CN216313392U - PCBA circuit board for bluetooth headset with fall buffer function - Google Patents
PCBA circuit board for bluetooth headset with fall buffer function Download PDFInfo
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- CN216313392U CN216313392U CN202123005611.XU CN202123005611U CN216313392U CN 216313392 U CN216313392 U CN 216313392U CN 202123005611 U CN202123005611 U CN 202123005611U CN 216313392 U CN216313392 U CN 216313392U
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- bluetooth headset
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Abstract
The utility model discloses a PCBA circuit board for a Bluetooth headset with a drop buffering function, relates to the field of Bluetooth headsets, and aims to solve the problems that the damping and buffering effects of most of Bluetooth headsets are not ideal enough, the PCBA circuit board in the Bluetooth headset is easy to break when the headset falls on the ground, the Bluetooth headset is damaged, and the use efficiency of the Bluetooth headset is reduced. The Bluetooth headset protection device is novel in structure, can effectively protect the PCBA in the Bluetooth headset, and avoids the condition that the PCBA is damaged due to the falling of the Bluetooth headset, so that the protection efficiency of the Bluetooth headset is improved.
Description
Technical Field
The utility model relates to the field of Bluetooth headsets, in particular to a PCBA circuit board with a falling buffer function for a Bluetooth headset.
Background
The Bluetooth earphone applies the Bluetooth technology to the hands-free earphone, so that users can avoid annoying wiring stumbling and can easily talk in various ways. Since the advent of bluetooth headsets, it has been a good tool for the mobile commerce industry to increase efficiency.
Although convenient to use, the condition that drops takes place very easily wearing the in-process, if bluetooth headset's shock attenuation buffering effect is not ideal enough, the earphone drops and leads to the inside PCBA circuit board of bluetooth headset to break easily on the ground to lead to bluetooth headset to damage, reduced bluetooth headset's availability factor's problem. Therefore, in order to solve such problems, we propose a PCBA circuit board for a bluetooth headset having a drop buffering function.
SUMMERY OF THE UTILITY MODEL
The PCBA circuit board for the Bluetooth headset with the falling buffering function solves the problems that the damping buffering effect of most of Bluetooth headsets is not ideal enough, and the PCBA circuit board in the Bluetooth headset is easy to break when the headset falls on the ground, so that the Bluetooth headset is damaged, and the using efficiency of the Bluetooth headset is reduced.
In order to achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides a PCBA circuit board for bluetooth earphone with drop buffer function, includes bluetooth earphone body and mounting box, the PCBA board is installed in the mounting box, just the mounting groove has been seted up in the bluetooth earphone body, the equal fixed mounting of both ends inner wall has damper about the mounting groove, the mounting box is installed in two between the damper, just buffer gear is installed to the mounting groove lateral wall all around, buffer gear installs in the lateral wall all around of mounting box, just first radiator-grid has all been seted up in the upper and lower both sides lateral wall of mounting box.
Through adopting above-mentioned technical scheme, the PCBA board sets up in the mounting box, carries out effectual protection to be equipped with first radiator-grid in the both sides of mounting box, be convenient for carry out the heat dissipation to the PCBA board and handle.
Preferably, one side of the Bluetooth headset body is provided with a plurality of heat dissipation holes with the same structure through the mounting groove, and one side of the Bluetooth headset body, which is far away from the heat dissipation holes, is provided with a second heat dissipation net which runs through the side wall of the Bluetooth headset body.
Through adopting above-mentioned technical scheme, the louvre and the second radiator-grid that set up can effectively carry out the heat dissipation to the part in the mounting groove and handle.
Preferably, damper includes first stopper, spout, second stopper, gag lever post and spliced pole, just the equal fixed mounting in upper and lower both sides inner wall of mounting groove has the same second stopper of a plurality of structures, slidable mounting has two gag lever posts that are the symmetric distribution in the second stopper, and two the gag lever post is crisscross distribution, the gag lever post lateral wall runs through and has seted up the spout, and two sliding connection is equipped with the spliced pole in the spout of gag lever post, the one end slidable mounting that the second stopper was kept away from to two gag lever posts is in first stopper, just first stopper fixed mounting is in the lateral wall of mounting box.
Through adopting above-mentioned technical scheme, two gag lever posts slide in first stopper and second stopper, slide to the shift position card and die, avoid mounting box and PCBA circuit board to suffer the extrusion and lead to damaging.
Preferably, damper still includes damping spring, just the inner wall fixed mounting in both sides has a plurality of damping spring that the structure is the same about the mounting groove, damping spring keeps away from the one end and the mounting box fixed connection of mounting groove lateral wall.
Through adopting above-mentioned technical scheme, the damping spring of mounting box both sides carries out effective shock attenuation protection to the mounting box.
Preferably, buffer gear includes first buffer spring and second buffer spring, just the equal fixed mounting of mounting groove both sides inner wall has two first buffer springs that are the symmetric distribution, the equal fixed mounting of the both sides inner wall of the first buffer spring of mounting groove perpendicular to has two second buffer springs that the structure is the same.
Through adopting above-mentioned technical scheme, the first buffer spring and the second buffer spring that set up carry out buffering processing to the mounting box.
Preferably, buffer gear still includes the buffering frame, just the buffering frame is installed in the lateral wall all around of mounting box, the buffering frame is articulated mutually by a plurality of buffering strips and is constituteed, just the lateral wall of buffering frame respectively with a plurality of first buffer spring and a plurality of second buffer spring is connected.
Through adopting above-mentioned technical scheme, the buffering frame that the mounting box set up all around carries on spacingly to the mounting box, reduces the range of motion of mounting box.
The utility model has the beneficial effects that:
1. both ends all are equipped with the structure about the mounting box and have the same stop gear, can effectively avoid mounting box and PCBA board to receive the extrusion, carry out the first layer protection to the PCBA board through the cooperation with damping spring.
2. The periphery of the mounting box is provided with the buffering frame, the moving range of the mounting box is limited through the buffering frame, the shaking range of the mounting box is reduced, the buffering treatment is carried out through the matching of the first buffering spring and the second buffering spring, and the second layer protection is carried out on the PCBA.
In conclusion, the protection device can effectively protect the PCBA in the Bluetooth headset, and avoid the condition that the PCBA is damaged due to the falling of the Bluetooth headset, so that the protection efficiency of the Bluetooth headset is improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a top cross-sectional view of the present invention;
FIG. 3 is a side sectional view of the present invention;
FIG. 4 is an enlarged view of A of FIG. 3 according to the present invention.
Reference numbers in the figures: 1. a Bluetooth earphone body; 2. heat dissipation holes; 3. mounting a box; 4. a buffer frame; 5. mounting grooves; 6. a first buffer spring; 7. a first stopper; 8. a first heat-dissipating mesh; 9. a second buffer spring; 10. a damping spring; 11. a chute; 12. a second heat-dissipating mesh; 13. a second limiting block; 14. a limiting rod; 15. connecting columns.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-3, a PCBA circuit board for bluetooth earphone with drop buffer function, including bluetooth earphone body 1 and mounting box 3, the PCBA board is installed in mounting box 3, and set up mounting groove 5 in the bluetooth earphone body 1, the equal fixed mounting of both ends inner wall has damper about the mounting groove 5, mounting box 3 is installed between two damper, and mounting groove 5 lateral wall all around installs damper, damper installs in mounting box 3 lateral wall all around, and mounting box 3 upper and lower both sides lateral wall all runs through and has seted up first radiator-grid 8, the PCBA board sets up in mounting box 3, carry out effectual protection, and be equipped with first radiator-grid 8 in mounting box 3's both sides, be convenient for carry out the thermal treatment to the PCBA board.
Referring to fig. 1-2, one side of the bluetooth headset body 1 penetrates through the mounting groove 5 and is provided with a plurality of heat dissipation holes 2 with the same structure, one side of the bluetooth headset body 1, which is far away from the heat dissipation holes 2, is provided with a second heat dissipation net 12, the second heat dissipation net 12 penetrates through the side wall of the bluetooth headset body 1, and the heat dissipation holes 2 and the second heat dissipation net 12 can effectively perform heat dissipation processing on parts in the mounting groove 5.
Referring to fig. 2-4, the damping mechanism includes a first stopper 7, a sliding groove 11, a second stopper 13, two stoppers 14 and a connecting post 15, wherein a plurality of second stoppers 13 with the same structure are fixedly mounted on the inner walls of the upper and lower sides of the mounting groove 5, two stoppers 14 are symmetrically arranged in the second stopper 13 in a sliding manner, the two stoppers 14 are staggered, the sliding groove 11 is formed in the side wall of each stopper 14, the connecting post 15 is slidably connected in the sliding groove 11 of the two stoppers 14, one end of each stopper 14, which is far away from the second stopper 13, is slidably mounted in the first stopper 7, the first stopper 7 is fixedly mounted on the side wall of the mounting box 3, the two stoppers 14 slide in the first stopper 7 and the second stopper 13 and are locked by sliding to a moving position, so as to prevent the mounting box 3 and the PCBA circuit board from being damaged by extrusion, the damping mechanism further includes a damping spring 10, and the inner wall fixed mounting in both sides has a plurality of damping spring 10 that the structure is the same about mounting groove 5, and damping spring 10 keeps away from the one end and the mounting box 3 fixed connection of 5 lateral walls of mounting groove, and damping spring 10 of 3 both sides of mounting box carries out effective shock attenuation protection to mounting box 3.
Referring to fig. 2-3, the buffer mechanism includes a first buffer spring 6 and a second buffer spring 9, two first buffer springs 6 are symmetrically installed on the inner walls of two sides of the installation groove 5, two second buffer springs 9 with the same structure are installed on the inner walls of two sides of the installation groove 5 perpendicular to the first buffer springs 6, the buffer mechanism further includes a buffer frame 4, the buffer frame 4 is installed on the peripheral side wall of the installation box 3, the buffer frame 4 is formed by hinging a plurality of buffer strips, the side wall of the buffer frame 4 is respectively connected with the plurality of first buffer springs 6 and the plurality of second buffer springs 9, the arranged first buffer springs 6 and the arranged second buffer springs 9 buffer the buffer frame 4, the arranged first buffer springs 6 and the arranged second buffer springs 9 buffer the installation box 3, the buffer frame 4 arranged around the installation box 3 limits the installation box 3, the range of motion of the mounting box 3 is reduced.
The working principle is as follows: when the Bluetooth headset is used, the heat dissipation holes 2 and the second heat dissipation nets 12 arranged on the two sides of the Bluetooth headset body 1 can effectively dissipate heat of parts in the installation groove 5, the PCBA is placed in the installation box 3, safety protection performance of the PCBA is improved, the first heat dissipation nets 8 are arranged on the two lower sides of the installation box 3, and the PCBA in the installation box 3 is dissipated through the first heat dissipation nets 8.
When bluetooth headset drops because of carelessness, two gag lever posts 14 slide in first stopper 7 and second stopper 13, it dies to slide the shift position card, avoid mounting box 3 and PCBA circuit board to suffer the extrusion and lead to damaging, the damping spring 10 of 3 both sides of mounting box carries out effective shock attenuation protection to mounting box 3 this moment, the buffering frame 4 that mounting box 3 set up all around carries on spacingly to mounting box 3, reduce the motion range of mounting box 3, the first buffer spring 6 and the second buffer spring 9 of setting cushion the removal of buffering frame 4 this moment, thereby improve the protective effect to the PCBA board.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (6)
1. The utility model provides a PCBA circuit board for bluetooth earphone with fall buffer function, includes bluetooth earphone body (1) and mounting box (3), its characterized in that, the PCBA board is installed in mounting box (3), just mounting groove (5) have been seted up in bluetooth earphone body (1), the equal fixed mounting in both ends inner wall has damper about mounting groove (5), mounting box (3) are installed in two between the damper, just damper is installed to mounting groove (5) lateral wall all around, damper installs in the lateral wall all around of mounting box (3), just first radiator-grid (8) have all been run through to the upper and lower both sides lateral wall of mounting box (3).
2. The PCBA circuit board with the falling buffering function for the Bluetooth headset according to claim 1, wherein a plurality of heat dissipation holes (2) with the same structure are formed in one side of the Bluetooth headset body (1) through a mounting groove (5), a second heat dissipation net (12) is formed in one side, away from the heat dissipation holes (2), of the Bluetooth headset body (1), and the second heat dissipation net (12) penetrates through the side wall of the Bluetooth headset body (1).
3. The PCBA circuit board with the falling buffering function for the Bluetooth headset according to claim 1, wherein the damping mechanism comprises a first limiting block (7), a sliding groove (11), a second limiting block (13), limiting rods (14) and a connecting column (15), a plurality of second limiting blocks (13) with the same structure are fixedly mounted on the inner walls of the upper side and the lower side of the mounting groove (5), two limiting rods (14) are symmetrically arranged in the second limiting block (13) in a sliding manner, the two limiting rods (14) are distributed in a staggered manner, the sliding groove (11) is formed in the side wall of each limiting rod (14) in a penetrating manner, the connecting column (15) is arranged in the sliding groove (11) of the two limiting rods (14) in a sliding manner, one end of each limiting rod (14) far away from the second limiting block (13) is slidably mounted in the first limiting block (7), and the first limiting block (7) is fixedly arranged on the side wall of the mounting box (3).
4. The PCBA circuit board with the fall buffering function for the Bluetooth headset of claim 3, wherein the damping mechanism further comprises a damping spring (10), a plurality of damping springs (10) with the same structure are fixedly mounted on the inner walls of the upper side and the lower side of the mounting groove (5), and one end, far away from the side wall of the mounting groove (5), of each damping spring (10) is fixedly connected with the mounting box (3).
5. The PCBA circuit board with the falling buffering function for the Bluetooth headset of claim 1, wherein the buffering mechanism comprises a first buffering spring (6) and a second buffering spring (9), two first buffering springs (6) are symmetrically arranged on the inner walls of two sides of the mounting groove (5) in a fixed mode, and two second buffering springs (9) with the same structure are arranged on the inner walls of two sides, perpendicular to the first buffering springs (6), of the mounting groove (5) in a fixed mode.
6. The PCBA circuit board with the falling buffering function for the Bluetooth headset of claim 5, wherein the buffering mechanism further comprises a buffering frame (4), the buffering frame (4) is mounted on the peripheral side wall of the mounting box (3), the buffering frame (4) is formed by hinging a plurality of buffering strips, and the side wall of the buffering frame (4) is respectively connected with the plurality of first buffering springs (6) and the plurality of second buffering springs (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123005611.XU CN216313392U (en) | 2021-12-02 | 2021-12-02 | PCBA circuit board for bluetooth headset with fall buffer function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123005611.XU CN216313392U (en) | 2021-12-02 | 2021-12-02 | PCBA circuit board for bluetooth headset with fall buffer function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216313392U true CN216313392U (en) | 2022-04-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123005611.XU Active CN216313392U (en) | 2021-12-02 | 2021-12-02 | PCBA circuit board for bluetooth headset with fall buffer function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216313392U (en) |
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2021
- 2021-12-02 CN CN202123005611.XU patent/CN216313392U/en active Active
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Address after: 518000, Building A, No. 66 Longwo Second Road, Longtian Community, Longtian Street, Pingshan District, Shenzhen City, Guangdong Province, China. Ruofei Company Comprehensive Building No. 401 Patentee after: Shenzhen Youyi Technology Co.,Ltd. Address before: 518000 Room 201, building a, Zhuoke science and Technology Park, 190 Chongqing Road, Heping community, Fuhai street, Bao'an District, Shenzhen, Guangdong Province Patentee before: Shenzhen Youyi Technology Co.,Ltd. |