CN213845304U

CN213845304U - UVLED module

Info

Publication number: CN213845304U
Application number: CN202022639419.5U
Authority: CN
Inventors: 李知霆; 陶亚霖
Original assignee: Zhongshan Shunweixin Technology Co ltd
Current assignee: Zhongshan Shunweixin Technology Co ltd
Priority date: 2020-11-14
Filing date: 2020-11-14
Publication date: 2021-07-30
Anticipated expiration: 2030-11-14

Abstract

The utility model discloses a UVLED module, its technical scheme's main points are including the base plate, the cavity structures of base plate for having the step, periphery at the base plate is equipped with the metallization circuit layer, be equipped with the light window apron on the metallization circuit layer, the light window apron is including the metalwork, be equipped with respectively on the metalwork and lead to the unthreaded hole, cover the light window lens that leads to the unthreaded hole, the light window apron is planar structure, the top that the base plate was located to the light window apron makes and forms the cavity between light window apron and the base plate, be equipped with the chipset in the cavity, the chipset is fixed on the base plate. The utility model discloses compare in traditional UVLED light source and module have that the integrated level is high, high-power, gas tightness is good, inorganic encapsulation, advantages such as simple structure mainly are applied to in requiring high or unsuitable organic material encapsulation's light source module to gas tightness and reliability.

Description

UVLED module

[ technical field ] A method for producing a semiconductor device

The utility model relates to a UVLED module.

[ background of the invention ]

With the gradual maturity of LED technology, LEDs are widely applied in various industries. In recent years, development of 5G technology drives interconnection of everything and smart home, different meanings of light are given, and the infrared LED plays an important role in security, face recognition, machine vision and intelligent control; the new crown epidemic situation deepens the attention of people to the health condition of the people, the ultraviolet disinfection and sterilization products enter the public visual field for the first time, various medical and household ultraviolet LED disinfection products and schemes which are closely related to life are developed, and the LED is only used as an illumination light source. Along with the transformation and diversification of application scenes, new requirements are provided for the reliability of the LED, particularly, organic materials such as silica gel or epoxy resin are easy to age and yellow in the physicochemical characteristics of a light source in an invisible light waveband, and the device is ineffective or dead due to the change of oxygen permeation, moisture permeation and light transmission characteristics, and the traditional silica gel or epoxy resin packaging form cannot well meet the reliability requirements of products. Therefore, it is urgent to find a reliable hermetic inorganic packaging technology.

[ Utility model ] content

The utility model discloses the purpose is overcome prior art not enough, provides a UVLED module, compares in traditional UVLED light source and module have integrated level height, high-power, gas tightness good, inorganic encapsulation, advantages such as simple structure.

The utility model discloses a realize through following technical scheme:

the utility model provides a UVLED module which characterized in that: including base plate 2, base plate 2 is the cavity structures who has the step base plate 2's periphery is equipped with metallization circuit layer 4 be equipped with optical window apron 1 on metallization circuit layer 4, optical window apron 1 is equipped with respectively on metalwork 101 and leads to the unthreaded hole, covers the optical window lens 102 that leads to the unthreaded hole, optical window apron 1 is planar structure, and optical window apron 1 is located the top of base plate 2 makes optical window apron 1 with form cavity 6 between the base plate 2 be equipped with chipset 3 in the cavity 6, chipset 3 is fixed on base plate 2.

The UVLED module of above-mentioned characterized in that: the chip group 3 is formed by connecting a plurality of chips in series.

The UVLED module as above, its characterized in that: the material of base plate 2 is one of pottery, aluminum product, copper product, aluminium carborundum base plate, the height H4 ≧ 0.35 millimeter of base plate 2 upper ledge.

The UVLED module as above, its characterized in that: the optical window lens 102 is made of quartz glass, and the shape of the optical window lens 102 is one of square, circular, ellipsoid and semispherical; the depth H3 of the cavity 6 is greater than or equal to 0.5 mm.

The UVLED module as above, its characterized in that: the metal piece 101 is made of kovar, copper or aluminum, and a nickel plating layer is arranged on the surface of the metal piece 101.

The UVLED module as above, its characterized in that: the metal piece 101 bottom border part is equipped with the metal welding limit that extends, the metal welding limit with metallization line layer 4 welded connection, the width H1 of metal welding limit is ≧ 0.5 millimeter, the thickness H2 of metallization line layer 4 is ≧ 80 microns, metallization line layer 4 surface is equipped with gold-plated layer or nickel-plated layer.

The UVLED module as above, its characterized in that: the optical window lens 102 is connected to the metal member 101 by welding.

The UVLED module as above, its characterized in that: and a solder 5 for welding and connecting the optical window lens 102 and the metal piece 101 is arranged between the optical window lens 102 and the metal piece 101, the solder 5 is annular, and the solder 5 is made of an inorganic material.

The UVLED module as above, its characterized in that: the solder 5 comprises TiCuBiZnMn, wherein Ti accounts for 6.8-25%, Cu accounts for 19.6-34%, Bi accounts for 4.2-7.3%, Zn accounts for 21-37%, and Mn accounts for 0.56-1.2%.

The UVLED module as above, its characterized in that: and a plating layer is arranged in an annular area with the edge of less than or equal to 0.5 mm of the optical window lens 102, the thickness of the plating layer is greater than or equal to 10 micrometers, and the plating layer is composed of nickel gold or copper.

Compared with the prior art, the utility model discloses there is following advantage:

1. the utility model discloses compare in traditional UVLED light source and module have that the integrated level is high, high-power, gas tightness is good, inorganic encapsulation, advantages such as simple structure mainly are applied to in requiring high or unsuitable organic material encapsulation's light source module to gas tightness and reliability.

2. The utility model discloses base plate, metalwork, optical window lens all adopt inorganic material, and solder, metallization line layer and all cladding materials also adopt inorganic material, adopt sintering process or fusion welding process to make optical window apron with optical window lens and metalwork sealing-in as an organic whole, adopt resistance welding or fusion welding process to combine optical window apron and base plate as an organic whole to make UVLED module, realize high gas tightness, inorganic encapsulation.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of a substrate of a UVLED module according to the present invention;

fig. 2 is a schematic cross-sectional view of an overall structure of a first embodiment of the present invention, in which a substrate is a cavity structure, an optical window cover plate is a planar structure, and an optical window lens is fusion-welded to a metal member;

fig. 3 is a schematic cross-sectional view of the whole structure of a second embodiment of the present invention, in which the chip is a front chip and the optical window lens is connected to the metal member by sintering;

fig. 4 is a schematic cross-sectional view of the overall structure of the third embodiment of the present invention, in which the chip is a flip chip and the optical window lens is connected with the metal member by sintering.

In the figure: 1 is a light window cover plate; 101 is a metal piece; 102 is a light window lens; 2 is a substrate; 3 is a chip group; 4 is a metallized circuit layer; 5 is solder; 6 is a cavity; and 7 is a circuit layer.

[ detailed description ] embodiments

The technical features of the present invention will be described in further detail below with reference to the accompanying drawings so that those skilled in the art can understand the technical features.

The UVLED module comprises a substrate 2, a metalized circuit layer 4 is arranged on the periphery of the substrate 2, an optical window cover plate 1 is arranged on the metalized circuit layer 4, the optical window cover plate 1 comprises a metal piece 101, an optical window lens 102 which is provided with an optical through hole and covers the optical through hole is arranged on the metal piece 101 respectively, the optical window cover plate 1 is arranged above the substrate 2 to enable the optical window cover plate 1 and the substrate 2 to form a cavity 6, a chip set 3 is arranged in the cavity 6, and the chip set 3 is fixed on the substrate 2.

Further, the chip set 3 is formed by connecting a plurality of chips in series. The plurality of chips are connected in series and bonded on the circuit layer 7 of the substrate 2 through a solder paste, silver glue die bonding or eutectic process, the metalized circuit layer 4 is arranged at the edge of the substrate 2, the optical window cover plate 1 is assembled on the metalized circuit layer 4 of the substrate through a corresponding tool fixture, and finally the optical window cover plate 1 and the substrate 2 are sealed into a whole through a resistance welding or fusion welding process.

The shape of the light window cover plate 1 is not limited to a square, a circle, etc. The depth H3 of the cavity 6 formed between the optical window cover plate 1 and the substrate 2 is ≧ 0.5 mm, the substrate 2 may be a planar structure or a cavity structure with steps, and when the substrate 2 is a planar structure, the corresponding optical window cover plate 1 is a cavity structure; when the substrate 2 is a cavity structure with steps, the corresponding optical window cover plate 1 is a planar structure, and the height H4 of the steps is not less than 0.35 mm, so that gold wires are not damaged when the substrates are assembled and sealed conveniently.

Be equipped with the circuit pattern on base plate 2, base plate 2's material can be ceramic substrate, also can be metal substrate such as aluminum product, copper product etc. also can adopt other composite material that have high heat conduction and reflection of light characteristic, such as aluminium carborundum base plate, scribble the metal substrate of graphite alkene etc..

Further, the surface of the ceramic substrate is plated with aluminum or a high-reflection coating material such as PTFE is adopted, so that the overall light extraction performance of the device in the invisible light band, particularly the UVC band, is further improved.

When the optical window lens 102 is connected with the metal piece 101 in a sintering mode, the solder 5 for connecting the optical window lens 102 and the metal piece 101 in a welding mode is arranged between the optical window lens 102 and the metal piece 101, the solder 5 is annular, and the solder 5 is made of inorganic materials. The solder 5 comprises TiCuBiZnMn, wherein Ti accounts for 6.8-25%, Cu accounts for 19.6-34%, Bi accounts for 4.2-7.3%, Zn accounts for 21-37%, and Mn accounts for 0.56-1.2%.

The optical window lens 102 and the metal member 101 may be joined by welding, and the solder 5 is not required.

In the UVLED module, the optical window lens 102 is made of quartz glass, and the shape of the optical window lens 102 is one of a square shape, a circular shape, an ellipsoid shape, and a hemisphere shape.

According to the UVLED module, the metal member 101 is made of kovar, copper or aluminum, a nickel-plated layer is disposed on the surface of the metal member 101, an extended metal welding edge is disposed on the edge portion of the bottom of the metal member 101, the metal welding edge is welded to the metalized circuit layer 4, and the width H1 of the metal welding edge is not less than 0.5 mm.

The thickness H2 ≧ 80 microns of metallization circuit layer 4, metallization circuit layer 4 surface is equipped with the cladding material, the material of cladding material is gold or nickel gold.

According to the UVLED module, the annular area with the thickness being less than or equal to 0.5 mm at the edge of the optical window lens 102 is plated, the thickness of the plating layer is greater than or equal to 10 micrometers, and the plating layer is made of nickel or copper.

The embodiment of the utility model is only right the description that the preferred embodiment of the utility model goes on, not to injecing utility model design and scope, not departing from the utility model discloses under the prerequisite of design idea, engineering technical staff is right in the art the technical scheme of the utility model make various variants and improvements, all should fall into the protection scope of the utility model.

Claims

1. The utility model provides a UVLED module which characterized in that: including base plate (2), base plate (2) are the cavity structures who has the step the periphery of base plate (2) is equipped with metallization circuit layer (4) be equipped with light window apron (1) on metallization circuit layer (4), light window apron (1) is equipped with logical unthreaded hole, covers respectively on metalwork (101) the light window lens (102) of logical unthreaded hole, light window apron (1) is planar structure, and light window apron (1) is located the top of base plate (2) makes light window apron (1) with form cavity (6) between base plate (2) be equipped with chipset (3) in cavity (6), chipset (3) are fixed on base plate (2).

2. The UVLED module of claim 1, wherein: the chip group (3) is formed by connecting a plurality of chips in series.

3. The UVLED module of claim 2, wherein: the material of base plate (2) is one of pottery, aluminum product, copper product, aluminium carborundum base plate, the height H4 ≧ 0.35 millimeter of step on base plate (2).

4. The UVLED module of claim 2, wherein: the optical window lens (102) is made of quartz glass, and the shape of the optical window lens (102) is one of square, round, ellipsoid and hemisphere; the depth H3 ≧ 0.5 mm of the cavity (6).

5. The UVLED module of claim 2, wherein: the metal piece (101) is made of kovar or copper or aluminum, and a nickel plating layer is arranged on the surface of the metal piece (101).

6. The UVLED module of claim 2, wherein: the metal piece (101) bottom border part is equipped with the metal welding limit that extends, the metal welding limit with metallization line layer (4) welded connection, the width H1 of metal welding limit is ≧ 0.5 millimeter, the thickness H2 of metallization line layer (4) is ≧ 80 microns, metallization line layer (4) surface is equipped with gold-plated layer or nickel plating layer.

7. The UVLED module of claim 2, wherein: the optical window lens (102) is connected with the metal piece (101) through welding.

8. The UVLED module of claim 2, wherein: and a solder (5) for connecting the optical window lens (102) and the metal piece (101) in a welding manner is arranged between the optical window lens (102) and the metal piece (101), the solder (5) is annular, and the solder (5) is made of an inorganic material.