CN213945285U - Automatic laser marking machine for wafer sample - Google Patents
Automatic laser marking machine for wafer sample Download PDFInfo
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- CN213945285U CN213945285U CN202022663756.8U CN202022663756U CN213945285U CN 213945285 U CN213945285 U CN 213945285U CN 202022663756 U CN202022663756 U CN 202022663756U CN 213945285 U CN213945285 U CN 213945285U
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- automatic laser
- laser marking
- marking machine
- storage
- pushing
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Abstract
The utility model provides an automatic laser marking machine of disk sample relates to automatic laser marking technical field, the utility model provides an automatic laser marking machine of disk sample, include: the device comprises a marking device, a storage pushing device and a transferring device; the marking device and the storage pushing device are arranged oppositely, and the transferring device is arranged at the downstream of the storage pushing device; the material storage and pushing device is used for storing materials and conveying the materials to move towards the direction close to the marking device; the material of marking completion in transporting the device and transporting storage propelling movement device. The utility model provides an automatic laser marking machine of disk sample can alleviate and wait to beat the mark material among the prior art and beat the technical problem that the mark material easily produced the mixture.
Description
Technical Field
The utility model belongs to the technical field of automatic laser marking technique and specifically relates to an automatic laser marking machine of disk sample is related to.
Background
In the prior art, a laser marking mode is adopted to mark a blank, so that marks such as codes, two-dimensional codes, bar codes and the like are formed. In the marking process, the materials to be marked and the marked materials are easy to mix, and the marking materials are not easy to distinguish. In addition, the distance between the material and the marking device needs to be strictly controlled in the marking process, otherwise, the mark cannot be accurately marked on the material.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an automatic laser marking machine of disk sample to treat among the alleviating prior art and beat the technical problem that the mark material easily produced the mixture.
In a first aspect, the utility model provides an automatic laser marking machine of disk sample, include: the device comprises a marking device, a storage pushing device and a transferring device;
the marking device and the storage pushing device are arranged oppositely, and the transferring device is arranged at the downstream of the storage pushing device;
the material storage and pushing device is used for storing materials and conveying the materials to move towards the direction close to the marking device;
the transfer device transfers the materials marked in the storage pushing device.
With reference to the first aspect, the present invention provides a first possible implementation manner of the first aspect, wherein the material storage pushing device includes: the device comprises a material storage barrel and a material pusher, wherein the fixed end of the material pusher is connected with the material storage barrel;
the material storage barrel is used for storing the materials, and the material pusher is used for pushing the materials in the material storage barrel out.
With reference to the first possible implementation manner of the first aspect, the present invention provides a second possible implementation manner of the first aspect, wherein the storage barrel includes: the guide ring, the base and the guide rod;
the guide rods are connected between the guide ring and the base, and the guide rods are arranged around the axis of the guide ring at intervals.
With reference to the first possible implementation manner of the first aspect, the present invention provides a third possible implementation manner of the first aspect, wherein the pusher includes: the material pushing device comprises a material pushing cylinder and a material pushing workpiece, wherein the material pushing workpiece is connected to the movable end of the material pushing cylinder.
With reference to the first aspect, the present invention provides a fourth possible implementation manner of the first aspect, wherein the transfer device includes: sucking disc and transportation driving piece, the sucking disc with the transportation driving piece is connected.
With reference to the fourth possible implementation manner of the first aspect, the present invention provides a fifth possible implementation manner of the first aspect, wherein the transfer drive member includes: the sucker is connected to one end of the swing arm, the other end of the swing arm is connected with a driving shaft of the motor, and the extending direction of the swing arm is perpendicular to the driving shaft.
In combination with the first aspect, the present invention provides a sixth possible implementation manner of the first aspect, wherein the automatic laser marking machine for wafer samples further includes a positioner, the positioner is installed the marking device with between the storage pushing devices, and the positioner has a positioning surface adapted to the material.
With reference to the sixth possible implementation manner of the first aspect, the present invention provides a seventh possible implementation manner of the first aspect, wherein the positioner is in transmission connection with the positioning driving member.
With reference to the seventh possible implementation manner of the first aspect, the present invention provides an eighth possible implementation manner of the first aspect, wherein the positioner has a first station and a second station;
at the first station, the positioner is opposite to the material storage pushing device;
and at the second station, the positioner is positioned beside the material storage pushing device.
Combine the first aspect, the utility model provides a ninth possible implementation of the first aspect, wherein, beat the mark device the storage propelling movement device with transport the device and install respectively in the workstation, install the blowing fill on the workstation.
The embodiment of the utility model provides a following beneficial effect has been brought: the marking device and the storage pushing device are arranged oppositely, the transferring device is arranged at the downstream of the storage pushing device, materials are stored and conveyed through the storage pushing device and move towards the direction close to the marking device, the transferring device transfers the materials finished by marking in the storage pushing device, and therefore the materials to be marked and the marked materials are separated, and the materials to be marked and the marked materials are prevented from being mixed.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention or the related art, the drawings required to be used in the description of the embodiments or the related art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a front view of an automatic laser marking machine for wafer samples provided by the embodiment of the present invention;
fig. 2 is a top view of an automatic laser marking machine for wafer samples provided by the embodiment of the present invention;
fig. 3 is a schematic diagram of a storage cylinder of the automatic laser marking machine for wafer samples provided by the embodiment of the present invention.
Icon: 001-marking a device; 002-a storage pushing device; 210-a storage barrel; 211-a guide ring; 212-a base; 213-a guide bar; 220-pusher; 221-a material pushing cylinder; 222-pushing the work piece; 003-a transport device; 310-a suction cup; 320-transport drive; 321-a swing arm; 322-a motor; 004-a locator; 005-a work bench; 006-discharge hopper.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "physical quantity" in the formula, unless otherwise noted, is understood to mean a basic quantity of a basic unit of international system of units, or a derived quantity derived from a basic quantity by a mathematical operation such as multiplication, division, differentiation, or integration.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
As shown in fig. 1, the embodiment of the utility model provides an automatic laser marking machine of disk sample, include: the marking device 001, the storage pushing device 002 and the transferring device 003 are arranged in the device; the marking device 001 is arranged opposite to the storage pushing device 002, and the transferring device 003 is arranged at the downstream of the storage pushing device 002; the material storage pushing device 002 is used for storing materials and conveying the materials to move towards the direction close to the marking device 001; transport device 003 transports the material of marking completion in the storage propelling movement device 002.
Specifically, marking device 001 adopts laser marking equipment can form permanent mark on the material surface, and storage propelling movement device 002 can save the material to carry the material to the direction that is close to marking device 001, thereby the interval of adjustment material and marking device 001. The transfer device 003 can remove the marked material from the storage propelling movement device 002, thereby separating the material to be marked from the marked material.
In the embodiment of the present invention, the material storage pushing device 002 includes: the material storage barrel 210 and the material pusher 220, wherein the fixed end of the material pusher 220 is connected with the material storage barrel 210; the material storage barrel 210 is used for storing materials, and the pusher 220 is used for pushing out the materials in the material storage barrel 210.
Specifically, the storage barrel 210 can be used for storing materials, and when the storage barrel 210 stores a wafer workpiece, the wafer workpiece can move along the axial direction of the storage barrel 210 and is matched with the wafer workpiece through the inner side wall of the storage barrel 210, so that the wafer workpiece is prevented from being turned over.
As shown in fig. 1 and 3, the cartridge 210 includes: guide ring 211, base 212, and guide rod 213; a plurality of guide rods 213 are connected between the guide ring 211 and the base 212, and the plurality of guide rods 213 are spaced around the axis of the guide ring 211.
Specifically, a gap is formed between any two adjacent guide rods 213, and when the wafer workpiece moves in the storage barrel 210, air in the storage barrel 210 can flow through the gap, so that the balance of the air pressure inside and outside the storage barrel 210 is ensured. The inner diameter of the guide ring 211 is larger than the radial dimension of the material so that the material can enter and exit the inner cavity of the cartridge 210 through the opening of the guide ring 211.
Further, the pusher 220 includes: the material pushing device comprises a material pushing cylinder 221 and a material pushing working piece 222, wherein the material pushing working piece 222 is connected to the movable end of the material pushing cylinder 221.
Specifically, the pusher 220 may extend into the material storage barrel 210 through the annular structure, which has an inner diameter smaller than the radial dimension of the material. The pushing cylinder 221 is used for driving the pushing workpiece 222 to move in a telescopic manner, and the pushing workpiece 222 is used for pushing the material to extend out of the storage barrel 210.
As shown in fig. 1 and 2, the transfer device 003 includes: a suction cup 310 and a transfer drive 320, the suction cup 310 being connected to the transfer drive 320.
Specifically, the suction cup 310 can absorb the wafer workpiece, and the transfer driving member 320 drives the suction cup 310 to move, so that the marked wafer workpiece can be removed from the magazine 210.
Further, transfer drive 320 includes: a swing arm 321 and a motor 322, wherein the suction cup 310 is connected to one end of the swing arm 321, the other end of the swing arm 321 is connected to a driving shaft of the motor 322, and the extending direction of the swing arm 321 is perpendicular to the driving shaft.
Specifically, the swing arm 321 is driven by the motor 322 to rotate around the rotating shaft, and the suction cup 310 is driven by the swing arm 321 to move, so as to transfer the wafer workpiece.
As shown in fig. 1, the automatic laser marking machine for wafer samples further comprises a positioner 004, the positioner 004 is installed between the marking device 001 and the storage pushing device 002, and the positioner 004 is provided with a positioning surface matched with the material.
Specifically, the pusher 220 pushes the material to move along the material storage barrel 210, and the material abuts against the positioning surface of the positioner 004, so that the position of the material relative to the marking device 001 is ensured to be fixed.
Further, the positioner 004 is in transmission connection with the positioning driving member.
The positioning driving piece can drive the positioner 004 to move, when the positioner 004 is aligned with the opening of the material storage barrel 210, the pusher 220 pushes the material to move from the material storage barrel 210 to the direction close to the marking device 001 until the material abuts against the positioner 004 and the marking device 001 marks the material. When marking is completed, the pusher 220 is retracted, the positioning driving member drives the positioner 004 to move away from the opening of the material storage barrel 210, and the transfer driving member 320 drives the suction cup 310 to adsorb the marked material, so that the material to be marked and the marked material are separated.
Further, the positioner 004 has a first station and a second station; in the first station, the positioner 004 faces the storage pushing device 002; in the second station, the positioner 004 is located beside the storage pusher 002.
Specifically, the positioner 004 has an opening through which the marking device 001 may mark the material at the first station. The end face of the positioner 004 departing from the marking device 001 forms a positioning face, and when the pusher 220 pushes the material to abut against the positioning face, the marking device 001 starts marking the material. At the second station, positioner 004 avoids the opening of storage cartridge 210, thereby avoiding positioner 004 blocking transfer drive 320 from transferring the marked material.
As shown in fig. 1 and 2, the marking device 001, the storage pushing device 002 and the transferring device 003 are respectively mounted on the workbench 005, and the discharging hopper 006 is mounted on the workbench 005.
Specifically, a plurality of discharging hoppers 006 are respectively installed on the working table 005, and the wafer workpiece can be stored in the discharging hoppers 006, and the material to be marked and the marked material are respectively stored, so that the material to be marked and the marked material are prevented from being mixed.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. The utility model provides an automatic laser marking machine of wafer sample which characterized in that includes: marking a device (001), storing and pushing a device (002) and transferring a device (003);
the marking device (001) is arranged opposite to the storage pushing device (002), and the transferring device (003) is arranged at the downstream of the storage pushing device (002);
the storage pushing device (002) is used for storing materials and conveying the materials to move towards the direction close to the marking device (001);
transport device (003) transport beat the mark completion in storage propelling movement device (002) the material.
2. Automatic laser marking machine for disc samples according to claim 1, characterized in that said magazine pusher device (002) comprises: the material pushing device comprises a material storage barrel (210) and a material pushing device (220), wherein the fixed end of the material pushing device (220) is connected with the material storage barrel (210);
the material storage barrel (210) is used for storing the materials, and the pusher (220) is used for pushing the materials in the material storage barrel (210).
3. Automatic laser marking machine for disc samples according to claim 2, characterized in that said storage cartridge (210) comprises: a guide ring (211), a base (212) and a guide rod (213);
the guide rods (213) are connected between the guide ring (211) and the base (212), and the guide rods (213) are arranged at intervals around the axis of the guide ring (211).
4. Automatic laser marking machine for disc samples according to claim 2, characterized in that said pusher (220) comprises: the material pushing device comprises a material pushing cylinder (221) and a material pushing working piece (222), wherein the material pushing working piece (222) is connected to the movable end of the material pushing cylinder (221).
5. Automatic laser marking machine of disc samples according to claim 1, characterized in that said transfer means (003) comprise: a suction cup (310) and a transfer drive (320), the suction cup (310) being connected with the transfer drive (320).
6. Automatic laser marking machine for disc samples according to claim 5, characterized in that said transfer drive (320) comprises: the suction cup (310) is connected to one end of the swing arm (321), the other end of the swing arm (321) is connected with a driving shaft of the motor (322), and the extending direction of the swing arm (321) is perpendicular to the driving shaft.
7. Automatic laser marking machine for disc samples according to claim 1, characterized in that it further comprises a positioner (004), said positioner (004) being mounted between said marking means (001) and said magazine pusher means (002), and said positioner (004) having a positioning surface adapted to said material.
8. Automatic laser marking machine for disc samples according to claim 7, characterized in that the positioner (004) is in driving connection with a positioning drive.
9. Automatic laser marking machine of disc samples according to claim 8, characterized in that the positioner (004) has a first station and a second station;
at the first station, the positioner (004) faces the material storage and pushing device (002);
in the second station, the positioner (004) is located beside the magazine pusher (002).
10. The automatic laser marking machine for wafer samples as claimed in claim 1, characterized in that the marking device (001), the stock pusher (002) and the transfer device (003) are respectively mounted on a working table (005), and a discharge hopper (006) is mounted on the working table (005).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202022663756.8U CN213945285U (en) | 2020-11-17 | 2020-11-17 | Automatic laser marking machine for wafer sample |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022663756.8U CN213945285U (en) | 2020-11-17 | 2020-11-17 | Automatic laser marking machine for wafer sample |
Publications (1)
Publication Number | Publication Date |
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CN213945285U true CN213945285U (en) | 2021-08-13 |
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CN202022663756.8U Active CN213945285U (en) | 2020-11-17 | 2020-11-17 | Automatic laser marking machine for wafer sample |
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- 2020-11-17 CN CN202022663756.8U patent/CN213945285U/en active Active
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