CN213905396U - Particle reinforced thermoelectric refrigerating sheet - Google Patents
Particle reinforced thermoelectric refrigerating sheet Download PDFInfo
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- CN213905396U CN213905396U CN202022746663.1U CN202022746663U CN213905396U CN 213905396 U CN213905396 U CN 213905396U CN 202022746663 U CN202022746663 U CN 202022746663U CN 213905396 U CN213905396 U CN 213905396U
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Abstract
The utility model discloses a particle reinforced thermoelectric cooling sheet. The thermoelectric refrigerating sheet aims to solve the problems that the thermoelectric refrigerating sheet in the prior art cannot meet the special requirements of customers on the shapes and the installation strength requirements of special positions; the utility model comprises a heat absorbing surface substrate, a heat releasing surface substrate and semiconductor particles, wherein the semiconductor particles are welded between the heat absorbing surface substrate and the heat releasing surface substrate; a plurality of screw fixing grooves are cut on the corresponding side surfaces of the heat absorption surface substrate and the heat release surface substrate; imitation particles are welded between two sides of the heat absorption surface substrate and the heat release surface substrate, which are provided with screw fixing grooves. In the manufacturing of the two substrates, the semicircular screw fixing grooves for installation are directly produced by adopting a laser cutting or cutting technology, so that the positioning and installation of screws for the installation of subsequent products are ensured, and the installation strength requirement of a special position is met; the artificial particle material is adopted for reinforcement, so that the strength of the material is improved.
Description
Technical Field
The utility model relates to a thermoelectric refrigeration piece field especially relates to a particle reinforcement type thermoelectric refrigeration piece.
Background
The shape of the thermoelectric cooling piece commonly used at present is generally square or rectangular, which is mainly convenient for production and processing, and thus the special shape requirement of customers on the thermoelectric cooling piece cannot be met. Meanwhile, when the refrigerator is installed by a customer, screw holes are required to be arranged on the periphery of the refrigerator for fixing to ensure that the cold surface of the refrigerating sheet is tightly attached to a target object, and the hot surface of the refrigerator is in good contact with the heat dissipation part, so that the thermal contact resistance is reduced, and the efficiency of a product is improved. However, some structures are very compact, and the positions of the mounting grooves or mounting holes need to be considered in the structure of the refrigerating sheet, so that the structural strength of the product at the mounting position is insufficient, and the performance is reduced.
For example, a chinese patent document discloses "a thermoelectric cooling plate based on 3D printing and a method for manufacturing the same", wherein the publication No. CN110556471A includes at least one pair of thermocouple pairs and a substrate connected by a conductive material, the thermocouple pairs are distributed on the substrate, the formed thermocouple pair includes two thermoelectric arms, a first conductive thin film is connected between the two thermoelectric arms in the same thermocouple pair, the first conductive thin film is attached to the cold ends of the thermoelectric arms, and the hot ends of the thermoelectric arms are connected to the substrate; one thermoelectric arm in the same thermocouple pair is an N-type thermoelectric arm, and the other thermoelectric arm is a P-type thermoelectric arm; the area of the cold end of the thermoelectric arm is smaller than that of the hot end of the thermoelectric arm. The thermoelectric refrigerating sheet of the scheme can not meet the special requirements of customers on the shapes and the installation strength requirements of special positions.
SUMMERY OF THE UTILITY MODEL
The utility model mainly solves the problem that the thermoelectric refrigeration piece in the prior art can not meet the special requirements of the shape and the installation strength requirements of the special position of the client; the particle reinforced thermoelectric cooling sheet is provided, screw fixing grooves are formed in two sides of a substrate, and the requirement of mounting strength of a special position is met; the side surfaces are welded by imitated particles to reinforce and improve the strength of the side surfaces.
The above technical problem of the present invention can be solved by the following technical solutions:
a particle-reinforced thermoelectric cooling sheet comprises a heat-absorbing surface substrate, a heat-releasing surface substrate and semiconductor particles, wherein the semiconductor particles are welded between the heat-absorbing surface substrate and the heat-releasing surface substrate; a plurality of screw fixing grooves are cut on the corresponding side surfaces of the heat absorption surface substrate and the heat release surface substrate; imitation particles are welded between two sides of the heat absorption surface substrate and the heat release surface substrate, which are provided with screw fixing grooves.
The special requirements of customers on the shape of the thermoelectric cooling sheet are met by cutting the side surfaces of the two substrates, and the semicircular screw fixing grooves for installation are directly produced by adopting a laser cutting or cutting technology in the manufacturing of the two substrates, so that the positioning and installation of screws for subsequent product installation are ensured, and the installation strength requirements of special positions are met; the two substrates are adopted to be grooved at all corresponding positions, and the cold end and the hot end are fixed into a whole, so that the possibility of product failure caused by overlarge shearing force of cold end load is avoided. The region between the screw fixation grooves cannot be soldered using the existing thermoelectric semiconductor particles due to stress, and is therefore reinforced using a dummy particle material. Improving the self-strength.
Preferably, the thermal conductivity of the dummy particles is less than 1W/(m.k). The material of the imitation particles adopts a material with thermal insulation or low thermal conductivity, thereby reducing useless heat transfer and ensuring the working efficiency of the heat transfer of the thermoelectric cooling sheet.
Preferably, the dummy particles are independently arranged. The arrangement of the imitation particle materials is not limited by the series connection of the whole circuit, and the imitation particle materials are independently arranged in various and simple modes; and is applicable to all types and materials of substrates.
Preferably, the distance between the adjacent dummy particles is 0 to 3 times the distance between the semiconductor particles.
The spacing between the imitation particle materials is 0-3 times of the semiconductor spacing, is not limited by the semiconductor arrangement structure, and is freely arranged.
Preferably, the cross-sectional shape of the dummy particles includes a rectangle and a square; copper layers and anti-oxidation layers are covered on two side faces of the imitation particles, which are in contact with the heat absorption surface substrate and the heat release surface substrate. The shapes of the dummy particles are various.
Preferably, the dummy particles are cubic particles. The granular imitation particles have various combination forms and are suitable for the shape which is not cut through.
Preferably, the dummy particles are elongated. The imitation particles are in strip shapes, and the connection strength is enhanced.
Preferably, the dummy particles have a plate shape that fits the shapes of the heat absorbing surface substrate and the heat radiating surface substrate. Further enhancing the strength of the connection between the two substrates.
The utility model has the advantages that:
1. the special requirements of customers on the shape of the thermoelectric cooling sheet are met by cutting the side surfaces of the two substrates.
2. The semicircular screw fixing grooves for installation are directly produced by adopting a laser cutting or cutting technology in the manufacturing of the two substrates, so that the screw positioning and installation of subsequent product installation are ensured, and the installation strength requirement of a special position is met.
3. The two substrates are adopted to be grooved at all corresponding positions, and the cold end and the hot end are fixed into a whole, so that the possibility of product failure caused by overlarge shearing force of cold end load is avoided.
4. The artificial particle material is adopted for reinforcement, so that the strength of the material is improved.
Drawings
Fig. 1 is an exploded view of a thermoelectric cooling chip according to the present invention.
In the figure, 1 is a heat absorption surface substrate, 2 is a heat release surface substrate, 3 is a semiconductor particle, 4 is a dummy particle, and 5 is a screw fixing groove.
Detailed Description
The technical solution of the present invention is further specifically described below by way of examples and with reference to the accompanying drawings.
The first embodiment is as follows:
a particle-reinforced thermoelectric cooling sheet of the present embodiment, as shown in fig. 1, includes a heat-absorbing surface substrate 1, a heat-radiating surface substrate 2, semiconductor particles 3, and dummy particles 4.
The semiconductor particles 3 are bonded between the heat absorbing surface substrate 1 and the heat releasing surface substrate 2.
A plurality of screw fixing grooves 5 are cut on the corresponding side surfaces of the heat absorption surface substrate 1 and the heat release surface substrate 2. The semicircular screw fixing grooves 5 for installation are directly produced by adopting a laser cutting or cutting technology in the manufacturing of the two substrates, so that the screw positioning and installation of subsequent product installation are ensured, and the installation strength requirement of a special position is met.
The special requirements of customers on the shape of the thermoelectric cooling sheet are met by cutting the side surfaces of the two substrates. In this embodiment, three semicircular screw fixing grooves 5 are cut in the left and right sides of the heat absorbing surface substrate 1 and the heat radiating surface substrate 2, respectively. The two substrates are adopted to be grooved at all corresponding positions, and the cold end and the hot end are fixed into a whole, so that the possibility of product failure caused by overlarge shearing force of cold end load is avoided.
Since the region between the screw fixing grooves cannot be welded by the conventional thermoelectric semiconductor particles 3 due to stress, the region is reinforced by the dummy particles 4 to improve the strength of the region. The dummy particles 4 are welded between the heat absorbing surface substrate 1 and the heat releasing surface substrate 2 on both sides where the screw fixing grooves 5 are formed. In the present embodiment, dummy particles 4 are welded on both sides of the thermoelectric cooling sheet.
The cross-sectional shape of the dummy particles 4 includes a rectangle and a square; the two side surfaces of the imitation particles 4, which are in contact with the heat absorption surface substrate 1 and the heat release surface substrate 2, are covered with copper layers and oxidation-resistant layers, and the imitation particles 4 have various shapes.
The material of the imitation particles 4 adopts a material with thermal insulation or low thermal conductivity, so that useless heat transfer is reduced, and the working efficiency of heat transfer of the thermoelectric cooling sheet is ensured. In the present embodiment, the thermal conductivity of the dummy particles 4 is less than 1W/(m · k).
The dummy particles 4 are in the form of cubic granules. The granular dummy particles 4 are various in combination and adapted to a shape that does not pass through shear.
The dummy particles 4 are arranged independently of each other. The arrangement of the imitation particle 4 materials is not limited by the series connection of the whole circuit, and the imitation particle 4 materials are independently arranged in various and simple modes; and is applicable to all types and materials of substrates.
The distance between adjacent dummy particles 4 is 0 to 3 times the semiconductor particle distance. The arrangement is free without being restricted by the arrangement structure of the semiconductor particles 3.
Example two:
in the particle-reinforced thermoelectric cooling sheet of the present embodiment, the shape of the dummy particles 4 is optimized, and the dummy particles 4 of the present embodiment are elongated. The connection strength between the heat absorbing surface substrate 1 and the heat releasing surface substrate 2 is strengthened.
The present embodiment optimizes only the shape of the dummy particles 4, and the other settings are the same as those of the first embodiment.
Example three:
the particle-reinforced thermoelectric cooling sheet of the present example is optimized in the shape of the dummy particles 4, and the dummy particles 4 of the present example are plate-shaped so as to fit the side surface shapes of the heat-absorbing surface substrate 1 and the heat-radiating surface substrate 2. The strength of connection between the heat absorbing surface substrate 1 and the heat releasing surface substrate 2 is further increased.
The present embodiment optimizes only the shape of the dummy particles 4, and the other settings are the same as those of the first embodiment.
The utility model discloses a to the cutting of two base plate sides, satisfy the customer to the special requirement of thermoelectric cooling piece's shape. The semicircular screw fixing grooves for installation are directly produced by adopting a laser cutting or cutting technology in the manufacturing of the two substrates, so that the screw positioning and installation of subsequent product installation are ensured, and the installation strength requirement of a special position is met. The two substrates are adopted to be grooved at all corresponding positions, and the cold end and the hot end are fixed into a whole, so that the possibility of product failure caused by overlarge shearing force of cold end load is avoided. The artificial particle material is adopted for reinforcement, so that the strength of the material is improved.
It should be understood that the examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes and modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope of the appended claims.
Claims (8)
1. A particle-reinforced thermoelectric cooling sheet comprises a heat-absorbing surface substrate (1), a heat-emitting surface substrate (2) and semiconductor particles (3), wherein the semiconductor particles (3) are welded between the heat-absorbing surface substrate (1) and the heat-emitting surface substrate (2); the heat-absorbing surface heat-radiating device is characterized in that a plurality of screw fixing grooves (5) are cut on the corresponding side surfaces of the heat-absorbing surface substrate (1) and the heat-radiating surface substrate (2); imitation particles (4) are welded between two sides of the heat absorption surface substrate (1) and the heat release surface substrate (2) which are provided with screw fixing grooves (5).
2. A particle-reinforced thermoelectric cooling chip as claimed in claim 1, wherein the dummy particles (4) have a thermal conductivity of less than 1W/(m-k).
3. A particle-reinforced thermoelectric cooling chip as claimed in claim 1 or 2, wherein said dummy particles (4) are independently disposed.
4. A particle-reinforced thermoelectric cooling sheet as claimed in claim 3, wherein the spacing between adjacent dummy particles (4) is 0 to 3 times the spacing between semiconductor particles (3).
5. A particle-reinforced thermoelectric cooling chip as claimed in claim 1, 2 or 4, wherein the cross-sectional shape of said dummy particles (4) comprises rectangular and square; copper layers and anti-oxidation layers are covered on two side surfaces of the imitation particles (4) which are in contact with the heat absorption surface substrate (1) and the heat release surface substrate (2).
6. A particle-reinforced thermoelectric cooling chip as claimed in claim 5, wherein said dummy particles (4) are in the form of cubic particles.
7. A particle-reinforced thermoelectric cooling sheet as claimed in claim 5, wherein the dummy particles (4) have a long shape.
8. The particle-reinforced thermoelectric cooling sheet as claimed in claim 5, wherein the dummy particles (4) have a plate shape adapted to the side shapes of the heat-absorbing surface substrate (1) and the heat-radiating surface substrate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022746663.1U CN213905396U (en) | 2020-11-24 | 2020-11-24 | Particle reinforced thermoelectric refrigerating sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022746663.1U CN213905396U (en) | 2020-11-24 | 2020-11-24 | Particle reinforced thermoelectric refrigerating sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213905396U true CN213905396U (en) | 2021-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022746663.1U Active CN213905396U (en) | 2020-11-24 | 2020-11-24 | Particle reinforced thermoelectric refrigerating sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213905396U (en) |
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2020
- 2020-11-24 CN CN202022746663.1U patent/CN213905396U/en active Active
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