CN116995009B - Die assembly for chip packaging processing - Google Patents
Die assembly for chip packaging processing Download PDFInfo
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- CN116995009B CN116995009B CN202311244086.8A CN202311244086A CN116995009B CN 116995009 B CN116995009 B CN 116995009B CN 202311244086 A CN202311244086 A CN 202311244086A CN 116995009 B CN116995009 B CN 116995009B
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- chip packaging
- chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000012545 processing Methods 0.000 title claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 55
- 238000003825 pressing Methods 0.000 claims abstract description 30
- 238000013461 design Methods 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000012858 packaging process Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012549 training Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses a die assembly for chip packaging processing, which relates to the technical field of chip processing and comprises a chip packaging device main body, wherein a workbench is arranged on the chip packaging device main body, the workbench is provided with a die assembly, the end part of the workbench is provided with a die discharge hole of a conveyor belt, the outer wall of the chip packaging device main body above the workbench is provided with a pressing assembly, the pressing assembly presses a chip into a shell part in the die assembly, the workbench is internally provided with a pushing mechanism and an ejection mechanism, the pushing mechanism and the ejection mechanism penetrate through the extending end of the outer wall of the workbench and are connected through a linkage belt, and the pushing mechanism pushes the die assembly to the upper end position of the ejection mechanism; through the cooperation of pushing mechanism and ejection mechanism, the mould subassembly can be fast, high-efficient remove and ejecting the chip shell that encapsulates.
Description
Technical Field
The invention relates to the technical field of chip processing, in particular to a die assembly for chip packaging processing.
Background
Die assemblies for chip packaging are tools used in integrated circuit (chip) manufacturing processes designed to package bare semiconductor chips in a protective enclosure to protect the chips from the environment and to facilitate their connection to external circuitry, packaging is the process of packaging tiny semiconductor devices in a larger, more durable enclosure, typically placing the enclosure of the packaged chips in a die, and packaging the chips in the enclosure using a press down tool in a packaging apparatus.
Although the existing chip packaging technology has a certain degree of maturity, there are certain drawbacks, one of which is that after packaging is completed, the mold needs to be pushed to a manual area and taken out and fastened by a worker, the mold needs to be pushed to the manual area and manually operated, extra time and labor are required, and strict coordination is required to avoid any error or damage. This increases the complexity and time costs of the manufacturing process, which increases labor requirements and associated labor costs due to the need for specialized workers to perform the mold processing. In addition, the difficulty of manual operation also needs to consider the requirements of training and skill maintenance, and therefore, a die assembly for chip packaging processing is provided.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the die assembly for chip packaging processing, and the die assembly can rapidly and efficiently move and eject the packaged chip shell through the cooperation of the pushing mechanism and the ejection mechanism, and the automatic pressing operation can reduce packaging problems and quality deviation caused by manual operation errors.
In order to solve the technical problems, the invention provides the following technical scheme: the die assembly for chip packaging processing comprises a chip packaging device main body, wherein a workbench is arranged on the chip packaging device main body, the die assembly is placed on the workbench, a die discharge hole of a conveyor belt is arranged at the end part of the workbench, a pressing assembly is arranged on the outer wall of the chip packaging device main body above the workbench, the pressing assembly presses down a chip to be installed in a shell piece in the die assembly, a pushing mechanism and an ejection mechanism are further arranged in the workbench, the pushing mechanism and the ejection mechanism penetrate through the extending end of the outer wall of the workbench and are connected through a linkage belt, and the pushing mechanism pushes the die assembly to the upper end position of the ejection mechanism;
the die assembly comprises a die bin for placing the shell piece and a movable block for closing the bottom end inside the die bin and being in sliding connection with the die bin;
the ejection mechanism comprises a fixed rod arranged in the workbench and penetrating through the outer wall of the workbench, a second threaded rod rotationally connected in the fixed rod and rotationally connected with the inner wall of the workbench, an outer sleeve rod connected to the outer end of the second threaded rod and attached to the outer end of the fixed rod, screw blocks in threaded connection with two sides of the second threaded rod, hinging rods movably connected to the screw blocks, and ejector rods movably connected with the two groups of hinging rods;
wherein the top end of the ejector rod penetrates through the outer wall of the top end of the workbench and is contacted with the movable block.
As a preferable technical scheme of the invention, the pressing component comprises a fixed table fixed on the side wall of the main body of the chip packaging device, a telescopic cylinder arranged in the fixed table, a connecting plate fixed with the bottom end of the telescopic cylinder, side plates connected with the two ends of the connecting plate, a first threaded rod connected between the two groups of side plates, a rotating cap fixed on the end part of the first threaded rod, two groups of movable plates movably connected with the first threaded rod, two groups of connecting rods inserted into the two side walls of the movable plates and connected with the side plates, a lower pressing plate arranged between the two groups of movable plates, and a fixing piece for fixing the lower pressing plate between the two groups of movable plates.
As a preferred technical scheme of the invention, the first threaded rod is divided into two parts, the middle is separated by a convex block, and the thread directions of the two parts are opposite.
As a preferable technical scheme of the invention, the pushing mechanism comprises a rotating shaft which is arranged in the workbench and is rotationally connected with the inner wall of the workbench, an extending end driving shaft which penetrates through the outer wall of the workbench, a gear which is connected with the middle outer wall of the rotating shaft, a mounting plate which is connected with the gear, a connecting rod which is connected with the mounting plate, a hinge piece which is connected with the other end of the connecting rod, a push rod which is connected with the hinge piece, and a sliding rail which is connected with the push rod in a sliding way and is arranged on the surface of the workbench;
wherein a mold assembly is placed on the surface of the middle position of the sliding rail.
As a preferable technical scheme of the invention, the driving shaft is connected with the outer sleeve rod through a linkage belt, and the driving shaft rotates to drive the outer sleeve rod to synchronously rotate.
As a preferable technical scheme of the invention, the driving shaft is divided into two parts, the outer end is connected with the outer sleeve rod through the linkage belt, and the inner end is a rotating area.
As a preferable technical scheme of the invention, the threads on the second threaded rod are arranged in a left part and a right part, and the left group of threads and the right group of threads are arranged in opposite directions.
As a preferable technical scheme of the invention, the push rod is in T-shaped design, and the push rod is in linear sliding connection in the sliding rail.
Compared with the prior art, the method has the following beneficial effects:
1. and (3) efficient packaging processing: through the cooperation of pushing mechanism and ejection mechanism, the mould subassembly can be fast, high-efficient remove and ejecting the chip shell that encapsulates.
2. And (3) automation operation: the external control unit can control the actions of the pressing component and the pushing mechanism, so that automatic packaging and material taking operation are realized, and manual intervention is reduced.
3. Consistent package quality: the automatic pressing operation can ensure that the position and the fixation degree of the chip in each packaging process are consistent, and the stability of the packaging quality is improved.
4. Multifunction: the device is suitable for chip packaging of different types and sizes, and has wide adaptability.
5. The operation is convenient: the design of the ejection mechanism makes it very convenient to take out the packaged chip shell.
6. Human resources are saved: automatic pushing and pushing operation reduces manual intervention, and improves production efficiency and utilization of human resources.
7. And (3) accurate control: the size of the lower pressing plate and the moving position of the die assembly can be accurately controlled through the external control unit, and the packaging accuracy is ensured.
8. The human error is reduced: automatic pressing operations may reduce packaging problems and quality variances due to human operation errors.
In summary, the die assembly and the device for chip packaging processing have the advantages of high efficiency, automation, consistency, multifunction, convenience in operation and the like, and can effectively improve the packaging processing efficiency and quality.
Drawings
FIG. 1 is a schematic view of the structure of the present invention in a three-dimensional state;
FIG. 2 is a schematic view showing a partial structure of a pressing assembly according to the present invention;
FIG. 3 is a schematic view of the structure of FIG. 2 in a three-dimensional exploded condition according to the present invention;
FIG. 4 is a schematic view showing a structure of the pushing mechanism of the present invention in a three-dimensional state;
FIG. 5 is a schematic view showing a partial structure of a pushing mechanism according to the present invention;
FIG. 6 is a schematic view showing a structural perspective state of an ejection mechanism according to the present invention;
fig. 7 is an enlarged view of the structure of fig. 1 a according to the present invention.
Wherein: 1. a chip packaging device body; 2. a work table; 3. a die discharge port; 4. a mold assembly; 41. a mold bin; 42. a movable block; 5. pressing down the assembly; 51. a fixed table; 52. a telescopic cylinder; 53. a connecting plate; 54. a side plate; 55. a first threaded rod; 56. a rotating cap; 57. a movable plate; 58. a connecting rod; 59. a lower pressing plate; 510. a fixing member; 6. a pushing mechanism; 61. a rotating shaft; 62. a drive shaft; 63. a gear; 64. a mounting plate; 65. a connecting rod; 66. a hinge; 67. a push rod; 68. a slide rail; 7. an ejection mechanism; 71. a fixed rod; 72. a second threaded rod; 73. an outer sleeve rod; 74. a nut block; 75. a hinge rod; 76. a push rod; 8. and (5) linking the belt.
Detailed Description
In order that the manner in which the above recited features, objects and advantages of the present invention are obtained will become readily apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. Based on the examples in the implementation manner, other examples obtained by a person skilled in the art without making creative efforts fall within the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents, etc. used in the following examples are commercially available unless otherwise specified.
Examples
Referring to fig. 1-7, in an embodiment of the present invention, a die assembly for chip packaging processing includes a chip packaging device main body 1, a workbench 2 located on the chip packaging device main body 1, a die assembly 4 is placed on the workbench 2, a conveyor die discharge port 3 located at an end of the workbench 2, where the die discharge port 3 is configured to convey the used die assembly 4 away for subsequent use, a pressing component 5 is disposed on an outer wall of the chip packaging device main body 1 above the workbench 2, the pressing component 5 is configured to press down a chip into a shell member in the die assembly 4, a pushing mechanism 6 and an ejection mechanism 7 are further disposed inside the workbench 2, the pushing mechanism 6 and an ejection mechanism 7 penetrate through an extending end of an outer wall of the workbench 2 and are connected through a linkage belt 8, the pushing mechanism 6 pushes the die assembly 4 to a position of an upper end of the ejection mechanism 7, and drives the ejection mechanism 7 to eject a packaged chip shell in the die assembly 4 through the linkage belt 8 when the pushing mechanism 6 is restored for subsequent use, and the die assembly 4 includes a die bin 41 for placing the shell member and a material taking block 41 which is slidably connected with the inner bottom end of the die bin 41;
as shown in fig. 2 to 3, the pressing assembly 5 includes a fixing table 51 fixed on a side wall of the chip package device body 1, a telescopic cylinder 52 disposed in the fixing table 51, a connection plate 53 fixed to a bottom end of the telescopic cylinder 52, side plates 54 connected to both ends of the connection plate 53, a first threaded rod 55 connected between the two sets of side plates 54, a turning cap 56 fixed to an end of the first threaded rod 55, two sets of movable plates 57 movably connected to the first threaded rod 55, two sets of connection rods 58 penetrating through both side walls of the movable plates 57 and connected to the side plates 54, a pressing plate 59 disposed between the two sets of movable plates 57, and a fixing member 510 fixing the pressing plate 59 between the two sets of movable plates 57;
the chip packaging device main body 1 is provided with an external control unit which can control the starting and closing of the telescopic air cylinder 52, after the size of the lower pressure plate 59 to be used for pressing down is selected according to the requirement, a worker rotates the rotary cap 56, so that the rotary cap 56 drives the first threaded rod 55 to rotate, the first threaded rod 55 is divided into two parts, the middle is separated by a convex block, the thread directions of the two parts are opposite, when the first threaded rod 55 rotates, the movable plates 57 on the two parts are driven to move in opposite directions, the distance between the two groups of movable plates 57 is adjusted, the lower pressure plate 59 is fixed on the two groups of movable plates 57 through the fixing piece 510 after the size of the lower pressure plate 59 is matched with the size of the lower pressure plate 59, and then the telescopic air cylinder 52 is started, the lower pressure plate 59 is driven to press down to install the chip in the shell in the die assembly 4.
As shown in fig. 4 to 5, wherein the pushing mechanism 6 comprises a rotating shaft 61 placed inside the table 2 and rotatably connected to the inner wall of the table 2, an extended end driving shaft 62 penetrating the outer wall of the table 2, a gear 63 connected to the middle outer wall of the rotating shaft 61, a mounting plate 64 connected to the gear 63, a link 65 connected to the mounting plate 64, a hinge 66 connected to the other end of the link 65, a push rod 67 connected to the hinge 66, a slide rail 68 slidably connected to the push rod 67 and placed on the surface of the table 2, wherein the mold assembly 4 is placed on the surface at the middle position of the slide rail 68;
as shown in fig. 6, the ejector mechanism 7 includes a fixed rod 71 disposed in the working table 2 and penetrating through the outer wall of the working table 2, a second threaded rod 72 rotatably connected in the fixed rod 71 and rotatably connected with the inner wall of the working table 2, an outer sleeve rod 73 connected to the outer end of the second threaded rod 72 and attached to the outer end of the fixed rod 71, screw blocks 74 screwed on two sides of the second threaded rod 72, hinge rods 75 movably connected to the screw blocks 74, and ejector rods 76 movably connected with two groups of hinge rods 75, wherein the top ends of the ejector rods 76 penetrate through the outer wall of the top end of the working table 2 and contact with the movable blocks 42.
As shown in fig. 7, it is noted that the driving shaft 62 is connected with the outer sleeve 73 through the linkage belt 8, and the driving shaft 62 rotates to drive the outer sleeve 73 to rotate synchronously;
after the chip is packaged in the shell part in the die assembly 4 through the pressing assembly 5, the driving shaft 62 can be rotated, the driving shaft 62 is divided into two parts, the outer end is connected with the outer sleeve rod 73 through the linkage belt 8, the inner end is a rotating area, the driving shaft 62 is rotated to drive the gear 63 to rotate, the gear 63 is rotated to drive the mounting plate 64 to rotate, the mounting plate 64 drives the connecting rod 65 to rotate, the push rod 67 is in a T-shaped design, the push rod 67 is in linear sliding connection in the sliding rail 68, the connecting rod 65 drives the push rod 67 to move along the sliding rail 68, the end part of the push rod 67 pushes the die assembly 4 to move to the position above the ejection mechanism 7, the surface of the workbench 2 above the ejection mechanism 7 is provided with a limiting part to clamp two side walls of the die bin 41, at the moment, the driving shaft 62 can synchronously drive the outer sleeve rod 73 to rotate through the linkage belt 8 in the rotating process, the outer sleeve rod 73 drives the second threaded rod 72 to rotate, the threads on the second threaded rod 72 are also arranged in left and right parts, the left and right sets of threads are arranged in opposite directions, the second threaded rod 72 rotates to drive the two sets of screw blocks 74 to move outwards, the screw blocks 74 pull the two sets of hinge rods 75 to expand and move downwards, the hinge rods 75 pull the ejector rods 76 to move downwards and move into the workbench 2, when the end part of the push rod 67 pushes the die assembly 4 to a position above the ejection mechanism 7, the drive shaft 62 reversely rotates to drive the push rod 67 to restore and move, at the moment, the drive shaft 62 drives the outer sleeve rod 73 to reversely rotate through the linkage belt 8, the outer sleeve rod 73 drives the second threaded rod 72 to reversely rotate, so that the two sets of screw blocks 74 are driven to move on the second threaded rod 72 oppositely, the two sets of hinge rods 75 are extruded upwards, finally the ejector rods 76 are driven to upwards move to eject the movable block 42 upwards, the movable block 42 moves upwards in the die bin 41 to eject the shell piece packaged with the chip, and a worker can take off the shell piece, and the die assembly can quickly and efficiently move and eject the packaged chip shell through the cooperation of the pushing mechanism 6 and the ejection mechanism 7;
in view of the foregoing, the most important cores are the die assembly 4, the hold-down assembly 5, the pushing mechanism 6 and the ejector mechanism 7,
the die assembly 4 includes:
the mold bin 41 is used for placing the shell member;
and a movable block 42 which is slidably connected with the bottom of the mold bin and is used for keeping close contact.
The pressing down assembly 5 includes:
a fixing table 51 fixed on a side wall of the chip packaging apparatus main body;
a telescopic cylinder 52 installed inside the fixed table;
the connecting plate 53 is fixedly connected with the bottom of the telescopic cylinder;
side plates 54 connected to both ends of the connection plate;
the first threaded rod 55 is positioned between the side plates and is fixed at one end through a rotating cap;
a turning cap 56 fixed to an end of the first threaded rod;
two movable plates 57 connected to the first threaded rod and movably connected thereto;
two groups of connecting rods 58 are inserted into the two side walls of the movable plate and connected with the side plates;
a lower pressure plate 59, a fixing member fixed between the two sets of movable plates.
The pushing mechanism 6 includes:
a rotating shaft 61 installed inside the workbench and rotatably connected to the inner wall of the workbench;
the driving shaft 62 penetrates through the extending end of the outer wall of the workbench and is connected with the outer sleeve rod through a linkage belt;
a gear 63 connected to the outer wall of the middle of the rotating shaft;
a mounting plate 64 attached to the gear;
a connecting rod 65 connected to the mounting plate;
a hinge 66 connected to the other end of the link;
the push rod 67 is connected to the hinge piece and is connected to the sliding rail on the surface of the workbench in a sliding manner;
slide rails 68 are located on the table surface for supporting the mold assembly.
The ejector mechanism 7 includes:
a fixing rod 71 disposed in the table and penetrating through the outer wall of the table;
the second threaded rod 72 is connected with the inner wall of the fixed rod and is rotationally connected with the inner wall of the workbench;
the outer sleeve rod 73 is connected to the outer end of the second threaded rod and is attached to the outer end of the fixed rod;
the nut blocks 74 are connected to the threads on both sides of the second threaded rod;
a hinge lever 75 movably connected to the nut block;
the ejector rod 76 is movably connected with the two groups of hinging rods, and the top end of the ejector rod penetrates through the outer wall of the top end of the workbench and is contacted with the movable block.
Through the cooperation of these parts, this mould subassembly can realize fast, high-efficient encapsulation chip to the size of clamp down and the position of mould can be adjusted in a flexible way, with the chip packaging demand of adaptation different specifications and sizes, such design can improve production efficiency and ensure encapsulation quality.
The die assembly for chip packaging processing comprises the following steps:
1. placing a die assembly and a chip package: the die assembly 4 is placed on the table 2 and the chip to be packaged is placed in the die magazine 41.
2. Pressing down the chip: the telescopic cylinder 52 is controlled by an external control unit, so that the lower pressure plate 59 is pressed down to fix the chip in the shell in the die assembly 4.
3. Pushing the die assembly: the drive shaft 62 is rotated to cause the gear 63 and the link 65 to slide the ram 67 to push the mold assembly 4 over the ejector mechanism 7.
4. Ejecting the packaged chips: the drive shaft 62 is rotated in the opposite direction to drive the ejector pins 76 upward to eject the movable block 42 and eject the chip-packaged housing member out of the mold bin.
5. Taking out the packaged chip: and taking off the ejected packaged chip shell.
In summary, the die assembly can realize fast and efficient chip packaging, and can flexibly adjust the size of the lower pressing plate and the position of the die so as to adapt to the chip packaging requirements of different specifications and sizes, and the design scheme can improve the production efficiency and ensure the packaging quality.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above" and "over" a second feature includes both the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "under," "under" and "beneath" the second feature includes the first feature being directly under and obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be appreciated by persons skilled in the art that the present invention is not limited by the foregoing description of embodiments, which are given by way of example only, and not as a limitation, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. The utility model provides a die assembly is used in chip packaging processing, includes chip packaging device main part (1), be provided with workstation (2) on chip packaging device main part (1), die assembly (4) have been placed on workstation (2), workstation (2) tip is equipped with mould discharge gate (3) of conveyer belt, its characterized in that: the chip packaging device comprises a chip packaging device body (1) and is characterized in that a pressing component (5) is arranged on the outer wall of the chip packaging device body (1) above a workbench (2), a chip is pressed and installed in a shell piece in a die component (4) by the pressing component (5), a pushing mechanism (6) and an ejection mechanism (7) are further arranged in the workbench (2), the pushing mechanism (6) and the ejection mechanism (7) penetrate through the extending end of the outer wall of the workbench (2) and are connected through a linkage belt (8), and the pushing mechanism (6) pushes the die component (4) to the upper end position of the ejection mechanism (7);
wherein the die assembly (4) comprises a die bin (41) for placing the shell part and a movable block (42) for closing the bottom end inside the die bin (41) and being in sliding connection with the die bin (41);
the ejection mechanism (7) comprises a fixed rod (71) which is arranged in the workbench (2) and penetrates through the outer wall of the workbench (2), a second threaded rod (72) which is rotatably connected in the fixed rod (71) and is rotatably connected with the inner wall of the workbench (2), an outer sleeve rod (73) which is connected to the outer end of the second threaded rod (72) and is attached to the outer end of the fixed rod (71), nut blocks (74) which are in threaded connection with the two sides of the second threaded rod (72), hinging rods (75) which are movably connected to the nut blocks (74) and ejector rods (76) which are movably connected with the two groups of hinging rods (75);
wherein the top end of the ejector rod (76) penetrates through the outer wall of the top end of the workbench (2) and is contacted with the movable block (42).
2. The die assembly for chip package processing according to claim 1, wherein: the pressing component (5) comprises a fixed table (51) fixed on the side wall of the chip packaging device main body (1), a telescopic cylinder (52) arranged in the fixed table (51), a connecting plate (53) fixed with the bottom end of the telescopic cylinder (52), side plates (54) connected to two ends of the connecting plate (53), a first threaded rod (55) connected between the two groups of side plates (54), a rotating cap (56) fixed on the end part of the first threaded rod (55), two groups of movable plates (57) movably connected to the first threaded rod (55), two groups of connecting rods (58) inserted into the two side walls of the movable plates (57) and connected with the side plates (54), a pressing plate (59) arranged between the two groups of movable plates (57), and a fixing piece (510) for fixing the pressing plate (59) between the two groups of movable plates (57).
3. The die assembly for chip package processing according to claim 2, wherein: an external control unit is arranged on the chip packaging device main body (1), and the output end of the control unit is electrically connected with the input end of the telescopic cylinder (52).
4. A die assembly for chip packaging process according to claim 3, wherein: the first threaded rod (55) is divided into two parts, the middle of the first threaded rod is separated by a lug, and the thread directions of the two parts are opposite.
5. The die assembly for chip package processing according to claim 1, wherein: the pushing mechanism (6) comprises a rotating shaft (61) arranged inside the workbench (2) and rotationally connected with the inner wall of the workbench (2), an extending end driving shaft (62) penetrating through the outer wall of the workbench (2), a gear (63) connected with the middle outer wall of the rotating shaft (61), a mounting plate (64) connected with the gear (63), a connecting rod (65) connected with the mounting plate (64), a hinge (66) connected with the other end of the connecting rod (65), a push rod (67) connected with the hinge (66), and a sliding rail (68) connected with the push rod (67) in a sliding manner and arranged on the surface of the workbench (2);
wherein the die assembly (4) is placed on the surface at the middle position of the sliding rail (68).
6. The die assembly for chip packaging process according to claim 5, wherein: the driving shaft (62) is connected with the outer sleeve rod (73) through a linkage belt (8), and the driving shaft (62) rotates to drive the outer sleeve rod (73) to synchronously rotate.
7. The die assembly for chip packaging process according to claim 6, wherein: the driving shaft (62) is divided into two parts, the outer end is connected with the outer sleeve rod (73) through the linkage belt (8), and the inner end is a rotating area.
8. The die assembly for chip package processing according to claim 1, wherein: the upper threads of the second threaded rod (72) are arranged in a left part and a right part, and the left threads and the right threads are oppositely arranged.
9. The die assembly for chip packaging process according to claim 5, wherein: the push rod (67) is in T-shaped design, and the push rod (67) is in linear sliding connection in the sliding rail (68).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311244086.8A CN116995009B (en) | 2023-09-26 | 2023-09-26 | Die assembly for chip packaging processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311244086.8A CN116995009B (en) | 2023-09-26 | 2023-09-26 | Die assembly for chip packaging processing |
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| CN116995009A CN116995009A (en) | 2023-11-03 |
| CN116995009B true CN116995009B (en) | 2023-11-28 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112103210A (en) * | 2020-08-13 | 2020-12-18 | 张国华 | Chip bonding process equipment for semiconductor chip packaging |
| CN213936158U (en) * | 2021-01-19 | 2021-08-10 | 江西玖芯半导体有限公司 | Adjustable fixing mechanism for chip packaging |
| CN113295988A (en) * | 2021-07-28 | 2021-08-24 | 江苏澳芯微电子有限公司 | Computer chip packaging test equipment |
| CN216288316U (en) * | 2022-01-12 | 2022-04-12 | 广州派我信息科技有限公司 | Packaging hardware is used in integrated circuit chip design |
| CN219457576U (en) * | 2023-04-10 | 2023-08-01 | 青岛朗势电子科技有限公司 | Bluetooth chip encapsulation fixing device |
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2023
- 2023-09-26 CN CN202311244086.8A patent/CN116995009B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112103210A (en) * | 2020-08-13 | 2020-12-18 | 张国华 | Chip bonding process equipment for semiconductor chip packaging |
| CN213936158U (en) * | 2021-01-19 | 2021-08-10 | 江西玖芯半导体有限公司 | Adjustable fixing mechanism for chip packaging |
| CN113295988A (en) * | 2021-07-28 | 2021-08-24 | 江苏澳芯微电子有限公司 | Computer chip packaging test equipment |
| CN216288316U (en) * | 2022-01-12 | 2022-04-12 | 广州派我信息科技有限公司 | Packaging hardware is used in integrated circuit chip design |
| CN219457576U (en) * | 2023-04-10 | 2023-08-01 | 青岛朗势电子科技有限公司 | Bluetooth chip encapsulation fixing device |
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| Publication number | Publication date |
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| CN116995009A (en) | 2023-11-03 |
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