CN221058619U - Microwave power amplifier with heat radiation structure - Google Patents
Microwave power amplifier with heat radiation structure Download PDFInfo
- Publication number
- CN221058619U CN221058619U CN202321775608.2U CN202321775608U CN221058619U CN 221058619 U CN221058619 U CN 221058619U CN 202321775608 U CN202321775608 U CN 202321775608U CN 221058619 U CN221058619 U CN 221058619U
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- China
- Prior art keywords
- power amplifier
- microwave power
- plate
- radiating
- heat dissipation
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- 230000005855 radiation Effects 0.000 title claims abstract description 15
- 230000017525 heat dissipation Effects 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 description 7
- 230000003139 buffering effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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Abstract
The utility model belongs to the technical field of microwave power amplifiers, and particularly relates to a microwave power amplifier with a heat radiation structure, which comprises a microwave power amplifier, wherein connectors are arranged on two sides of the microwave power amplifier, a shell wall is fixed in the middle of the microwave power amplifier, a device cavity is formed in the center of the shell wall, a radiating fin is fixedly connected with the outer wall of the shell wall and is arranged in the heat radiation cavity, and a radiating fan is arranged in the center of the bottom of the microwave power amplifier.
Description
Technical Field
The utility model belongs to the technical field of microwave power amplifiers, and particularly relates to a microwave power amplifier with a heat dissipation structure.
Background
The microwave power amplifier is an electronic measuring instrument used in the fields of engineering and technology related to product application, electronic and communication technology and aviation and aerospace science technology, wherein the application number of the microwave power amplifier is CN 202122024097.8. The microwave power amplifier comprises a plurality of side plates enclosed to form a cabinet body, wherein a containing cavity is arranged in the cabinet body, and a power amplification module and a dust removing structure are arranged in the containing cavity and are arranged at intervals. At least one side plate is provided with a radiating hole for radiating heat, the dust removing structure comprises a dust removing mechanism and a driving mechanism, and the dust removing mechanism is provided with a dust removing piece for cleaning the radiating hole; the driving mechanism is arranged on the side plate provided with the heat dissipation holes, and the dust removal mechanism is connected with the driving mechanism so that the dust removal mechanism is movably arranged on the side plate. At present, when the microwave power amplifier is used for a long time, the temperature of the microwave power amplifier can be gradually increased, so that the microwave power amplifier needs to be subjected to heat dissipation treatment in time, and the heat dissipation efficiency of the existing microwave power amplifier is lower, so that a novel heat dissipation mode of the microwave power amplifier is designed to improve the heat dissipation effect of the microwave power amplifier.
Disclosure of utility model
The utility model aims to provide a microwave power amplifier with a heat radiation structure, and aims to solve the problem that the temperature of the microwave power amplifier is gradually increased when the microwave power amplifier is in a long time in the prior art, so that the microwave power amplifier needs to be subjected to heat radiation treatment in time.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a microwave power amplifier with heat radiation structure, includes microwave power amplifier, the joint is installed to microwave power amplifier's both sides, microwave power amplifier's middle part is fixed with the shell wall, the device chamber has been seted up to the center department of shell wall, the outer wall fixedly connected with fin of shell wall, the fin sets up the inside in the heat dissipation chamber, radiator fan is installed to microwave power amplifier's bottom center department.
In order to enable the heat radiation fan to convey the hot air in the heat radiation cavity to the outside, the microwave power amplifier with the heat radiation structure is preferable, and two sides of the heat radiation fan are respectively communicated with the outer side of the microwave power amplifier and the heat radiation cavity.
In order to enable the radiating fins to radiate heat to the shell wall, the microwave power amplifier with the radiating structure is preferable in the utility model, the radiating fins are distributed at equal intervals on the surface of the shell wall, and the radiating fins are made of copper.
In order to enable the connecting pad to buffer between the connecting plate and the fixing plate, the microwave power amplifier with the heat dissipation structure is preferable in the utility model, the connecting plate is fixedly connected to two sides of the bottom shell of the microwave power amplifier, the fixing plate is fixedly connected to one side of the connecting plate, and the connecting pad is connected to the surface of the fixing plate.
In order to enable the connecting pad to absorb shock to the fixing plate and the side plate, the microwave power amplifier with the heat dissipation structure is preferable in the utility model, the side plate is connected to the other side of the connecting pad far away from the fixing plate, the surface of the side plate is fixedly connected with a mounting piece, and the mounting piece is provided with a mounting hole.
In order to make the spring buffer between the fixed plate and the side plate, it is preferable that the microwave power amplifier with the heat dissipation structure is provided with a spring connected between the fixed plate and the side plate at the bottom and a spring connected between the fixed plate and the side plate at the top, and the spring is specifically a strong spring.
Compared with the prior art, the utility model has the beneficial effects that:
1) The connector is used for connecting the microwave power amplifier with equipment, and then the device cavity, the shell wall, the radiating fins, the radiating cavity and the radiating fan are matched with each other, when the radiating fan is started, the radiating fan can convey hot air which is radiated by the radiating fins in the radiating cavity, so that the microwave power amplifier can be quickly radiated;
2) Through the cooperation between connecting plate, fixed plate, connection pad, curb plate, installed part and the spring, install the installed part after appointed position, through connection pad and spring to the fixed plate shock attenuation and buffering to make the noise that microwave power amplifier shakes and produces lower.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is a schematic diagram of a front view structure of the present utility model;
FIG. 3 is a schematic diagram showing a three-dimensional cross-sectional structure of a microwave power amplifier according to the present utility model;
Fig. 4 is a schematic view showing a connection structure of the fixing plate and the side plate of the present utility model.
In the figure: 1. a microwave power amplifier; 2. a joint; 3. a device cavity; 4. a shell wall; 5. a heat sink; 6. a heat dissipation cavity; 7. a heat radiation fan; 8. a connecting plate; 9. a fixing plate; 10. a connection pad; 11. a side plate; 12. a mounting member; 13. and (3) a spring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides the following technical solutions: the utility model provides a microwave power amplifier with heat radiation structure, includes microwave power amplifier 1, joint 2 is installed to microwave power amplifier 1's both sides, microwave power amplifier 1's middle part is fixed with shell wall 4, device chamber 3 has been seted up to the center department of shell wall 4, the outer wall fixedly connected with fin 5 of shell wall 4, fin 5 sets up the inside in heat dissipation chamber 6, radiator fan 7 is installed to microwave power amplifier 1's bottom center department.
Preferably: the two sides of the cooling fan 7 are respectively communicated with the outer side of the microwave power amplifier 1 and the cooling cavity 6.
When the radiator is specifically used, the radiator fan 7 can rapidly radiate the heat of the heat radiating cavity 6 when radiating the heat of the inside of the device cavity 3 through the radiating fins 5.
Preferably: the radiating fins 5 are distributed at equal intervals on the surface of the shell wall 4, and the radiating fins 5 are made of copper.
When the heat dissipation device is particularly used, the heat dissipation treatment can be carried out on the shell wall 4 through the heat dissipation fins 5, so that the temperature inside the shell wall 4 can be quickly dissipated from the heat dissipation fins 5.
Preferably: the microwave power amplifier 1's bottom shell both sides fixedly connected with connecting plate 8, one side fixedly connected with fixed plate 9 of connecting plate 8, the surface of fixed plate 9 is connected with connecting pad 10.
In specific use, the connecting pad 10 is connected between the connecting plate 8 and the fixed plate 9, so that the connecting pad 10 can perform shock absorption and buffering on the connecting plate 8 and the fixed plate 9.
Preferably: the other side of the connecting pad 10 far away from the fixed plate 9 is connected with a side plate 11, the surface of the side plate 11 is fixedly connected with a mounting piece 12, and the mounting piece 12 is provided with a mounting hole.
In specific use, the mounting piece 12 can be conveniently mounted through the mounting hole, and the fixing plate 9 and the side plate 11 are damped and buffered through the connecting pad 10.
Preferably: a spring 13 is connected between the bottom fixing plate 9 and the side plate 11, and a spring 13 is connected between the top fixing plate 9 and the side plate 11, wherein the spring 13 is specifically a powerful spring.
In specific use, the springs 13 can make the fixed plate 9 and the side plate 11 mutually shock-absorbing and buffering.
Working principle: the signal wire is connected with the microwave power amplifier 1 through the connector 2, then components and parts are installed in the device cavity 3, along with the operation of the device cavity 3, the temperature in the shell wall 4 is gradually increased, then the radiating fin 5 blows the temperature outside after radiating the temperature in the radiating cavity 6 through the radiating fan 7, so that the temperature can be quickly radiated outside, after the installation piece 12 is installed at a designated position, the fixing plate 9 and the side plate 11 are mutually buffered through the strong spring of the spring 13, and then the connection part of the fixing plate 9 and the side plate 11 is damped through the connecting pad 10, so that the vibration amplitude of the microwave power amplifier 1 after being started is reduced, and the effect of physical damping of the microwave power amplifier 1 is achieved.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
1. The utility model provides a microwave power amplifier with heat radiation structure, includes microwave power amplifier (1), its characterized in that: the microwave power amplifier comprises a microwave power amplifier body (1), wherein connectors (2) are arranged on two sides of the microwave power amplifier body (1), a shell wall (4) is fixed in the middle of the microwave power amplifier body (1), a device cavity (3) is formed in the center of the shell wall (4), radiating fins (5) are fixedly connected to the outer wall of the shell wall (4), the radiating fins (5) are arranged in the radiating cavity (6), and a radiating fan (7) is arranged at the center of the bottom of the microwave power amplifier body (1).
2. A microwave power amplifier having a heat dissipation structure as defined in claim 1, wherein: the two sides of the radiating fan (7) are respectively communicated with the outer side of the microwave power amplifier (1) and the radiating cavity (6).
3. A microwave power amplifier having a heat dissipation structure as defined in claim 1, wherein: the radiating fins (5) are distributed on the surface of the shell wall (4) at equal intervals, and the radiating fins (5) are made of copper.
4. A microwave power amplifier having a heat dissipation structure as defined in claim 3, wherein: the microwave power amplifier is characterized in that connecting plates (8) are fixedly connected to two sides of a bottom shell of the microwave power amplifier (1), one side of each connecting plate (8) is fixedly connected with a fixing plate (9), and a connecting pad (10) is connected to the surface of each fixing plate (9).
5. A microwave power amplifier having a heat dissipation structure as defined in claim 4, wherein: the connecting pad (10) is connected with a side plate (11) at the other side far away from the fixed plate (9), a mounting piece (12) is fixedly connected to the surface of the side plate (11), and a mounting hole is formed in the mounting piece (12).
6. A microwave power amplifier having a heat dissipation structure as defined in claim 5, wherein: the bottom is connected with spring (13) between fixed plate (9) and curb plate (11), and the top is connected with spring (13) between fixed plate (9) and curb plate (11), spring (13) are a powerful spring specifically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321775608.2U CN221058619U (en) | 2023-07-07 | 2023-07-07 | Microwave power amplifier with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321775608.2U CN221058619U (en) | 2023-07-07 | 2023-07-07 | Microwave power amplifier with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221058619U true CN221058619U (en) | 2024-05-31 |
Family
ID=91198948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321775608.2U Active CN221058619U (en) | 2023-07-07 | 2023-07-07 | Microwave power amplifier with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221058619U (en) |
-
2023
- 2023-07-07 CN CN202321775608.2U patent/CN221058619U/en active Active
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