CN213956087U - Heat pipe with good heat transfer effect - Google Patents
Heat pipe with good heat transfer effect Download PDFInfo
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- CN213956087U CN213956087U CN202021943710.5U CN202021943710U CN213956087U CN 213956087 U CN213956087 U CN 213956087U CN 202021943710 U CN202021943710 U CN 202021943710U CN 213956087 U CN213956087 U CN 213956087U
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Abstract
The utility model discloses a heat pipe with good heat transfer effect, which comprises a pipe body, the body includes evaporation zone, adiabatic section and condensation segment, all be provided with the capillary structure layer on the pipe wall of evaporation zone adiabatic section and condensation segment, the thickness of the capillary structure layer on the evaporation zone pipe wall is crescent from the one end that is close to the adiabatic section to the other end, the thickness of the capillary structure layer on the pipe wall of adiabatic section is reduced gradually from the one end that is close to the evaporation zone to the other end, the thickness of the capillary structure layer on the pipe wall of condensation segment equals the minimum thickness of the capillary structure layer on the pipe wall of adiabatic section, the minimum thickness of the capillary structure layer on the pipe wall of evaporation zone equals the maximum thickness of the capillary structure layer on the pipe wall of adiabatic section; the end of the condensation section is provided with a cold guide sheet and a semiconductor refrigeration sheet, the cold guide sheet and the semiconductor refrigeration sheet are arranged adjacently, and the cold guide sheet is connected with the inner cavity of the tube body. The utility model discloses operating medium's backward flow speed and condensing rate in the acceleration of heat pipe have greatly improved the radiating efficiency of this heat pipe.
Description
Technical Field
The utility model relates to a heat pipe technical field specifically is a heat pipe that heat transfer effect is good.
Background
Heat pipes have been widely used in electronic components with large heat generation because of their advantage of high heat transfer capacity. When the heat pipe works, the low-boiling point working medium filled in the pipe body is evaporated and vaporized after the evaporation section absorbs heat generated by the heating electronic element, and the steam takes the heat to move to the condensation section and is liquefied and condensed at the condensation section to release the heat, so that the electronic element is cooled. The liquefied working medium flows back to the evaporation section under the action of the capillary structure on the inner wall of the heat conduction pipe, and is continuously evaporated, vaporized, liquefied and condensed, so that the working medium circularly moves in the heat conduction pipe, and heat generated by the electronic element is continuously dissipated. Therefore, in the process of circulating heat dissipation, the reflux speed of the working medium plays a very critical role, and how to accelerate the reflux speed of the working medium becomes a problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat pipe that heat transfer effect is good for the backward flow speed and the condensing rate of working medium among the heat pipe, greatly improved the radiating efficiency of this heat pipe.
In order to achieve the above object, the utility model provides a following technical scheme:
a heat pipe with good heat transfer effect comprises a pipe body, wherein the pipe body comprises an evaporation section, a heat insulation section and a condensation section, the heat insulation section is positioned between the evaporation section and the condensation section, capillary structure layers are arranged on pipe walls of the evaporation section, the heat insulation section and the condensation section, the thickness of the capillary structure layers on the pipe walls of the evaporation section is gradually increased from one end close to the heat insulation section to the other end, the thickness of the capillary structure layers on the pipe walls of the heat insulation section is gradually reduced from one end close to the evaporation section to the other end, the thickness of the capillary structure layers on the pipe walls of the condensation section is equal to the minimum thickness of the capillary structure layers on the pipe walls of the heat insulation section, and the minimum thickness of the capillary structure layers on the pipe walls of the evaporation section is equal to the maximum thickness of the capillary structure layers on the pipe walls of the heat insulation section;
the tip of condensation segment is equipped with and leads cold piece and semiconductor refrigeration piece, lead cold piece and semiconductor refrigeration piece adjacent and establish, lead cold piece with the inner chamber of body meets.
In one embodiment, the inner diameters of the heat insulation section and the condensation section are the same, and the inner diameter of the evaporation section is gradually reduced from one end close to the heat insulation section to the other end.
In one embodiment, the maximum inner diameter of the evaporator end is the same as the inner diameter of the heat-insulated end.
In one embodiment, a vacuum heat insulation layer is arranged between the tube wall of the heat insulation section and the capillary structure layer.
In one embodiment, the outer wall of the condensation section is provided with an annular groove.
In one embodiment, the wall of the condensing section is made of metal.
The utility model discloses a heat pipe that heat transfer effect is good utilizes the gradual change internal diameter of evaporation zone and the different capillary structure layer thickness of three-section, strengthens the capillary force of capillary structure layer on the evaporation zone to operating medium's backward flow speed in the acceleration heat pipe utilizes cold-conducting piece and semiconductor refrigeration piece to accelerate the rate of condensation simultaneously, and the two combines together the radiating efficiency who has greatly improved this heat pipe.
Drawings
Fig. 1 is a schematic structural view of a heat pipe with good heat transfer effect according to the present invention;
10. a pipe body; 11. an evaporation section; 12. a thermally insulating section; 121. a vacuum heat insulation layer; 13. a condensing section; 131. an annular groove; 132. a cold conducting sheet; 133. a semiconductor refrigeration sheet; 21. a first capillary structure layer; 22. a second capillary structure layer; 23. and a third capillary structure layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Fig. 1 is a schematic structural diagram of a heat pipe with a good heat transfer effect according to an embodiment, where the heat pipe with a good heat transfer effect includes a pipe body 10, and the pipe body 10 includes an evaporation section 11, a heat insulation section 12, and a condensation section 13, the heat insulation section 12 is located between the evaporation section 11 and the condensation section 13, inner diameters of the heat insulation section 12 and the condensation section 13 are the same, and an inner diameter of the evaporation section 11 gradually decreases from one end near the heat insulation section 12 to the other end, where a maximum inner diameter of the evaporation section 11 is the same as an inner diameter of the heat insulation section 12. The inner diameter of the evaporation section 11 gradually decreases from one end close to the heat-insulating section 12 to the other end, so that the capillary force gradually increases from one end close to the heat-insulating section 12 to the other end, and the working medium flows back to the evaporation section 11 at a higher speed.
The tube walls of the evaporation section 11, the heat insulation section 12 and the condensation section 13 are all provided with a capillary structure layer, the capillary structure layer on the tube wall of the evaporation section 11 is a first capillary structure layer 21, the thickness of the first capillary structure layer 21 is gradually increased from one end close to the heat insulation section 12 to the other end, the capillary structure layer on the pipe wall of the heat insulation section 12 is a second capillary structure layer 22, the thickness of the second capillary structure layer 22 is gradually reduced from one end close to the evaporation section 11 to the other end, the capillary structure layer on the pipe wall of the condensation section 13 is a third capillary structure layer 23, the thickness of the third capillary structure layer 23 is equal to the minimum thickness of the second capillary structure layer 22 on the pipe wall of the heat insulation segment 12, the minimum thickness of the first capillary structure layer 21 on the tube wall of the evaporation section 11 is equal to the maximum thickness of the second capillary structure layer 22 on the tube wall of the heat insulation section 12. The thicknesses of the first capillary structure layer 21, the second capillary structure layer 22 and the third capillary structure layer 23 are gradually reduced, so that the capillary force is gradually increased from one end close to the heat insulation section 12 to the other end, and the working medium flows back to the evaporation section 11 at a higher speed.
Specifically, the end of the condensation section 13 is provided with a cold conducting sheet 132 and a semiconductor refrigerating sheet 133, the cold conducting sheet 132 and the semiconductor refrigerating sheet 133 are adjacent to each other, and the cold conducting sheet 132 is connected with the inner cavity of the tube body 10 and used for transferring heat in the working medium inside the tube and inside the third capillary structure layer 23 to the outside of the tube, so that the heat dissipation efficiency is improved.
In one embodiment, the outer wall of the tube wall of the condensation section 13 is provided with an annular groove 131, the tube wall of the condensation section 13 is made of metal, heat in the third capillary structure layer 23 can be transferred to the outside through the metal tube wall, the arrangement of the annular groove 131 can increase the heat dissipation area, reduce the transfer distance of heat in the metal tube wall, and can also be used for being connected with curved-surface heat dissipation fins and the like in a clamping manner to improve the heat dissipation speed.
In one embodiment, a vacuum insulation layer 121 is disposed between the tube wall of the insulation segment 12 and the second capillary structure layer 22, so as to reduce heat loss of the insulation segment 12 and avoid heat in the heat pipe from being dissipated to an unspecified position.
The utility model discloses a heat pipe that heat transfer effect is good utilizes the gradual change internal diameter of evaporation zone 11 and the different capillary structure layer thickness of three-section, strengthens the capillary force of capillary structure layer on the evaporation zone 11 to accelerate working medium's among the heat pipe velocity of flow back, annular groove 131, lead cold plate 132 and semiconductor refrigeration piece 133 accelerate the rate of condensation simultaneously, the two combines together the radiating efficiency who has greatly improved this heat pipe.
The foregoing examples, while indicating preferred embodiments of the invention, are given by way of illustration and description, it is to be understood that the invention is not limited to the disclosed forms herein but is not intended to be exhaustive or to exclude other examples and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings or the skill or knowledge of the relevant art, and not to limit the scope of the invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit and scope of the present invention, and these changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention, which is to be construed as being limited only by the appended claims. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A heat pipe with good heat transfer effect comprises a pipe body, wherein the pipe body comprises an evaporation section, a heat insulation section and a condensation section, the heat insulation section is positioned between the evaporation section and the condensation section, and the heat pipe is characterized in that capillary structure layers are arranged on pipe walls of the evaporation section, the heat insulation section and the condensation section, the thickness of the capillary structure layers on the pipe walls of the evaporation section is gradually increased from one end close to the heat insulation section to the other end, the thickness of the capillary structure layers on the pipe walls of the heat insulation section is gradually reduced from one end close to the evaporation section to the other end, the thickness of the capillary structure layers on the pipe walls of the condensation section is equal to the minimum thickness of the capillary structure layers on the pipe walls of the heat insulation section, and the minimum thickness of the capillary structure layers on the pipe walls of the evaporation section is equal to the maximum thickness of the capillary structure layers on the pipe walls of the heat insulation section;
the tip of condensation segment is equipped with and leads cold piece and semiconductor refrigeration piece, lead cold piece and semiconductor refrigeration piece adjacent and establish, lead cold piece with the inner chamber of body meets.
2. A heat pipe as claimed in claim 1, wherein the inside diameters of the heat insulating section and the condensing section are the same, and the inside diameter of said evaporating section is gradually decreased from one end near said heat insulating section to the other end.
3. A heat pipe having a high heat transfer effect as claimed in claim 2, wherein a maximum inner diameter of said evaporation section is the same as an inner diameter of said adiabatic section.
4. A heat pipe as claimed in claim 1, wherein a vacuum heat insulating layer is provided between the wall of said heat insulating section and said capillary structure layer.
5. A heat pipe as claimed in claim 1, wherein the wall of said condensing section has an annular groove on its outer wall.
6. A heat pipe as claimed in claim 1, wherein the wall of said condensing section is made of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021943710.5U CN213956087U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with good heat transfer effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021943710.5U CN213956087U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with good heat transfer effect |
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| CN213956087U true CN213956087U (en) | 2021-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021943710.5U Active CN213956087U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with good heat transfer effect |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784584A (en) * | 2021-08-19 | 2021-12-10 | 联想(北京)有限公司 | Heat dissipation piece and electronic equipment |
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2020
- 2020-09-08 CN CN202021943710.5U patent/CN213956087U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784584A (en) * | 2021-08-19 | 2021-12-10 | 联想(北京)有限公司 | Heat dissipation piece and electronic equipment |
| GB2610012A (en) * | 2021-08-19 | 2023-02-22 | Lenovo Beijing Ltd | Heat dissipation member and electronic apparatus |
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