CN115043008B - Diode braid packaging system and method integrating detection and packaging - Google Patents
Diode braid packaging system and method integrating detection and packaging Download PDFInfo
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- CN115043008B CN115043008B CN202210810481.7A CN202210810481A CN115043008B CN 115043008 B CN115043008 B CN 115043008B CN 202210810481 A CN202210810481 A CN 202210810481A CN 115043008 B CN115043008 B CN 115043008B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a diode braid packaging system and method integrating detection and packaging, comprising a workbench (1), wherein a disqualified diode removing device (2), an electrical property detecting device (3) and a hot pressing device (4) are sequentially arranged on the table top of the workbench (1) from right to left, and the electrical property detecting device (3) comprises a first through groove (5) formed in the workbench (1), a bracket (6) fixedly arranged right above the first through groove (5) and a lifting cylinder (7) fixedly arranged on the bracket (6); the hot pressing device (4) comprises a vertical cylinder (11) fixedly arranged on the table top of the workbench (1), a plurality of pressure heads (13) are fixedly arranged on the bottom surface of the frame (12) at intervals along the circumferential direction of the bottom surface, and heating rods (14) are arranged on the front side wall and the rear side wall of the frame (12). The beneficial effects of the invention are as follows: the structure is compact, the diode packaging efficiency is improved, and a customer can conveniently tear the adhesive film from the carrier band nipple.
Description
Technical Field
The invention relates to the technical field of diode packaging, in particular to a diode braid packaging system and method integrating detection and packaging.
Background
The structure of a diode used for a machine tool is shown in fig. 1, and the diode comprises a body 30, two pins 31 are formed on one side of the body 30, and the diode is arranged on a circuit board of a machine tool control box. When the diode is produced and molded, workers in a workshop need to package a plurality of diodes, and the diodes are conveyed to a customer after the diodes are packaged. The existing method for packaging the diode is as follows: the worker firstly places the carrier band pup joint 18 shown in fig. 2-3 on the table surface of the workbench, and ensures that each containing groove 32 on the carrier band pup joint 18 is arranged upwards, then the worker respectively places a diode in each containing groove 32 as shown in fig. 4-5, then the worker sequentially contacts pins 31 of the diode from left to right by adopting two contacts of the electrical property detection equipment, if the worker checks that the resistance value of the detected diode does not meet the requirement in the electrical property detection equipment, the worker removes the unqualified diode from the carrier band pup joint 18 and places a new diode again, after the electrical properties of all the diodes on the carrier band pup joint 18 are detected, the worker covers a layer of adhesive film 33 on the top surface of the carrier band pup joint 18 as shown in fig. 6, finally the adhesive film 33 and the carrier band pup joint 18 are heat-sealed into a whole through a hot press on the top surface of the adhesive film 33, and accordingly the braiding package of the diode is finally realized.
However, this method, while capable of taping the diode, still suffers from the following technical drawbacks:
I. when a defective diode is detected, it is necessary to manually take out the defective diode from the accommodating groove 32, and the space of the accommodating groove 32 is small, so that it is difficult for a worker to take out the diode from the accommodating groove 32, which certainly reduces the packaging efficiency of the diode.
II. When the contact of the electrical performance detecting device touches the pin 31 of the diode, the pin 31 is in a suspended state, so that when the contact touches the pin 31, the pin 31 is bent and deformed, the diode is damaged, and the diode is frequently returned by customers.
II. The bottom surface of whole glued membrane 33 and the top surface adhesion of whole carrier band nipple 18 in an organic whole cause glued membrane 33 and carrier band nipple 18 joint strength big, lead to when the customer needs take the diode, need consume very big effort just can tear glued membrane 33 from carrier band nipple 18, brought very big inconvenience for the use of customer.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a diode braid packaging system and method which have compact structure, improve the diode packaging efficiency and bring convenience for a customer to tear a glue film from a carrier tape nipple.
The aim of the invention is achieved by the following technical scheme: the diode braid packaging system integrating detection and packaging comprises a workbench, wherein a disqualified diode removing device, an electrical property detecting device and a hot pressing device are sequentially arranged on a table top of the workbench from right to left, the electrical property detecting device comprises a first through groove formed in the workbench, a support fixedly arranged right above the first through groove, and a lifting cylinder fixedly arranged on the support, a lifting plate is fixedly arranged at the acting end of a piston rod of the lifting cylinder, electrical property detecting equipment is fixedly arranged at the top of the lifting plate, and two contacts of the electrical property detecting equipment are arranged through the lifting plate;
the hot pressing device comprises a vertical air cylinder fixedly arranged on the table surface of the workbench, a piston rod of the vertical air cylinder penetrates through the workbench, a frame is fixedly arranged on the extending end, a plurality of pressure heads are fixedly arranged on the bottom surface of the frame at intervals along the circumferential direction of the frame, and heating rods are arranged on the front side wall and the rear side wall of the frame;
a feeding cylinder positioned under the electrical property detection device is arranged under the workbench, a movable table is fixedly arranged at the acting end of a piston rod of the feeding cylinder, and two diagonally distributed positioning columns are fixedly arranged on the top surface of the movable table;
the packaging system further comprises a carrier band short section, a plurality of sinking grooves are formed in the top surface of the carrier band short section and along the length direction of the carrier band short section, the outer contour of each sinking groove is matched with the outer wheel of the diode body, two strip-shaped grooves communicated with the sinking grooves are formed in one side of each sinking groove, the depth of each strip-shaped groove is smaller than that of each sinking groove, and positioning holes which are diagonally arranged are formed in the left end and the right end of the carrier band short section.
Unqualified diode removing devices is including setting up the second through groove on the workstation, set firmly in the portal frame directly over the second through groove, set firmly on the crossbeam of portal frame and pick the material cylinder, and the piston rod of picking the material cylinder runs through the crossbeam setting, and has set firmly first revolving cylinder on the extension, has welded the rotor plate on the first revolving cylinder rotation axis, and the other end welding of rotor plate has the suction head that is located directly over the second through groove, and the top mouth department of suction head is connected with the vacuum pump.
The vacuum pump is arranged at the top of the portal frame beam, and a working port of the vacuum pump is connected with a top port of the suction head through a hose.
The material receiving device comprises a first rotary cylinder fixedly arranged on the table surface of the workbench, a rotary shaft of the first rotary cylinder penetrates through the workbench, and a material receiving box is fixedly arranged at the extending end and is positioned right below the first through groove.
The workbench is characterized in that a plurality of supporting legs supported on the ground are fixedly arranged on the bottom surface of the workbench, a base plate is fixedly arranged between the supporting legs, and a cylinder body of the feeding cylinder is fixedly arranged on the top surface of the base plate.
The connecting plates are welded on the left side wall and the right side wall of the frame, two vertical air cylinders are fixedly arranged on the table top of the workbench, and the acting ends of piston rods of the two vertical air cylinders are welded on the two connecting plates respectively.
The packaging system further comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the lifting cylinder, the electromagnetic valve of the feeding cylinder, the electromagnetic valve of the vertical cylinder, the electromagnetic valve of the first rotary cylinder and the electromagnetic valve of the second rotary cylinder.
A diode braid packaging method integrating detection and packaging comprises the following steps:
s1, a worker places a carrier band nipple on a platform, then places a diode in each sinking groove, namely, places a body of the diode in each sinking groove, and simultaneously places two pins of the diode in two strip-shaped grooves, after placing in the sinking grooves, the body is supported at the bottom of the sinking grooves, and the pins are supported at the bottom of the strip-shaped grooves, so that a plurality of diodes are placed on the carrier band nipple;
s2, positioning the carrier band pup joint, namely lifting up two ends of the carrier band pup joint by a worker, sleeving two positioning holes of the carrier band pup joint on two positioning columns respectively, and supporting the carrier band pup joint on the top surface of the mobile station, so that positioning of the carrier band pup joint is realized, and at the moment, two pins of a diode positioned at the head end of the carrier band pup joint are respectively positioned under two contacts;
s3, detecting the resistance of the first diode, wherein the specific operation steps are as follows:
s31, a worker controls a piston rod of a lifting cylinder to extend downwards, the piston rod drives a lifting plate to move downwards, and the lifting plate drives an electrical property detection device to move downwards, so that two contacts are driven to pass through a first through groove to move downwards;
s32, after a piston rod of a lifting cylinder is fully extended, two contacts are respectively contacted with two pins of a first diode, at the moment, the resistance value of the diode is displayed in electrical property detection equipment, if the resistance value is not in accordance with the requirement, the diode is judged to be a defective product, at the moment, a worker firstly controls the piston rod of the lifting cylinder to retract, the piston rod drives the electrical property detection equipment to reset, the worker controls the piston rod of a material removing cylinder to extend downwards, the piston rod drives a suction head and the first rotating cylinder to synchronously move downwards, after the piston rod of the material removing cylinder is fully extended, the bottom surface of the suction head is just contacted with the top surface of a body of the defective diode, then a vacuum pump is started, the vacuum pump pumps vacuum the suction head, the body of the defective diode is adsorbed on the bottom surface of the suction head under negative pressure, then the worker controls the piston rod of the material removing cylinder to retract, and then drives the defective diode to synchronously move upwards, after the piston rod drives a rotating shaft of the first rotating cylinder to rotate, and after the rotating shaft drives the rotating plate to rotate, a controller controls the first rotating cylinder to be closed, the defective diode is driven to rotate, and then the defective diode is repeatedly controlled to fall into a new qualified diode, and a new diode is repeatedly detected, and the defective diode is removed after the defective diode is repeatedly subjected to the vacuum detection;
if the resistance value of the diode in the electrical performance detection device meets the requirement in the step S32, a worker controls a piston rod of the feeding cylinder to extend leftwards so that a second diode on the carrier band pup joint enters a detection station to detect the resistance of the second diode, and thus the continuous detection can finish the detection of the resistance of all the diodes on the carrier band pup joint;
s4, after all diodes on the carrier band pup joint are detected, a worker controls the piston rod of the feeding cylinder to extend out completely, and the carrier band pup joint is just located at a hot press station;
s5, covering a layer of adhesive film on the carrier tape nipple by a worker, connecting a power line of a heating rod to a power supply by the worker, generating heat on the heating rod after the worker is electrified, transmitting the heat to a frame, transmitting the heat to each pressure head by the frame, controlling piston rods of two vertical air cylinders to extend downwards by the worker, driving the frame to move downwards by the piston rods, driving each pressure head to move downwards synchronously by the frame, respectively pressing each hot-pressing head on the outer edge of the adhesive film after the piston rods of the vertical air cylinders extend completely, and fixing the adhesive film on the carrier tape nipple after the adhesive film receives the heat from the pressure heads, so that the diode is packaged finally;
s6, after packaging, controlling the piston rod of the vertical cylinder to retract by a worker, after retracting, controlling the piston rod of the feeding cylinder to retract, and after retracting and resetting, taking off the finished product material on the mobile station by the worker;
s7, repeating the operations of the steps S1-S6, and continuously detecting and packaging the plurality of diodes.
The invention has the following advantages: the structure is compact, the diode packaging efficiency is improved, and a customer can conveniently tear the adhesive film from the carrier band nipple.
Drawings
FIG. 1 is a schematic diagram of a diode structure;
FIG. 2 is a schematic view of a conventional carrier strip sub;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is a schematic illustration of the placement of a diode in a receiving slot of a carrier strip sub;
FIG. 5 is a cross-sectional view B-B of FIG. 4;
FIG. 6 is a schematic illustration of a layer of adhesive film overlying the top surface of the carrier strip sub;
FIG. 7 is a schematic diagram of the structure of the present invention;
FIG. 8 is an enlarged partial schematic view of section I of FIG. 7;
FIG. 9 is a bottom view of the frame;
FIG. 10 is a schematic diagram illustrating the connection of the lift plate to the electrical property detection apparatus;
FIG. 11 is a schematic view of a carrier strip sub according to the present invention;
FIG. 12 is a cross-sectional view of C-C of FIG. 11;
FIG. 13 is a schematic illustration of the placement of a diode in a carrier strip sub;
FIG. 14 is a D-D sectional view of FIG. 13;
FIG. 15 is a schematic illustration of positioning a carrier strip sub;
FIG. 16 is a schematic diagram of detecting a first diode resistance value;
FIG. 17 is a schematic illustration of a carrier strip sub entering a thermal compression station;
FIG. 18 is a schematic illustration of a film covered on the top surface of a carrier strip sub;
FIG. 19 is a schematic illustration of thermal compression;
in the figure, a 1-workbench, a 2-disqualified diode removing device, a 3-electrical performance detecting device, a 4-hot pressing device, a 5-first through groove, a 6-bracket, a 7-lifting cylinder, an 8-lifting plate, a 9-electrical performance detecting device, a 10-contact, a 11-vertical cylinder, a 12-frame, a 13-pressure head, a 14-heating rod, a 15-feeding cylinder, a 16-moving table, a 17-positioning column, a 18-carrier short section, a 19-sinking groove, a 20-strip groove, a 21-positioning hole, a 22-second through groove, a 23-portal frame, a 24-picking cylinder, a 25-first rotary cylinder, a 26-suction head, a 27-vacuum pump, a 28-second rotary cylinder, a 29-receiving box, a 30-body, 31-pins, a 32-receiving groove and a 33-adhesive film.
Detailed Description
The invention is further described below with reference to the accompanying drawings, the scope of the invention not being limited to the following:
as shown in fig. 7-12, a diode braid packaging system integrating detection and packaging comprises a workbench 1, an unqualified diode removing device 2, an electrical property detecting device 3 and a hot pressing device 4 are sequentially arranged on the surface of the workbench 1 from right to left, the electrical property detecting device 3 comprises a first through groove 5 formed in the workbench 1, a support 6 fixedly arranged right above the first through groove 5, a lifting cylinder 7 fixedly arranged on the support 6, a lifting plate 8 fixedly arranged on the acting end of a piston rod of the lifting cylinder 7, electrical property detecting equipment 9 is fixedly arranged at the top of the lifting plate 8, and two contacts 10 of the electrical property detecting equipment 9 are all arranged through the lifting plate 8.
The hot pressing device 4 comprises a vertical air cylinder 11 fixedly arranged on the table top of the workbench 1, a piston rod of the vertical air cylinder 11 penetrates through the workbench 1, a frame 12 is fixedly arranged on the extending end, connecting plates are welded on the left side wall and the right side wall of the frame 12, two vertical air cylinders 11 are fixedly arranged on the table top of the workbench 1, the acting ends of the piston rods of the two vertical air cylinders 11 are respectively welded on the two connecting plates, a plurality of pressure heads 13 are fixedly arranged on the bottom surface of the frame 12 along the circumferential interval of the bottom surface, and heating rods 14 are arranged on the front side wall and the rear side wall of the frame 12; the disqualified diode removing device 2 comprises a second through groove 22 formed in the workbench 1, a portal frame 23 fixedly arranged right above the second through groove 22, a material picking cylinder 24 fixedly arranged on a beam of the portal frame 23, a piston rod of the material picking cylinder 24 penetrates through the beam, a first rotary cylinder 25 fixedly arranged on an extending end, a rotary plate is welded on a rotary shaft of the first rotary cylinder 25, a suction head 26 arranged right above the second through groove 22 is welded at the other end of the rotary plate, a vacuum pump 27 is connected to a top end opening of the suction head 26, the vacuum pump 27 is arranged at the top of the beam of the portal frame 23, and a working port of the vacuum pump 27 is connected with a top end opening of the suction head 26 through a hose.
A feeding cylinder 15 positioned right below the electrical property detection device 3 is arranged below the workbench 1, a movable table 16 is fixedly arranged on the acting end of a piston rod of the feeding cylinder 15, and two diagonally distributed positioning columns 17 are fixedly arranged on the top surface of the movable table 16; a plurality of supporting legs supported on the ground are fixedly arranged on the bottom surface of the workbench 1, a base plate is fixedly arranged between the supporting legs, and a cylinder body of the feeding cylinder 15 is fixedly arranged on the top surface of the base plate
The packaging system further comprises a carrier band short section 18, a plurality of sinking grooves 19 are formed in the top surface of the carrier band short section 18 along the length direction of the carrier band short section, the outer outline of each sinking groove 19 is matched with the outer wheel of the diode body 30, two strip-shaped grooves 20 communicated with the sinking grooves are formed in one side of each sinking groove 19, the depth of each strip-shaped groove 20 is smaller than that of each sinking groove 19, and positioning holes 21 which are diagonally arranged are formed in the left end and the right end of the carrier band short section 18.
The material receiving device further comprises a second rotary air cylinder 28 fixedly arranged on the surface of the workbench 1, a rotary shaft of the second rotary air cylinder 28 penetrates through the workbench 1, a material receiving box 29 is fixedly arranged at the extending end, and the material receiving box 29 is located under the second through groove 22.
The packaging system further comprises a controller electrically connected to the solenoid valve of the lifting cylinder 7, the solenoid valve of the feeding cylinder 15, the solenoid valve of the vertical cylinder 11, the solenoid valve of the first rotary cylinder 25 and the solenoid valve of the second rotary cylinder 28, and a worker can control the extension or retraction of the piston rods of the respective cylinders through the controller.
A diode braid packaging method integrating detection and packaging comprises the following steps:
s1, a worker places a carrier band pup joint 18 on a platform, then places a diode in each sinking groove 19, namely, places a body 30 of the diode in each sinking groove 19, and simultaneously places two pins 31 of the diode in two strip-shaped grooves 20, after placing, the body 30 is supported at the bottom of the sinking groove 19, and meanwhile, the pins 31 are supported at the bottom of the strip-shaped grooves 20, so that a plurality of diodes are placed on the carrier band pup joint 18, as shown in fig. 13-14;
s2, positioning the carrier band pup joint, namely lifting up two ends of the carrier band pup joint 18 by a worker, sleeving two positioning holes 21 of the carrier band pup joint 18 on two positioning posts 17 respectively, and supporting the carrier band pup joint 18 on the top surface of the mobile station 16, so that positioning of the carrier band pup joint is realized, as shown in FIG. 15, and at the moment, two pins 31 of a diode at the head end of the carrier band pup joint 18 are respectively positioned under two contacts 10;
s3, detecting the resistance of the first diode, wherein the specific operation steps are as follows:
s31, a worker controls a piston rod of the lifting cylinder 7 to extend downwards, the piston rod drives the lifting plate 8 to move downwards, the lifting plate 8 drives the electrical property detection equipment 9 to move downwards, and then the two contacts 10 are driven to move downwards through the first through groove 5;
s32, after the piston rod of the lifting cylinder 7 is fully extended, the two contacts 10 are respectively contacted with the two pins 31 of the first diode as shown in FIG. 16, at the moment, the resistance value of the diode is displayed in the electrical property detection device 9, if the resistance value is not in accordance with the requirement, the diode is judged to be a defective product, at the moment, a worker firstly controls the piston rod of the lifting cylinder 7 to retract, the piston rod drives the electrical property detection device 9 to reset, the worker controls the piston rod of the picking cylinder 24 to extend downwards, the piston rod drives the suction head 26 and the first rotary cylinder 25 to synchronously move downwards, after the piston rod of the picking cylinder 24 is fully extended, the bottom surface of the suction head 26 is just contacted with the top surface of the body 30 of the defective diode, then the worker starts the vacuum pump 27 to vacuumize the suction head 26, under negative pressure, the body 30 of the unqualified diode is adsorbed on the bottom surface of the suction head 26, then a worker controls the piston rod of the picking cylinder 24 to retract, and further drives the unqualified diode to synchronously move upwards, after reset, the worker controls the rotating shaft of the first rotating cylinder 25 to rotate, the rotating shaft drives the rotating plate to rotate, the rotating plate drives the suction head 26 to rotate, after rotating in place, the controller controls the first rotating cylinder 25 to be closed, the unqualified diode is positioned right above the material receiving box 29, then the worker controls the vacuum pump 27 to be closed, the unqualified diode falls into the material receiving box 29, after the unqualified diode is picked out, the first rotating cylinder 25 is controlled to reset, and a diode is newly supplemented into the sinking groove 19, and the detection process is repeated until the resistance of the newly supplemented diode is qualified;
if the electrical property detection device 9 shows that the resistance value of the diode meets the requirement in step S32, the worker controls the piston rod of the feeding cylinder 15 to extend leftwards so that the second diode on the carrier band nipple 18 enters the detection station to detect the resistance of the second diode, and thus the continuous detection can complete the detection of the resistance of all the diodes on the carrier band nipple 18;
in the detection process of the step S3, since both the pins 31 are supported at the bottom of the bar-shaped groove 20, after the contact 10 touches the pins 31, the pins 31 will not bend and deform, and compared with the traditional method for detecting the electrical performance of the diode, the diode is well protected; in addition, in step S32, the unqualified diode in the carrier band nipple 18 can be rapidly removed from the carrier band nipple by the unqualified diode removing device 2, so that the packaging efficiency of the diode is greatly improved.
S4, after all diodes on the carrier band pup joint 18 are detected, a worker controls the piston rod of the feeding cylinder 15 to extend completely, and the carrier band pup joint 18 is just positioned at a hot press station as shown in FIG. 17;
s5, a worker covers a layer of adhesive film 33 on the carrier band pup joint 18 as shown in fig. 18, then the worker connects a power line of the heating rod 14 to a power supply, after the power is supplied, heat is generated on the heating rod 14 and transferred to the frame 12, the frame 12 transfers the heat to each pressure head 13, then the worker controls piston rods of the two vertical air cylinders 11 to extend downwards, the piston rods drive the frame 12 to move downwards, the frame 12 drives each pressure head 13 to move downwards synchronously, after the piston rods of the vertical air cylinders 11 extend completely, each thermal pressure head 13 respectively presses the outer edge of the adhesive film 33 as shown in fig. 19, and after the adhesive film 33 receives the heat from the pressure heads 13, the adhesive film 33 is fixed on the carrier band pup joint 18, so that the diode packaging is finally realized;
in the step S5, the adhesive film 33 is fixed on the carrier band nipple 18 by the pressure heads 13 arranged at intervals, so that the connection between the adhesive film 33 and the carrier band nipple 18 is ensured to be point-to-point, and compared with the traditional method, the adhesive film is directly and thermally pressed on the top surface of the carrier band nipple 18, so that a customer can more conveniently tear the adhesive film 33 from the carrier band nipple 18, and great convenience is brought to the use of the customer.
S6, after packaging, a worker controls the piston rod of the vertical cylinder 11 to retract, after retraction, controls the piston rod of the feeding cylinder 15 to retract, and after retraction and reset, the worker removes the finished product material on the mobile station 16 from the mobile station;
s7, repeating the operations of the steps S1-S6, and continuously detecting and packaging the plurality of diodes.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (1)
1. The diode braid packaging method integrating detection and packaging is characterized in that a packaging system is adopted, the packaging system comprises a workbench (1), a disqualified diode removing device (2), an electrical performance detecting device (3) and a hot pressing device (4) are sequentially arranged on the surface of the workbench (1) from right to left, the electrical performance detecting device (3) comprises a first through groove (5) formed in the workbench (1), a support (6) fixedly arranged right above the first through groove (5) and a lifting cylinder (7) fixedly arranged on the support (6), a lifting plate (8) is fixedly arranged at the acting end of a piston rod of the lifting cylinder (7), electrical performance detecting equipment (9) is fixedly arranged at the top of the lifting plate (8), and two contacts (10) of the electrical performance detecting equipment (9) are all arranged through the lifting plate (8);
the hot pressing device (4) comprises a vertical air cylinder (11) fixedly arranged on the table top of the workbench (1), a piston rod of the vertical air cylinder (11) penetrates through the workbench (1), a frame (12) is fixedly arranged on the extending end, a plurality of pressure heads (13) are fixedly arranged on the bottom surface of the frame (12) at intervals along the circumferential direction of the frame, and heating rods (14) are arranged on the front side wall and the rear side wall of the frame (12);
a feeding cylinder (15) positioned right below the electrical property detection device (3) is arranged below the workbench (1), a movable table (16) is fixedly arranged at the acting end of a piston rod of the feeding cylinder (15), and two positioning columns (17) which are diagonally distributed are fixedly arranged on the top surface of the movable table (16);
the packaging system further comprises a carrier band nipple (18), a plurality of sinking grooves (19) are formed in the top surface of the carrier band nipple (18) along the length direction of the carrier band nipple, the outer outline of each sinking groove (19) is matched with the outer wheel of a diode body (30), two strip-shaped grooves (20) communicated with the sinking grooves are formed in one side of each sinking groove (19), the depth of each strip-shaped groove (20) is smaller than that of each sinking groove (19), and positioning holes (21) which are diagonally arranged are formed in the left end and the right end of each carrier band nipple (18); the disqualified diode removing device (2) comprises a second through groove (22) formed in the workbench (1), a portal frame (23) fixedly arranged right above the second through groove (22), a material removing cylinder (24) is fixedly arranged on a cross beam of the portal frame (23), a piston rod of the material removing cylinder (24) penetrates through the cross beam, a first rotary cylinder (25) is fixedly arranged on an extending end, a rotary plate is welded on a rotary shaft of the first rotary cylinder (25), a suction head (26) positioned right above the second through groove (22) is welded at the other end of the rotary plate, and a vacuum pump (27) is connected to a top end opening of the suction head (26); the vacuum pump (27) is arranged at the top of the cross beam of the portal frame (23), and a working port of the vacuum pump (27) is connected with a top end port of the suction head (26) through a hose; the material receiving device comprises a second rotary cylinder (28) fixedly arranged on the table top of the workbench (1), a rotary shaft of the second rotary cylinder (28) penetrates through the workbench (1), a material receiving box (29) is fixedly arranged on the extending end, and the material receiving box (29) is positioned under the second through groove (22); a plurality of supporting legs supported on the ground are fixedly arranged on the bottom surface of the workbench (1), a base plate is fixedly arranged between the supporting legs, and a cylinder body of the feeding cylinder (15) is fixedly arranged on the top surface of the base plate; connecting plates are welded on the left and right side walls of the frame (12), two vertical air cylinders (11) are fixedly arranged on the table top of the workbench (1), and the acting ends of piston rods of the two vertical air cylinders (11) are respectively welded on the two connecting plates; the packaging system further comprises a controller, wherein the controller is electrically connected with an electromagnetic valve of the lifting cylinder (7), an electromagnetic valve of the feeding cylinder (15), an electromagnetic valve of the vertical cylinder (11), an electromagnetic valve of the first rotary cylinder (25) and an electromagnetic valve of the second rotary cylinder (28), and the packaging system is characterized in that: the method comprises the following steps:
s1, a worker places a carrier band short joint (18) on a platform, then places a diode in each sinking groove (19), namely, a body (30) of the diode is placed in each sinking groove (19), meanwhile, two pins (31) of the diode are placed in two strip-shaped grooves (20), after placing, the body (30) is supported at the bottom of the sinking groove (19), and meanwhile, the pins (31) are supported at the bottom of the strip-shaped grooves (20), so that a plurality of diodes are placed in the carrier band short joint (18);
s2, positioning the carrier band pup joint, namely lifting up two ends of the carrier band pup joint (18) by workers, sleeving two positioning holes (21) of the carrier band pup joint (18) on two positioning columns (17) respectively, and supporting the carrier band pup joint (18) on the top surface of the mobile station (16), so that positioning of the carrier band pup joint is realized, and at the moment, two pins (31) of a diode positioned at the head end of the carrier band pup joint (18) are positioned under two contacts (10) respectively;
s3, detecting the resistance of the first diode, wherein the specific operation steps are as follows:
s31, a worker controls a piston rod of a lifting cylinder (7) to extend downwards, the piston rod drives a lifting plate (8) to move downwards, and the lifting plate (8) drives an electrical property detection device (9) to move downwards, so that two contacts (10) are driven to pass through a first through groove (5) to move downwards;
s32, after the piston rod of the lifting cylinder (7) is completely extended, two contacts (10) are respectively contacted with two pins (31) of a first diode, at the moment, the resistance value of the first diode is displayed in the electrical property detection equipment (9), if the resistance value is not in accordance with the requirement, the first diode is judged to be an unqualified product, at the moment, a worker firstly controls the piston rod of the lifting cylinder (7) to retract, after the piston rod drives the electrical property detection equipment (9) to reset, the worker controls the piston rod of the picking cylinder (24) to extend downwards, the piston rod drives the suction head (26) and the first rotary cylinder (25) to synchronously move downwards, and after the piston rod of the picking cylinder (24) is completely extended, the bottom surface of the suction head (26) is just contacted with the top surface of the body (30) of the unqualified diode, then the vacuum pump (27) is started, the vacuum pump (27) vacuumizes the suction head (26), the body (30) of the unqualified diode is adsorbed on the bottom surface of the suction head (26) under negative pressure, then a worker controls the piston rod of the picking cylinder (24) to retract, further drives the unqualified diode to synchronously move upwards, after the worker resets, the worker controls the rotating shaft of the first rotating cylinder (25) to rotate, the rotating shaft drives the rotating plate to rotate, the rotating plate drives the suction head (26) to rotate, after the rotating shaft is rotated in place, the controller controls the first rotating cylinder (25) to be closed, and the unqualified diode is positioned right above the receiving box (29), then, a worker controls the vacuum pump (27) to be closed, unqualified diodes fall into the receiving box (29), after the unqualified diodes are removed, the first rotary cylinder (25) is controlled to reset, a diode is newly supplemented into the sinking tank (19), and the detection process is repeated until the resistance of the newly supplemented diode is qualified;
if the electrical property detection device (9) shows that the resistance value of the first diode meets the requirement in the step S32, a worker controls the piston rod of the feeding cylinder (15) to extend leftwards so that the second diode on the carrier band nipple (18) enters a detection station to detect the resistance of the second diode, and thus the continuous detection can finish the detection of the resistance of all the diodes on the carrier band nipple (18);
s4, after all diodes on the carrier band pup joint (18) are detected, a worker controls a piston rod of the feeding cylinder (15) to extend completely, and the carrier band pup joint (18) is just located at a hot press station;
s5, covering a layer of adhesive film (33) on the carrier band pup joint (18) by a worker, connecting a power line of a heating rod (14) to a power supply by the worker, generating heat on the heating rod (14) after electrifying, transmitting the heat to the frame (12), transmitting the heat to each pressure head (13) by the frame (12), controlling piston rods of two vertical air cylinders (11) to extend downwards by the worker, driving the frame (12) to move downwards by the piston rods, driving each pressure head (13) to synchronously move downwards by the frame (12), respectively pressing each pressure head (13) on the outer edge of the adhesive film (33) after the piston rods of the vertical air cylinders (11) extend completely, and fixing the adhesive film (33) on the carrier band pup joint (18) after the adhesive film (33) receives the heat from the pressure heads (13), so as to finally realize encapsulation of a diode;
s6, after packaging, controlling the piston rod of the vertical cylinder (11) to retract by a worker, after retracting, controlling the piston rod of the feeding cylinder (15) to retract, and after retracting and resetting, taking off the finished product material on the mobile station (16) by the worker;
s7, repeating the operations of the steps S1-S6, and continuously detecting and packaging the plurality of diodes.
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