movably connected with the front shell (3), a movable hook frame spring (7) is arranged outside the movable hook frame iron shaft (6), the movable hook frame spring (7) is connected with the front shell (3), a movable hook frame (8) is arranged below the front shell (3), and the movable hook frame (8) is fixedly connected with the front shell (3) and the metal conductive heat sink (10).

3. The semiconductor pure metal conduction radiator according to claim 2, wherein a PET ceramic refrigerating sheet (9) is installed in the front shell (3), and the PET ceramic refrigerating sheet (9) is fixedly connected with the front shell (3).

4. A semiconductor pure metal conduction heat sink according to claim 3, characterized in that a movable hook frame silica gel pad (13) is mounted on the right side of the movable hook frame (8).

5. A semiconductor pure metal conduction heat sink according to claim 4, characterized in that a front case hook silica gel pad (2) is mounted on the front case (3).

6. A semiconductor pure metal conduction heat sink according to claim 1, wherein a silent fan (11) is installed in the metal conduction heat sink (10), a metal fan cover (12) is installed outside the silent fan (11), and the metal fan cover (12) is fixedly connected to the metal conduction heat sink (10).