CN211352215U - 5G communication module test assembly and computer equipment - Google Patents
5G communication module test assembly and computer equipment Download PDFInfo
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- CN211352215U CN211352215U CN202020308042.2U CN202020308042U CN211352215U CN 211352215 U CN211352215 U CN 211352215U CN 202020308042 U CN202020308042 U CN 202020308042U CN 211352215 U CN211352215 U CN 211352215U
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Abstract
The utility model discloses a 5G communication module test assembly and computer equipment. The 5G communication module test assembly comprises a power supply conversion circuit, a switch circuit, a signal switching chip set and a system on chip; the power supply conversion circuit is respectively connected with the switch circuit and the 5G communication module to be tested, the switch circuit is connected with the signal switching chipset, and the signal switching chipset is respectively connected with the system on chip and the 5G communication module to be tested; the signal switching chipset acquires a test signal sent by the to-be-tested 5G communication module corresponding to the packaging type based on the level state sent by the switch circuit, and sends the test signal to the system on chip so as to complete the test of the test signal. This 5G communication module test subassembly and computer equipment accessible switching circuit output's high-low level accomplishes the test to the 5G communication module of different encapsulation types, practices thrift the test cost, promotes production efficiency.
Description
Technical Field
The utility model belongs to the wireless communication field, more specifically says, the utility model relates to a 5G communication module test assembly and computer equipment.
Background
With the development of 5G, different packages, such as m.2 package interface and LGA package interface, need to be made for 5G communication modules. Generally, when testing 5G communication modules packaged differently, different test motherboards are manufactured. Because each kind of encapsulation all needs a specific test mainboard for the 5G communication module of different encapsulation can not use a test mainboard to test, and work efficiency is low, has also caused the waste of manpower and resource.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a test device and computer equipment that pluralism just is directed against different 5G communication module are provided.
In order to achieve the above object, the utility model provides a 5G communication module test assembly and computer equipment, including power supply converting circuit, switch circuit, signal switching chipset and system on chip; the power supply conversion circuit is respectively connected with the switch circuit and the 5G communication module to be tested, the switch circuit is connected with the signal switching chipset, and the signal switching chipset is respectively connected with the system on chip and the 5G communication module to be tested; and the signal switching chipset acquires a test signal sent by the to-be-tested 5G communication module corresponding to the packaging type based on the level state sent by the switch circuit, and sends the test signal to the system on chip so as to complete the test of the test signal.
In one embodiment, the signal switching chipset comprises at least two signal switching chips, and each signal switching chip is provided with a corresponding input pin, an output pin and an enable pin; each signal switching chip is connected with the to-be-tested 5G communication module in different packages through the corresponding input pin, connected with the system on chip through the corresponding output pin and connected with the switch circuit through the corresponding enable pin.
In one embodiment, the number of input pins in each signal switching chip is the same as the number of package types corresponding to the 5G communication module to be tested.
In one embodiment, the number of the enable pins in each signal switching chip is the same as the number of the switch circuits.
In one embodiment, the power conversion circuit comprises a power chip, a first resistor and a second resistor; the power supply chip comprises a power supply input pin, a power supply enabling pin and a power supply output pin; the power supply chip is respectively connected with a power supply voltage and one end of a first resistor through the power supply input pin; the power supply chip is respectively connected with the other end of the first resistor and one end of the second resistor through the power supply enabling pin, and the other end of the second resistor is grounded; and the power supply chip is respectively connected with the switch circuit and the 5G communication module to be tested through the power supply output pin.
In one embodiment, the switching circuit comprises a switch, a third resistor and a fourth resistor; one end of the switch is connected with one end of a third resistor, and the other end of the third resistor is connected with the power supply output pin; the other end of the switch is respectively connected with one end of a fourth resistor and the signal switching chip set; the other end of the fourth resistor is grounded.
In one embodiment, the system on chip uses a chip model F761769BZED-50Soc 1.
The utility model also provides a computer equipment, including above-mentioned 5G communication module test assembly.
The utility model provides a 5G communication module test assembly and computer equipment is through adopting the different level state of switch circuit output to make the test signal transmission of the 5G communication module that the signal switching chipset will correspond the encapsulation type give the upper system on chip, test the 5G communication module of different encapsulation types with the completion, practice thrift the test cost, promote production efficiency.
The present invention will be described in more detail with reference to the accompanying drawings and examples.
Drawings
The contents of the description and the references in the drawings are briefly described as follows:
fig. 1 is a schematic block diagram of a 5G communication module testing assembly provided by the present invention;
FIG. 2 is a schematic diagram of the signal switching chipset and the system on chip of FIG. 1;
fig. 3 is a schematic diagram of a 5G communication module to be tested according to the present invention;
fig. 4 is a schematic diagram of another 5G communication module to be tested according to the present invention;
FIG. 5 is a schematic diagram of the power conversion circuit of FIG. 1;
FIG. 6 is a schematic diagram of the switching circuit of FIG. 1;
labeled as: 1. a first signal switching chip; 2. a second signal switching chip; 3. a system on a chip.
Detailed Description
The following description of the embodiments of the present invention, with reference to the accompanying drawings, will be made in further detail to explain, for example, the shapes and structures of the components, the mutual positions and connection relationships among the components, the functions and working principles of the components, the manufacturing process, and the operation and use method of the components, so as to help those skilled in the art to understand the concept and technical solutions of the present invention more completely, accurately and deeply.
Referring to fig. 1, the embodiment provides a 5G communication module testing assembly 100, and the 5G communication module testing assembly 100 is applied to a computer device. The computer device includes but is not limited to a tablet computer and a notebook computer. This computer equipment adopts 5G communication module test assembly 100, can accomplish and test the 5G communication module of different encapsulation types, practices thrift the test cost, promotes production efficiency.
Fig. 1 is a schematic block diagram of a 5G communication module testing assembly 100 provided by the present invention, which includes a power conversion circuit 10, a switch circuit 20, a signal switching chipset 30 and a system on chip 40.
The power conversion circuit 10 is respectively connected with the switch circuit 20 and the 5G communication module to be tested, the switch circuit 20 is connected with the signal switching chipset 30, and the signal switching chipset 30 is respectively connected with the system-on-chip 40 and the 5G communication module to be tested. The signal switching chipset 30 obtains a test signal sent by the to-be-tested 5G communication module corresponding to the package type based on the level state sent by the switch circuit 20, and sends the test signal to the system on chip to complete the test of the test signal.
Further, the signal switching chipset 30 includes at least two signal switching chips, and each signal switching chip is provided with a corresponding input pin, an output pin, and an enable pin. Each signal switching chip is connected with the to-be-tested 5G communication module in different packages through the corresponding input pin, connected with the system on chip through the corresponding output pin and connected with the switch circuit through the corresponding enable pin.
Specifically, the number of signal switching chips in the signal switching chipset is determined according to the number of signals to be tested in the 5G communication module to be tested, which need to be tested by using the 5G communication module testing component. If the signals to be tested in the 5G communication module to be tested comprise PCIE signals and USB signals, the number of the signal switching chips in the signal switching chip set needs to be two.
Furthermore, the number of input pins in each signal switching chip is the same as the number of package types corresponding to the 5G communication module to be tested.
Specifically, when the package type of the 5G communication module to be tested includes an M2 package interface and an LGA package interface, each signal switching chip needs to be provided with two input pins for inputting the same test signal of the M2 package interface and the LGA package interface.
Further, the number of the enable pins in each signal switching chip is the same as the number of the switch circuits.
Specifically, if there is one switching circuit, the level state output by the switching circuit is two: 1 (high level) or 0 (low level), each signal switching chip only needs to be provided with one enabling pin; if the number of the switching circuits is two, the level states output by the switching circuits are four: 00. 01, 10 and 11, two enable pins are provided for each signal switching chip.
It can be understood that one level state can control the 5G communication module to be tested corresponding to one package type. In practice, the user may determine the number of switching circuits according to the number of package types.
Referring to fig. 2-4, a 5G communication module to be tested with two types of packages, i.e., an M2 package interface and an LGA package interface, is taken as an example for description, test signals corresponding to the two types of the 5G communication module to be tested include PCIE signals and USB signals, and according to the number of the test signals, the signal switching chipset 30 includes two signal switching chips, a signal switching chip 1 and a signal switching chip 2, and each signal switching chip includes two input pins IN1 and IN2, an output pin OUT, and an enable pin EN.
Specifically, an input pin IN1 IN the signal switching chip 1 is connected to a PCIE signal pin IN the to-be-tested 5G communication module corresponding to the M2 package interface, and is configured to obtain a PCIE signal corresponding to the M2 package interface; the input pin IN2 of the signal switching chip 1 is connected to a PCIE signal pin IN the to-be-tested 5G communication module corresponding to the LGA package interface, and is configured to acquire a PCIE signal corresponding to the LGA package interface. The signal switching chip 1 outputs the PCIE signal corresponding to the M2 package interface or the LGA package interface to the system on chip 40 through the output pin.
An input pin IN1 IN the signal switching chip 2 is connected with a USB signal pin IN the 5G communication module to be tested corresponding to the M2 packaging interface and is used for acquiring a USB signal corresponding to the M2 packaging interface; the input pin IN2 of the signal switching chip 2 is connected to a USB signal pin of the 5G communication module to be tested corresponding to the LGA package interface, and is used to obtain a USB signal corresponding to the LGA package interface. The signal switching chip 1 outputs the USB signal corresponding to the M2 package interface or the LGA package interface to the system-on-chip 40 through the output pin.
Further, referring to fig. 5, the power conversion circuit 10 includes a power chip, a first resistor R1 and a second resistor R2. The power supply chip comprises a power supply input pin VCC, a power supply enable pin EN and a power supply output pin OUT. The power supply chip is respectively connected with a power supply voltage VCC and one end of a first resistor R1 through a power supply input pin VCC. The power chip is respectively connected with the other end of the first resistor R1 and one end of the second resistor R2 through a power enable pin EN, and the other end of the second resistor R2 is grounded. The power supply chip is respectively connected with the switch circuit 20 and the 5G communication module to be tested through a power supply output pin OUT.
Further, referring to fig. 6, the switch circuit includes a switch J2, a third resistor R3, and a fourth resistor R4. One end of the switch J2 is connected to one end of the third resistor R3, and the other end of the third resistor R3 is connected to the power output pin. The other end of the switch J2 is connected to one end of a fourth resistor R4 and the signal switching chip set 30. The other end of the fourth resistor R4 is grounded.
Further, the system on chip adopts a chip with the model F761769BZED-50Soc 1.
Adopt the technical scheme of the utility model, through adopting the different level state of switch circuit output to make the signal switching chipset send the test signal that corresponds the 5G communication module of encapsulation type for the SOC, test the 5G communication module of different encapsulation types with the completion, practice thrift the test cost, promote production efficiency.
The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, and various insubstantial improvements can be made without modification to the method and technical solution of the present invention, or the present invention can be directly applied to other occasions without modification, all within the scope of the present invention.
Claims (8)
1.5G communication module test assembly, its characterized in that includes: the power supply switching circuit comprises a power supply switching circuit, a signal switching chip set and a system on a chip;
the power supply conversion circuit is respectively connected with the switch circuit and the 5G communication module to be tested, the switch circuit is connected with the signal switching chipset, and the signal switching chipset is respectively connected with the system on chip and the 5G communication module to be tested;
and the signal switching chipset acquires a test signal sent by the to-be-tested 5G communication module corresponding to the packaging type based on the level state sent by the switch circuit, and sends the test signal to the system on chip so as to complete the test of the test signal.
2. The 5G communication module test assembly of claim 1, wherein the signal switching chipset comprises at least two signal switching chips, each of the signal switching chips is provided with a corresponding input pin, output pin and enable pin;
each signal switching chip is connected with the to-be-tested 5G communication module in different packages through the corresponding input pin, connected with the system on chip through the corresponding output pin and connected with the switch circuit through the corresponding enable pin.
3. The 5G communication module testing assembly according to claim 2, wherein the number of input pins in each signal switching chip is the same as the number of package types corresponding to the 5G communication module to be tested.
4. The 5G communication module test assembly of claim 2, wherein the number of enable pins in each of the signal switching chips is the same as the number of the switch circuits.
5. The 5G communication module test assembly of claim 1, wherein the power conversion circuit comprises a power chip, a first resistor and a second resistor;
the power supply chip comprises a power supply input pin, a power supply enabling pin and a power supply output pin; the power supply chip is respectively connected with a power supply voltage and one end of a first resistor through the power supply input pin; the power supply chip is respectively connected with the other end of the first resistor and one end of the second resistor through the power supply enabling pin, and the other end of the second resistor is grounded; and the power supply chip is respectively connected with the switch circuit and the 5G communication module to be tested through the power supply output pin.
6. The 5G communication module test assembly of claim 5, wherein the switching circuit comprises a switch, a third resistor and a fourth resistor;
one end of the switch is connected with one end of a third resistor, and the other end of the third resistor is connected with the power supply output pin; the other end of the switch is respectively connected with one end of a fourth resistor and the signal switching chip set; the other end of the fourth resistor is grounded.
7. The 5G communication module test assembly of claim 1, wherein the system-on-a-chip employs a model F761769BZED-50Soc1 chip.
8. Computer apparatus, characterized in that it comprises a 5G communication module testing assembly according to any of claims 1-7.
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| CN202020308042.2U CN211352215U (en) | 2020-03-13 | 2020-03-13 | 5G communication module test assembly and computer equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112486228A (en) * | 2020-11-04 | 2021-03-12 | 淮北矿业股份有限公司 | Control system and method for flotation machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112486228A (en) * | 2020-11-04 | 2021-03-12 | 淮北矿业股份有限公司 | Control system and method for flotation machine |
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