CN213889548U - 一种半导体硅片抛光用上载暂存机构 - Google Patents
一种半导体硅片抛光用上载暂存机构 Download PDFInfo
- Publication number
- CN213889548U CN213889548U CN202022883127.6U CN202022883127U CN213889548U CN 213889548 U CN213889548 U CN 213889548U CN 202022883127 U CN202022883127 U CN 202022883127U CN 213889548 U CN213889548 U CN 213889548U
- Authority
- CN
- China
- Prior art keywords
- loading
- silicon wafer
- uploading
- polishing
- overflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 199
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 197
- 239000010703 silicon Substances 0.000 title claims abstract description 197
- 238000005498 polishing Methods 0.000 title claims abstract description 86
- 230000007246 mechanism Effects 0.000 title claims abstract description 74
- 238000003860 storage Methods 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 235000012431 wafers Nutrition 0.000 claims abstract description 181
- 239000000872 buffer Substances 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 5
- 239000012160 loading buffer Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 239000007788 liquid Substances 0.000 description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 25
- 239000010410 layer Substances 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 13
- 239000007864 aqueous solution Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 9
- 239000007921 spray Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000011143 downstream manufacturing Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011144 upstream manufacturing Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022883127.6U CN213889548U (zh) | 2020-12-05 | 2020-12-05 | 一种半导体硅片抛光用上载暂存机构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022883127.6U CN213889548U (zh) | 2020-12-05 | 2020-12-05 | 一种半导体硅片抛光用上载暂存机构 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN213889548U true CN213889548U (zh) | 2021-08-06 |
Family
ID=77100443
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202022883127.6U Active CN213889548U (zh) | 2020-12-05 | 2020-12-05 | 一种半导体硅片抛光用上载暂存机构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN213889548U (zh) |
-
2020
- 2020-12-05 CN CN202022883127.6U patent/CN213889548U/zh active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6532975B1 (en) | Substrate processing apparatus and substrate processing method | |
JP3583883B2 (ja) | 自動ウェーハめっき装置 | |
CN213889515U (zh) | 一种半导体硅片抛光用下载暂存机构 | |
CN213889549U (zh) | 一种硅片抛光用暂存放置系统 | |
KR20120089187A (ko) | 액 처리 장치 및 액 처리 방법 | |
CN105319871B (zh) | 一种半导体基板的显影装置和方法 | |
CN112405339A (zh) | 一种硅片抛光用暂存放置系统 | |
CN115132623A (zh) | 一种晶圆研磨抛光装置及传输方法 | |
CN213889548U (zh) | 一种半导体硅片抛光用上载暂存机构 | |
CN221065799U (zh) | 一种自动活化晶圆擦片机 | |
CN114425742B (zh) | 一种分布式清洗装置 | |
CN113337864A (zh) | 晶圆片清洗装置及包括其的晶圆电镀系统 | |
CN108511376A (zh) | 一种升降型喷淋清洗系统 | |
KR101591957B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
CN109262449B (zh) | 分离式卡盘装置以及晶圆的研磨工艺 | |
CN107591315A (zh) | 用于处理基板的装置和方法 | |
CN115472537A (zh) | 一种硅片加工处理装置及处理工艺 | |
KR20160147163A (ko) | 기판 처리 장치 및 세정 방법 | |
CN213889547U (zh) | 一种硅片抛光前用中转装置 | |
KR101736853B1 (ko) | 기판 처리 장치 및 방법 | |
KR101098365B1 (ko) | 기판 처리 장치 및 방법 | |
KR101842125B1 (ko) | 기판 처리 장치 및 방법 | |
JP3644706B2 (ja) | ポリッシング装置 | |
KR102134434B1 (ko) | 세정 유닛 및 기판 처리 장치 | |
CN201262946Y (zh) | 硅片干燥设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |
|
CP03 | Change of name, title or address |