CN213300941U - Heat pipe with high heat transfer efficiency - Google Patents
Heat pipe with high heat transfer efficiency Download PDFInfo
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- CN213300941U CN213300941U CN202021943677.6U CN202021943677U CN213300941U CN 213300941 U CN213300941 U CN 213300941U CN 202021943677 U CN202021943677 U CN 202021943677U CN 213300941 U CN213300941 U CN 213300941U
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Abstract
The utility model discloses a heat pipe with high heat transfer efficiency, which comprises a pipe body, wherein the pipe body comprises an evaporation section, a heat insulation section and a condensation section, the heat insulation section is positioned between the evaporation section and the condensation section, the inner diameters of the heat insulation section and the condensation section are the same, and the inner diameter of the evaporation section is gradually reduced from one end close to the heat insulation section to the other end; the evaporation section is provided with a first capillary structure layer, the heat insulation section and the condensation section are provided with second capillary structure layers, and the thickness of the first capillary structure layer is gradually increased from one end close to the heat insulation section to the other end; and a conducting wire is arranged between the pipe wall of the heat insulation section and the second capillary structure layer. The utility model discloses utilize the gradual change thickness of first capillary structural layer to accelerate liquid working medium's backward flow speed, utilize the gradual change internal diameter of evaporation zone and the electromagnetic field that the wire circular telegram formed to improve gaseous state working medium's rate of motion, improved heat-conduction efficiency.
Description
Technical Field
The utility model relates to a heat pipe technical field specifically is a heat pipe that heat transfer efficiency is high.
Background
Heat pipes have been widely used in electronic components with large heat generation because of their advantage of high heat transfer capacity. When the heat pipe works, the low-boiling point working medium filled in the pipe body is evaporated and vaporized after the evaporation section absorbs heat generated by the heating electronic element, and the steam takes the heat to move to the condensation section and is liquefied and condensed at the condensation section to release the heat, so that the electronic element is cooled. The liquefied working medium flows back to the evaporation section under the action of the capillary structure on the inner wall of the heat conduction pipe, and is continuously evaporated, vaporized, liquefied and condensed, so that the working medium circularly moves in the heat conduction pipe, and heat generated by the electronic element is continuously dissipated. Therefore, in the process of circulating heat dissipation, the reflux speed of the working medium plays a very critical role, and how to accelerate the reflux speed of the working medium becomes a problem which needs to be solved urgently.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat pipe that heat transfer efficiency is high utilizes the gradual change thickness of first capillary structure layer to accelerate liquid working medium's backward flow speed, utilizes the gradual change internal diameter of evaporation zone and the electromagnetic field that the wire circular telegram formed to improve gaseous state working medium's rate of motion, has improved heat-conduction efficiency.
In order to achieve the above object, the utility model provides a following technical scheme:
a heat pipe with high heat transfer efficiency comprises a pipe body, wherein the pipe body comprises an evaporation section, a heat insulation section and a condensation section, the heat insulation section is positioned between the evaporation section and the condensation section, the inner diameters of the heat insulation section and the condensation section are the same, and the inner diameter of the evaporation section is gradually reduced from one end close to the heat insulation section to the other end;
the evaporation section is provided with a first capillary structure layer, the heat insulation section and the condensation section are provided with second capillary structure layers, and the thickness of the first capillary structure layer is gradually increased from one end close to the heat insulation section to the other end;
and a conducting wire is arranged between the pipe wall of the heat insulation section and the second capillary structure layer.
In one embodiment, the outer diameters of the evaporation section, the heat insulation section and the condensation section are the same.
In one embodiment, a cavity is formed between the tube wall of the heat insulation section and the second capillary structure layer, the lead is located in the cavity, an electrifying interface is arranged on the tube wall of the heat insulation section, a storage battery is further arranged in the cavity, and the electrifying interface and the storage battery are sequentially connected with the lead.
In one embodiment, a slot for inserting the cooling element is arranged between the tube wall of the condensation section and the second capillary structure layer.
In one embodiment, the maximum inner diameter of the evaporator end is the same as the inner diameter of the heat-insulated end.
In one embodiment, the slot is provided with a plurality of heat dissipation holes.
The utility model discloses a heat pipe that heat transfer efficiency is high utilizes the gradual change thickness of first capillary structural layer, strengthens the capillary force of capillary structural layer on the evaporation zone for liquid working medium's backward flow speed, the electromagnetic field that utilizes the gradual change internal diameter of evaporation zone and the wire circular telegram to form improves gaseous state working medium's velocity of motion, has improved heat conduction efficiency.
Drawings
Fig. 1 is a schematic plan view of a heat pipe with high heat transfer efficiency according to the present invention;
fig. 2 is a schematic view of the internal structure of a heat pipe with high heat transfer efficiency according to the present invention;
10. a pipe body; 11. an evaporation section; 12. a thermally insulating section; 121. a cavity; 122. a wire; 123. a power-on interface; 124. a storage battery; 13. a condensing section; 131. a slot; 132. heat dissipation holes; 21. a first capillary structure layer; 22. and a second capillary structure layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Fig. 1 is a schematic view showing an internal structure of a heat pipe having a high heat transfer efficiency in one embodiment, and fig. 2 is a schematic view showing a plane structure of the heat pipe having a high heat transfer efficiency in one embodiment. The heat pipe with high heat transfer efficiency comprises a pipe body 10, wherein the pipe body 10 comprises an evaporation section 11, a heat insulation section 12 and a condensation section 13, the heat insulation section 12 is positioned between the evaporation section 11 and the condensation section 13, the inner diameters of the heat insulation section 12 and the condensation section 13 are the same, and the inner diameter of the evaporation section 11 is gradually reduced from one end close to the heat insulation section 12 to the other end. The inner diameter of the evaporation section 11 gradually decreases from one end close to the heat-insulating section 12 to the other end, so that the capillary force gradually increases from one end close to the heat-insulating section 12 to the other end, and the working medium flows back to the evaporation section 11 at a higher speed.
The evaporation section 11 is provided with a first capillary structure layer 21, the heat insulation section 12 and the condensation section 13 are provided with a second capillary structure layer 22, the thickness of the first capillary structure layer 21 gradually increases from one end close to the heat insulation section 12 to the other end, preferably, the minimum thickness of the first capillary structure layer 21 is greater than or equal to the thickness of the second capillary structure layer 22, so that the capillary force gradually increases from one end close to the heat insulation section 12 to the other end, and the speed of the working medium flowing back to the evaporation section 11 is higher.
Specifically, the outer diameters of the evaporation section 11, the heat insulation section 12 and the condensation section 13 are the same, a cavity 121 is arranged between the tube wall of the heat insulation section 12 and the second capillary structure layer 22, a conducting wire 122 is arranged between the tube wall of the heat insulation section 12 and the second capillary structure layer 22, the conducting wire 122 is located in the cavity 121, an electrifying interface 123 is arranged on the tube wall of the heat insulation section 12, a storage battery 124 is further arranged in the cavity 121, the electrifying interface 123, the storage battery 124 and the conducting wire 122 are electrically connected in sequence, and an electromagnetic field is formed by the electrified conducting wire 122 to accelerate the flow speed of gaseous working media in the tube, so that the heat conduction efficiency is improved.
In an embodiment, a slot 131 for inserting a cooling element is disposed between the tube wall of the condensation section 13 and the second capillary structure layer 22, the slot 131 is provided with a plurality of heat dissipation holes 132, the heat dissipation holes 132 are distributed on the slot 131 in an array, heat dissipation devices such as a heat sink, a semiconductor cooling plate or a cooling plate can be inserted into the slot 131, and the heat dissipation holes 132 can enable the heat pipe to dissipate heat normally when no heat dissipation device is inserted.
The utility model discloses a heat pipe that heat transfer efficiency is high utilizes the gradual change thickness of first capillary structure layer 21, strengthens the capillary force of first capillary structure layer 21 for liquid working medium's backward flow speed, the electromagnetic field that utilizes the gradual change internal diameter of evaporation zone 11 and the circular telegram of wire 122 to form improves gaseous state working medium's rate of motion, has improved heat conduction efficiency.
The foregoing examples, while indicating preferred embodiments of the invention, are given by way of illustration and description, it is to be understood that the invention is not limited to the disclosed forms herein but is not intended to be exhaustive or to exclude other examples and may be used in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings or the skill or knowledge of the relevant art, and not to limit the scope of the invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the spirit and scope of the present invention, and these changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the present invention, which is to be construed as being limited only by the appended claims. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A heat pipe with high heat transfer efficiency comprises a pipe body, wherein the pipe body comprises an evaporation section, a heat insulation section and a condensation section, the heat insulation section is positioned between the evaporation section and the condensation section, the heat insulation section and the condensation section are identical in inner diameter, and the inner diameter of the evaporation section is gradually reduced from one end close to the heat insulation section to the other end;
the evaporation section is provided with a first capillary structure layer, the heat insulation section and the condensation section are provided with second capillary structure layers, and the thickness of the first capillary structure layer is gradually increased from one end close to the heat insulation section to the other end;
and a conducting wire is arranged between the pipe wall of the heat insulation section and the second capillary structure layer.
2. A heat pipe having high heat transfer efficiency according to claim 1, wherein the outer diameters of said evaporation section, said adiabatic section and said condensation section are the same.
3. A heat pipe according to claim 2 having a cavity between the wall of the heat-insulating section and the second capillary structure layer, wherein the wires are disposed in the cavity, the wall of the heat-insulating section is provided with a power-on interface, the cavity is further provided with a storage battery, and the power-on interface and the storage battery are sequentially connected to the wires.
4. A heat pipe having high heat transfer efficiency as claimed in claim 2, wherein a slot for inserting a cooling member is provided between the wall of the condensation section and the second wick structure layer.
5. A heat pipe having high heat transfer efficiency as set forth in claim 1, wherein said maximum inner diameter of said evaporation section is the same as the inner diameter of said adiabatic section.
6. A heat pipe as claimed in claim 4, wherein said insertion groove is formed with a plurality of heat dissipation holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021943677.6U CN213300941U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with high heat transfer efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021943677.6U CN213300941U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with high heat transfer efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213300941U true CN213300941U (en) | 2021-05-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021943677.6U Active CN213300941U (en) | 2020-09-08 | 2020-09-08 | Heat pipe with high heat transfer efficiency |
Country Status (1)
| Country | Link |
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| CN (1) | CN213300941U (en) |
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2020
- 2020-09-08 CN CN202021943677.6U patent/CN213300941U/en active Active
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