CN212542406U

CN212542406U - Semiconductor device package with shock absorption

Info

Publication number: CN212542406U
Application number: CN202021642649.0U
Authority: CN
Inventors: 周明; 伍林; 范红亮; 顾礼建
Original assignee: Jiangsu Mingxin Microelectronics Co ltd
Current assignee: Jiangsu Mingxin Microelectronics Co ltd
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2021-02-12
Anticipated expiration: 2030-08-10

Abstract

The utility model discloses a semiconductor device encapsulates with absorbing, concretely relates to semiconductor device technical field, which comprises a housin, the top of casing is provided with dustproof construction, the inside bottom of casing is provided with heat radiation structure, heat radiation structure's top is provided with solid crystal layer, the top fixedly connected with semiconductor chip on solid crystal layer, the bottom of casing is provided with the backup pad, be provided with shock-absorbing structure between casing and the backup pad, bottom plate fixed connection is in the both sides on the inside top of backup pad. The utility model discloses a be provided with baffle, heat pipe, fin, standing groove and heat dissipation ventilation hole, during the use, on the heat that semiconductor chip long-time operation produced passes through the leading-in fin of heat pipe, the baffle is with firm semiconductor chip's use, and the heat is discharged through heat dissipation ventilation hole after leading-in fin, is convenient for discharge inside heat, prevents that the heat from causing the damage to inside spare part, has improved the life-span of using.

Description

Semiconductor device package with shock absorption

Technical Field

The utility model relates to a semiconductor device technical field specifically is a semiconductor device encapsulation with shock attenuation.

Background

At present, the application range of semiconductor devices is more and more extensive, the variety of semiconductor devices is various, and the function and use are also different, and the semiconductor devices need to be packaged and used when using, and the current semiconductor device packaging still has some problems, and the shock attenuation effect is relatively poor, receives when external collision, makes inside spare part drop easily, influences semiconductor device's result of use.

In the process of implementing the present invention, the inventor finds that at least the following problems exist in the prior art and are not solved:

(1) the traditional semiconductor device packaging has insufficient buffering effect, and internal parts are easy to fall off when being collided;

(2) the traditional semiconductor device packaging has poor heat dissipation effect, and cannot dissipate internal heat in time, so that the use of internal parts is influenced;

(3) in the conventional semiconductor device package, the semiconductor device is in contact with air for a long time, dust is easily accumulated, and the dust enters the interior to reduce the use effect of elements.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor device encapsulation with shock attenuation to propose the not enough problem of buffering effect in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor device package with shock absorption comprises a shell, wherein a dustproof structure is arranged at the top end of the shell, a heat dissipation structure is arranged at the bottom end inside the shell, a solid crystal layer is arranged at the top end of the heat dissipation structure, a semiconductor chip is fixedly connected to the top end of the solid crystal layer, a support plate is arranged at the bottom end of the shell, and a shock absorption structure is arranged between the shell and the support plate;

shock-absorbing structure includes the roof, roof fixed connection is in the both sides of casing bottom, be provided with the bottom plate under the roof, bottom plate fixed connection is in the both sides on the inside top of backup pad, the equal fixedly connected with activity cover stock in the bottom of roof and the top of bottom plate, the equal swing joint of intermediate position department between the activity cover stock has buffer spring, the equal swing joint in both sides between the activity cover stock has the hinge bar.

Preferably, the outer diameter of the buffer spring is smaller than the inner diameter of the movable sleeve block, and a telescopic structure is formed between the buffer spring and the movable sleeve block.

Preferably, the buffer springs are symmetrically distributed about a vertical center line of the housing.

Preferably, heat radiation structure comprises baffle, heat pipe, fin, standing groove and heat dissipation ventilation hole, baffle fixed connection is in the bottom of solid crystal layer, the bottom fixedly connected with heat pipe of baffle, the bottom of heat pipe is provided with the standing groove, the inside of standing groove is provided with the multiunit fin, and the one end of fin and heat pipe is connected, heat radiation structure is including the heat dissipation ventilation hole, heat dissipation ventilation hole fixed connection is in the intermediate position department of casing bottom.

Preferably, the fins are equal in size, and are arranged in the placing groove at equal intervals.

Preferably, dustproof construction comprises placing seat, first dust guard, adhesive linkage, second dust guard and silica gel sealing washer, place seat fixed connection on the top of casing, place the first dust guard of the inside top fixedly connected with of seat, place the inside bottom fixedly connected with second dust guard of seat, place the inside intermediate position department fixedly connected with adhesive linkage of seat, dustproof construction includes the silica gel sealing washer, silica gel sealing washer fixed connection is on the inside top of casing.

Preferably, the first dust guard plate and the second dust guard plate have the same thickness, and the second dust guard plate is bonded to the first dust guard plate through a bonding layer.

Compared with the prior art, the beneficial effects of the utility model are that: the semiconductor device package with the shock absorption not only realizes a shock absorption structure, effectively protects the use of the semiconductor device, realizes a heat dissipation structure, effectively dissipates internal heat, but also realizes a dust removal structure and protects the use effect of internal elements;

(1) by arranging the top plate, the bottom plate, the movable sleeve block, the buffer spring and the hinge rod, when the buffer device is used, the buffer spring is arranged between the shell and the support plate, when external impact force is applied, the buffer spring is stressed and extruded towards the inside of the movable sleeve block, the stability during buffering is ensured by the bottom plate and the top plate, the hinge rods are movably hinged to two sides of the movable sleeve block, when the buffer spring is stressed and buffered in the movable sleeve block, the hinge rods are closer and closer along with the reduction of the distance between the bottom plate and the top plate, the stability during use is improved, the damage of internal parts is avoided, and the efficiency is increased;

(2) by arranging the partition plate, the heat conduction pipe, the fins, the placing groove and the heat dissipation vent hole, when the heat dissipation device is used, heat generated by long-time operation of the semiconductor chip is guided into the fins through the heat conduction pipe, the partition plate is used for stabilizing the semiconductor chip, and the heat is discharged through the heat dissipation vent hole after being guided into the fins, so that the heat in the semiconductor chip can be conveniently discharged, the damage of the heat to internal parts is prevented, and the service life is prolonged;

(3) through being provided with and placing the seat, first dust guard, the adhesive linkage, second dust guard and silica gel sealing washer, in use, the device is placed in the air for a long time, the surface accumulates the dust easily, the top of casing is connected with places the seat, the inside of placing the seat bonds through the adhesive linkage has first dust guard and second dust guard, first dust guard and second dust guard have played dirt-proof effect, can block the inside that external dust got into the casing, and the silica gel sealing washer is connected at the inside top of casing, avoid the dust to get into inside and cause the damage to inside spare part, the security of using has been increased.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

fig. 2 is a schematic view of a front partial section structure of the placement groove of the present invention;

fig. 3 is an enlarged partial sectional view of the utility model at a in fig. 1;

fig. 4 is a schematic view of a front view partial section structure of the second dust guard of the present invention.

In the figure: 1. a support plate; 2. a heat dissipation structure; 201. a partition plate; 202. a heat conducting pipe; 203. a fin; 204. a placement groove; 205. a heat dissipation vent; 3. a housing; 4. a dust-proof structure; 401. a placing seat; 402. a first dust-proof plate; 403. an adhesive layer; 404. a second dust-proof plate; 405. a silica gel seal ring; 5. a semiconductor chip; 6. solidifying a crystal layer; 7. a hinged lever; 8. a buffer spring; 9. a base plate; 10. a movable sleeve block; 11. a top plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Example 1: referring to fig. 1-4, a semiconductor device package with shock absorption includes a housing 3, a dustproof structure 4 is disposed at the top end of the housing 3, a heat dissipation structure 2 is disposed at the bottom end inside the housing 3, a die bonding layer 6 is disposed at the top end of the heat dissipation structure 2, a semiconductor chip 5 is fixedly connected to the top end of the die bonding layer 6, a support plate 1 is disposed at the bottom end of the housing 3, and a shock absorption structure is disposed between the housing 3 and the support plate 1;

referring to fig. 1-4, a semiconductor device package with shock absorption further includes a shock absorption structure, the shock absorption structure includes a top plate 11, the top plate 11 is fixedly connected to two sides of the bottom end of the housing 3, a bottom plate 9 is disposed under the top plate 11, the bottom plate 9 is fixedly connected to two sides of the top end inside the support plate 1, the bottom end of the top plate 11 and the top end of the bottom plate 9 are both fixedly connected with movable sleeve blocks 10, buffer springs 8 are movably connected to the middle positions between the movable sleeve blocks 10, the buffer springs 8 are symmetrically distributed about the vertical center line of the housing 3, the outer diameter of the buffer springs 8 is smaller than the inner diameter of the movable sleeve blocks 10, a telescopic structure is formed between the buffer springs 8 and the movable sleeve blocks 10, and hinge rods 7 are movably hinged to two sides between the movable;

specifically, as shown in fig. 1 and 3, buffer spring 8 is disposed between housing 3 and supporting plate 1, when external impact force is applied, buffer spring 8 is stressed to extrude inside of movable sleeve 10, bottom plate 9 and top plate 11 ensure stability during buffering, and hinge rod 7 is movably hinged on two sides of movable sleeve 10, when buffer spring 8 is stressed and buffered inside of movable sleeve 10, hinge rod 7 is also closer and closer along with reduction of distance between bottom plate 9 and top plate 11, stability of use is improved, internal parts are prevented from being damaged, and efficiency is increased.

Example 2: the heat dissipation structure 2 comprises a partition plate 201, a heat pipe 202, fins 203, a placing groove 204 and heat dissipation vent holes 205, the partition plate 201 is fixedly connected to the bottom end of the solidified crystal layer 6, the heat pipe 202 is fixedly connected to the bottom end of the partition plate 201, the placing groove 204 is arranged at the bottom end of the heat pipe 202, a plurality of groups of fins 203 are arranged inside the placing groove 204, the sizes of the fins 203 are equal, the fins 203 are arranged inside the placing groove 204 at equal intervals, the fins 203 are connected with one end of the heat pipe 202, the heat dissipation structure 2 comprises the heat dissipation vent holes 205, and the heat dissipation vent holes 205 are fixedly connected to the middle position of the bottom;

specifically, as shown in fig. 1 and 2, heat generated by long-time operation of the semiconductor chip 5 is introduced to the fins 203 through the heat conducting pipes 202, the partition plate 201 stabilizes the use of the semiconductor chip 5, and the heat is discharged through the heat dissipating vent holes 205 after being introduced into the fins 203, so that the heat inside the semiconductor chip is conveniently discharged, the heat is prevented from damaging the internal components, and the service life of the semiconductor chip is prolonged.

Example 3: the dustproof structure 4 comprises a placing seat 401, a first dustproof plate 402, an adhesive layer 403, a second dustproof plate 404 and a silica gel sealing ring 405, the placing seat 401 is fixedly connected to the top end of the shell 3, the top end inside the placing seat 401 is fixedly connected with the first dustproof plate 402, the thicknesses of the first dustproof plate 402 and the second dustproof plate 404 are equal, the first dustproof plate 402 is adhered with the second dustproof plate 404 through the adhesive layer 403, the bottom end inside the placing seat 401 is fixedly connected with the second dustproof plate 404, the adhesive layer 403 is fixedly connected to the middle position inside the placing seat 401, the dustproof structure 4 comprises the silica gel sealing ring 405, and the silica gel sealing ring 405 is fixedly connected to the top end inside the shell 3;

specifically, as shown in fig. 1 and 4, the device is placed in the air for a long time, dust is easily accumulated on the surface, the top of the housing 3 is connected with the placing seat 401, the inside of the placing seat 401 is bonded with the first dust guard 402 and the second dust guard 404 through the bonding layer 403, the first dust guard 402 and the second dust guard 404 have a dust-proof effect, the external dust can be prevented from entering the housing 3, and the silica gel sealing ring 405 is connected to the top inside the housing 3, so that the dust is prevented from entering the inside and damaging the internal parts, and the use safety is improved.

The working principle is as follows: the utility model discloses when using, at first, buffer spring 8 sets up between casing 3 and backup pad 1, when receiving external impact force, buffer spring 8 atress is to the inside extrusion of activity sleeve 10, stability when buffering has been guaranteed to bottom plate 9 and roof 11, and it has hinge bar 7 to articulate in the activity of the both sides of activity sleeve 10, when buffer spring 8 cushions at the inside atress of activity sleeve 10, hinge bar 7 is also more and more being close to along with reducing of bottom plate 9 and roof 11 distance, the stability of using has been improved, avoid inside spare part to cause the damage, the efficiency that has increased.

After that, the heat generated by the long-time operation of the semiconductor chip 5 is conducted to the fins 203 through the heat conduction pipes 202, the partition plate 201 stabilizes the use of the semiconductor chip 5, and the heat conducted to the fins 203 is discharged through the heat dissipation vent holes 205, so that the heat inside is conveniently discharged, the damage of the heat to the internal parts is prevented, and the service life is prolonged.

Finally, the device is placed in the air for a long time, the surface accumulates the dust easily, the top of casing 3 is connected with places seat 401, place the inside of seat 401 and bond through adhesive linkage 403 and have first dust guard 402 and second dust guard 404, first dust guard 402 and second dust guard 404 have played dirt-proof effect, can block the inside that external dust got into casing 3, and silica gel sealing washer 405 connects at the inside top of casing 3, avoid the dust to get into inside and cause the damage to inside spare part, the security of using has been increased.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A semiconductor device package with shock absorption, includes casing (3), its characterized in that: the dustproof structure (4) is arranged at the top end of the shell (3), the heat dissipation structure (2) is arranged at the bottom end inside the shell (3), the solid crystal layer (6) is arranged at the top end of the heat dissipation structure (2), the semiconductor chip (5) is fixedly connected to the top end of the solid crystal layer (6), the support plate (1) is arranged at the bottom end of the shell (3), and the damping structure is arranged between the shell (3) and the support plate (1);

shock-absorbing structure includes roof (11), roof (11) fixed connection is in the both sides of casing (3) bottom, be provided with bottom plate (9) under roof (11), bottom plate (9) fixed connection is in the both sides on the inside top of backup pad (1), the equal fixedly connected with activity cover block (10) in bottom of roof (11) and the top of bottom plate (9), the equal swing joint in intermediate position department between activity cover block (10) has buffer spring (8), the equal activity hinge joint in both sides between activity cover block (10) has hinge bar (7).

2. The semiconductor device package with shock absorption of claim 1, wherein: the outer diameter of the buffer spring (8) is smaller than the inner diameter of the movable sleeve block (10), and a telescopic structure is formed between the buffer spring (8) and the movable sleeve block (10).

3. The semiconductor device package with shock absorption of claim 1, wherein: the buffer springs (8) are symmetrically distributed about the vertical center line of the shell (3).

4. The semiconductor device package with shock absorption of claim 1, wherein: heat radiation structure (2) comprise baffle (201), heat pipe (202), fin (203), standing groove (204) and heat dissipation ventilation hole (205), baffle (201) fixed connection is in the bottom of solid crystal layer (6), the bottom fixedly connected with heat pipe (202) of baffle (201), the bottom of heat pipe (202) is provided with standing groove (204), the inside of standing groove (204) is provided with multiunit fin (203), and the one end of fin (203) with heat pipe (202) is connected, heat radiation structure (2) are including heat dissipation ventilation hole (205), heat dissipation ventilation hole (205) fixed connection is in the intermediate position department of casing (3) bottom.

5. The semiconductor device package with shock absorption according to claim 4, wherein: the fins (203) are equal in size, and the fins (203) are arranged in the placing groove (204) at equal intervals.

6. The semiconductor device package with shock absorption of claim 1, wherein: dustproof construction (4) comprise placing seat (401), first dust guard (402), adhesive linkage (403), second dust guard (404) and silica gel sealing washer (405), place seat (401) fixed connection on the top of casing (3), place the first dust guard of the inside top fixedly connected with (402) of seat (401), place the inside bottom fixedly connected with second dust guard (404) of seat (401), place the inside intermediate position department fixedly connected with adhesive linkage (403) of seat (401), dustproof construction (4) include silica gel sealing washer (405), silica gel sealing washer (405) fixed connection is on the inside top of casing (3).

7. The semiconductor device package with shock absorption of claim 6, wherein: the first dust-proof plate (402) and the second dust-proof plate (404) are equal in thickness, and the second dust-proof plate (404) is bonded to the first dust-proof plate (402) through a bonding layer (403).