CN213692050U

CN213692050U - System-in-package structure of CF storage card

Info

Publication number: CN213692050U
Application number: CN202022567540.1U
Authority: CN
Inventors: 张军军; 阳芳芳; 陆海琴
Original assignee: Taiji Semiconductor Suzhou Co ltd
Current assignee: Taiji Semiconductor Suzhou Co ltd
Priority date: 2020-11-09
Filing date: 2020-11-09
Publication date: 2021-07-13
Anticipated expiration: 2030-11-09

Abstract

The utility model relates to a system-level packaging structure of CF storage card, which comprises a packaging substrate, an electronic component, a control chip, a storage chip and a gold thread; the electronic component is welded on the packaging substrate through solder paste; the control chip is adhered to the packaging substrate through the film adhesive layer, and the plurality of storage chips are sequentially stacked and adhered to the packaging substrate through the film adhesive layer; all the elements are electrically connected through gold wires and are plastically packaged on the packaging substrate through epoxy resin; according to the scheme, different chips are packaged in a side-by-side and overlapped mode, and active electronic elements and passive devices are integrated and packaged together to form a system-level chip, a printed circuit board is not used as a connecting carrier between a bearing chip and an electronic component, and the problem that the system performance is subjected to bottleneck due to inherent deficiency of the printed circuit board is solved; the method has the advantages of short development period, lower power consumption, better performance, lower cost price, smaller volume, lighter weight and the like.

Description

System-in-package structure of CF storage card

Technical Field

The utility model relates to a system in package structure of CF storage card belongs to integrated circuit storage class chip system in package technical field.

Background

The CF memory card (Compact Flash) was first introduced by SanDisk in 1994 and weighs only 14g, and is a solid product, i.e. has no moving parts when in operation; the CF memory card adopts flash memory (flash) technology, is a stable storage solution, and does not need a battery to maintain the data stored therein; the CF memory card has higher safety and protection for the stored data than the traditional disk drive; the reliability of the compact disk drive is 5 to 10 times higher than that of the conventional disk drive, and the power consumption of the CF memory card is only 5 percent of that of the compact disk drive; these excellent conditions have led most digital cameras to choose CF memory cards as their first choice storage media.

With the release of the CF Express 1.0 specification by the CF card alliance, the method is suitable for small package application requiring high throughput and low delay based on a long-tested and widely popular PCIE interface and the next generation specification of an efficient NVM Express stack; as a natural evolution of CFAST 2.0 and XQD 2.0, CF express 1.0 aims to meet the requirements for various vertical domain applications in the future; in terms of physical size, the outer dimension specification of CF express 1.0 is reduced from 74.1X 54.4X 6.2mm for CF type I/II to 38.5X 29.6X 3.8mm (same as XQD); the new form factor enables system-in-package of CF memory cards as compared to other mainstream SSDs due to the already mature connector (XQD) market, which can provide smaller packages.

The traditional packaging scheme of the CF memory card is that chip-on-board packaging (COB) is adopted, namely, a control chip is independently packaged into a control module, a plurality of memory chips are packaged into a memory module, and then the control module, the memory module, various active electronic elements and passive devices are subjected to system integration on a printed circuit board; the disadvantages of this are evident: the development period is long, and the yield is low; a large system integration volume; higher product development cost is also easily limited by different processes of materials and chips.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to overcome the deficiencies of the prior art and to provide a system-in-package structure of a CF memory card.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a system-in-package structure of a CF storage card comprises a package substrate, an electronic component, a control chip, a storage chip and a gold wire; the electronic component is welded on the packaging substrate through solder paste; the control chip and the storage chip are respectively provided with a film adhesive layer, the control chip is adhered to the packaging substrate through the film adhesive layer, the number of the storage chips is multiple, the multiple storage chips are aligned along the long edge, and the multiple storage chips are sequentially stacked and adhered to the packaging substrate through the film adhesive layers; the control chip and the packaging substrate, the plurality of storage chips and the packaging substrate are electrically connected through gold wires; the electronic component, the control chip, the storage chip and the gold wire are plastically packaged on the packaging substrate through epoxy resin.

Preferably, the electronic component includes a plurality of active electronic elements and passive devices.

Preferably, the encapsulated unit size is between 14mm 20mm and 20mm 32 mm.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the scheme starts from the CF storage card packaging standpoint, carries out the parallel and superposed packaging mode on different chips, and integrates and packages the chips with a plurality of active electronic elements and passive devices with different functions together to realize a complete CF storage card standard packaging piece; the system-on-chip formed in this way does not use a printed circuit board as a carrier for connecting a carrier chip and an active electronic element with a passive device, and can solve the problem that the system performance is subjected to bottleneck due to the inherent shortage of the printed circuit board.

The system-in-package not only simply integrates the chips, but also has the advantages of short development period, lower power consumption, better performance, lower cost price, smaller volume, lighter weight and the like; system-in-package is an important implementation path beyond moore's law.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

fig. 1 is a schematic diagram of a system-in-package structure of a CF memory card according to the present invention;

FIG. 2 is a schematic view of a first step of the process of the present invention;

FIG. 3 is a schematic diagram of a second step of the process of the present invention;

FIG. 4 is a schematic diagram of a third step of the process of the present invention;

FIG. 5 is a fourth schematic view of the process of the present invention;

FIG. 6 is a schematic diagram of a fifth step of the process of the present invention;

FIG. 7 is a sixth schematic view of the process of the present invention;

FIG. 8 is a seventh schematic view of the process of the present invention;

fig. 9 is an eighth schematic diagram of the processing procedure of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1, the system-in-package structure of CF memory card of the present invention comprises a package substrate 1, an electronic component 2, a control chip 3, a memory chip 4 and a gold wire 5.

The electronic component 2 comprises various active electronic elements and passive devices, such as a capacitor, a resistor, an inductor, a transient diode, a load switch, a voltage stabilizer and the like; each electronic component 2 is welded on the packaging substrate 1 through solder paste 6, the solder paste 6 is firstly printed on the packaging substrate 1 through a steel mesh, and then each electronic component 2 is attached on the packaging substrate 1 and is firmly welded through reflow soldering.

All be provided with film viscose layer 7 on control chip 3 and the memory chip 4, control chip 3 pastes with packaging substrate 1 through film viscose layer 7, and memory chip 4 has many, and many memory chip 4 are aligned along long limit to pile up in proper order through film viscose layer 7 and paste on packaging substrate 1, toast the solidification again at last.

After the components are installed, the components are firstly cleaned by plasma, and then the control chip 3 and the packaging substrate 1, the plurality of storage chips 4 and the packaging substrate 1 are bonded through gold wires 5.

Then placing the substrate with the bonded gold wires 5 on a lower die of an injection molding machine for preheating, pressing down an upper die, pressing the preheated epoxy resin 8 into a die cavity, demolding and baking after the epoxy resin 8 is hardened, and finally cutting the whole packaging substrate 1 combined with the epoxy resin 8 into single pieces; the individual package unit size is between 14mm 20mm to 20mm 32 mm.

The system-in-package structure of the CF storage card is mainly used for realizing all electrical properties of various components of the CF storage card through one-time systematic packaging; the number of the control chips, the number of the memory chips and the stacking mode, and the types and the numbers of the active electronic elements and the passive devices can be differentiated according to different functions of the CF memory card.

The technical difficulty and corresponding solution in the scheme are as follows:

the technical difficulty is as follows: signal integrity problems of multiple types and quantities of electronic elements and multiple memory chip control chips;

the first solution is as follows: for the combined encapsulation of active electronic components and more than 20 types of passive devices, more than 100 types of types and more than 20 types of passive devices, and a plurality of memory chips and control chips, the problem of signal integrity is firstly solved, namely, a signal is required to be transmitted to a load end without error after passing through a transmission medium from a source end. An RLCG model of the transmission line is constructed through simulation software, parasitic parameters are extracted, and the influence of distribution parameters such as resistance, inductance and capacitance of the RLCG model is comprehensively considered. Through reasonable layout of electronic elements and chips, reasonable circuit distribution in the substrate enables influences of problems such as characteristic impedance, crosstalk and high-frequency signal backflow to be minimized.

The technical difficulty is two: plastic packaging of the large-size packaging unit;

the second solution is that: the CF storage card system-in-package introduced by the invention has the unit size of 14mmX20 mm-20 mmX32mm according to the difference of functions and storage capacity, and the plastic package of the large-size package unit has the problems of substrate warpage, internal delamination of the package unit and the like. For the problem of substrate warping, the problems of package substrate warping and package unit warping after singulation in the manufacturing process are effectively solved through means such as optimized package substrate plate edge grid design, optimized package substrate core base material, reasonable epoxy resin component proportion, optimized epoxy resin curing and baking curve and the like; for the problem of internal lamination of the packaging unit, the problem of internal lamination of the packaging unit is solved through the optimized type of the film adhesive, the optimized baking parameters of the film adhesive, and the injection molding and mold flow parameters.

As shown in fig. 2 to 9, the process of the package structure of the present embodiment is as follows:

the first step is as follows: the active electronic element is welded with the passive device;

the second step is that: thinning and cutting the wafer material;

the third step: control chip paster;

the fourth step: pasting and baking a plurality of storage chips;

the fifth step: the control chip and a plurality of storage chip bonding wires;

and a sixth step: epoxy resin plastic package;

the seventh step: baking and curing;

eighth step: and (6) cutting the sheets.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. A system-in-package structure of CF storage card is characterized in that: the packaging structure comprises a packaging substrate (1), an electronic component (2), a control chip (3), a storage chip (4) and a gold wire (5); the electronic component (2) is welded on the packaging substrate (1) through solder paste (6); the control chip (3) and the storage chip (4) are respectively provided with a film adhesive layer (7), the control chip (3) is adhered to the packaging substrate (1) through the film adhesive layer (7), the storage chip (4) is provided with a plurality of storage chips, the plurality of storage chips (4) are aligned along the long edge, and are sequentially stacked and adhered to the packaging substrate (1) through the film adhesive layer (7); the control chip (3) is electrically connected with the packaging substrate (1), the plurality of storage chips (4) and the storage chips (4) are electrically connected with the packaging substrate (1) through gold wires (5); the electronic component (2), the control chip (3), the storage chip (4) and the gold wire (5) are plastically packaged on the packaging substrate (1) through epoxy resin (8).

2. The system-in-package structure of a CF memory card according to claim 1, wherein: the electronic component (2) comprises a plurality of active electronic elements and passive devices.

3. The system-in-package structure of a CF memory card according to claim 1, wherein: the size of the encapsulated unit is between 14mm 20mm and 20mm 32 mm.