CN213755415U

CN213755415U - Channel gate integrated circuit board

Info

Publication number: CN213755415U
Application number: CN202023058518.0U
Authority: CN
Inventors: 王世普
Original assignee: Shenzhen Enjoy Parking Intelligent Technology Co ltd
Current assignee: Shenzhen Enjoy Parking Intelligent Technology Co ltd
Priority date: 2020-12-18
Filing date: 2020-12-18
Publication date: 2021-07-20
Anticipated expiration: 2030-12-18

Abstract

The utility model discloses a passageway floodgate integrated circuit board relates to passageway floodgate integrated circuit board field, including the protecting frame, the top both sides of protecting frame all are connected with the buffering post, and the top of buffering post is connected with the shock attenuation board, and the top of shock attenuation board is provided with the arch, and the bottom of shock attenuation board is connected with flexible pole. The utility model discloses a blotter, the shock attenuation board, arch and elastic rod, the protection frame protects circuit board main part chamber, the buffer cavity who constitutes between the blotter of protection frame outer lane and the protection frame reduces the impact force when circuit board main part collides with external object, when receiving the collision extrusion, the shock attenuation board receives the extrusion elastic rod, the elastic rod receives the extrusion crooked power that receives the shock attenuation board and disperses, the arch of rubber material is extruded, the arch is protected the shock attenuation board, at this moment, the shock attenuation board carries out the shock attenuation to the protection frame, thereby reduce rocking of circuit board main part, prevent that the electronic component of circuit board main part is not hard up.

Description

Channel gate integrated circuit board

Technical Field

The utility model relates to a passageway floodgate integrated circuit board field specifically is a passageway floodgate integrated circuit board.

Background

The integrated circuit board is a miniature electronic device or component, is a carrier for loading the integrated circuit, and is required to be used when a channel gate is used.

The existing integrated circuit board is single in structure, when the integrated circuit board is used on a channel gate, edge damage and cracking on the integrated circuit board are easily caused after collision, electronic components on the surface of the integrated circuit board are easily loosened, and the integrated circuit board is difficult to improve the heat dissipation efficiency of an original heat dissipation fin when the integrated circuit board is used, so that the use effect of the integrated circuit board is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: in order to solve the problems that electronic components are easy to loosen and poor in heat dissipation effect after being collided, the channel gate integrated circuit board is provided.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a passageway floodgate integrated circuit board, includes the protective frame, the top both sides of protective frame all are connected with the buffering post, the top of buffering post is connected with the shock attenuation board, the top of shock attenuation board is provided with the arch, the bottom of shock attenuation board is connected with the elastic rod, the outer lane of protective frame is provided with the blotter, the internally mounted of protective frame has the circuit board main part, the outside of circuit board main part is provided with the heat dissipation layer, the top and the bottom of circuit board main part all are connected with radiating fin through the heat dissipation short-flat, the louvre has been seted up at the top of protective frame.

Preferably, the buffer pads are provided in plurality, and the plurality of buffer pads are annularly distributed on the outer ring of the protective frame.

Preferably, the bulges are provided with a plurality of bulges, and the bulges are all made of rubber materials.

Preferably, the heat dissipation short pieces, the heat dissipation fins and the heat dissipation holes are all provided in plurality, and the plurality of heat dissipation short pieces, the heat dissipation fins and the heat dissipation holes are correspondingly arranged.

Preferably, the shock absorption plate, the buffer column and the buffer pad are made of rubber materials.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a blotter, the shock attenuation board, arch and elastic rod, the user overlaps the protective frame in the outside of circuit board main part, the protective frame protects circuit board main part chamber, the buffer cavity body that constitutes between the blotter of protective frame outer lane and the protective frame reduces the impact force when circuit board main part collides with external object, when receiving the collision extrusion, the shock attenuation board receives the extrusion of stress elastic rod, the elastic rod receives the extrusion bending and disperses the power that the shock attenuation board received, the arch of rubber material is extruded, the arch protects the shock attenuation board, at this moment, the shock attenuation board carries out the shock attenuation to the protective frame, thereby reduce the rocking of circuit board main part, prevent that the electronic component of circuit board main part from becoming flexible;

2. the utility model discloses a heat dissipation layer, heat dissipation short piece, radiating fin and louvre when the circuit board operation, carry out the heat dissipation through the heat dissipation layer and handle the circuit board main part, prolong the life of circuit board main part, the heat dissipation layer with heat transmission to heat dissipation short piece, the heat dissipation short piece passes through radiating fin and conveys the heat to the louvre with the heat and discharge the heat.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of the protection frame of the present invention;

fig. 3 is an enlarged schematic structural view of a point a in fig. 1 according to the present invention;

fig. 4 is a schematic view of the protective frame of the present invention.

In the figure: 1. a protective frame; 2. a circuit board main body; 3. a heat dissipation layer; 4. heat dissipation holes; 5. a heat dissipating fin; 6. a heat-dissipating short piece; 7. a damper plate; 8. an elastic rod; 9. a buffer column; 10. a protrusion; 11. a cushion pad.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "connected" and "disposed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. The following describes an embodiment of the present invention according to its overall structure.

Referring to fig. 1-4, a channel gate integrated circuit board comprises a protective frame 1, a circuit board main body 2, a heat dissipation layer 3, heat dissipation holes 4, heat dissipation fins 5, heat dissipation short pieces 6, a shock absorption plate 7, an elastic rod 8, a buffer column 9, a protrusion 10 and a buffer pad 11, wherein both sides of the top of the protective frame 1 are connected with the buffer column 9, the top of the buffer column 9 is connected with the shock absorption plate 7, the top of the shock absorption plate 7 is provided with the protrusion 10, the bottom of the shock absorption plate 7 is connected with the elastic rod 8, the outer ring of the protective frame 1 is provided with the buffer pad 11, the circuit board main body 2 is installed inside the protective frame 1, the heat dissipation layer 3 is arranged outside the circuit board main body 2, the top and the bottom of the circuit board main body 2 are both connected with the heat dissipation fins 5 through the heat dissipation short pieces 6, the heat dissipation holes 4 are formed in the top of the protective frame 1, a user sleeves the protective frame 1 outside the circuit board main body 2, the protection frame 1 protects the circuit board main body cavity.

Please refer to fig. 1, the plurality of buffering pads 11 are disposed, and the plurality of buffering pads 11 are annularly distributed on the outer ring of the protection frame 1, and a buffering cavity formed between the buffering pads 11 on the outer ring of the protection frame 1 and the protection frame 1 reduces the impact force when the circuit board main body 2 collides with an external object.

Please refer to fig. 1 and 3, a plurality of protrusions 10 are provided, and the plurality of protrusions 10 are made of rubber, the protrusions 10 made of rubber are extruded, and the protrusions 10 protect the damping plate 7.

Please refer to fig. 2 and 4, the plurality of heat dissipation short pieces 6, the plurality of heat dissipation fins 5 and the plurality of heat dissipation holes 4 are disposed correspondingly, the heat dissipation layer 3 is used to perform heat dissipation processing on the circuit board main body 2 to prolong the service life of the circuit board main body 2, the heat dissipation layer 3 transmits heat to the plurality of heat dissipation short pieces 6, and the plurality of heat dissipation short pieces 6 transmits heat to the plurality of heat dissipation holes 4 through the plurality of heat dissipation fins 5 to discharge the heat.

Please refer to fig. 1, 3 and 4, the damping plate 7, the cushion pillar 9 and the cushion pad 11 are made of rubber, when the damping plate 7 is extruded by collision, the elastic rod 8 is extruded by the force of the damping plate 7, and the elastic rod 8 is extruded and bent to disperse the force of the damping plate 7.

The working principle is as follows: firstly, a user sleeves the protective frame 1 outside the circuit board main body 2, the protective frame 1 protects a cavity of the circuit board main body, a buffer cavity formed between the buffer pad 11 on the outer ring of the protective frame 1 and the protective frame 1 reduces the impact force when the circuit board main body 2 collides with an external object, when the circuit board main body is collided and extruded, the shock absorption plate 7 is extruded by the elastic rod 8, the elastic rod 8 is extruded and bent to disperse the force applied to the shock absorption plate 7, the bulge 10 made of rubber is extruded, the bulge 10 protects the shock absorption plate 7, at the moment, the shock absorption plate 7 absorbs shock to the protective frame 1, so that the shaking of the circuit board main body 2 is reduced, the electronic elements of the circuit board main body 2 are prevented from loosening, when the circuit board operates, the heat dissipation treatment is carried out on the circuit board main body 2 through the heat dissipation layer 3, the service life of the circuit board main body 2 is prolonged, the heat dissipation layer 3 transmits the heat to the heat dissipation short sheet 6, the heat dissipation short fins 6 transfer heat to the heat dissipation holes 4 through the heat dissipation fins 5 to discharge the heat.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A channel gate integrated circuit board, includes protective frame (1), its characterized in that: the improved shock absorption structure is characterized in that buffering columns (9) are connected to two sides of the top of the protection frame (1), damping plates (7) are connected to the top of the buffering columns (9), protrusions (10) are arranged at the top of the damping plates (7), elastic rods (8) are connected to the bottom of the damping plates (7), buffering pads (11) are arranged on the outer ring of the protection frame (1), a circuit board main body (2) is arranged inside the protection frame (1), a heat dissipation layer (3) is arranged outside the circuit board main body (2), heat dissipation fins (5) are connected to the top and the bottom of the circuit board main body (2) through heat dissipation short pieces (6), and heat dissipation holes (4) are formed in the top of the protection frame (1).

2. The channel gate integrated circuit board of claim 1, wherein: the buffer pads (11) are arranged in a plurality of numbers, and the buffer pads (11) are annularly distributed on the outer ring of the protective frame (1).

3. The channel gate integrated circuit board of claim 1, wherein: the bulges (10) are provided with a plurality of bulges (10) which are made of rubber materials.

4. The channel gate integrated circuit board of claim 1, wherein: the heat dissipation short sheets (6), the heat dissipation fins (5) and the heat dissipation holes (4) are arranged in a plurality of numbers, and the heat dissipation short sheets (6), the heat dissipation fins (5) and the heat dissipation holes (4) are arranged correspondingly.

5. The channel gate integrated circuit board of claim 1, wherein: the damping plate (7), the buffering columns (9) and the buffering pads (11) are all made of rubber materials.