CN115043008A - Diode braid packaging system and method integrating detection and packaging - Google Patents
Diode braid packaging system and method integrating detection and packaging Download PDFInfo
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- CN115043008A CN115043008A CN202210810481.7A CN202210810481A CN115043008A CN 115043008 A CN115043008 A CN 115043008A CN 202210810481 A CN202210810481 A CN 202210810481A CN 115043008 A CN115043008 A CN 115043008A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B15/00—Attaching articles to cards, sheets, strings, webs, or other carriers
- B65B15/04—Attaching a series of articles, e.g. small electrical components, to a continuous web
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
- B65B51/14—Applying or generating heat or pressure or combinations thereof by reciprocating or oscillating members
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- Computer Hardware Design (AREA)
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Abstract
The invention discloses a diode braid packaging system and method integrating detection and packaging, and the diode braid packaging system comprises a workbench (1), wherein an unqualified diode removing device (2), an electrical property detection device (3) and a hot pressing device (4) are sequentially arranged on the table top of the workbench (1) from right to left, the electrical property detection device (3) comprises a first through groove (5) formed in the workbench (1), a support (6) fixedly arranged right above the first through groove (5), and a lifting cylinder (7) fixedly arranged on the support (6); the hot pressing device (4) comprises a vertical cylinder (11) fixedly arranged on the table top of the workbench (1), a plurality of pressing heads (13) are fixedly arranged on the bottom surface of the frame (12) at intervals along the circumferential direction of the frame, and heating rods (14) are arranged on the front side wall and the rear side wall of the frame (12). The invention has the beneficial effects that: compact structure, improvement diode encapsulation efficiency, make things convenient for the customer to tear the glued membrane from the carrier band nipple joint.
Description
Technical Field
The invention relates to the technical field of diode packaging, in particular to a diode braid packaging system and method integrating detection and packaging.
Background
The diode used in a machine tool is shown in fig. 1 and comprises a body 30, two pins 31 are formed on one side of the body 30, and the diode is mounted on a circuit board of a machine tool control box. After the diodes are produced and molded, workers in a workshop need to package the diodes and convey the diodes to customers after the diodes are packaged. The existing method for packaging the diode is as follows: firstly, a worker puts the carrier tape short section 18 shown in figures 2-3 on the table top of a workbench, ensures that each accommodating groove 32 on the carrier tape short section 18 is arranged upwards, then the worker puts a diode into each accommodating groove 32 respectively as shown in figures 4-5, then the worker uses two contacts of an electrical property detection device to sequentially contact pins 31 of the diode from left to right, if the worker checks that the resistance value of the detected diode is not satisfactory in the electrical property detection device, the worker removes the unqualified diode from the carrier tape short section 18 and puts a new diode in, after the electrical properties of all the diodes on the carrier tape short section 18 are detected, the worker covers a layer 33 on the top surface of the carrier tape short section 18 as shown in figure 6, finally, the electrical property is thermally pressed on the top surface of an adhesive film 33 through a heating plate, the adhesive film 33 and the carrier tape short section 18 are thermally sealed into a whole, thereby finally realizing the braid package of the diode.
However, although this method can braid and package the diode, the following technical drawbacks still exist:
I. when the defective diode is detected, the defective diode needs to be manually taken out from the accommodating groove 32, and the accommodating groove 32 has a small space, so that it is difficult for a worker to take out the diode from the accommodating groove 32, which undoubtedly reduces the packaging efficiency of the diode.
II. When the contact of the electrical performance detection equipment touches the pin 31 of the diode, the pin 31 is in a suspended state, so that when the contact touches the pin 31, the pin 31 is bent and deformed, the diode is damaged, and the goods are returned frequently by customers.
II. The bottom surface of whole glued membrane 33 and the top surface adhesion of whole carrier band nipple joint 18 in an organic whole, cause glued membrane 33 and carrier band nipple joint 18's joint strength big, lead to when the customer will take the diode, need consume very big power gas and can tear glued membrane 33 from carrier band nipple joint 18, brought very big inconvenience for customer's use.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a diode braid packaging system and a diode braid packaging method which are compact in structure, improve the diode packaging efficiency, facilitate a client to tear a glue film from a carrier tape short section and integrate detection and packaging.
The purpose of the invention is realized by the following technical scheme: a diode braid packaging system integrating detection and packaging comprises a workbench, wherein an unqualified diode removing device, an electrical property detection device and a hot pressing device are sequentially arranged on the table top of the workbench from right to left, the electrical property detection device comprises a first through groove formed in the workbench, a support fixedly arranged right above the first through groove, and a lifting cylinder fixedly arranged on the support, a lifting plate is fixedly arranged on the action end of a piston rod of the lifting cylinder, electrical property detection equipment is fixedly arranged at the top of the lifting plate, and two contacts of the electrical property detection equipment penetrate through the lifting plate;
the hot pressing device comprises a vertical cylinder fixedly arranged on the table top of the workbench, a piston rod of the vertical cylinder penetrates through the workbench, a frame is fixedly arranged on the extending end, a plurality of pressing heads are fixedly arranged on the bottom surface of the frame at intervals along the circumferential direction of the frame, and heating rods are arranged on the front side wall and the rear side wall of the frame;
a feeding cylinder which is positioned right below the electrical property detection device is arranged below the workbench, a moving table is fixedly arranged on the action end of a piston rod of the feeding cylinder, and two positioning columns which are distributed diagonally are fixedly arranged on the top surface of the moving table;
this packaging system still includes the carrier band nipple joint, and the top of carrier band nipple joint is gone up and has been seted up a plurality of heavy grooves along its length direction, and the outline of heavy groove cooperatees with the foreign steamer of the body of diode, and two bar grooves rather than the intercommunication are seted up to one side of heavy groove, and the degree of depth in bar groove is less than the degree of depth of heavy groove, the locating hole that is diagonal setting is all seted up to the left and right ends of carrier band nipple joint.
Unqualified diode removing devices leads to the groove including the second of seting up on the workstation, sets firmly the portal frame directly over the groove is led to the second, has set firmly on the crossbeam of portal frame and has rejected the material cylinder, and the piston rod that rejects the material cylinder runs through the crossbeam setting, and extends to serve and set firmly first revolving cylinder, and the welding has the rotor plate on the first revolving cylinder rotation axis, and the other end welding of rotor plate has the suction head that is located directly over the second leads to the groove, and the top port department of suction head is connected with the vacuum pump.
The vacuum pump is arranged at the top of the portal frame beam, and the working port of the vacuum pump is connected with the top port of the suction head through a hose.
The material receiving device comprises a second rotary cylinder fixedly arranged on the table top of the workbench, a rotary shaft of the second rotary cylinder penetrates through the workbench, a material receiving box is fixedly arranged on the extending end, and the material receiving box is positioned right below the second through groove.
The bottom surface of the workbench is fixedly provided with a plurality of supporting legs supported on the ground, a backing plate is fixedly arranged between the supporting legs, and the cylinder body of the feeding cylinder is fixedly arranged on the top surface of the backing plate.
All the welding has the connecting plate on the lateral wall about the frame, has set firmly two vertical cylinders on the mesa of workstation, and the effect end of two vertical cylinder piston rods welds respectively on two connecting plates.
The packaging system further comprises a controller, wherein the controller is electrically connected with the electromagnetic valve of the lifting cylinder, the electromagnetic valve of the feeding cylinder, the electromagnetic valve of the vertical cylinder, the electromagnetic valve of the first rotating cylinder and the electromagnetic valve of the second rotating cylinder.
A diode braid packaging method integrating detection and packaging comprises the following steps:
s1, a worker places the carrier tape short section on a platform, then a diode is placed in each sinking groove, namely, a body of the diode is placed in the sinking groove, two pins of the diode are placed in the two strip-shaped grooves respectively, after the diode is placed in the sinking groove, the body is supported at the bottom of the sinking groove, and the pins are supported at the bottom of the strip-shaped grooves, so that a plurality of diodes are loaded on the carrier tape short section;
s2, positioning the carrier tape short section, namely, lifting two ends of the carrier tape short section upwards by a worker, respectively sleeving two positioning holes of the carrier tape short section on two positioning columns, and supporting the carrier tape short section on the top surface of a mobile station, so that the carrier tape short section is positioned, and at the moment, two pins of a diode positioned at the head end of the carrier tape short section are respectively positioned under two contacts;
s3, detecting the resistance of the first diode, wherein the specific operation steps are as follows:
s31, a worker controls a piston rod of the lifting cylinder to extend downwards, the piston rod drives the lifting plate to move downwards, the lifting plate drives the electric performance detection equipment to move downwards, and then the two contacts are driven to pass through the first through groove to move downwards;
s32, when the piston rod of the lifting cylinder is completely extended, two contacts are respectively contacted with two pins of a first diode, the resistance value of the diode is displayed in the electrical property detection equipment, if the resistance value is not qualified, the diode is judged to be a unqualified product, at the moment, a worker firstly controls the piston rod of the lifting cylinder to retract, the piston rod drives the electrical property detection equipment to reset, the worker controls the piston rod of the material picking cylinder to extend downwards, the piston rod drives the suction head and the first rotary cylinder to move downwards synchronously, when the piston rod of the material picking cylinder is completely extended, the bottom surface of the suction head is just contacted with the top surface of the unqualified diode body, then the vacuum pump of the worker starts, the vacuum pump vacuumizes the suction head, the unqualified diode body is adsorbed on the bottom surface of the suction head under negative pressure, and then the worker controls the piston rod of the material picking cylinder to retract, then the unqualified diodes are driven to synchronously move upwards, after the diodes are reset, workers control a rotating shaft of a first rotating cylinder to rotate, the rotating shaft drives a rotating plate to rotate, the rotating plate drives a suction head to rotate, when the diodes rotate to a position, a controller controls the first rotating cylinder to be closed, the unqualified diodes are positioned right above a material receiving box, the workers control a vacuum pump to be closed, the unqualified diodes fall into the material receiving box, after the unqualified diodes are removed, the first rotating cylinder is controlled to reset, a diode is newly supplemented into a sinking groove, and the detection process is repeated until the resistance of the newly supplemented diode is qualified;
if the electrical property detection equipment displays that the resistance value of the diode meets the requirement in step S32, the worker controls the piston rod of the feeding cylinder to extend leftward to enable the second diode on the carrier tape short section to enter a detection station to detect the resistance of the second diode, and the detection of the resistances of all diodes on the carrier tape short section can be completed through continuous detection;
s4, when all diodes on the tape sub are detected, a worker controls a piston rod of the feeding cylinder to extend completely, and the tape sub is just positioned at a hot-pressing station;
s5, a worker covers a layer of glue film on the carrier tape short section, then the worker connects a power line of a heating rod to a power supply, after the power supply is powered on, heat is generated on the heating rod and is transmitted to a frame, the frame transmits the heat to each pressure head, then the worker controls piston rods of two vertical air cylinders to extend downwards, the piston rods drive the frame to move downwards, the frame drives each pressure head to move downwards synchronously, after the piston rods of the vertical air cylinders extend completely, each hot pressing head presses the outer edge of the glue film respectively, and after the glue film receives the heat from the pressure heads, the glue film is fixed on the carrier tape short section, so that the encapsulation of the diode is finally realized;
s6, after packaging, controlling the piston rod of the vertical cylinder to retract by a worker, controlling the piston rod of the feeding cylinder to retract after retraction, and taking the finished product material on the mobile platform off the mobile platform after retraction and resetting;
s7, repeating the operations of steps S1-S6, so as to continuously inspect and package the plurality of diodes.
The invention has the following advantages: compact structure, improvement diode encapsulation efficiency, make things convenient for the customer to tear the glued membrane from the carrier band nipple joint.
Drawings
FIG. 1 is a schematic diagram of a diode structure;
FIG. 2 is a schematic structural diagram of a conventional carrier tape sub;
FIG. 3 is a cross-sectional view A-A of FIG. 2;
FIG. 4 is a schematic view of a diode being loaded in a receiving slot of a tape sub;
FIG. 5 is a cross-sectional view B-B of FIG. 4;
FIG. 6 is a schematic diagram of covering a glue film on the top surface of the tape sub;
FIG. 7 is a schematic structural view of the present invention;
FIG. 8 is an enlarged view of a portion I of FIG. 7;
FIG. 9 is a bottom view of the frame;
FIG. 10 is a schematic view of the connection of the lifter plate to the electrical performance detection apparatus;
FIG. 11 is a schematic structural diagram of a carrier tape sub according to the present invention;
FIG. 12 is a cross-sectional view C-C of FIG. 11;
FIG. 13 is a schematic view of a diode built into a tape sub;
FIG. 14 is a cross-sectional view D-D of FIG. 13;
FIG. 15 is a schematic view of positioning a carrier tape sub;
FIG. 16 is a diagram illustrating the detection of the resistance of a first diode;
FIG. 17 is a schematic view of the carrier tape sub entering a thermal bonding station;
FIG. 18 is a schematic diagram of the adhesive film covering the top surface of the carrier tape sub;
FIG. 19 is a schematic view of a thermal press;
in the figure, 1-a workbench, 2-a unqualified diode rejecting device, 3-an electrical property detecting device, 4-a thermal compression device, 5-a first through groove, 6-a support, 7-a lifting cylinder, 8-a lifting plate, 9-an electrical property detecting device, 10-a contact, 11-a vertical cylinder, 12-a frame, 13-a pressure head, 14-a heating rod, 15-a feeding cylinder, 16-a moving table, 17-a positioning column, 18-a carrier tape short section, 19-a sink groove, 20-a strip groove, 21-a positioning hole, 22-a second through groove, 23-a portal frame, 24-a material picking cylinder, 25-a first rotating cylinder, 26-a suction head, 27-a vacuum pump, 28-a second rotating cylinder and 29-a material receiving box, 30-body, 31-pin, 32-accommodating groove and 33-adhesive film.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 7-12, a diode braid packaging system integrating detection and packaging comprises a workbench 1, wherein an unqualified diode removing device 2, an electrical property detection device 3 and a hot pressing device 4 are sequentially arranged on a table board of the workbench 1 from right to left, the electrical property detection device 3 comprises a first through groove 5 arranged on the workbench 1, a support 6 fixedly arranged right above the first through groove 5 and a lifting cylinder 7 fixedly arranged on the support 6, a lifting plate 8 is fixedly arranged on an acting end of a piston rod of the lifting cylinder 7, electrical property detection equipment 9 is fixedly arranged at the top of the lifting plate 8, and two contacts 10 of the electrical property detection equipment 9 all penetrate through the lifting plate 8.
The hot pressing device 4 comprises a vertical cylinder 11 fixedly arranged on the table-board of the workbench 1, piston rods of the vertical cylinder 11 penetrate through the workbench 1, a frame 12 is fixedly arranged on the extending end, connecting plates are welded on the left side wall and the right side wall of the frame 12, two vertical cylinders 11 are fixedly arranged on the table-board of the workbench 1, the acting ends of the piston rods of the two vertical cylinders 11 are respectively welded on the two connecting plates, a plurality of pressing heads 13 are fixedly arranged on the bottom surface of the frame 12 at intervals along the circumferential direction of the frame, and heating rods 14 are arranged on the front side wall and the rear side wall of the frame 12; unqualified diode removing devices 2 is including seting up second through groove 22 on workstation 1, set firmly portal frame 23 directly over second through groove 22, set firmly on portal frame 23's the crossbeam and pick material cylinder 24, the piston rod that picks material cylinder 24 runs through the crossbeam setting, and extends to serve and set firmly first revolving cylinder 25, and the welding has the rotor plate on the first revolving cylinder 25 rotation axis, and the other end welding of rotor plate has suction head 26 that is located directly over second through groove 22, and the top port department of suction head 26 is connected with vacuum pump 27, vacuum pump 27 sets up in the top of portal frame 23 crossbeam, and vacuum pump 27's working port and suction head 26's top port are through hose connection.
A feeding cylinder 15 which is positioned right below the electrical property detection device 3 is arranged below the workbench 1, a moving table 16 is fixedly arranged on the action end of a piston rod of the feeding cylinder 15, and two positioning columns 17 which are distributed diagonally are fixedly arranged on the top surface of the moving table 16; a plurality of supporting legs supported on the ground are fixedly arranged on the bottom surface of the workbench 1, a backing plate is fixedly arranged between the supporting legs, and the cylinder body of the feeding cylinder 15 is fixedly arranged on the top surface of the backing plate
This packaging system still includes carrier band nipple joint 18, and carrier band nipple joint 18 is on the top surface and seted up a plurality of heavy grooves 19 along its length direction, and the outline of heavy groove 19 cooperatees with the foreign steamer of the body 30 of diode, and two bar grooves 20 rather than the intercommunication are seted up to one side of heavy groove 19, and the degree of depth of bar groove 20 is less than the degree of depth of heavy groove 19, the locating hole 21 that is diagonal setting is all seted up to the left and right ends of carrier band nipple joint 18.
The material receiving device comprises a second rotary cylinder 28 fixedly arranged on the table surface of the workbench 1, a rotary shaft of the second rotary cylinder 28 penetrates through the workbench 1, a material receiving box 29 is fixedly arranged on the extending end, and the material receiving box 29 is positioned right below the second through groove 22.
The packaging system further comprises a controller electrically connected with the solenoid valves of the lifting cylinder 7, the feeding cylinder 15, the vertical cylinder 11, the first rotary cylinder 25 and the second rotary cylinder 28, and a worker can control the extension or retraction of the piston rods of the respective cylinders through the controller.
A diode braid packaging method integrating detection and packaging comprises the following steps:
s1, a worker places the carrier tape sub 18 on a platform, then a diode is placed in each sinking groove 19, namely, a body 30 of the diode is placed in the sinking groove 19, two pins 31 of the diode are placed in the two strip-shaped grooves 20, the body 30 is supported at the bottom of the sinking groove 19, and the pins 31 are supported at the bottom of the strip-shaped grooves 20, so that a plurality of diodes are placed on the carrier tape sub 18 as shown in figures 13-14;
s2, positioning the carrier tape sub, namely, a worker lifts the two ends of the carrier tape sub 18 upwards, then the two positioning holes 21 of the carrier tape sub 18 are respectively sleeved on the two positioning columns 17, and the carrier tape sub 18 is supported on the top surface of the mobile station 16, so that the carrier tape sub is positioned as shown in figure 15, and at the moment, two pins 31 of a diode positioned at the head end of the carrier tape sub 18 are respectively positioned under two contacts 10;
s3, detecting the resistance of the first diode, wherein the specific operation steps are as follows:
s31, a worker controls a piston rod of the lifting cylinder 7 to extend downwards, the piston rod drives the lifting plate 8 to move downwards, the lifting plate 8 drives the electrical property detection equipment 9 to move downwards, and then the two contacts 10 are driven to pass through the first through groove 5 to move downwards;
s32, when the piston rod of the lifting cylinder 7 is completely extended, the two contacts 10 respectively contact the two pins 31 of the first diode as shown in fig. 16, at this time, the resistance value of the diode is displayed in the electrical property detection device 9, if the resistance value does not meet the requirement, the diode is determined to be a non-defective product, at this time, the worker first controls the piston rod of the lifting cylinder 7 to retract, after the piston rod drives the electrical property detection device 9 to reset, the worker controls the piston rod of the material rejecting cylinder 24 to extend downward, the piston rod drives the suction head 26 and the first rotating cylinder 25 to move downward synchronously, when the piston rod of the material rejecting cylinder 24 is completely extended, the bottom surface of the suction head 26 just contacts the top surface of the body 30 of the non-defective diode, then the worker starts the vacuum pump 27, the vacuum pump 27 vacuumizes the suction head 26, and the body 30 of the non-defective diode is absorbed on the bottom surface of the suction head 26 under negative pressure, then, the worker controls a piston rod of the material rejecting cylinder 24 to retract so as to drive the unqualified diode to synchronously move upwards, after the unqualified diode is reset, the worker controls a rotating shaft of the first rotating cylinder 25 to rotate, the rotating shaft drives a rotating plate to rotate, the rotating plate drives a suction head 26 to rotate, after the rotating plate rotates to a position, the controller controls the first rotating cylinder 25 to be closed, the unqualified diode is positioned right above the material receiving box 29, the worker controls a vacuum pump 27 to be closed, the unqualified diode falls into the material receiving box 29, after the unqualified diode is rejected, the first rotating cylinder 25 is controlled to reset, a diode is newly supplemented into the sinking groove 19, and the detection process is repeated until the resistance of the newly supplemented diode is qualified;
if the electrical property detection device 9 shows that the resistance value of the diode meets the requirement in step S32, the worker controls the piston rod of the feeding cylinder 15 to extend leftward, so that the second diode on the tape sub 18 enters the detection station to detect the resistance of the second diode, and the detection of the resistances of all diodes on the tape sub 18 can be completed through such continuous detection;
in the detection process of step S3, since the two pins 31 are supported at the bottom of the bar-shaped groove 20, when the contact 10 touches the pins 31, the pins 31 will not be bent or deformed, and compared with the conventional method for detecting the electrical property of a diode, the method well protects the diode; in addition, in step S32, the unqualified diodes detected in the tape sub 18 can be quickly and directly removed therefrom by the unqualified diode removing device 2, so that the packaging efficiency of the diodes is greatly improved.
S4, when all diodes on the tape sub 18 are detected, a worker controls the piston rod of the feeding cylinder 15 to be completely extended, and the tape sub 18 is just positioned at a thermal compression station as shown in FIG. 17;
s5, covering a glue film 33 on the tape carrier sub 18 by a worker as shown in figure 18, connecting a power line of a heating rod 14 to a power supply by the worker, generating heat on the heating rod 14 after the worker is electrified, transmitting the heat to the frame 12, transmitting the heat to each pressure head 13 by the frame 12, controlling piston rods of two vertical cylinders 11 to extend downwards by the worker, driving the frame 12 to move downwards by the piston rods, driving each pressure head 13 to move downwards synchronously by the frame 12, pressing each hot-pressing head 13 on the outer edge of the glue film 33 after the piston rods of the vertical cylinders 11 are completely extended as shown in figure 19, fixing the glue film 33 on the tape carrier sub 18 after the glue film 33 receives the heat from the pressure heads 13, and finally realizing the encapsulation of the diode;
in this step S5, the adhesive film 33 is fixed on the tape carrier sub 18 by the pressing heads 13 arranged at intervals, which ensures that the connection between the adhesive film 33 and the tape carrier sub 18 is point-to-point, and compared with the conventional method, the adhesive film is directly and thermally pressed on the top surface of the tape carrier sub 18, so that the adhesive film 33 can be torn off from the tape carrier sub 18 more conveniently by a customer, and great convenience is brought to the customer.
S6, after packaging, controlling the piston rod of the vertical cylinder 11 to retract by a worker, controlling the piston rod of the feeding cylinder 15 to retract after retraction, and after retraction and reset, taking the finished product material on the mobile station 16 off from the worker by the worker;
s7, repeating the operations of steps S1-S6, so as to continuously inspect and package the plurality of diodes.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a collection detects and packs diode braid packaging system in an organic whole which characterized in that: the diode heat exchanger comprises a workbench (1), wherein an unqualified diode removing device (2), an electrical property detection device (3) and a hot pressing device (4) are sequentially arranged on a table board of the workbench (1) from right to left, the electrical property detection device (3) comprises a first through groove (5) formed in the workbench (1), a support (6) fixedly arranged right above the first through groove (5) and a lifting cylinder (7) fixedly arranged on the support (6), a lifting plate (8) is fixedly arranged on an action end of a piston rod of the lifting cylinder (7), electrical property detection equipment (9) is fixedly arranged at the top of the lifting plate (8), and two contacts (10) of the electrical property detection equipment (9) are arranged through the lifting plate (8);
the hot pressing device (4) comprises a vertical cylinder (11) fixedly arranged on the table top of the workbench (1), a piston rod of the vertical cylinder (11) penetrates through the workbench (1) and is fixedly provided with a frame (12) at the extending end, a plurality of pressing heads (13) are fixedly arranged on the bottom surface of the frame (12) at intervals along the circumferential direction of the frame, and heating rods (14) are arranged on the front side wall and the rear side wall of the frame (12);
a feeding cylinder (15) positioned right below the electrical property detection device (3) is arranged below the workbench (1), a moving table (16) is fixedly arranged on the action end of a piston rod of the feeding cylinder (15), and two positioning columns (17) distributed diagonally are fixedly arranged on the top surface of the moving table (16);
this packaging system still includes carrier band nipple joint (18), has seted up a plurality of heavy grooves (19) on the top surface of carrier band nipple joint (18) and along its length direction, and the outline of heavy groove (19) cooperatees with the foreign steamer of body (30) of diode, and two bar grooves (20) rather than the intercommunication are seted up to one side of heavy groove (19), and the degree of depth of bar groove (20) is less than the degree of depth of heavy groove (19), locating hole (21) that are the diagonal angle and set up are all seted up to the end about carrier band nipple joint (18).
2. The diode braid packaging system integrating detection and packaging as a whole as claimed in claim 1, wherein: unqualified diode removing devices (2) are including seting up second through groove (22) on workstation (1), portal frame (23) directly over second through groove (22) set firmly, it picks material cylinder (24) to have set firmly on the crossbeam of portal frame (23), the piston rod that picks material cylinder (24) runs through the crossbeam setting, and extend and serve and set firmly first revolving cylinder (25), the welding has the rotor plate on first revolving cylinder (25) rotation axis, the welding of the other end of rotor plate has suction head (26) that are located directly over second through groove (22), the top port department of suction head (26) is connected with vacuum pump (27).
3. The diode braid packaging system integrating detection and packaging as a whole as claimed in claim 2, wherein: the vacuum pump (27) is arranged at the top of a cross beam of the portal frame (23), and a working port of the vacuum pump (27) is connected with a top port of the suction head (26) through a hose.
4. The diode braid packaging system integrating detection and packaging as a whole as claimed in claim 2, wherein: the material receiving device comprises a second rotary cylinder (28) fixedly arranged on the table top of the workbench (1), a rotary shaft of the second rotary cylinder (28) penetrates through the workbench (1) and is fixedly provided with a material receiving box (29) on the extending end, and the material receiving box (29) is positioned right below the second through groove (22).
5. The diode braid packaging system integrating detection and packaging as a whole as claimed in claim 1, wherein: the bottom surface of the workbench (1) is fixedly provided with a plurality of supporting legs supported on the ground, a backing plate is fixedly arranged between the supporting legs, and the cylinder body of the feeding cylinder (15) is fixedly arranged on the top surface of the backing plate.
6. The diode braid packaging system integrating detection and packaging as a whole as claimed in claim 1, wherein: all welded the connecting plate on the lateral wall about frame (12), set firmly two vertical cylinders (11) on the mesa of workstation (1), the effect end of two vertical cylinders (11) piston rod welds respectively on two connecting plates.
7. The diode braid packaging system integrating detection and packaging as a whole as claimed in claim 1, wherein: the packaging system also comprises a controller which is electrically connected with the electromagnetic valve of the lifting cylinder (7), the electromagnetic valve of the feeding cylinder (15), the electromagnetic valve of the vertical cylinder (11), the electromagnetic valve of the first rotating cylinder (25) and the electromagnetic valve of the second rotating cylinder (28).
8. A diode braid packaging method integrating detection and packaging is adopted, and the diode braid packaging system integrating detection and packaging is characterized in that: it comprises the following steps:
s1, a worker places the carrier tape short section (18) on a platform, then a diode is placed in each sinking groove (19), namely a body (30) of the diode is placed in the sinking groove (19), two pins (31) of the diode are placed in two strip-shaped grooves (20) respectively, after the diode is placed in the sinking groove, the body (30) is supported at the bottom of the sinking groove (19), and the pins (31) are supported at the bottom of the strip-shaped grooves (20), so that a plurality of diodes are placed in the carrier tape short section (18);
s2, positioning the carrier tape short section, namely, lifting the two ends of the carrier tape short section (18) upwards by a worker, then respectively sleeving the two positioning holes (21) of the carrier tape short section (18) on the two positioning columns (17), and supporting the carrier tape short section (18) on the top surface of the mobile station (16), so that the positioning of the carrier tape short section is realized, and at the moment, two pins (31) of a diode positioned at the head end of the carrier tape short section (18) are respectively positioned under two contacts (10);
s3, detecting the resistance of the first diode, wherein the specific operation steps are as follows:
s31, a worker controls a piston rod of the lifting cylinder (7) to extend downwards, the piston rod drives the lifting plate (8) to move downwards, the lifting plate (8) drives the electrical property detection equipment (9) to move downwards, and then the two contacts (10) are driven to pass through the first through groove (5) to move downwards;
s32, when the piston rod of the lifting cylinder (7) is completely extended out, two contacts (10) are respectively contacted with two pins (31) of a first diode, the resistance value of the diode is displayed in the electrical property detection device (9), if the resistance value is not qualified, the diode is judged to be a unqualified product, at the moment, a worker firstly controls the piston rod of the lifting cylinder (7) to retract, the piston rod drives the electrical property detection device (9) to reset, the worker controls the piston rod of the material rejecting cylinder (24) to extend downwards, the piston rod drives the suction head (26) and the first rotary cylinder (25) to synchronously move downwards, when the piston rod of the material rejecting cylinder (24) is completely extended out, the bottom surface of the suction head (26) is just contacted with the top surface of the body (30) of the unqualified diode, then the worker starts a vacuum pump (27), and the vacuum pump (27) vacuumizes the suction head (26), under negative pressure, the unqualified diode body (30) is absorbed on the bottom surface of the suction head (26), then the worker controls the piston rod of the material rejecting cylinder (24) to retract so as to drive the unqualified diode to synchronously move upwards, after resetting, the worker controls the rotation shaft of the first rotary cylinder (25) to rotate, the rotation shaft drives the rotating plate to rotate, the rotating plate drives the suction head (26) to rotate, when the diode is rotated to the position, the controller controls the first rotating cylinder (25) to be closed, the unqualified diode is positioned right above the material receiving box (29), then a worker controls the vacuum pump (27) to be closed, the unqualified diodes fall into the material receiving box (29), and after the unqualified diodes are removed, the first rotary cylinder (25) is controlled to reset, a diode is newly supplemented into the sinking groove (19), and the detection procedure is repeated until the resistance of the newly supplemented diode is qualified;
if the electrical property detection device (9) displays that the resistance value of the diode meets the requirement in step S32, the worker controls the piston rod of the feeding cylinder (15) to extend leftward to enable the second diode on the tape sub (18) to enter a detection station to detect the resistance of the second diode, and the detection of the resistances of all diodes on the tape sub (18) can be completed through continuous detection;
s4, when all diodes on the tape sub (18) are detected, a worker controls a piston rod of the feeding cylinder (15) to extend completely, and the tape sub (18) is just positioned at a hot-pressing station;
s5, covering a layer of adhesive film (33) on the carrier tape short section (18) by a worker, connecting a power line of a heating rod (14) to a power supply by the worker, generating heat on the heating rod (14) after the worker is electrified, transmitting the heat to a frame (12), transmitting the heat to each pressure head (13) by the frame (12), controlling piston rods of two vertical cylinders (11) to extend downwards by the worker, driving the frame (12) to move downwards by the piston rods, driving each pressure head (13) to synchronously move downwards by the frame (12), pressing each hot-pressing head (13) on the outer edge of the adhesive film (33) respectively after the piston rods of the vertical cylinders (11) completely extend, and fixing the adhesive film (33) on the carrier tape short section (18) after the adhesive film (33) receives the heat from the pressure heads (13) so as to finally realize the encapsulation of the diode;
s6, after packaging, controlling the piston rod of the vertical cylinder (11) to retract by a worker, controlling the piston rod of the feeding cylinder (15) to retract after retraction, and taking the finished product on the mobile platform (16) off the worker after retraction and reset;
s7, repeating the operations of steps S1-S6, so as to continuously inspect and package the plurality of diodes.
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| CN115043008B (en) | 2023-06-23 |
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