CN218647907U - Chip bonding device with adsorption structure for semiconductor packaging - Google Patents
Chip bonding device with adsorption structure for semiconductor packaging Download PDFInfo
- Publication number
- CN218647907U CN218647907U CN202222940559.5U CN202222940559U CN218647907U CN 218647907 U CN218647907 U CN 218647907U CN 202222940559 U CN202222940559 U CN 202222940559U CN 218647907 U CN218647907 U CN 218647907U
- Authority
- CN
- China
- Prior art keywords
- bonding
- telescopic link
- frame
- bonding frame
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a chip bonding device is used in semiconductor package with adsorption structure, including the bonding frame, the fixed bonding frame that is provided with in the outside of bonding frame, the top of bonding frame is rotated and is connected with the transmission lead screw, and the middle part transmission of transmission lead screw is connected with the transmission slider, and the fixed removal bonding frame that is provided with in top of transmission slider removes the outside of bonding frame and has seted up the lift spout, and the top fixed mounting of lift spout has automatically controlled telescopic link, and automatically controlled telescopic link's bottom mounting is provided with the lift balladeur train, the utility model relates to a chip bonding device is used in semiconductor package with adsorption structure, this chip bonding device has increased adsorption apparatus, through adsorbing rubber disk and semiconductor chip direct contact to adopt the crowded absorbent mode of taking out to realize the shift bonding work of semiconductor, the stable and reliable landing of being difficult for becoming flexible, and can not cause the damage to semiconductor chip, get and put fast efficiency high, improved semiconductor chip's bonding efficiency.
Description
Technical Field
The utility model relates to a semiconductor chip packaging technology field specifically is a chip bonding device for semiconductor package with adsorption structure.
Background
The packaging process flow of the semiconductor is to cut the wafer into small chips through the scribing process, then to stick the small chips cut to the small island of the corresponding substrate frame by glue, then to use the ultra-fine metal wire or the conductive resin to stick the bonding pad of the chip to the corresponding pin of the substrate and to form the required circuit, then to package and protect the independent chip by the plastic shell, to carry on a series of operations after the plastic package, to carry on the finished product test after the package is finished. In the packaging process of the semiconductor, the semiconductor needs to be bonded, a bonding device is needed in the process, and the common bonding device mostly adopts a clamping and transferring mode to realize the bonding work of the semiconductor.
The existing bonding device mostly adopts a clamping and transferring mode to realize the bonding of the semiconductor chip, so that the semiconductor is easy to be stressed and damaged, and the stability is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip bonding device for semiconductor package with adsorption structure to solve the current bonding device that proposes among the above-mentioned background art and adopt the mode that the centre gripping shifted to realize the bonding to the semiconductor more, easily make the problem that the semiconductor atress damaged.
In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a chip bonding device for semiconductor package with adsorption structure, includes the bonding frame, the fixed bonding frame that is provided with in the outside of bonding frame, the top of bonding frame is rotated and is connected with the transmission lead screw, the middle part transmission of transmission lead screw is connected with the transmission slider, the fixed removal bonding frame that is provided with in top of transmission slider, the lift spout has been seted up in the outside of removal bonding frame, the top fixed mounting of lift spout has automatically controlled telescopic link, the bottom mounting of automatically controlled telescopic link is provided with the lift balladeur train, the fixed adsorption apparatus that is provided with in the outside of lift balladeur train, the inside fixed mounting of bonding frame has the controller, has add adsorption apparatus, through adsorbing offset disc and semiconductor chip direct contact to adopt the crowded absorbent mode of taking out to realize the transfer bonding work to the semiconductor, reliable and stable difficult landing that becomes flexible, and can not cause the damage to the semiconductor chip, get fast efficient fast, improved semiconductor chip's bonding efficiency.
Preferably, adsorption apparatus constructs including adsorbing the drum, removing piston and miniature telescopic link, the top fixed mounting who adsorbs the drum has miniature telescopic link, miniature telescopic link's bottom mounting is provided with and is located the inside removal piston that adsorbs the drum, the bottom threaded connection who adsorbs the drum has the adsorption rubber disc, miniature telescopic link and controller electric connection adopt to take out crowded absorbent mode and realize the transfer bonding work to the semiconductor, and reliable and stable difficult not hard up landing, and can not cause the damage to the semiconductor chip.
Preferably, one side fixed mounting of bonding frame has servo motor, servo motor's output and the one end fixed connection of transmission lead screw, servo motor and automatically controlled telescopic link all with controller electric connection, can realize the transfer bonding work to semiconductor chip automatically, improve work efficiency.
Preferably, the middle part of the top end of the bonding machine seat is fixedly provided with a bonding table, so that chips can be conveniently placed for bonding, and the bonding machine seat is stable and reliable.
Preferably, one side fixed mounting on bonding frame top has the panel of controlling, the fixed surface who controls the panel installs on-off switch, the controller is through on-off switch and external power supply electric connection, and easy operation is convenient.
Preferably, four corners of bonding frame bottom are all fixed and are provided with anti-skidding callus on the sole, can improve the stability that bonding device put.
Compared with the prior art, the beneficial effects of the utility model are that: this chip bonding device has increased adsorption apparatus and has constructed, through adsorbing rubber disc and semiconductor chip direct contact to adopt and take out crowded absorbent mode and realize the transfer bonding work to the semiconductor, reliable and stable difficult not hard up landing, and can not cause the damage to the semiconductor chip, get fast efficient of putting, improved semiconductor chip's bonding efficiency.
Drawings
FIG. 1 is a schematic structural view of the bonding apparatus of the present invention;
FIG. 2 is a schematic structural view of the movable bonding frame of the present invention;
FIG. 3 is a front cross-sectional view of the adsorption mechanism of the present invention;
fig. 4 is a front cross-sectional view of the bonding frame of the present invention.
In the figure: 1. bonding the base; 2. bonding the frame; 3. an adsorption mechanism; 31. an adsorption cylinder; 32. moving the piston; 33. a miniature telescopic rod; 34. adsorbing the rubber disc; 4. a bonding station; 5. a transmission screw rod; 6. moving the bonding frame; 7. an electric control telescopic rod; 8. a transmission slide block; 9. a servo motor; 10. a control panel; 11. a lifting chute; 12. a lifting carriage; 13. a controller; 14. an anti-skid foot pad.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Please refer to fig. 1-4, the utility model provides a chip bonding device for semiconductor package with adsorption structure, including bonding frame 1, the fixed bonding frame 2 that is provided with in the outside of bonding frame 1, the top of bonding frame 2 is rotated and is connected with transmission lead screw 5, the middle part transmission of transmission lead screw 5 is connected with transmission slider 8, transmission slider 8's fixed removal bonding frame 6 that is provided with in top, lift spout 11 has been seted up in the outside of removal bonding frame 6, the top fixed mounting of lift spout 11 has automatically controlled telescopic link 7, the bottom mounting of automatically controlled telescopic link 7 is provided with lift balladeur train 12, the fixed adsorption apparatus 3 that is provided with in the outside of lift balladeur train 12, the inside fixed mounting of bonding frame 1 has controller 13, adsorption apparatus 3 includes adsorption cylinder 31, removal piston 32 and miniature telescopic link 33, the top fixed mounting of adsorption cylinder 31 has miniature telescopic link 33, the bottom mounting of miniature telescopic link 33 is provided with the removal piston 32 that is located the adsorption cylinder 31 inside, the bottom threaded connection of adsorption cylinder 31 has adsorption rubber disk 34, miniature telescopic link 33 and controller 13, adopt the mode of suction cylinder to realize the stable and reliable transfer bonding work of getting and putting the semiconductor chip loose, can not be difficult, and can not harm, and high efficiency of semiconductor chip bonding is improved, the extruded landing is fast.
One side fixed mounting of bonding frame 2 has servo motor 9, servo motor 9's output and the one end fixed connection of transmission lead screw 5, servo motor 9 and automatically controlled telescopic link 7 all with 13 electric connection of controller, the fixed bonding platform 4 that is provided with in middle part on 1 top of bonding frame, one side fixed mounting on 1 top of bonding frame has control panel 10, the fixed surface who controls panel 10 installs start/stop switch, controller 13 is through start/stop switch and external power supply electric connection, four corners of 1 bottom of bonding frame are all fixed and are provided with anti-skidding callus on the sole 14, the operation is simple and convenient, the stable operation is reliable, the bonding efficiency of semiconductor chip has been improved.
When the embodiment of the application is used: the bonding device is placed stably and then powered on, a semiconductor to be bonded is placed on a bonding table 4, a servo motor 9 can integrally drive a movable bonding frame 6 to move through a transmission lead screw 5 and a transmission slide block 8, the adsorption mechanism 3 is enabled to be just opposite to a chip to be adsorbed, then an electric control telescopic rod 7 can work firstly, a lifting sliding frame 12 is pushed to move, the adsorption mechanism 3 is further driven to move downwards, an adsorption rubber disc 34 is enabled to be in contact with the upper surface of the chip to be bonded, then a micro telescopic rod 33 can contract, a movable piston 32 is pulled to move upwards, the internal pressure of the adsorption cylinder 31 is reduced due to the fact that the space of gas in the adsorption cylinder 31 is enlarged, negative suction is generated at the adsorption rubber disc 34, adsorption and transfer of the semiconductor chip are achieved, then normal transfer bonding can be carried out, transfer bonding work of the semiconductor is achieved by adopting a suction and squeezing adsorption mode, loosening and sliding are stable and not prone to occur, damage to the semiconductor chip is not caused, the picking and placing speed is high, and placing efficiency is improved, and bonding efficiency of the semiconductor chip is achieved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. The utility model provides a chip bonding device for semiconductor package with adsorption structure, includes bonding frame (1), its characterized in that: the fixed bonding frame (2) that is provided with in the outside of bonding frame (1), the top of bonding frame (2) is rotated and is connected with transmission lead screw (5), the middle part transmission of transmission lead screw (5) is connected with transmission slider (8), the fixed removal bonding frame (6) that is provided with in top of transmission slider (8), lift spout (11) have been seted up in the outside of removal bonding frame (6), the top fixed mounting of lift spout (11) has automatically controlled telescopic link (7), the bottom mounting of automatically controlled telescopic link (7) is provided with lift balladeur train (12), the fixed adsorption equipment (3) that is provided with in the outside of lift balladeur train (12), the inside fixed mounting of bonding frame (1) has controller (13).
2. The die-bonding apparatus for semiconductor packaging having an adsorption structure according to claim 1, wherein: adsorption apparatus constructs (3) including adsorbing drum (31), removal piston (32) and miniature telescopic link (33), the top fixed mounting who adsorbs drum (31) has miniature telescopic link (33), the bottom mounting of miniature telescopic link (33) is provided with and is located the inside removal piston (32) of adsorbing drum (31), the bottom threaded connection who adsorbs drum (31) has adsorption rubber dish (34), miniature telescopic link (33) and controller (13) electric connection.
3. The die-bonding apparatus for semiconductor packaging having an adsorption structure according to claim 1, wherein: one side fixed mounting of bonding frame (2) has servo motor (9), the output of servo motor (9) and the one end fixed connection of transmission lead screw (5), servo motor (9) and automatically controlled telescopic link (7) all with controller (13) electric connection.
4. The die bonding apparatus for semiconductor packaging having an adsorption structure according to claim 1, wherein: and a bonding table (4) is fixedly arranged in the middle of the top end of the bonding machine base (1).
5. The die-bonding apparatus for semiconductor packaging having an adsorption structure according to claim 1, wherein: one side fixed mounting on bonding frame (1) top has controls panel (10), the fixed surface who controls panel (10) installs the on-off switch, controller (13) are through on-off switch and external power supply electric connection.
6. The die-bonding apparatus for semiconductor packaging having an adsorption structure according to claim 1, wherein: four corners of the bottom end of the bonding machine base (1) are fixedly provided with anti-skidding foot pads (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222940559.5U CN218647907U (en) | 2022-11-05 | 2022-11-05 | Chip bonding device with adsorption structure for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222940559.5U CN218647907U (en) | 2022-11-05 | 2022-11-05 | Chip bonding device with adsorption structure for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218647907U true CN218647907U (en) | 2023-03-17 |
Family
ID=85497134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222940559.5U Active CN218647907U (en) | 2022-11-05 | 2022-11-05 | Chip bonding device with adsorption structure for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218647907U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116689908A (en) * | 2023-08-10 | 2023-09-05 | 深圳市明益光电有限公司 | Welding wire device for manufacturing LED lamp |
-
2022
- 2022-11-05 CN CN202222940559.5U patent/CN218647907U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116689908A (en) * | 2023-08-10 | 2023-09-05 | 深圳市明益光电有限公司 | Welding wire device for manufacturing LED lamp |
| CN116689908B (en) * | 2023-08-10 | 2023-10-03 | 深圳市明益光电有限公司 | Welding wire device for manufacturing LED lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN218647907U (en) | Chip bonding device with adsorption structure for semiconductor packaging | |
| US8003495B2 (en) | Manufacturing method for semiconductor integrated device | |
| KR20120112010A (en) | Substrate transfer method and substrate transfer apparatus | |
| CN113856996A (en) | Glue dispensing mechanism of automatic chip mounting device for integrated circuit | |
| CN214848515U (en) | Wafer pad pasting device of compatible multiple size | |
| CN213936158U (en) | Adjustable fixing mechanism for chip packaging | |
| CN107512412A (en) | A kind of equipment for the automatic mounted box of LED | |
| CN216698082U (en) | Automatic gum pasting device for magnetic core | |
| CN215093071U (en) | Positioning jig is used in processing of camera lens subassembly | |
| JP7401904B2 (en) | Apparatus and method for applying adhesive tape to a board | |
| KR100386633B1 (en) | removal device for cover film in adhesive for adhesion of semiconductor chip and removal method for cover film use of it | |
| CN220208907U (en) | Auxiliary adsorption device for chip bonding | |
| CN214956788U (en) | Rectifier bridge belt type welding foot chip facility | |
| CN201645482U (en) | Crystal grain picking device | |
| CN217197496U (en) | Composite board surface printing device | |
| CN219483214U (en) | Adhesive deposite device for semiconductor packaging | |
| CN215011376U (en) | Processing device for integrated circuit paster | |
| CN201466011U (en) | Device for automatically filling a plurality of chips | |
| CN214603654U (en) | Semiconductor chip grinding device | |
| CN216678920U (en) | Glue dispensing plate device for semiconductor soldering lug equipment | |
| CN220596279U (en) | Material receiving and transferring device for stator punching production | |
| CN214588810U (en) | Frequency conversion multifunctional chip packaging structure | |
| CN218194514U (en) | Chip loading device for CMP wafer polishing machine | |
| CN218775947U (en) | Chip spot welding mechanism | |
| CN220331646U (en) | Clamping device for chip cutting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |