CN213936158U - Adjustable fixing mechanism for chip packaging - Google Patents
Adjustable fixing mechanism for chip packaging Download PDFInfo
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- CN213936158U CN213936158U CN202120139709.5U CN202120139709U CN213936158U CN 213936158 U CN213936158 U CN 213936158U CN 202120139709 U CN202120139709 U CN 202120139709U CN 213936158 U CN213936158 U CN 213936158U
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Abstract
The utility model discloses an adjustable fixing mechanism for chip packaging, which comprises a transmission mechanism, a chip placing mechanism, a chip clamping mechanism, a chip pushing mechanism and a pressure sensor; the transmission mechanism comprises a bottom plate, a groove, a rectangular limiting groove, a motor, a threaded sleeve, a screw rod and a jacking block, wherein the groove is formed in the inner top of the bottom plate; the utility model discloses be equipped with chip push mechanism, after the chip package is accomplished, through stretching out of second electro-hydraulic push rod, the chip that the drive was installed and is promoted the encapsulation and accomplish in the push pedal of second electro-hydraulic push rod front end moves forward, makes the chip slide in the chip through the ramp and stores inside the box, reduces personnel's work content, improves work efficiency.
Description
Technical Field
The utility model relates to a chip package technical field specifically is an adjustable fixed establishment is used in chip package.
Background
The shell for installing the semiconductor integrated circuit chip plays a role in placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit, the connecting points on the chip are connected to the pins of the package shell through the conducting wires, and the pins are connected with other devices through the conducting wires on the printed board, so that the package plays an important role in both a CPU and other LSI integrated circuits, and in the process of packaging the chip, the position of the chip needs to be fixed, and the chip is conveniently packaged.
The prior adjustable fixing mechanism for packaging the chip has the following defects:
1. the existing fixing mechanism for chip packaging is generally fixed in a certain step, the chip is required to be transferred for multiple times due to more chip packaging steps, and the fixing mechanism is fixed in position and difficult to move, so that the chip is required to be transferred by manual operation for multiple times by personnel, the work of the personnel is complicated, and the working efficiency is low.
2. The conventional fixing mechanism for chip packaging needs to be manually operated by personnel to take out a chip after the chip packaging is finished, so that the work of the personnel is increased, and the working efficiency is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip packaging is with adjustable fixed establishment to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an adjustable fixing mechanism for chip packaging comprises a transmission mechanism, a chip placing mechanism, a chip clamping mechanism, a chip pushing mechanism and a pressure sensor; the transmission mechanism comprises a bottom plate, a groove, a rectangular limiting groove, a motor, a screw sleeve, a screw rod and a top block, wherein the groove is arranged at the inner top of the bottom plate, the rectangular limiting groove is arranged at the central position of the top of the bottom plate and is communicated with the groove, the motor is fixedly installed at one end inside the groove, the screw rod is installed at the output end of the motor through a rotating shaft, one end of the screw rod is fixedly connected with one end, away from the motor, inside the groove through a bearing, the screw sleeve is installed on the surface of the screw rod through a threaded structure, the top block is fixedly installed at the top of the screw sleeve and extends to the outer side of the bottom plate through the rectangular limiting groove, a chip placing mechanism is fixedly installed at the top of the top block and comprises a chip placing plate and a slope plate, the slope plate is fixedly installed at the front top of the chip placing plate, and chip clamping mechanisms are, chip clamping mechanism includes first mounting panel, first electronic hydraulic rod and clamp plate, the central point department fixed mounting of the relative one side of first mounting panel has first electronic hydraulic rod, the one end fixed mounting that first mounting panel was kept away from to first electronic hydraulic rod has the clamp plate, pressure sensor has been pasted to the relative one side of clamp plate, the rear end fixed mounting that the board top was placed to the chip has chip push mechanism, chip push mechanism includes second mounting panel, the electronic hydraulic rod of second and push pedal, the positive central point department fixed mounting of second mounting panel has the electronic hydraulic rod of second, the electronic hydraulic rod of second keeps away from the one end fixed mounting of second mounting panel has the push pedal.
Preferably, a chip storage box is fixedly mounted at one end of the front surface of the bottom plate, and protective pads are adhered to the periphery and the bottom of the inner part of the chip storage box.
Preferably, the four corners department fixed mounting of bottom plate bottom has the bracing piece, and the bottom fixed mounting of bracing piece has the universal wheel, and the rear side of universal wheel is equipped with the brake lever.
Preferably, the top of one side of the bottom plate is fixedly provided with a handle, and the surface of the handle is sleeved with an anti-slip sleeve.
Preferably, one side of the rear end of the top of the bottom plate is fixedly provided with a control mechanism, the front surface of the control mechanism is provided with a PLC (programmable logic controller) and a power switch, and the central position of the bottom of one side of the control mechanism is connected with the plug through a wire.
Preferably, the motor is electrically connected with the control mechanism through a wire, the first electric hydraulic push rod is electrically connected with the control mechanism through a wire, and the second electric hydraulic push rod is electrically connected with the control mechanism through a wire.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses be equipped with the motor, when the motor rotates, the lead screw that drives through rotation axis connection rotates together, makes the swivel nut of installing on the lead screw surface begin to remove to the kicking block that the messenger installed at the swivel nut top begins to remove, thereby drives the chip placement machine who installs at the kicking block top and begins to remove, reduces the number of times that personnel shifted the chip, reduces personnel's work content, improves work efficiency.
2. The utility model discloses be equipped with chip push mechanism, after the chip package is accomplished, through stretching out of second electro-hydraulic push rod, the chip that the drive was installed and is promoted the encapsulation and accomplish in the push pedal of second electro-hydraulic push rod front end moves forward, makes the chip slide in the chip through the ramp and stores inside the box, reduces personnel's work content, improves work efficiency.
Drawings
Fig. 1 is a front sectional view of the present invention;
fig. 2 is a top view of the present invention;
FIG. 3 is a schematic front view of the present invention;
fig. 4 is an enlarged schematic view of the chip placing mechanism, the chip clamping mechanism and the chip pushing mechanism in fig. 1 of the present invention.
In the figure: 1. a transmission mechanism; 101. a base plate; 102. a groove; 103. a rectangular limiting groove; 104. a motor; 105. a threaded sleeve; 106. a screw rod; 107. a top block; 2. a chip placement mechanism; 201. a chip placement board; 202. a ramp plate; 3. a chip clamping mechanism; 301. a first mounting plate; 302. a first electro-hydraulic ram; 303. a clamping plate; 4. a chip pushing mechanism; 401. a second mounting plate; 402. a second electro-hydraulic push rod; 403. pushing the plate; 5. a pressure sensor; 6. a chip storage box; 601. a protective pad; 7. a support bar; 8. a universal wheel; 9. a brake lever; 10. a handle; 11. an anti-slip sleeve; 12. a control mechanism; 1201. a PLC controller; 1202. a power switch; 13. and (4) a plug.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, the present invention provides an embodiment: an adjustable fixing mechanism for chip packaging comprises a transmission mechanism 1, a chip placing mechanism 2, a chip clamping mechanism 3, a chip pushing mechanism 4 and a pressure sensor 5; the transmission mechanism 1 comprises a bottom plate 101, a groove 102, a rectangular limiting groove 103, a motor 104, a threaded sleeve 105, a screw rod 106 and a top block 107, wherein the groove 102 is arranged at the inner top of the bottom plate 101, the rectangular limiting groove 103 is arranged at the central position of the top of the bottom plate 101, the rectangular limiting groove 103 is communicated with the groove 102, the motor 104 is fixedly arranged at one end inside the groove 102, the screw rod 106 is arranged at the output end of the motor 104 through a rotating shaft, one end of the screw rod 106 is fixedly connected with one end, far away from the motor 104, inside the groove 102 through a bearing, the threaded sleeve 105 is arranged on the surface of the screw rod 106 through a threaded structure, the top block 107 is fixedly arranged at the top of the threaded sleeve 105, the top block 107 penetrates through the rectangular limiting groove 103 and extends to the outer side of the bottom plate 101, a chip placing mechanism 2 is fixedly arranged at the top of the top block 107, the chip placing mechanism 2 comprises a chip placing plate 201 and a slope plate 202, and the slope plate 202 is fixedly arranged at the top of the front surface of the chip placing plate 201, chip clamping mechanism 3 is installed to the both ends symmetry of chip placing plate 201 top front side, chip clamping mechanism 3 includes first mounting panel 301, first electronic hydraulic push rod 302 and pinch-off plate 303, the central point department fixed mounting of the relative one side of first mounting panel 301 has first electronic hydraulic push rod 302, the one end fixed mounting that first electronic hydraulic push rod 302 kept away from first mounting panel 301 has pinch-off plate 303, pressure sensor 5 has been pasted to the relative one side of pinch-off plate 303, the rear end fixed mounting at chip placing plate 201 top has chip push mechanism 4, chip push mechanism 4 includes second mounting panel 401, second electronic hydraulic push rod 402 and push pedal 403, the positive central point department fixed mounting of second mounting panel 401 has second electronic hydraulic push rod 402, the one end fixed mounting that second mounting panel 401 was kept away from to second electronic hydraulic push rod 402 has push pedal 403.
Specifically, after the device is powered on, a chip to be packaged is placed between the first mounting plates 301 on the top of the chip placing plate 201, the first electric hydraulic push rod 302 is controlled to extend through the control mechanism 12, the clamping plate 303 clamps and fixes the chip to be packaged, a pressure signal generated when the chip is clamped is transmitted to the interior of the PLC 1201 through the pressure sensor 5 arranged on one side of the clamping plate 303, the first electric hydraulic push rod 302 is set through the PLC 1201, it is ensured that in the subsequent work, the chip clamping mechanism 3 cannot damage the chip due to excessive force applied when the chip is clamped, the rotation of the motor 104 is set through the PLC 1201, the position of the chip placing mechanism 2 is controlled through the rotation turns of the control motor 104, the chip placing mechanism 2 is moved to one side of the top of the bottom plate 101 when the rotation of the control motor 104 is completed after the chip is packaged, at the moment, the PLC sets and controls the first electric hydraulic push rod 302 to contract, the second electric hydraulic push rod 402 starts to extend out, the chip is pushed out of the chip placing plate 201 and slides into the chip storage box 6 through the slope plate 202, then the PLC 1201 sets the control motor 104 to reverse to enable the chip placing mechanism 2 to return to the initial position, the next automatic chip packaging operation is started, the model of the motor 104 is Y315L2-4, the model of the first electric hydraulic push rod 302 is IP800, the model of the second electric hydraulic push rod 402 is IP800, the model of the pressure sensor 5 is IMS-S40A, and the model of the PLC 1201 is S7-300.
Further, a chip storage box 6 is fixedly mounted at one end of the front surface of the bottom plate 101, and a protection pad 601 is adhered to the inner periphery and the inner bottom of the chip storage box 6.
Specifically, the chip storage box 6 is used for placing the packaged chip, and the protective pad 601 prevents the chip from colliding with the inner wall of the chip storage box 6 when the chip enters the chip storage box 6, so that the chip is damaged.
Furthermore, the four corners of the bottom plate 101 are fixedly provided with support rods 7, the bottom ends of the support rods 7 are fixedly provided with universal wheels 8, and the rear sides of the universal wheels 8 are provided with brake levers 9.
Specifically, the supporting rod 7 supports the device, the height of the device is increased, the universal wheel 8 and the brake rod 9 are integrated, the universal wheel 8 is M4-6109-829S4, the universal wheel 8 is convenient to move, and the brake rod 9 is used for braking the universal wheel 8
Further, a handle 10 is fixedly installed at the top of one side of the bottom plate 101, and an anti-slip sleeve 11 is sleeved on the surface of the handle 10.
Specifically, the handle 10 is convenient for a person to hold the device to push the device, the anti-slip sleeve 11 increases the friction force on the surface of the handle 10, and the phenomenon that the person slides when holding the handle 10 is avoided
Further, a control mechanism 12 is fixedly mounted on one side of the rear end of the top of the bottom plate 101, a PLC controller 1201 and a power switch 1202 are arranged on the front surface of the control mechanism 12, and the central position of the bottom of one side of the control mechanism 12 is connected with the plug 13 through a wire.
Further, the motor 104 is electrically connected to the control mechanism 12 through a wire, the first electro-hydraulic push rod 302 is electrically connected to the control mechanism 12 through a wire, and the second electro-hydraulic push rod 402 is electrically connected to the control mechanism 12 through a wire.
Specifically, plug 13 connects external power source and supplies power for the device, set for the motion process of motor 104 through PLC controller 1201, set for the flexible length of first electronic hydraulic push rod 302 through PLC controller 1201, avoid leading to the chip to damage because first electronic hydraulic push rod 302 stretches out the overlength, control the flexible state of second electronic hydraulic push rod 402 through PLC controller 1201, make second electronic hydraulic push rod 402 can release the chip that the encapsulation was accomplished and place board 201.
The working principle is as follows: a worker moves the device to a designated position through the universal wheels 8, fixes the device through the brake rods 9, connects an external power supply through the plugs 13 to supply power to the device, places a chip to be packaged between the first mounting plates 301 on the top of the chip placing plate 201, controls the first electric hydraulic push rod 302 to extend through the control mechanism 12, enables the clamping plate 303 to clamp and fix the chip to be packaged, transmits a pressure signal during clamping the chip to the interior of the PLC 1201 through the pressure sensor 5 arranged on one side of the clamping plate 303, sets the first electric hydraulic push rod 302 through the PLC 1201, ensures that the chip clamping mechanism 3 cannot damage the chip due to excessive force during clamping the chip during subsequent work, sets the rotation of the motor 104 through the PLC 1201, and controls the position of the chip placing mechanism 2 through controlling the rotation turns of the motor 104, after the chip packaging is completed, the setting motor 104 rotates to enable the chip placing mechanism 2 to move to one side of the top of the bottom plate 101, at the moment, the PLC 1201 sets and controls the first electric hydraulic push rod 302 to contract, the second electric hydraulic push rod 402 starts to extend out, the chip is pushed out of the chip placing plate 201 and slides into the chip storage box 6 through the slope plate 202, then the PLC 1201 sets and controls the motor 104 to reverse to enable the chip placing mechanism 2 to return to the initial position, and the next automatic chip packaging operation is started.
The details of the present invention are well known to those skilled in the art.
Finally, it is to be noted that: the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified and replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (6)
1. An adjustable fixing mechanism for chip packaging comprises a transmission mechanism (1), a chip placing mechanism (2), a chip clamping mechanism (3), a chip pushing mechanism (4) and a pressure sensor (5); the method is characterized in that: the transmission mechanism (1) comprises a bottom plate (101), a groove (102), a rectangular limiting groove (103), a motor (104), a threaded sleeve (105), a screw rod (106) and a top block (107), wherein the groove (102) is formed in the inner top of the bottom plate (101), the rectangular limiting groove (103) is formed in the central position of the top of the bottom plate (101), the rectangular limiting groove (103) is communicated with the groove (102), the motor (104) is fixedly installed at one end inside the groove (102), the screw rod (106) is installed at the output end of the motor (104) through a rotating shaft, one end of the screw rod (106) is fixedly connected with one end, far away from the motor (104), inside the groove (102) through a bearing, the threaded sleeve (105) is installed on the surface of the screw rod (106) through a threaded structure, the top block (107) is fixedly installed at the top of the threaded sleeve (105), and the top block (107) penetrates through the rectangular limiting groove (103) and extends to the outer side of the bottom plate (101), the chip placing mechanism (2) is fixedly mounted at the top of the top block (107), the chip placing mechanism (2) comprises a chip placing plate (201) and a slope plate (202), the slope plate (202) is fixedly mounted at the front top of the chip placing plate (201), chip clamping mechanisms (3) are symmetrically mounted at two ends of the front side of the top of the chip placing plate (201), each chip clamping mechanism (3) comprises a first mounting plate (301), a first electric hydraulic push rod (302) and a clamping plate (303), the first electric hydraulic push rod (302) is fixedly mounted at the central position of one side, opposite to the first mounting plate (301), of the first electric hydraulic push rod (302), the clamping plate (303) is fixedly mounted at one end, far away from the first mounting plate (301), of the first electric hydraulic push rod (302), a pressure sensor (5) is pasted at one side, opposite to the clamping plate (303), and a chip pushing mechanism (4) is fixedly mounted at the rear end of the top of the chip placing plate (201), chip push mechanism (4) include second mounting panel (401), electronic hydraulic rod of second (402) and push pedal (403), the positive central point department fixed mounting of second mounting panel (401) has electronic hydraulic rod of second (402), the one end fixed mounting that second mounting panel (401) were kept away from in electronic hydraulic rod of second (402) has push pedal (403).
2. The adjustable fixing mechanism for chip packaging according to claim 1, wherein: the chip storage box (6) is fixedly mounted at one end of the front face of the bottom plate (101), and the protective pad (601) is adhered to the periphery and the inner bottom inside the chip storage box (6).
3. The adjustable fixing mechanism for chip packaging according to claim 1, wherein: the bottom plate (101) is characterized in that supporting rods (7) are fixedly mounted at four corners of the bottom plate (101), universal wheels (8) are fixedly mounted at the bottom ends of the supporting rods (7), and brake rods (9) are arranged on the rear sides of the universal wheels (8).
4. The adjustable fixing mechanism for chip packaging according to claim 1, wherein: the top of one side of the bottom plate (101) is fixedly provided with a handle (10), and the surface of the handle (10) is sleeved with an anti-slip sleeve (11).
5. The adjustable fixing mechanism for chip packaging according to claim 1, wherein: one side of the rear end of the top of the bottom plate (101) is fixedly provided with a control mechanism (12), a PLC (programmable logic controller) 1201 and a power switch (1202) are arranged on the front side of the control mechanism (12), and the central position of the bottom of one side of the control mechanism (12) is connected with a plug (13) through a wire.
6. The adjustable fixing mechanism for chip packaging according to claim 1, wherein: the motor (104) is electrically connected with the control mechanism (12) through a lead, the first electric hydraulic push rod (302) is electrically connected with the control mechanism (12) through a lead, and the second electric hydraulic push rod (402) is electrically connected with the control mechanism (12) through a lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120139709.5U CN213936158U (en) | 2021-01-19 | 2021-01-19 | Adjustable fixing mechanism for chip packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120139709.5U CN213936158U (en) | 2021-01-19 | 2021-01-19 | Adjustable fixing mechanism for chip packaging |
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| Publication Number | Publication Date |
|---|---|
| CN213936158U true CN213936158U (en) | 2021-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120139709.5U Active CN213936158U (en) | 2021-01-19 | 2021-01-19 | Adjustable fixing mechanism for chip packaging |
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| CN (1) | CN213936158U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397059A (en) * | 2022-01-18 | 2022-04-26 | 凯晟动力技术（嘉兴）有限公司 | EGR (exhaust gas recirculation) corrosion-resistant pressure sensor packaging device and application method thereof |
| CN116995009A (en) * | 2023-09-26 | 2023-11-03 | 广东长华科技有限公司 | Die assembly for chip packaging processing |
-
2021
- 2021-01-19 CN CN202120139709.5U patent/CN213936158U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397059A (en) * | 2022-01-18 | 2022-04-26 | 凯晟动力技术（嘉兴）有限公司 | EGR (exhaust gas recirculation) corrosion-resistant pressure sensor packaging device and application method thereof |
| CN116995009A (en) * | 2023-09-26 | 2023-11-03 | 广东长华科技有限公司 | Die assembly for chip packaging processing |
| CN116995009B (en) * | 2023-09-26 | 2023-11-28 | 广东长华科技有限公司 | Die assembly for chip packaging processing |
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