CN213904332U - Mainboard temperature detecting system - Google Patents
Mainboard temperature detecting system Download PDFInfo
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- CN213904332U CN213904332U CN202023283757.6U CN202023283757U CN213904332U CN 213904332 U CN213904332 U CN 213904332U CN 202023283757 U CN202023283757 U CN 202023283757U CN 213904332 U CN213904332 U CN 213904332U
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- temperature sensor
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- mainboard
- temperature
- temperature detection
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- 238000001514 detection method Methods 0.000 claims abstract description 13
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- 238000004891 communication Methods 0.000 claims abstract description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
The utility model discloses a mainboard temperature detecting system, include: the temperature sensor is in communication connection with the controller through a single bus transmission protocol; the temperature sensor is arranged on a Bottom layer of the chip to be detected on the mainboard; and the master equipment reads the temperature detection data through the controller. The utility model provides a current mainboard temperature listen the low this problem of precision, newly-built size and 0603 imitative temperature sensor, can conveniently place on BGA Bottom layer, be close to the heat source more to improve temperature sensor's the precision of listening. And IIC protocol transmission is not adopted between the temperature sensor of the mainboard temperature detection system and the controller, so that the system cost is effectively reduced.
Description
Technical Field
The utility model relates to a mainboard design field, concretely relates to system is listened to mainboard temperature.
Background
As the integrated level of the chip is higher and higher, the heat dissipation power consumption is higher and higher, and most of the high integrated level chips adopt Ball Grid Array (BGA) packaging, BGA technology is a surface mount technology applied to integrated circuits, and is often used to permanently fix devices such as microprocessors. BGA packages can provide more pins than other packages such as Dual in-line packages or Quad Flat packages (Quad Flat packages), the bottom surface of the entire device can be fully used as pins rather than only the periphery, and the device can have a shorter average wire length than the type of Package defined by the periphery for better high speed performance.
The temperature sensors widely used at present are 4Pin and above sensors with IIC interfaces, the size of the temperature sensors is large, and the BGA temperature sensors cannot be placed between the BGA temperature sensors due to the fact that the Pin intervals of the BGA are small, so that the temperature sensors widely used at present can only be placed around the BGA chip, the accuracy of the temperature detected by the temperature sensors is seriously reduced, and the error is large.
Disclosure of Invention
In order to solve the technical problem, the utility model provides a mainboard temperature detecting system has improved the temperature detecting precision of high integration mainboard, the cost is reduced.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a mainboard temperature detection system comprises: the temperature sensor is in communication connection with the controller through a single bus transmission protocol;
the temperature sensor is arranged on a Bottom layer of the chip to be detected on the mainboard;
and the master equipment reads the temperature detection data through the controller.
Further, the package specification of the temperature sensor is 0603.
Further, the controller is a complex programmable logic device.
Further, the controller is a micro control unit.
Further, the temperature sensor is driven by GPIO.
Further, the controller comprises an IIC interface, and the IIC interface is in communication connection with the main device.
Further, the chip to be tested is a BGA chip.
The utility model has the advantages that:
the utility model discloses a mainboard temperature detecting system has solved current mainboard temperature and has listened low this problem of precision, has newly-built the temperature sensor that size and 0603 are similar, can conveniently place at BGA Bottom layer, is close to the heat source more to improve temperature sensor's the precision of listening.
The utility model provides an among the mainboard temperature detecting system, not adopt IIC agreement transmission between temperature sensor and the controller, effectively reduced system cost.
Drawings
Fig. 1 is a schematic structural diagram of a motherboard temperature detection system according to an embodiment of the present invention.
Fig. 2 is a second schematic structural diagram of a motherboard temperature detection system according to an embodiment of the present invention.
Detailed Description
In order to clearly illustrate the technical features of the present invention, the present invention is explained in detail by the following embodiments in combination with the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted so as to not unnecessarily limit the invention.
As shown in fig. 1, the embodiment of the utility model discloses mainboard temperature detecting system includes: the temperature sensor is in communication connection with the controller through a single bus transmission protocol;
the temperature sensor is arranged on a Bottom layer of the chip to be detected on the mainboard;
and the master equipment reads the temperature detection data through the controller.
The chip that awaits measuring can select to be the BGA chip, because the Pin interval of BGA chip is less, can conveniently set up on the Bottom layer of the chip that awaits measuring in order to make temperature sensor, needs to adopt the temperature sensor of little encapsulation, this embodiment temperature sensor's encapsulation specification is preferred to be 0603, can be close to the heat source more, improves and listens the precision. Each temperature sensor is not transmitted by the IIC protocol, but is in communication connection with the controller by the single-bus transmission protocol, so that the cost of the detection system is lower.
Fig. 2 shows another embodiment of the motherboard temperature detecting system of the present invention, wherein the Controller can be selected as a Complex Programmable Logic Device (CPLD) or a Micro Controller Unit (MCU).
Each temperature sensor needs to be driven by a GPIO (General-Purpose Input/Output).
The controller is provided with an IIC interface, and is in communication connection with the Master device through the IIC interface, so that the Master device can read data conveniently.
Although the embodiments of the present invention have been described with reference to the accompanying drawings, the scope of the present invention is not limited thereto. Various modifications and alterations will occur to those skilled in the art based on the foregoing description. And are neither required nor exhaustive of all embodiments. On the basis of the technical scheme of the utility model, various modifications or deformations that technical personnel in the field need not pay out creative work and can make still are within the protection scope of the utility model.
Claims (7)
1. A mainboard temperature detection system, comprising: the temperature sensor is in communication connection with the controller through a single bus transmission protocol;
the temperature sensor is arranged on a Bottom layer of the chip to be detected on the mainboard;
and the master equipment reads the temperature detection data through the controller.
2. The system of claim 1, wherein the temperature sensor is 0603.
3. The system as claimed in claim 1, wherein the controller is a complex programmable logic device.
4. The motherboard temperature detection system of claim 1, wherein the controller is a micro-control unit.
5. The motherboard temperature detection system of claim 1, wherein the temperature sensor is driven by GPIO.
6. The motherboard temperature detection system of claim 1, wherein the controller comprises an IIC interface, and is communicatively coupled to the host device via the IIC interface.
7. The system as claimed in claim 1, wherein the chip under test is a BGA chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023283757.6U CN213904332U (en) | 2020-12-30 | 2020-12-30 | Mainboard temperature detecting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023283757.6U CN213904332U (en) | 2020-12-30 | 2020-12-30 | Mainboard temperature detecting system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213904332U true CN213904332U (en) | 2021-08-06 |
Family
ID=77106697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023283757.6U Active CN213904332U (en) | 2020-12-30 | 2020-12-30 | Mainboard temperature detecting system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213904332U (en) |
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2020
- 2020-12-30 CN CN202023283757.6U patent/CN213904332U/en active Active
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