CN213690295U

CN213690295U - Signal transmitting system based on FPGA

Info

Publication number: CN213690295U
Application number: CN202023268766.8U
Authority: CN
Inventors: 李兆; 李晨露
Original assignee: Harbin University of Science and Technology
Current assignee: Harbin University of Science and Technology
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-07-13
Anticipated expiration: 2030-12-30

Abstract

The utility model discloses a signal transmitting system based on FPGA, relating to the technical field of signal transmission; the inner lower side of the interior of the signal transmitting system body is provided with an inner radiating fin, the bottom of the inner radiating fin is connected with a plurality of radiating tubes, the bottoms of the plurality of radiating tubes are provided with outer radiating fins, the bottoms of the outer radiating fins are provided with radiating fans, two sides of the bottom of the signal transmitting system body are provided with connecting supports, the connecting supports are provided with guide holes, the bottoms of the guide posts are provided with fixed bottom plates and movably connected with the guide holes, the upper ends of the guide posts are provided with upper limiting plates, the outer sides of the guide posts are sleeved with rubber sleeves, two sides of the bottom of the signal transmitting system body are provided with support posts, and the bottoms of the support posts are connected with a plurality; the utility model can realize rapid operation and improve the heat dissipation efficiency; the shock absorption can be realized after the installation, the overall performance is improved, and the phenomenon of damage of internal elements due to shaking is not easy to cause.

Description

Signal transmitting system based on FPGA

Technical Field

The utility model belongs to the technical field of signal transmission, concretely relates to signal transmission system based on FPGA.

Background

The signal transmitting system based on the FPGA is easy to shake when in use, easily causes damage to internal components, and causes high temperature of the components due to poor heat dissipation.

Disclosure of Invention

The signal transmitting system aims to solve the problems that the existing signal transmitting system based on the FPGA is easy to shake when in use, internal components are easy to damage, and meanwhile, the heat dissipation performance is poor, so that the high temperature of the components is caused; an object of the utility model is to provide a signal emission system based on FPGA.

The utility model discloses a signal transmitting system based on FPGA, which comprises a signal transmitting system body, an inner radiating fin, a radiating pipe body, an outer radiating fin, a radiating fan, a connecting support, a fixed bottom plate, a guide post, an upper limiting plate, a rubber sleeve, a support post and a damping spring; the inside downside of signal transmission system body is provided with interior fin, the bottom of interior fin is connected with several heat dissipation body, outer heat dissipation piece is installed to the bottom of several heat dissipation body, radiator fan is installed to the bottom of outer heat dissipation piece, the connection support is all installed to the bottom both sides of signal transmission system body, the guiding hole has been seted up on the connection support, fixed baseplate is installed to the bottom of guide post on, and guide post and guiding hole swing joint, the spacing board is gone up to the upper end of guide post is installed, the rubber sleeve has been cup jointed in the outside of guide post, the support column is all installed to the bottom both sides of signal transmission system body, the bottom of support column is connected with several damping spring.

Preferably, the signal emission system body comprises a singlechip, a peripheral circuit, a DDS signal generation module, a D/A converter and a DDS signal filtering and amplifying circuit; the single chip microcomputer is respectively connected with the peripheral circuit and the DDS signal generation module, the peripheral circuit is connected with the DDS signal generation module, the DDS signal generation module is connected with the D/A converter, and the D/A converter is connected with the DDS signal filtering and amplifying circuit.

Preferably, the outer heat dissipation fin comprises a heat dissipation seat and a plurality of heat dissipation fins, and the outer side wall of the heat dissipation seat is provided with the plurality of heat dissipation fins.

Preferably, a plurality of damping hole grooves are formed in the rubber sleeve and are communicated with the inner hole body of the rubber sleeve.

Preferably, the fixed bottom plate is provided with a plurality of fixing holes.

Preferably, a dustproof sleeve is sleeved on the outer side of the damping spring.

Compared with the prior art, the beneficial effects of the utility model are that:

firstly, quick operation can be realized, the heat dissipation efficiency is improved, and meanwhile, quick installation can be realized;

and secondly, the shock absorption can be realized after the installation, the overall performance is improved, and the phenomenon of damage of internal elements due to shaking is not easy to cause.

Drawings

For ease of illustration, the invention is described in detail by the following detailed description and accompanying drawings.

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic structural view of the outer and the middle heat dissipation plates of the present invention;

FIG. 3 is a schematic structural view of the rubber sleeve of the present invention;

fig. 4 is a schematic structural diagram of the middle signal generating system body of the present invention.

In the figure: 1-a signal transmission system body; 2-inner heat sink; 3-a heat dissipation pipe body; 4-external heat dissipation sheet; 5-a heat dissipation fan; 6-connecting a support; 7-fixing the bottom plate; 8-a guide post; 9-upper limiting plate; 10-a rubber sleeve; 11-a support column; 12-a damping spring; 41-a heat sink; 42-heat dissipation fins; 101-damping hole groove.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described below with reference to specific embodiments shown in the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. The structure, ratio, size and the like shown in the drawings of the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention does not have the substantial significance in the technology, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy which can be produced by the present invention and the achievable purpose. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

It should also be noted that, in order to avoid obscuring the invention with unnecessary details, only the structures and/or process steps that are closely related to the solution according to the invention are shown in the drawings, while other details that are not relevant to the invention are omitted.

As shown in fig. 1, the following technical solutions are adopted in the present embodiment: the radiating system comprises a signal transmitting system body 1, an inner radiating fin 2, a radiating tube body 3, an outer radiating fin 4, a radiating fan 5, a connecting support 6, a fixed bottom plate 7, a guide post 8, an upper limiting plate 9, a rubber sleeve 10, a support post 11 and a damping spring 12; an inner radiating fin 2 is arranged on the lower side of the inside of a signal transmitting system body 1, a plurality of radiating pipe bodies 3 are connected to the bottom of the inner radiating fin 2, outer radiating fins 4 are mounted at the bottoms of the radiating pipe bodies 3, the outer radiating fins 4 can realize quick heat dissipation, a radiating fan 5 is mounted at the bottom of each outer radiating fin 4, the radiating fan 5 is convenient for auxiliary heat dissipation, connecting supports 6 are mounted on two sides of the bottom of the signal transmitting system body 1, guide holes are formed in the connecting supports 6, a fixed bottom plate 7 is mounted at the bottom of each guide post 8, each guide post 8 is movably connected with each guide hole, an upper limiting plate 9 is mounted at the upper end of each guide post 8, the upper limiting plate 9 can realize limiting of each guide post, a rubber sleeve 10 is sleeved on the outer side of each guide post 8, each rubber sleeve 10 can realize shock absorption, support posts 11 are mounted on two sides of the bottom of the signal transmitting system body 1, damping spring 12 can realize quick shock attenuation, and support column 11 can realize supporting.

As shown in fig. 2, the outer heat dissipation sheet 4 further includes a heat dissipation seat 41 and a plurality of heat dissipation fins 42, and the plurality of heat dissipation fins 42 are disposed on an outer side wall of the heat dissipation seat 41, so that the heat dissipation fins 42 can improve heat dissipation.

As shown in fig. 3, a plurality of damping hole grooves 101 are further formed in the rubber sleeve 10, and the damping hole grooves 101 are communicated with the inner hole body of the rubber sleeve 10.

As shown in fig. 4, further, the signal transmitting system body includes a single chip, a peripheral circuit, a DDS signal generating module, a D/a converter, a DDS signal filtering and amplifying circuit; the single chip microcomputer is respectively connected with the peripheral circuit and the DDS signal generation module, the peripheral circuit is connected with the DDS signal generation module, the DDS signal generation module is connected with the D/A converter, and the D/A converter is connected with the DDS signal filtering and amplifying circuit.

Furthermore, a plurality of fixing holes are formed in the fixing bottom plate 7.

Further, a dustproof sleeve is sleeved on the outer side of the damping spring 12.

The working principle of the specific embodiment is as follows: when using, realize the transmission of signal through signal transmission system body 1, mainly realize control through the singlechip, inside heat dissipation can be realized to interior fin 2, cooling tube body 3 is connected with outer fin 4, it can realize inside and outside thermal exchange, quick heat dissipation is realized to rethread radiator fan 5, it can improve the thermal diffusivity, high durability and convenient use, and adopt rubber sleeve 10, damping spring 12 realizes the shock attenuation of signal transmission system body, and adopt guide post 8 to realize the direction, make stability when the shock attenuation high, the phenomenon of inside component damage is difficult for appearing.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A signal transmission system based on FPGA is characterized in that: the device comprises a signal transmitting system body, an inner radiating fin, a radiating tube body, an outer radiating fin, a radiating fan, a connecting support, a fixed bottom plate, a guide column, an upper limiting plate, a rubber sleeve, a support column and a damping spring; the inside downside of signal transmission system body is provided with interior fin, the bottom of interior fin is connected with several heat dissipation body, outer heat dissipation piece is installed to the bottom of several heat dissipation body, radiator fan is installed to the bottom of outer heat dissipation piece, the connection support is all installed to the bottom both sides of signal transmission system body, the guiding hole has been seted up on the connection support, fixed baseplate is installed to the bottom of guide post on, and guide post and guiding hole swing joint, the spacing board is gone up to the upper end of guide post is installed, the rubber sleeve has been cup jointed in the outside of guide post, the support column is all installed to the bottom both sides of signal transmission system body, the bottom of support column is connected with several damping spring.

2. The FPGA-based signal transmission system of claim 1, wherein: the signal emission system body comprises a singlechip, a peripheral circuit, a DDS signal generation module, a D/A converter and a DDS signal filtering and amplifying circuit; the single chip microcomputer is respectively connected with the peripheral circuit and the DDS signal generation module, the peripheral circuit is connected with the DDS signal generation module, the DDS signal generation module is connected with the D/A converter, and the D/A converter is connected with the DDS signal filtering and amplifying circuit.

3. The FPGA-based signal transmission system of claim 1, wherein: the outer radiating fins comprise radiating seats and radiating fins, and a plurality of radiating fins are arranged on the outer side walls of the radiating seats.

4. The FPGA-based signal transmission system of claim 1, wherein: a plurality of damping hole grooves are formed in the rubber sleeve and are communicated with an inner hole body of the rubber sleeve.

5. The FPGA-based signal transmission system of claim 1, wherein: the fixed bottom plate is provided with a plurality of fixed holes.

6. The FPGA-based signal transmission system of claim 1, wherein: and a dustproof sleeve is sleeved on the outer side of the damping spring.