CN213984718U - Heat pipe with quick heat dissipation - Google Patents
Heat pipe with quick heat dissipation Download PDFInfo
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- CN213984718U CN213984718U CN202021945839.XU CN202021945839U CN213984718U CN 213984718 U CN213984718 U CN 213984718U CN 202021945839 U CN202021945839 U CN 202021945839U CN 213984718 U CN213984718 U CN 213984718U
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Abstract
The utility model discloses a heat pipe with fast heat dissipation, which comprises a pipe body, the body includes evaporation zone, adiabatic section and condensation segment, all be provided with the capillary structure layer on the pipe wall of evaporation zone, adiabatic section and condensation segment, the thickness of the capillary structure layer on the evaporation zone pipe wall is crescent from the one end that is close to the adiabatic section to the other end, the thickness of the capillary structure layer on the pipe wall of adiabatic section is reduced gradually from the one end that is close to the evaporation zone to the other end, the thickness of the capillary structure layer on the pipe wall of condensation segment equals the minimum thickness of the capillary structure layer on the pipe wall of adiabatic section, the minimum thickness of the capillary structure layer on the pipe wall of evaporation zone equals the maximum thickness of the capillary structure layer on the pipe wall of adiabatic section; the tube wall of the condensation section is also provided with fins which vertically penetrate through the capillary vessel layer. The utility model discloses utilize the different capillary structure layer thickness of three-section to accelerate the backward flow speed of working medium in the heat pipe to utilize fin to accelerate the rate of condensation, greatly improved the radiating efficiency of this heat pipe.
Description
Technical Field
The utility model relates to a heat pipe technical field specifically is a heat pipe fast dispels heat.
Background
Heat pipes have been widely used in electronic components with large heat generation because of their advantage of high heat transfer capacity. When the heat pipe works, the low-boiling point working medium filled in the pipe body is evaporated and vaporized after the evaporation section absorbs heat generated by the heating electronic element, and the steam takes the heat to move to the condensation section and is liquefied and condensed at the condensation section to release the heat, so that the electronic element is cooled. The liquefied working medium flows back to the evaporation section under the action of the capillary structure on the inner wall of the heat conduction pipe, and is continuously evaporated, vaporized, liquefied and condensed, so that the working medium circularly moves in the heat conduction pipe, and heat generated by the electronic element is continuously dissipated. Therefore, in the process of circulating heat dissipation, the reflux speed of the working medium plays a very critical role, and how to accelerate the reflux speed of the working medium becomes a problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fast heat pipe dispels heat utilizes the different capillary structure layer thickness of three-section to accelerate the backward flow speed of working medium in the heat pipe to utilize fin to accelerate the rate of condensation, greatly improved the radiating efficiency of this heat pipe.
In order to achieve the above object, the utility model provides a following technical scheme:
a heat pipe with fast heat dissipation comprises a pipe body, wherein the pipe body comprises an evaporation section, a heat insulation section and a condensation section, the heat insulation section is positioned between the evaporation section and the condensation section, capillary structure layers are arranged on pipe walls of the evaporation section, the heat insulation section and the condensation section, the thickness of the capillary structure layers on the pipe walls of the evaporation section is gradually increased from one end close to the heat insulation section to the other end, the thickness of the capillary structure layers on the pipe walls of the heat insulation section is gradually reduced from one end close to the evaporation section to the other end, the thickness of the capillary structure layers on the pipe walls of the condensation section is equal to the minimum thickness of the capillary structure layers on the pipe walls of the heat insulation section, and the minimum thickness of the capillary structure layers on the pipe walls of the evaporation section is equal to the maximum thickness;
and fins are also arranged on the tube wall of the condensation section and vertically penetrate through the capillary structure layer.
In one embodiment, the fin is a cone, and the bottom surface of the fin is connected with the inner cavity of the tube body.
In one embodiment, the fins are distributed in more than two rows.
In one embodiment, the fins are provided with convection holes.
In one embodiment, the end of the condensation section is provided with a cold guide sheet and a semiconductor refrigeration sheet, the cold guide sheet and the semiconductor refrigeration sheet are arranged adjacently, and the cold guide sheet is connected with the inner cavity of the tube body.
In one embodiment, the inner diameters of the heat insulation section and the condensation section are the same, and the inner diameter of the evaporation section is gradually reduced from one end close to the heat insulation section to the other end.
In one embodiment, the maximum inner diameter of the evaporator end is the same as the inner diameter of the heat-insulated end.
In one embodiment, a vacuum heat insulation layer is arranged between the tube wall of the heat insulation section and the capillary structure layer.
The utility model discloses a fast heat pipe dispels heat utilizes the gradual change internal diameter of evaporation zone and the different capillary structure layer thickness of three-section, strengthens the capillary force of capillary structure layer on the evaporation zone to operating medium's backward flow speed in the heat pipe is accelerated, utilizes fin to accelerate the condensing rate simultaneously, and the two combines together and has greatly improved the radiating efficiency of this heat pipe.
Drawings
Fig. 1 is a schematic structural view of a heat pipe with a fast heat dissipation function of the present invention;
10. a pipe body; 11. an evaporation section; 12. a thermally insulating section; 121. a vacuum heat insulation layer; 13. a condensing section; 131. a fin; 132. A cold conducting sheet; 133. a semiconductor refrigeration sheet; 134. a convection hole; 21. a first capillary structure layer; 22. a second capillary structure layer; 23. and a third capillary structure layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a heat pipe with fast heat dissipation in an embodiment, the heat pipe with fast heat dissipation includes a pipe body 10, the pipe body 10 includes an evaporation section 11, an insulation section 12 and a condensation section 13, the insulation section 12 is located between the evaporation section 11 and the condensation section 13, inner diameters of the insulation section 12 and the condensation section 13 are the same, an inner diameter of the evaporation section 11 gradually decreases from one end near the insulation section 12 to the other end, wherein a maximum inner diameter of the evaporation section 11 is the same as an inner diameter of the insulation section 12. The inner diameter of the evaporation section 11 gradually decreases from one end close to the heat-insulating section 12 to the other end, so that the capillary force gradually increases from one end close to the heat-insulating section 12 to the other end, and the working medium flows back to the evaporation section 11 at a higher speed.
The tube walls of the evaporation section 11, the heat insulation section 12 and the condensation section 13 are all provided with a capillary structure layer, the capillary structure layer on the tube wall of the evaporation section 11 is a first capillary structure layer 21, the thickness of the first capillary structure layer 21 is gradually increased from one end close to the heat insulation section 12 to the other end, the capillary structure layer on the pipe wall of the heat insulation section 12 is a second capillary structure layer 22, the thickness of the second capillary structure layer 22 is gradually reduced from one end close to the evaporation section 11 to the other end, the capillary structure layer on the pipe wall of the condensation section 13 is a third capillary structure layer 23, the thickness of the third capillary structure layer 23 is equal to the minimum thickness of the second capillary structure layer 22 on the pipe wall of the heat insulation segment 12, the minimum thickness of the first capillary structure layer 21 on the tube wall of the evaporation section 11 is equal to the maximum thickness of the second capillary structure layer 22 on the tube wall of the heat insulation section 12. The thicknesses of the first capillary structure layer 21, the second capillary structure layer 22 and the third capillary structure layer 23 are gradually reduced, so that the capillary force is gradually increased from one end close to the heat insulation section 12 to the other end, and the working medium flows back to the evaporation section 11 at a higher speed.
Specifically, the tube wall of the condensation section 13 is further provided with fins 131, the fins 131 vertically penetrate through the third capillary structure layer 23, the fins 131 can be used for transferring heat in the working medium in the tube and in the third capillary structure layer 23 to the outside of the tube, preferably, the fins 131 are cone-shaped, the fins 131 are distributed in more than two rows, the bottom surfaces of the fins 131 are connected with the inner cavity of the tube body 10, so that steam in the inner cavity can be directly contacted with the fins 131, the heat dissipation area of the condensation section 13 is increased, wherein the fins 131 are provided with convection holes 134, the axes of the convection holes 134 in the fins 131 are parallel to each other, and the heat dissipation efficiency can be further improved by matching with a fan.
In one embodiment, a vacuum heat insulation layer 121 is arranged between the tube wall of the heat insulation section 12 and the second capillary structure layer 22, so that heat loss of the heat insulation section 12 is reduced, and heat in the heat pipe is prevented from being dissipated to an unspecified position.
In one embodiment, in order to further increase the heat dissipation speed, the end of the condensation section 13 is provided with a cold guiding plate 132 and a semiconductor cooling plate 133, the cold guiding plate 132 and the semiconductor cooling plate 133 are arranged adjacently, and the cold guiding plate 132 is connected with the inner cavity of the tube 10.
The utility model discloses a fast heat pipe dispels heat utilizes the different capillary structure layer thickness of gradual change internal diameter of evaporation zone 11 and three-section, strengthens the capillary force of capillary structure layer on the evaporation zone 11 to accelerate working medium's among the heat pipe speed of refluxing, utilize fin 131, convection current hole 134, cold-conducting piece 132 and semiconductor refrigeration piece 133 to accelerate the rate of condensation simultaneously, the two combines together the radiating efficiency who has greatly improved this heat pipe.
The foregoing examples, while indicating preferred embodiments of the invention, are given by way of illustration and description, it is to be understood that the invention is not limited to the disclosed forms herein but is not intended to be exhaustive or to exclude other examples and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings or the skill or knowledge of the relevant art, and not to limit the scope of the invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit and scope of the present invention, and these changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention, which is to be construed as being limited only by the appended claims. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (8)
1. A heat pipe with fast heat dissipation comprises a pipe body, wherein the pipe body comprises an evaporation section, a heat insulation section and a condensation section, the heat insulation section is positioned between the evaporation section and the condensation section, and the heat pipe is characterized in that capillary structure layers are arranged on pipe walls of the evaporation section, the heat insulation section and the condensation section, the thickness of the capillary structure layers on the pipe walls of the evaporation section is gradually increased from one end close to the heat insulation section to the other end, the thickness of the capillary structure layers on the pipe walls of the heat insulation section is gradually reduced from one end close to the evaporation section to the other end, the thickness of the capillary structure layers on the pipe walls of the condensation section is equal to the minimum thickness of the capillary structure layers on the pipe walls of the heat insulation section, and the minimum thickness of the capillary structure layers on the pipe walls of the evaporation section is equal to the maximum thickness of the capillary structure layers on the pipe walls of the heat insulation section;
and fins are also arranged on the tube wall of the condensation section and vertically penetrate through the capillary structure layer.
2. A heat pipe as claimed in claim 1, wherein said fins are tapered, and the bottom surfaces of said fins are connected to the inner cavity of said pipe body.
3. A heat pipe as claimed in claim 1, wherein said fins are distributed in two or more rows.
4. A heat pipe according to claim 2, wherein said fins are provided with convection holes.
5. A heat pipe as claimed in claim 1, wherein the end of the condensing section is provided with a cold conducting plate and a semiconductor cooling plate, the cold conducting plate and the semiconductor cooling plate are disposed adjacent to each other, and the cold conducting plate is connected to the inner cavity of the pipe body.
6. A heat pipe as claimed in claim 1, wherein the inside diameters of the heat insulating section and the condensing section are the same, and the inside diameter of the evaporating section is gradually decreased from one end near the heat insulating section to the other end.
7. A heat pipe as claimed in claim 6, wherein said maximum inner diameter of said evaporation section is the same as the inner diameter of said adiabatic section.
8. A heat pipe according to claim 1, wherein a vacuum thermal insulation layer is disposed between the wall of the thermal insulation section and the capillary structure layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021945839.XU CN213984718U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with quick heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021945839.XU CN213984718U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with quick heat dissipation |
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| Publication Number | Publication Date |
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| CN213984718U true CN213984718U (en) | 2021-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021945839.XU Active CN213984718U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with quick heat dissipation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114894016A (en) * | 2022-04-29 | 2022-08-12 | 广州大学 | Metal wire array liquid absorption core one-way heat pipe and manufacturing method thereof |
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2020
- 2020-09-08 CN CN202021945839.XU patent/CN213984718U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114894016A (en) * | 2022-04-29 | 2022-08-12 | 广州大学 | Metal wire array liquid absorption core one-way heat pipe and manufacturing method thereof |
| CN114894016B (en) * | 2022-04-29 | 2023-09-15 | 广州大学 | Metal wire array wick unidirectional heat pipe and manufacturing method thereof |
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