CN213782009U

CN213782009U - Heat absorption end structure for controlling contact area through direct-contact secondary forming of heat pipe

Info

Publication number: CN213782009U
Application number: CN202022956147.1U
Authority: CN
Inventors: 曾道平; 范纲龙; 李文贺; 张伟亭
Original assignee: Huizhou Xunshuo Technology Co ltd
Current assignee: Huizhou Xunshuo Technology Co ltd
Priority date: 2020-12-11
Filing date: 2020-12-11
Publication date: 2021-07-23
Anticipated expiration: 2030-12-11

Abstract

The utility model relates to a heat pipe direct-contact secondary forming heat absorption end structure for controlling contact area, which comprises a heat conduction bottom plate, heat pipes and heat dissipation fins, wherein the heat pipes are embedded at the bottom of the heat conduction bottom plate through pressing deformation; the bottom of the heat conduction bottom plate is provided with a heat conduction bottom plate heat pipe groove; the heat pipe is provided with a primary flattened heat pipe part and a secondary flattened heat pipe part, the heat pipe part embedded at the bottom of the heat conduction bottom plate is the secondary flattened heat pipe part, the secondary flattened heat pipe part is embedded at the bottom of the heat conduction bottom plate and is flattened secondarily to form a secondary flattened heat pipe, so that the bottom of the heat conduction bottom plate and the bottom of the secondary flattened heat pipe are in the same horizontal plane, and a contact surface in contact with a heating element is formed; the utility model discloses, increase the conduction efficiency that the pipe was promoted the radiator through the quantity in limited plane to promote the performance of whole radiator.

Description

Heat absorption end structure for controlling contact area through direct-contact secondary forming of heat pipe

Technical Field

The invention belongs to the related technical field of radiators, and particularly relates to a heat absorption end structure for controlling a contact area by direct-contact secondary forming of a heat pipe.

Background

The heat pipe radiator is a new product produced by utilizing the heat pipe technology to make great improvements on a plurality of heat exchange products and systems. The heat pipe radiator has two main types of natural cooling and forced air cooling. The heat pipe radiator consists of a sealing pipe, a liquid absorption core and a steam channel. The liquid absorbing core surrounds the pipe wall of the sealing pipe and is soaked with volatile saturated liquid. The liquid may be distilled water, or ammonia, methanol, acetone, or the like. The heat pipe radiator filled with ammonia, methanol, acetone and other liquid has excellent heat dissipating capacity at low temperature. When the heat pipe radiator operates, the evaporation section of the heat pipe radiator absorbs heat generated by a heat source (such as a power semiconductor device) to ensure that liquid in the liquid absorption core pipe is boiled into steam. The vapor with heat moves from the evaporation section of the heat pipe radiator to the cooling section of the heat pipe radiator, and the vapor is condensed into liquid after the heat is transferred to the cooling section by the vapor. The condensed liquid is returned to the evaporation section by the capillary action of the wick on the tube wall, thus repeating the above cycle to dissipate heat continuously. The heat pipe radiator is a high-efficiency heat radiating device and has unique heat radiating characteristics. I.e. it has a high thermal conductivity and its temperature distribution in the axial direction between the evaporation section and the cooling section is uniform and substantially equal. The thermal resistance of the heat sink is determined by the thermal conductivity of the material and the effective area within the volume.

The existing market technology is that single pipe independent riveting is riveted with parallel pipe riveting, but all do not carry out leading flat suppression of clapping to the heat pipe, and the cross-section width of final riveting has all surpassed the size of heat source contact surface after a certain amount, makes its partial heat pipe can not all directly adsorb the heat that the heat source produced, and this product just solves this problem, makes under the condition that it does not increase cost, lets the heat pipe all effectually contact the heat source, lets the best state of whole heat dissipation module's performance.

The prior art has the following problems: the problem that the power consumption of the existing heating element is gradually increased but the heating surface is not increased is solved, so that the conduction efficiency of the radiator is improved by increasing the number of the heating pipes in a limited plane, the performance of the whole radiator is improved, and the market application space is wide.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, providing a heat pipe direct-touch post forming control area of contact's heat absorption end structure, this heat pipe direct-touch post forming control area of contact's heat absorption end structure: the conduction efficiency of the radiator is improved by increasing the number of the tubes in a limited plane, so that the performance of the whole radiator is improved.

In order to achieve the above object, the utility model provides a heat pipe direct-contact secondary forming control area of contact's heat absorption end structure is reached by following specific technological means:

a heat pipe direct-contact secondary forming heat absorption end structure for controlling contact area comprises a heat conduction bottom plate, a heat pipe and heat dissipation fins, wherein the heat pipe is embedded at the bottom of the heat conduction bottom plate through pressing deformation, the heat pipe is deformed and embedded into a heat pipe groove of the heat conduction bottom plate through a flattening process or a stamping process, and is fastened in the heat pipe groove of the bottom plate through external force, fixed connection/interference fit connection is achieved, welding or other adhesion is not needed, fastening and loosening are avoided directly through a tight-fit manufacturing process, and cost is low. The heat conducting bottom plate is connected with the heat radiating fins through the heat pipe, the heat conducting bottom plate is in heat conduction connection with the heating element, heat of the heating element can be directly conducted to the heat pipe and then conducted to the heat radiating fins through the heat pipe, and the heat radiating fins are in contact with the environment and radiate heat through natural cooling or forced air cooling. The heat pipe part that heat conduction bottom plate bottom department set up, its bottom horizontal plane flushes with heat conduction bottom plate bottom horizontal plane for with the contact quantity of heating element with the heat pipe increase, improve the heat conductivity, heat conduction bottom plate bottom is equipped with heat conduction bottom plate heat pipe groove, further improves radiating performance.

In one embodiment, the heat pipe is provided with a primary flattened heat pipe part and a secondary flattened heat pipe part, the heat pipe part embedded at the bottom of the heat conduction base plate is the secondary flattened heat pipe part, the secondary flattened heat pipe part is embedded at the bottom of the heat conduction base plate and is flattened for the second time to form a secondary flattened heat pipe, so that the bottom of the heat conduction base plate and the bottom of the secondary flattened heat pipe are in the same horizontal plane to form a contact surface with the heating element, and the heat pipe is locally flattened to a section D11 (see attached figure 12) so that the heat pipe can be smoothly placed in a heat conduction base plate heat pipe groove of the heat conduction base plate after being flattened for the first time; after the heat pipe is flattened for the first time, the heat pipe can be directly placed into the heat conduction bottom plate with the designed corresponding size, and then secondary pressing is carried out, so that secondary flattening is realized, namely the heat pipe is locally flattened to the size of D1 and D2 (see attached figure 5). Therefore, the heat conducting base plate is fastened in a heat pipe groove of the heat conducting base plate through external force, and the bottom of the heat conducting base plate meets the flatness requirement, or the heat conducting base plate is flattened for the second time and then is subjected to plane processing. The top of the heat conduction bottom plate is fixedly connected with heat conduction bottom plate fins, and the heat conduction bottom plate fins and the heat conduction bottom plate are integrally formed, so that the heat conductivity between the heat conduction bottom plate fins and the heat conduction bottom plate is high.

In one embodiment, the cross section of the first flattened heat pipe part and the cross section of the first flattened heat pipe part of the second flattened heat pipe part of the heat pipe are waist drum shapes or oval shapes, and the heat pipe can adapt to various complex environments and heat-conducting base plate heat pipe grooves with various shapes.

In one embodiment, the heat pipe is provided with a pipe wall, a liquid absorption core and a cavity, and the heat pipe enables heat to be quickly conducted due to the phase change process (evaporation and condensation of condensate) of the medium (namely condensate) after the medium is evaporated at the contact end of the heat conduction bottom plate and then condensed at the contact end of the heat dissipation fin, so that the temperature of the heating element is reduced. The heat pipe is provided with a pipe wall, a liquid absorbing core and a cavity, the interior of the heat pipe can be pumped into a negative pressure state, and proper condensate is filled into the heat pipe, the condensate has low boiling point and is easy to volatilize, and the phase change process of condensation can be realized.

In one embodiment, the wick of the heat pipe may be a wicking layer (capillary material layer) or a groove, and the pipe wall has a wick that is formed by the capillary layer. When the evaporation end of the heat pipe absorbs heat, condensate in the capillary layer is rapidly vaporized, vapor flows to the condensation end under the power of thermal diffusion, and at the condensation end, the heat is released through the condensation of the heat dissipation fins, the condensate flows back to the evaporation end along the capillary layer by virtue of capillary action to form circulation, and when the temperatures of the two ends of the heat pipe are equal, the circulation is stopped; the groove can be formed, the processing mode is simple, the difficulty is low, and the price is relatively low.

In one embodiment, the heat conducting bottom plate is provided with a mounting hole, and the mounting hole can be combined with a common heating element for mounting and fixing, so that the practicability and the universality are improved.

In one embodiment, the heat pipe is U-shaped, L-shaped, or straight, and the specific configuration of the heat pipe, such as the arrangement of the end cap, how to seal, etc., belongs to the common prior art, and will not be described repeatedly herein.

In one embodiment, the heat-conducting bottom plate is arranged below the heat-radiating fins, so that the heat-radiating efficiency of the heat pipe is further improved, the circulation efficiency is higher, and the condensate is contained in the cavity of the heat pipe, so that the evaporation and condensation phase change of the condensate are realized.

In one embodiment, the number of the heat conducting base plate heat pipe grooves of the heat conducting base plate is six, and the preferred scheme of size contact with the existing common heating element is that a contact surface formed by the bottom of the heat conducting base plate and the bottom of the secondary flattened heat pipe part is in heat transfer contact with the heating element, so that the heat of the heating element is conducted to the heat conducting base plate.

Because of above-mentioned technical scheme's application, the utility model discloses a technological effect and advantage:

the heat pipe direct-contact secondary forming heat absorption end structure for controlling the contact area improves the conduction efficiency of the radiator by increasing the number of the heat pipes in a limited plane, thereby improving the performance of the whole radiator, namely solving the problems that the size of the contact surface of the most key chip (heating element) is not increased, the power consumption is increased, and the key heat pipe effective contact surface of a stronger heat dissipation module is needed; the manufacturing process is easy to control, the original cost is not increased, and the problems that the contact surface of a heat source is small and the contact surface of an effective heat pipe of a radiator is overlarge in the market are solved. In addition, the size of the heat conduction bottom plate can accord with the contact surface of a smaller radiator device, the number of the heat pipes can be changed according to actual needs, the power consumption is continuously increased in a heat source without increasing the market state of the contact surface area, and the product has wide application prospect.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a schematic perspective view of a heat-absorbing end structure for controlling contact area of a heat pipe by direct-contact secondary molding;

FIG. 2 is a front view of a heat-absorbing end structure of a direct-contact secondary forming contact area control of a heat pipe;

FIG. 3 is a bottom view of a heat-absorbing end structure of a heat pipe direct-contact secondary forming control contact area;

FIG. 4 is a front view of a heat absorbing end of a heat pipe direct-contact secondary forming contact area controlling structure;

FIG. 5 is a partial enlarged view of the heat-absorbing end structure of the heat pipe direct contact type secondary forming control contact area at A in FIG. 4;

FIG. 6 is a schematic cross-sectional view comparing a heat absorption end structure of a heat pipe direct-contact secondary forming contact area-controlling heat absorption end structure with a prior art heat absorption end structure;

FIG. 7 is a schematic perspective view of a heat-conducting bottom plate of a heat-absorbing end structure with a contact area controlled by direct-contact secondary forming of a heat pipe;

FIG. 8 is a front view of a heat-conducting bottom plate of a heat-absorbing end structure for controlling contact area in direct-contact secondary forming of a heat pipe;

FIG. 9 is a bottom view of a heat-conducting bottom plate of a heat-absorbing end structure with a direct-contact secondary forming control contact area of a heat pipe;

FIG. 10 is a top view of a heat-conducting bottom plate of a heat-absorbing end structure with a contact area controlled by direct-contact secondary forming of a heat pipe;

FIG. 11 is a schematic view of a heat pipe structure formed by flattening and pressing a heat absorbing end structure of a direct-contact secondary forming contact area of the heat pipe for the first time;

FIG. 12 is a schematic cross-sectional view of a heat pipe B-B formed by first flattening and pressing a heat absorption end structure of a direct contact type secondary forming contact area control heat pipe.

In the figure: the heat pipe comprises a heat conduction bottom plate 1, a secondary flattened heat pipe 11, a pipe wall 111, a liquid absorption core 112, a cavity 113, a heat conduction bottom plate heat pipe groove 12, heat conduction bottom plate fins 13, mounting holes 14, a heat pipe 2, a secondary flattened heat pipe part 21, a primary flattened heat pipe part 22, heat dissipation fins 3 and a heating element 4.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It is to be noted that, in the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Meanwhile, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Example 1

Referring to fig. 1 to 12, the present invention provides a technical solution: a heat absorption end structure for controlling contact area of heat pipe direct contact type secondary forming.

The following describes a specific structure of a heat-absorbing end structure for controlling a contact area by direct-contact secondary forming of a heat pipe and a connection relationship between components:

the utility model discloses a heat pipe direct-contact secondary forming control area of contact's heat absorption end structure has hot bottom plate 1, heat pipe 2, heat radiation fins 3, heat pipe 2 warp to inlay in heat conduction bottom plate 1 bottom through the suppression, through beating flat technology or stamping process with 2 deformation embedding heat conduction bottom plate heat pipe inslot 12 of heat pipe, and make its fastening at the heat pipe inslot of bottom plate by external force, realize fixed connection/interference fit and connect, need not weld or other adhesion promptly, it does not loosen and takes off directly to reach the fastening through the tight-fitting processing procedure, therefore, the carrier wave prepaid electric energy meter is low in cost. The heat conduction bottom plate 1 is connected with the heat dissipation fins 3 through the heat pipes 2, the heat conduction bottom plate 1 is in heat conduction connection with the heating element 4, heat of the heating element 4 is directly conducted to the heat pipes 2 and then conducted to the heat dissipation fins 3 through the heat pipes 2, the heat dissipation fins 3 are in contact with the environment, and heat dissipation is conducted through natural cooling or forced air cooling. The heat pipe 2 part that 1 bottom of heat conduction bottom plate department set up, its bottom horizontal plane flushes with 1 bottom horizontal plane of heat conduction bottom plate for it is big with heating element 4 area of contact, improves the heat conductivity, and 1 bottom of heat conduction bottom plate is equipped with heat conduction bottom plate heat pipe groove 12, need not welding or other bonds, directly reaches heat pipe 2 through the tight fit processing procedure and does not loosen and take off for the fastening of heat conduction bottom plate 1, low cost.

Preferably, the heat pipe 2 is provided with a primary flattened heat pipe portion 22 and a secondary flattened heat pipe portion 21, the heat pipe 2 portion embedded at the bottom of the heat conduction bottom plate 1 is the secondary flattened heat pipe portion 21, the secondary flattened heat pipe portion 21 is embedded at the bottom of the heat conduction bottom plate 1 to be flattened for the second time to form a secondary flattened heat pipe 11, so that the bottom of the heat conduction bottom plate 1 and the bottom of the secondary flattened heat pipe 11 are the same horizontal plane, a contact surface contacting with the heating element 4 is formed, and the top of the heat conduction bottom plate 1 is fixedly connected with heat conduction bottom plate fins 13.

By adopting the technical scheme, the heat pipe 2 is locally flattened to the size of D11 and D22 on the section, so that the heat pipe 2 can be smoothly placed into the heat-conducting base plate heat pipe groove 12 of the heat-conducting base plate 1 after being flattened for the first time; after the heat pipe 2 is flattened for the first time, the heat pipe can be directly placed into the heat conduction bottom plate 1 with the designed corresponding size, secondary pressing is carried out again, secondary flattening is realized, namely the heat pipe 2 is locally flattened to the section D1 and D2. Therefore, the radiator is fastened in the heat conduction bottom plate heat pipe groove 12 of the heat conduction bottom plate 1 through external force, the bottom of the radiator meets the flatness requirement, or the plane is processed after secondary flattening, the number of the heating pipes 2 in the limited plane is increased to improve the conduction efficiency of the radiator, the performance of the whole radiator is improved, and the market application range is wide. And current market technology is that the single tube is independent to rivet with the riveting of union coupling, but all do not carry out leading flat of clapping to heat pipe 2, the cross-sectional width of final riveting has all surpassed the size of heating element 4 contact surface after a certain amount, make the heat that its partial heat pipe 2 can not all directly adsorb heating element 4 and produce, this product just solves this problem, make under the circumstances that it does not increase the cost, let the whole effectual heating element 4 that contacts of heat pipe 2, let the best condition of whole heat dissipation module's performance. In the state that the size and length of the heating element 4 are fixed, the heat pipe 2 is flattened twice through the technical scheme, and the heat pipe 2 is effectively in complete contact with the heating element 4 (see the attached figure 6). The heat conducting bottom plate fins 13 are fixedly connected to the top of the heat conducting bottom plate 1, so that the heat radiating performance is further improved, and the heat conducting bottom plate fins 13 and the heat conducting bottom plate 1 can be integrally formed, so that the heat conducting property between the heat conducting bottom plate fins 13 and the heat conducting bottom plate 1 is high, and the integrity is strong.

Preferably, the first flattened heat pipe portion 22 and the second flattened heat pipe portion 21 of the heat pipe 2 have a waist drum shape or an oval shape in cross section (see fig. 12).

By adopting the technical scheme, the cross section of the first flattened heat pipe part 22 and the first flattened cross section of the second flattened heat pipe part 21 of the heat pipe 2 are waist drum shapes or oval shapes, so that the heat pipe can be suitable for various complex environments and heat-conducting base plate heat pipe grooves 12 with various shapes.

Preferably, heat pipe 2 has a wall 111, a wick 112, and a cavity 113.

By adopting the technical scheme, the heat pipe 2 is provided with the pipe wall 111, the liquid absorbing core 112 and the cavity 113, and the heat pipe 2 enables heat to be quickly conducted and the temperature of the heating element 4 to be reduced due to the phase change process (evaporation and condensation of condensate) that the medium (namely the condensate) is evaporated at the contact end of the heat conducting bottom plate 1 and then condensed at the contact end of the radiating fins 3. The heat pipe 2 is provided with a pipe wall 111, a wick 112 and a cavity 113, the interior of the heat pipe 2 can be pumped into a negative pressure state, and appropriate condensate is filled in the heat pipe, and the condensate has a low boiling point, is easy to volatilize and can realize phase change.

Preferably, wick 112 of heat pipe 2 may be a wicking layer or channel.

By adopting the above technical solution, the wick 112 of the heat pipe 2 may be a capillary layer (capillary material layer), and the pipe wall 111 has the wick 112, which is formed by the capillary layer. One end of the heat pipe 2 is an evaporation end in contact with the heat conduction bottom plate 1, the other end of the heat pipe 2 is a condensation end in contact with the heat dissipation fins 3, when the evaporation end of the heat pipe 2 absorbs heat, condensate in the capillary layer is rapidly vaporized, vapor flows to the condensation end under the power of heat diffusion, the vapor is condensed at the condensation end through the heat dissipation fins 3 to release heat, the condensate flows back to the evaporation end along the capillary layer by virtue of capillary action to form circulation, and when the temperatures of the two ends of the heat pipe 2 are equal, the circulation is stopped.

Preferably, the heat conducting base plate 1 is provided with mounting holes 14.

Through adopting above-mentioned technical scheme, heat conduction bottom plate 1 is equipped with mounting hole 14, and this mounting hole 14 can combine the installation fixed with common heating element 4, improves practicality, commonality.

Preferably, the heat pipe 2 is U-shaped, L-shaped or straight.

By adopting the technical scheme, the heat pipe 2 is U-shaped, L-shaped or straight, and the specific structure of the heat pipe 2, such as the arrangement of the end cover, how to seal and the like, belongs to the common prior art, and the description is not repeated.

Preferably, the heat conducting base plate 1 is disposed below the heat dissipating fins 3, and the cavity 113 of the heat pipe 2 contains the condensate.

Through adopting above-mentioned technical scheme, heat conduction bottom plate 1 sets up in heat radiation fins 3's below, further improves heat pipe 2's radiating efficiency for circulation efficiency is higher, contains the condensate in heat pipe 2's the cavity 113, realizes the evaporation of condensate and the phase transition of condensing, better conduction heat energy.

Preferably, the number of the heat conducting base plate heat pipe grooves 12 of the heat conducting base plate 1 is six, and a contact surface formed by the bottom of the heat conducting base plate 1 and the bottom of the secondary flattened heat pipe 11 is in heat transfer contact with the heating element 4. The size of the heat conduction bottom plate 1 can accord with the contact surface of a smaller radiator device, the number of the heat pipes 2 can be changed according to actual needs, and the market state that the power consumption is continuously increased on the heating element 4 without increasing the contact surface area is realized, so that the technical scheme has wide application prospect; the purpose is to increase the conduction efficiency by increasing the number of heat pipes 2 implanted in the effective chip heat source (i.e., heating element 4) size.

By adopting the technical scheme, the number of the heat-conducting base plate heat pipe grooves 12 of the heat-conducting base plate 1 is six, and the heat-conducting base plate heat pipe grooves are in size contact with the existing common heating element 4, and a contact surface formed by the bottom of the heat-conducting base plate 1 and the bottom of the secondary flattened heat pipe 11 is in heat transfer contact with the heating element 4, so that the heat of the heating element 4 is directly conducted to the heat pipe 2; the product performance is good, the process is easy to control, the original cost is not increased, and the problems that the contact surface of a heat source is small and the contact surface of an effective heat pipe 2 of a radiator is overlarge in the market are solved.

Example 2

Referring to fig. 1 to 3 and fig. 7 to 11, the present invention provides a technical solution: a heat absorption end structure for controlling contact area of heat pipe direct contact type secondary forming.

the utility model discloses a heat pipe direct-contact secondary forming control area of contact's heat absorption end structure has hot bottom plate 1, heat pipe 2, heat radiation fins 3, heat pipe 2 warp to inlay in heat conduction bottom plate 1 bottom through the suppression, through beating flat technology or stamping process with 2 deformation embedding heat conduction bottom plate heat pipe inslot 12 of heat pipe, and make its fastening at the heat pipe inslot of bottom plate by external force, realize fixed connection/interference fit and connect, need not weld or other adhesion promptly, it does not loosen and takes off directly to reach the fastening through the tight-fitting processing procedure, therefore, the carrier wave prepaid electric energy meter is low in cost. The heat conduction bottom plate 1 is connected with the heat dissipation fins 3 through the heat pipes 2, heat of the heating element 4 is directly conducted to the heat pipes 2 and then conducted to the heat dissipation fins 3 through the heat pipes 2, and the heat dissipation fins 3 are in contact with the environment and perform heat dissipation through natural cooling or forced air cooling. The heat pipe 2 part that 1 bottom of heat conduction bottom plate department set up, its bottom horizontal plane flushes with 1 bottom horizontal plane of heat conduction bottom plate for it is big with heating element 4 area of contact, improves the heat conductivity, and 1 bottom of heat conduction bottom plate is equipped with heat conduction bottom plate heat pipe groove 12, need not welding or other bonds, directly reaches heat pipe 2 through the tight fit processing procedure and does not loosen and take off for the fastening of heat conduction bottom plate 1, low cost.

By adopting the technical scheme, the heat pipe 2 is provided with the primary flattened heat pipe part 22 and the secondary flattened heat pipe part 21, the part of the heat pipe 2 embedded at the bottom of the heat conduction base plate 1 is the secondary flattened heat pipe part 21, the secondary flattened heat pipe part 21 is embedded at the bottom of the heat conduction base plate 1 and is flattened for the second time to form the secondary flattened heat pipe 11, so that the bottom of the heat conduction base plate 1 and the bottom of the secondary flattened heat pipe 11 are in the same horizontal plane to form a contact surface with the heating element 4, and the heat pipe 2 is locally flattened to the size of D11 and D22, so that the heat pipe 2 can be smoothly placed into the heat conduction base plate heat pipe groove 12 of the heat conduction base plate 1 after being flattened for the first time; after the heat pipe 2 is flattened for the first time, the heat pipe can be directly placed into the heat conduction bottom plate 1 with the designed corresponding size, secondary pressing is carried out again, secondary flattening is realized, namely the heat pipe 2 is locally flattened to the section D1 and D2. Therefore, the radiator is fastened in the heat conduction bottom plate heat pipe groove 12 of the heat conduction bottom plate 1 through external force, the bottom of the radiator meets the requirement of flatness, or the plane is processed after secondary flattening, the number of the heating pipes in the limited plane is increased to improve the conduction efficiency of the radiator, the performance of the whole radiator is improved, and the market application range is wide. And current market technology is that the single tube is independent to rivet with the riveting of union coupling, but all do not carry out leading flat of clapping to heat pipe 2, the cross-sectional width of final riveting has all surpassed the size of heating element 4 contact surface after a certain amount, make the heat that its partial heat pipe 2 can not all directly adsorb heating element 4 and produce, this product just solves this problem, make under the circumstances that it does not increase the cost, let the whole effectual heating element 4 that contacts of heat pipe 2, let the best condition of whole heat dissipation module's performance. When the contact size of the heating element 4 is determined, the heat pipe 2 is flattened twice by the technical scheme, so that the heat pipe 2 is effectively and completely contacted with the heating element 4 (see the attached figure 6). The heat conducting bottom plate fins 13 are fixedly connected to the top of the heat conducting bottom plate 1, so that the heat radiating performance is further improved, and the heat conducting bottom plate fins 13 and the heat conducting bottom plate 1 are integrally formed, so that the heat conducting property between the heat conducting bottom plate fins 13 and the heat conducting bottom plate 1 is high, and the integrity is strong.

Preferably, heat pipe 2 has a wall 111, a wick 112, and a cavity 113.

Preferably, wick 112 of heat pipe 2 may be a wicking layer or channel.

By adopting the above technical scheme, the wick 112 of the heat pipe 2 can be a groove and can be set into a groove, an axial thin groove is formed in the inner wall of the pipe wall 111 to provide a capillary head and a condensate flow passage, the cross section of the groove can be a channel with rectangular, trapezoidal, circular or variable cross section, and the liquid flow resistance of the groove-type wick 112 is very small, so that the high axial heat transfer capacity can be achieved, the radial heat resistance is small, the processing mode is simple, the difficulty is small, the price is relatively cheap, and the circulation effect can be also achieved.

Preferably, the heat pipe 2 is U-shaped, L-shaped or straight.

By adopting the technical scheme, the number of the heat conduction base plate heat pipe grooves 12 of the heat conduction base plate 1 is six, and the heat conduction base plate 1 is in size contact with the existing common heating element 4, and a contact surface formed by the bottom of the heat conduction base plate 1 and the bottom of the secondary flattened heat pipe 11 is in heat transfer contact with the heating element 4, so that the heat of the heating element 4 is conducted to the heat conduction base plate 1; the product performance is good, the process is easy to control, the original cost is not increased, and the problems that the contact surface of a heat source is small and the contact surface of an effective heat pipe 2 of a radiator is overlarge in the market are solved.

The working principle and the using method of the heat absorbing end structure for controlling the contact area by the direct contact type secondary forming of the heat pipe are explained as follows:

the heat pipe 2 is partially flattened (namely, the primary flattened heat pipe part 22 and the secondary flattened heat pipe part 21 in the attached drawing 11) to the size of the section D11 and D22, so that the heat pipe 2 can be smoothly placed into the heat-conducting base plate heat pipe groove 12 of the heat-conducting base plate 1 after being flattened for the first time; after 2 first flattens of heat pipe, can directly place 1 the inside of the heat conduction bottom plate of the corresponding size of design, carry out the secondary suppression again, realize that the secondary flattens, 2 local slappings of heat pipe promptly to cross-section D1 with D2 size, realize the embedding, need not weld or other adhesion, directly reach the fastening through the tight-fitting process and do not loosen and take off. The heat pipe is fastened in a heat conduction bottom plate heat pipe groove 12 of the heat conduction bottom plate 1 through external force, and the bottom of the heat pipe meets the flatness requirement. Under the condition that the cost is not increased, the heat pipe 2 is enabled to be in full effective contact with the heating element 4, the performance of the whole radiating module is enabled to be in the best state, the heating element 4 is in the state that the size and the length are determined, the heat pipe 2 is designed to be flattened for the second time through the technical scheme, the heat pipe 2 is enabled to be in effective complete contact with the heating element 4, the heat pipe 2 is connected with the radiating fins 3 through the heat pipe 2 through the heat conduction bottom plate 1, the heat conduction bottom plate 1 and the heat pipe 2 of the heat pipe are in heat conduction contact with the heating element 4, the heat of the heating element 4 is directly conducted to the heat pipe 2 through the heat conduction bottom plate 1, then is conducted to the radiating fins 3 through the heat pipe 2, and the radiating fins 3 radiate heat. And the heat conducting bottom plate fins 13 are integrally formed on the top of the heat conducting bottom plate 1, so that the heat radiating performance is further improved.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a heat pipe direct-touch post forming control area of contact's heat absorption end structure, includes heat conduction bottom plate (1), heat pipe (2), heat radiation fins (3), its characterized in that: the heat pipes (2) are embedded at the bottom of the heat conduction bottom plate (1) through pressing deformation, the heat conduction bottom plate (1) is connected with the heat dissipation fins (3) through the heat pipes (2), and the horizontal plane of the bottom of the heat pipe (2) at the bottom of the heat conduction bottom plate (1) is flush with the horizontal plane of the bottom of the heat conduction bottom plate (1); the bottom of the heat conduction bottom plate (1) is provided with a heat conduction bottom plate heat pipe groove (12).

2. The heat pipe direct-contact secondary forming contact area controlling heat absorption end structure according to claim 1, wherein: heat pipe (2) are equipped with once and flatten hot-pipe portion (22) and secondary and flatten hot-pipe portion (21), inlay the heat pipe part of heat conduction bottom plate (1) bottom and flatten hot-pipe portion (21) for the secondary, secondary is flattened hot-pipe portion (21) and is inlayed and carry out the secondary and flatten formation secondary and flatten heat pipe (11) in heat conduction bottom plate (1) bottom, makes its heat conduction bottom plate (1) bottom and secondary flatten heat pipe (11) bottom and be same horizontal plane, constitutes the contact surface with heating element (4) contact, heat conduction bottom plate (1) top fixed connection is equipped with heat conduction bottom plate fin (13).

3. The heat pipe direct-contact secondary forming contact area controlling heat absorption end structure according to claim 2, wherein: the cross sections of the primary flattened hot pipe part (22) and the secondary flattened hot pipe part (21) of the heat pipe (2) which are flattened for the first time are waist drum-shaped or oval.

4. A heat pipe direct-contact secondary forming contact area controlling heat-absorbing end structure according to claim 3, wherein: the heat pipe (2) is provided with a pipe wall (111), a liquid absorbing core (112) and a cavity (113).

5. The heat pipe direct-contact secondary forming contact area controlling heat absorption end structure according to claim 4, wherein: the wick (112) of the heat pipe (2) may be a wicking layer or a channel.

6. The heat pipe direct-contact secondary forming contact area controlling heat absorption end structure according to claim 1, wherein: the heat conduction bottom plate (1) is provided with a mounting hole (14).

7. The heat pipe direct-contact secondary forming contact area controlling heat absorption end structure according to claim 5, wherein: the heat pipe (2) is U-shaped, L-shaped or straight.

8. A heat pipe direct-contact type secondary forming contact area controlling heat-absorbing end structure according to any one of claims 2 to 7, wherein: the heat conduction bottom plate (1) is arranged below the heat dissipation fins (3), and the cavity (113) of the heat pipe (2) contains condensate.

9. The heat pipe direct-contact secondary forming contact area controlling heat absorption end structure according to claim 2, wherein: the number of the heat conduction bottom plate heat pipe grooves (12) of the heat conduction bottom plate (1) is six, and a contact surface formed by the bottom of the heat conduction bottom plate (1) and the bottom of the secondary flattened heat pipe (11) is in heat transfer contact with the heating element (4).