CN213674436U - Automatic punching machine for inner-layer circuit board - Google Patents

Abstract

The utility model discloses an automatic piercing press of inlayer circuit board, the constitution of this piercing press has: a clapper pre-alignment workbench, a CCD pre-alignment workbench, an inner plate conveying mechanism, a die adjusting and aligning mechanism, a punching mechanism, a plate discharging and conveying mechanism and the like. The precise punching of the inner layer circuit board is completed through six steps of starting up → placing the board → whole board → pre-alignment → alignment before punching → plate discharging, and the whole process is automated, thereby reducing the manual participation, being efficient and reducing the production cost. The utility model discloses the machine is to inlayer circuit board and customization, because the inlayer circuit board is the compliance, and is very thin, is more difficult to control the precision, consequently needs a machine that is different from traditional hardboard piercing press to accomplish the accurate location operation of punching a hole and can not destroy the inlayer circuit board.

Description

Automatic punching machine for inner-layer circuit board

Technical Field

The utility model belongs to the technical field of automation equipment and specifically relates to indicate an automatic piercing press of inlayer circuit board.

Background

When processing a circuit board, it is necessary to bond the individual circuit boards together with high precision in order to assemble a final circuit. It has become increasingly necessary to index and punch holes in individual circuit board layers, typically by punching holes in precisely defined locations in the printed circuit board.

In the manufacturing process of domestic printed circuit boards, punching is mainly positioned by manual visual inspection. The positioning operation mode has the defects of high labor intensity, low efficiency, poor quality and poor repeatability. Such manual positioning operations are naturally costly and of low precision when a large number of punching operations with different punching specifications are required.

Particularly, the inner layer circuit board is flexible, very thin and more difficult to control the precision, so that a device different from the conventional hard board punching machine is required, for example, an automatic inner layer circuit board punching machine is developed to automatically feed, position, punch and blank in an automatic manner.

Disclosure of Invention

In view of the above, the present invention is directed to the deficiency of the prior art, and the main objective of the present invention is to provide an automatic punching machine for inner circuit boards, which realizes a series of actions of loading, positioning, punching and blanking of inner circuit boards in an automated manner.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

an automatic punching machine for inner layer circuit board comprises

The front end of the clapper pre-alignment mechanism is provided with a roller and a clapper alignment structure, the clapper is placed on a clapper pre-alignment workbench formed by the roller, and the clapper alignment structure acts to neat the clapper to a specified position;

the CCD pre-alignment mechanism is provided with at least two automatically moving CCD cameras, and after the CCD cameras grab targets on the plate, the CCD pre-alignment workbench automatically moves to a correct position through a motor according to the size of the punched plate and automatically pre-aligns the plate;

the inner-layer plate conveying mechanism is used for sucking the plate by a linear motor or a belt motor and a first vacuum chuck to accurately convey the plate to a punching workbench of the machine through air floatation, and releasing the first vacuum chuck to retreat to a CCD (charge coupled device) pre-alignment position after the plate reaches a punching die position;

a mould adjusting and aligning mechanism, which comprises a punching workbench, a pressing plate and an XYY motor driving and adjusting structure, wherein a channel for the plate to enter and send out is arranged between the pressing plate and the pressing plate, when the plate enters the punching workbench, the pressing plate presses down the fixed plate and uploads the target of the plate to a positioning system through a 4-camera or 8-camera recognition, and the positioning system acts on the XYY motor driving and adjusting structure according to a calculated adjusting value to push the punching workbench to rotate and move until the plate is aligned successfully;

the punching mechanism is positioned above the die adjusting and aligning mechanism and is provided with an upper die, and the upper die is provided with a punch head for punching the plate;

the plate discharging and conveying mechanism is connected with the punching mechanism and is used for discharging the plates;

the clapper pre-alignment mechanism, the CCD pre-alignment mechanism, the inner-layer plate conveying mechanism, the die adjusting and alignment mechanism, the punching mechanism and the plate discharging conveying mechanism are sequentially arranged to form an automatic assembly line.

As a preferred scheme, the clapper pre-alignment workbench is provided with a downward tilting prevention structure for preventing the clapper from bending downwards and being embedded into a gap of the roller, and the downward tilting prevention structure is a barrier strip.

As a preferred scheme, the clapper pre-alignment workbench is provided with an upwarp prevention structure for preventing the clapper from bending and upwarping upwards, and the upwarp prevention structure is a guide plate.

As a preferred scheme, in the CCD pre-alignment mechanism, an air blowing hold-down mechanism is provided on a mounting base of the CCD camera.

As a preferred scheme, the mold adjusting and aligning mechanism uses 4 cameras to identify the target of the plate, and the 4 cameras are respectively located at four corners above the plate.

As a preferred scheme, the mold adjusting and aligning mechanism adopts 8 cameras to identify targets of the plate, wherein 4 cameras are respectively located at four corners above the plate, and the other 4 cameras are respectively located at four corners below the plate, so that accurate alignment of the upper surface and the lower surface is realized.

Preferably, the upper die of the punching mechanism is mounted to the upper die plate by a die adjustment tool, and the die adjustment tool is capable of electrically moving the die to a set position.

As a preferable scheme, the inner layer plate conveying mechanism consists of an air cushion, a first vacuum chuck adsorbed below the plate and a linear motor.

Preferably, the plate discharging conveying mechanism is conveyed to a rear conveying belt through a second vacuum chuck and a linear motor or a belt motor to be discharged.

As a preferred scheme, the punching machine is further provided with a control panel, a system display and keyboard, a control computer, a pneumatic control panel and an electric cabinet, wherein the electric cabinet is respectively connected with corresponding motors on the machine, the pneumatic control panel is respectively connected with corresponding cylinders, and the control panel, the system display, the keyboard and the control computer form a control system of the punching machine.

Compared with the prior art, the utility model have obvious advantage and beneficial effect, particularly, can know by above-mentioned technical scheme, through will clap the board counterpoint mechanism in advance, CCD counterpoint mechanism in advance, inner plate conveying mechanism, mould adjustment counterpoint mechanism, the mechanism of punching a hole, play board conveying mechanism arranges in proper order and forms automatic assembly line, when punching a hole, according to put the board → whole board → counterpoint in advance → counterpoint before punching a hole → the step of → punching a hole → play board, the accuracy of accomplishing the inner layer circuit board punches a hole to full process automation operation reduces artifical the participation, high efficiency and reduction in production cost. The utility model discloses the method is to inlayer circuit board and customization, because the inlayer circuit board is the compliance, and is very thin, is more difficult to control the precision, consequently needs a method that is different from traditional hardboard piercing press, has many times location, claps the board location, counterpoints the location in advance, and counterpoint before punching a hole lacks one can to accomplish the accurate location operation of punching a hole and can not destroy the inlayer circuit board.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a schematic perspective view of an inner layer circuit board punching machine according to an embodiment of the present invention.

Fig. 2 is a main view of the inner-layer circuit board punching machine according to the embodiment of the present invention.

Fig. 3 is a top view of an inner layer circuit board punching machine according to an embodiment of the present invention.

Fig. 4 is a left side view of the inner layer circuit board punching machine according to the embodiment of the present invention.

Fig. 5 is a flowchart (a) of the inner circuit board punching machine control of the inner circuit board punching machine according to the embodiment of the present invention.

Fig. 6 is a flowchart of the inner circuit board punching machine control of the inner circuit board punching machine according to the embodiment of the present invention (ii).

Fig. 7 is a flowchart (iii) of the inner circuit board puncher controlling the inner circuit board puncher according to the embodiment of the present invention.

Fig. 8 is a flowchart (iv) of the inner circuit board puncher of the embodiment of the present invention for controlling the inner circuit board puncher.

The attached drawings indicate the following:

10. clapper pre-alignment mechanism 11 and roller

12. Clapper centering structure 13 and downward warping prevention structure

14. Upwarp-preventing structure 20 and CCD pre-alignment mechanism

21. Beam 22 and CCD camera

23. Air blowing pressing mechanism 30 and inner layer plate conveying mechanism

31. First vacuum chuck 32, air cushion

33. Pressing plate device 40 and mold adjusting and aligning mechanism

50. Punching mechanism 60 and plate discharging conveying mechanism

61. Second vacuum chuck 62, conveyer belt

70. Control panel 80, system display

90. Keyboard 100 and control computer

110. Pneumatically control the panel 120 electrical cabinet.

Detailed Description

Referring to fig. 1 to 4, there is shown a specific structure of a preferred embodiment of the present invention, which is an automatic inner layer circuit board punching machine, the machine is mainly used for punching an etched inner layer board, the machine can punch related tool holes required in the following processes, including positioning holes, rivet holes or pin holes, at one time, the machine mainly includes an image processing part, a die part capable of precisely and stably punching the tool holes, and system control software, and provides statistical data during production.

The inner-layer circuit board punching machine adopts a Windows10 operating system as a platform of application software to control logic, control and image processing of the machine, and compared with the old Windows 7/2000 version software, the new version provides a better man-machine interface comprising shortcut icons, scroll bars of Windows, clicking of a mouse, event logging, error reporting records and the like, and in addition, better provides compatibility with third-party software or hardware. However, the machine is not limited to the Windows10 operating system, and other systems of lower or higher versions may be used, as long as the normal operating conditions of the device software are met.

The utility model discloses a functional mechanism of inlayer circuit board piercing press constitutes and has: the automatic production line comprises a clapper pre-alignment mechanism 10, a CCD pre-alignment mechanism 20, an inner-layer board conveying mechanism 30, a die adjusting and aligning mechanism 40, a punching mechanism 50 and a board discharging conveying mechanism 60, wherein the clapper pre-alignment mechanism 10, the CCD pre-alignment mechanism 20, the inner-layer board conveying mechanism 30, the die adjusting and aligning mechanism 40, the punching mechanism 50 and the board discharging conveying mechanism 60 are sequentially arranged to form an automatic production line, and a series of full-automatic operation of placing an inner-layer circuit board (short for a board), namely, board → pre-alignment → punching → board discharging can be realized.

Structurally, the front end of the clapper pre-alignment mechanism 10 is provided with a roller 11 and a clapper alignment structure 12, when the clapper is placed on the roller 11, the roller 11 runs to match with the clapper action, and after the position of the clapper is arranged, the clapper is conveyed to a CCD pre-alignment workbench through an arm. If the trigger is additionally arranged at the front end of the clapper pre-alignment mechanism 10, the operation efficiency of the machine can be greatly improved and the manual intervention can be reduced.

And a downward warping prevention structure 13 for preventing the plate from bending downwards and being embedded into the gap of the roller 11 is arranged on the clapper pre-alignment workbench, and the downward warping prevention structure 13 is a barrier strip. And an upwarp prevention structure 14 for preventing the board from bending upwards and upwarping is arranged on the clapper pre-alignment workbench, and the upwarp prevention structure 14 is a guide plate. In some embodiments, the guide plate is designed on the cross beam 21. Due to the design of the downward warping prevention structure 13 and the upward warping prevention structure 14, the soft inner-layer circuit board cannot be conveyed smoothly due to warping deformation during feeding.

The CCD pre-alignment mechanism 20 is provided with two CCD cameras 22 which can move automatically, and after the CCD cameras 22 capture targets, the plates can be automatically moved to correct positions through a motor according to the sizes of the punched plates to be aligned in advance automatically. The two CCD cameras 22 have low magnification and large visual field, so that the targets on the etched inner-layer plate can be conveniently utilized to carry out automatic pre-alignment, manual alignment of operators is avoided, and the production efficiency is greatly improved. After the pre-alignment is completed, the motor automatically moves the plate to the next working table surface, namely the punching working table.

Furthermore, in order to ensure that the board is completely and flatly attached to the CCD pre-alignment workbench when the CCD camera 22 shoots, the air blowing pressing mechanism 23 is further arranged on the mounting seat of the CCD camera 22, the air blowing pressing mechanism 23 blows air downwards, the board can be pressed on the CCD pre-alignment workbench to be fixed by air pressure generated by air flow, and the board is flat, so that the problem that the target grabbing precision is not high due to poor warping and attaching degree of the soft inner-layer circuit board can be avoided.

In other embodiments, a manual pre-alignment table may be used instead of the CCD pre-alignment mechanism 20 and the clapper pre-alignment mechanism 10. The manual pre-alignment workbench (MAS) is provided with two CCD cameras 22 which can be conveniently moved to correct positions through a handle or a motor according to the size of a plate punched by a client, the two CCD cameras 22 have lower magnification and larger visual field, so that the target on the etched inner-layer plate can be conveniently used for manual rough alignment, an operator puts the inner-layer plate on the CCD pre-alignment workbench firstly, adjusts the position to display the target in the visual field of the CCD cameras 22, and the plate feeding system can automatically feed the plate to the punching workbench after pressing a 'start' button.

Structurally, there is a crossbeam 21 in this CCD counterpoint mechanism 20's top in advance, the board can be followed crossbeam 21 and transferred and pass through, two CCD cameras 22 have been installed to the crossbeam 21 left and right sides, CCD counterpoint workstation both sides in advance has light to provide the printing opacity illumination for digital camera, two CCD cameras 22 can remove the tram according to the work piece size, in addition can also install two little displays additional on crossbeam 21 and be used for showing the target position help and carry out thick location, the light source of light is in the frame of CCD counterpoint workstation below in advance. A counter capable of being reset is arranged on the side edge of the table board, so that a user can conveniently count.

The inner layer plate conveying mechanism 30 is used for conveying an inner layer plate which is as thin as 0.05mm, a linear motor or a belt motor and a first vacuum suction cup 31 are used for adsorbing the edge of the inner layer plate to drag the plate to be accurately conveyed to a punching workbench of a machine through air floatation, and the first vacuum suction cup 31 is released to retreat to a CCD pre-alignment position after the plate reaches a punching die position, so that the very thin inner layer plate can be smoothly conveyed and cannot be bent, deformed or scratched.

Specifically, the inner-layer plate conveying mechanism has the structure that: an air cushion 32 of a pre-alignment workbench, a first vacuum suction cup 31 adsorbed below a plate and a linear motor form an inner plate conveying mechanism together, and the plate can be smoothly fed into a punching position in a machine. The linear motor consists of a track and a motor rotor coil, the first vacuum sucker 31 is arranged on the rotor of the linear motor and can move back and forth on the track along with the rotor, and the cross beam 21 is provided with a pressure plate device 33 which can ensure that the plate is sucked by the sucker.

The mold adjustment alignment mechanism 40: the lower module generally contains all the sizes customized by customers, the die holder comprises a plurality of dies (or positions) with different sizes and a reference target of the machine, the die of the upper die holder which is a single position can be rapidly moved to a correct position through a tool manually or electrically according to the size of the punched plate, and then the die is locked through a very precise positioning pin, so that the precise positioning of the die can be ensured to ensure the precision of the punching position of the machine.

The punching mechanism 50: is located above the die adjustment and alignment mechanism, the punching mechanism 50 is provided with an upper die having a punch for punching the board. After a plate on a CCD pre-alignment workbench is pre-aligned and then is fed into a die punching position in a machine, a punching workbench detects a plate signal, a 4-camera or 8-camera is used for identifying a target in an inner plate and feeding back the accurate position of the target to a positioning system in a digital form, the target of the plate can be seen on a digital camera, an image processing system of software takes out the accurate position of the target on the plate according to the position, then an XYY motor is driven to drive the punching workbench of the machine to move to an error range allowing punching, the system compares the position of the target read on the plate with a reference target position on the machine, then deviation is automatically and evenly distributed, after the table surface is aligned, the machine automatically drives an upper die, and punching is started by a punch.

In some models, the mold alignment mechanism uses 4 cameras to identify the target of the board, and the 4 cameras are respectively located at four corners above the board. In other models, the mold adjusting and aligning mechanism adopts 8 cameras to identify the targets of the plate, wherein 4 cameras are respectively positioned at four corners above the plate, and the other 4 cameras are respectively positioned at four corners below the plate, so that the accurate alignment of the upper surface and the lower surface is realized.

When the board size changes, need use dedicated mould adjustment instrument to remove go up the mould and pin the mould behind the accurate position and utilize the locating pin, the utility model discloses a piercing press can satisfy, only needs select the board size in the software, goes up the mould and can automatically move to the settlement position. The lower mold is full-sized, which means that all required dimensions are already included without changing the position, and a reference target and a light bar for providing illumination are provided on the lower molds on the left and right sides, respectively. The middle part of the upper cover of the machine is provided with a light source and a light source regulator. In some high-power distribution models, the light source brightness is automatically adjusted by software analog quantity, and part of models are adjusted by manual knobs. The punching workbench can be driven by an XYY motor to carry out alignment adjustment after being pressed down by the pressing plate.

The plate discharging and conveying mechanism 60 conveys the punched inner-layer plate to the rear conveying belt 62 through the second vacuum chuck 61 and the linear motor or the belt motor, a required plate collecting machine or a cleaning machine can be connected to the rear of the conveying belt 62, and after the plate punching is finished, the plate collecting operation can be achieved without manual work through a production line designed in advance by a customer, so that the production efficiency is improved.

In addition, the inner circuit board punching machine is further provided with a control panel 70, a system display 80, a keyboard 90, a control computer 100, a pneumatic control panel 110, an electric cabinet 120 and the like.

The control panel 70 is provided with an on-off button, a start button, a stop button, a reset button, an emergency switch, a selection switch (manual type) for lighting up and down, and status indicators including a main power indicator, a control power indicator, a safety lock indicator, and an emergency switch indicator, which are arranged on the side of the machine, and the manual type is also provided with a start button and a reset button right in front of a manual pre-alignment working platform (MAS) for convenient operation.

The system display 80 and keyboard 90 are mounted on a height adjustable swivel arm on the right side of the machine and are adjustable to a convenient position for operation.

The machine control computer 100 is located below the pre-alignment table for controlling all actions of the machine, including moving the mold, entering and exiting the mold, aligning, punching, etc.

A pneumatic control panel 110 is mounted at the rear of the machine, and includes a pressure gauge, a pressure regulating valve, and an air bearing for controlling the mold locking mechanism, the mold positioning pin, and the mold movement, respectively, and each gauge has a suggested pressure.

The electric cabinet 120 is arranged on the right side of the machine and comprises a rotary switch, a main circuit breaker, a fuse, a power supply, a relay and the like, and the control PLC of the system is also arranged in the electric cabinet 120.

Referring to fig. 5 to 8, based on such an inner layer circuit board punching machine, a fully automatic punching method thereof can be detailed as follows:

first step, start up

Check confirmation is necessary before starting up: (1) the mold part in the machine has no foreign matters, the CCD pre-alignment workbench has no foreign matters, and the plate-out conveyer belt 62 has no foreign matters; (2) the pressure gauge reading on the pneumatic control panel 110 behind the machine is within the normal range (typically 90PSI or higher), ensuring that the machine has a compressed air supply (if the air pressure is not sufficient, it will cause the software to fail to start properly); (3) the machine shell is well covered, and the use safety is ensured. After all things are confirmed, the machine is turned on according to the following steps.

S1-1, after the selection switch On the machine electric control box 120 is rotated to the On position (clockwise selection is On, and anticlockwise selection is off), the white indicator light of the machine main power supply On the operation panel is lightened to show that the main control part circuit of the machine is electrified, and then the power supply start switch of the green button is pressed, and the green indicator light of the operation panel power supply is lightened. If the safety lock indicating lamp is turned on, it is indicated that the lower surrounding metal plate on the machine is loose or in an installation state, the safety lock indicating lamp is triggered, the front cover, the rear cover, the left cover and the right cover of the machine are checked respectively, the handle positions of the dies and the liquid level heights of compressed air and hydraulic oil are adjusted until the safety lock indicating lamp is turned off, and if the emergency stop indicating lamp is turned on, the emergency stop button is rotated to exit the emergency stop state.

S1-2, finding out the machine UPS, pressing the UPS start button O, hearing the crisp click, electrifying the UPS, and pressing the computer start button to start the computer (NOTE, the computer is a server mainboard, the start self-test time may be long, please wait patiently). Multiline software is then found and opened in the quick launch bar.

And S1-3, after the software is started, the hardware is self-checked, and if the self-check has an error, the hardware enters a hardware simulation mode. And entering a login interface when the self-checking is not wrong. And the operator inputs the account password on the login interface. And if the account password is input incorrectly, the user can stop at the login interface all the time, and enters the next interface if the account password is input correctly, and options of loading the latest configuration, loading the new configuration and creating the new configuration are popped up. When the model of the inner circuit board to be punched is the same as that of the previous batch, selecting 'loading the latest configuration'; when a match is found within the system, different from the model of the previous lot, then "load new configuration" is selected; "Create New configuration" is selected when the processed product belongs to a new lot.

After the configuration is finished, the hydraulic pump is started, another login interface is entered, the system can judge whether all the transmission and alignment motors return to zero, and when the judgment result is 'no', the system cannot control the machine to act and only can read or change the parameter file. And when the judgment result is yes, after the motor is reset to zero, the machine is controlled according to the configuration file, and the motor is moved to a corresponding position (including pre-positioning two cameras). Secondly, the system judges whether a reference target is obtained or not, and when the reference target is not obtained, the parameters are modified, and the reference target is obtained again; when the judgment result is yes, the system is started, and the staff performs the following actions:

second, placing the board

The staff (or the manipulator) etc. places the inner layer circuit board in the bat board pre-alignment mechanism 10 in a manual (or automatic) way, the system detects that there is a board signal, the roller operates, makes the inner layer circuit board move to the whole board position, then carries on the whole board action.

Third, the whole board

When the system senses a plate arranging signal, plate arranging action is started, plate arranging completion signals on two sides of the clapper are detected, the clapper stops and returns, and the conveying arm grabs the plate and moves to the pre-alignment table.

The fourth step is pre-alignment

The pre-alignment has two modes, one is MAS manual pre-alignment, the second is MAS automatic pre-alignment, when the MAS automatic pre-alignment is adopted, the two-phase machine displays the target position and carries out position fine adjustment through the XYY alignment motor, and the target position is moved to the center of the visual field. After the pre-alignment is successful, the edge of the inner layer plate is adsorbed by the two first vacuum suction cups 31 through the conveying system, and the plate is precisely conveyed to the punching workbench.

Fifthly, aligning before punching

After the pre-alignment table sends the plate, the punching workbench detects a plate signal, the target in the inner-layer plate is identified through the 4-camera or 8-camera, and the accurate position of the target is fed back to the positioning system in a digital form. And then, the system carries out image processing, the image processing system of the software compares the position information fed back by the camera with a preset 'reference target center' position of the inner plate, and then the XYY motor is driven to drive the worktable to move to an error range allowing punching. Then, the system judges whether the workbench is aligned successfully, and if the judgment result is 'no', the system returns to the image processing; if the judgment result is 'yes', the data such as SPC, harmomegathus value and the like are obtained.

Sixth step, punching

And (3) pressing down the upper punching die, punching the designated position of the plate by using a punching knife arranged in the upper punching die, lifting a press plate of the workbench after punching, and dragging the plate to a plate outlet conveyor belt by using the edges of the two first vacuum suction cups 31 for adsorbing the inner-layer plate through a conveying system.

Seventh step, go out board

The punched inner layer board is conveyed to the rear conveyer belt 62 by the board delivery mechanism 60 through the first vacuum suction cup 31 and the linear motor or the belt motor, so that the first board is produced, and the actions from the second step to the seventh step are repeated continuously, namely, the inner layer circuit board is punched continuously.

The utility model discloses an inner layer circuit board piercing press has the advance of trade.

(1) An advanced and automated inner layer plate post-etching precision punching system OPTILINE PE/ATP is applied, which mainly comprises a plate conveying system, a visual alignment system and a set of high-precision dies capable of repeatedly punching.

(2) ATP 1000 has the capability of processing ultrathin plates down to 2Mil in thickness, with the fastest processing speeds even exceeding 10 Panel/Min. The ATP 1000 is manually entered into the plate and the plate is positioned by the operator substantially on the pre-alignment table. Changing the panel size (moving the Punch Block and Die Block into the correct position) is usually done manually or by a special adjustment tool to coordinate the safe and quick movement.

(3) The ATP autoloading is designed to deliver a 002"/0.05mm thick sheet, replacing the traditional belt drive system, using a linear motor delivery system, with two first vacuum chucks 31 to grab the leading edge of the inner ply and pull it into the machine. Once in the machine, the inner plate is released and the suction cups return to the pre-alignment table position. The inner plate in the machine is positioned and punched out and the second set of suction cups carries it out of the outfeed table. By redesigning the carrying structure of the suction cups, the sheet can be passed through the machine without bending or damaging it. To facilitate transport and to prevent damage, the inner plies are transported on air flotation, the machine table providing a gentle air flotation during the ply transfer. All series OPTILINE PE/ATP machines use the same vision, algorithm and localization system as standards.

(4) Several fiducial marks of OPTILINE PE, which are part of the etched image, are used to locate the inner layer relative to the punch hole. Two or four or eight digital cameras are used to identify the target in the field of view and feed back digital information of its precise position to the positioning system. The microprocessor directs an X, Y, Y stage to position the target at a predetermined "reference target center" of the inner plate in the video system. Any target position deviations due to material dimensional changes are averaged and the system automatically segments the differences. And after the action of the alignment table is finished, the punching is automatically executed.

(5) The full size lower die is standard for all OPTILINE PE/ATP machines.

The bottom module contains all the required punching positions to accommodate the plate size covered by the machine (up to 24 "x 28(610mm x 711mm) in a standard opetp) or more. This design has a dual purpose. In ATP-1000, the plate size mold is automated and the full size lower mold eliminates the need to move the bottom mold. It also provides a flat continuous surface intended to help transport the sheet to the (0.002 "/0.05mm thick) OPE deck, eliminating any openings or holes at the bottom that could cause feed or discharge problems.

(6) Automatic punch block adjustment criteria ATP 3000/7800

The bottom mold assembly integrates all the required plate dimensions. The die will include a plurality of punch locations and a master reference target. The top punch die is a single die and can be automatically moved to the correct position based on the plate size. The compressed air achieves the air floatation effect through the design air path so as to reduce the abrasion during movement. The punching die is easy to disassemble, easy to maintain, and allows interchangeability in punching thick plates. The plate size information is input to the machine by operator input at the console, and the punch and camera are automatically positioned to the correct plate size by the stepper motor. Once in the approximate position, the mold mechanical locating pins are automatically inserted into the precision Casting plate size corresponding positions. This combination of motor positioning and mechanical cooperation provides fast switching, but still ensures positioning accuracy.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims (10)

1. The utility model provides an automatic piercing press of inlayer circuit board which characterized in that: comprises that

The front end of the clapper pre-alignment mechanism (10) is provided with a roller (11) and a clapper alignment structure (12), the clapper is placed on a clapper pre-alignment workbench formed by the roller, and the clapper alignment structure (12) acts to align the clapper to a specified position;

the CCD pre-alignment mechanism (20) is provided with at least two automatically moving CCD cameras (22), and after the CCD cameras (22) grab targets on the plate, the CCD pre-alignment workbench automatically moves to a correct position through a motor according to the size of the punched plate, and automatically pre-aligns the plate;

an inner plate conveying mechanism (30) which adsorbs the plate by a linear motor or a belt motor and a first vacuum suction cup (31) to drag the plate to be accurately fed to a punching worktable of the machine through air flotation, and releases the first vacuum suction cup (31) to return to a CCD (charge coupled device) pre-alignment position after the plate reaches a punching die position;

a mould adjusting and aligning mechanism, which comprises a punching workbench, a pressing plate and an XYY motor driving and adjusting structure, wherein a channel for the plate to enter and send out is arranged between the pressing plate and the pressing plate, when the plate enters the punching workbench, the pressing plate presses down the fixed plate and uploads the target of the plate to a positioning system through a 4-camera or 8-camera recognition, and the positioning system acts on the XYY motor driving and adjusting structure according to a calculated adjusting value to push the punching workbench to rotate and move until the plate is aligned successfully;

the punching mechanism (50) is positioned above the die adjusting and aligning mechanism, the punching mechanism (50) is provided with an upper die, and the upper die is provided with a punch head for punching the plate;

a plate delivery mechanism (60) connected with the punching mechanism (50) for delivering the plate;

the clapper pre-alignment mechanism (10), the CCD pre-alignment mechanism (20), the inner plate conveying mechanism (30), the die adjusting and aligning mechanism (40), the punching mechanism (50) and the plate discharging conveying mechanism (60) are sequentially arranged to form an automatic assembly line.

2. The automatic inner layer circuit board punching machine according to claim 1, wherein: the clapper pre-alignment workbench is provided with a downward warping prevention structure (13) for preventing the clapper from bending downward and being embedded into a gap of the roller (11), and the downward warping prevention structure (13) is a barrier strip.

3. The automatic inner layer circuit board punching machine according to claim 1, wherein: the clapper pre-alignment workbench is provided with an upwarp prevention structure (14) for preventing the clapper from bending upwards and upwarping, and the upwarp prevention structure (14) is a guide plate.

4. The automatic inner layer circuit board punching machine according to claim 1, wherein: in the CCD pre-alignment mechanism, a blowing and pressing mechanism (23) is arranged on a mounting seat of a CCD camera (22).

5. The automatic inner layer circuit board punching machine according to claim 1, wherein: the die adjusting and aligning mechanism (40) adopts 4 cameras to identify the target of the board, and the 4 cameras are respectively positioned at four corners above the board.

6. The automatic inner layer circuit board punching machine according to claim 1, wherein: the mold adjusting and aligning mechanism (40) adopts 8 cameras to identify the targets of the plates, wherein 4 cameras are respectively positioned at four corners above the plates, and the other 4 cameras are respectively positioned at four corners below the plates, so that the upper surface and the lower surface are accurately aligned.

7. The automatic inner layer circuit board punching machine according to claim 1, wherein: the upper die of the punching mechanism (50) is mounted on the upper die plate through a die adjusting tool, and the die adjusting tool can electrically move the die to a set position.

8. The automatic inner layer circuit board punching machine according to claim 1, wherein: the inner layer plate conveying mechanism (30) is composed of an air cushion (32), a first vacuum suction cup (31) adsorbed below the plate and a linear motor.

9. The automatic inner layer circuit board punching machine according to claim 1, wherein: the plate discharging conveying mechanism (60) is conveyed out to a rear conveying belt (62) through a second vacuum suction cup (61) and a linear motor or a belt motor.

10. The automatic inner layer circuit board punching machine according to claim 1, wherein: the device is also provided with a control panel (70), a system display (80), a keyboard (90), a control computer (100), a pneumatic control panel (110) and an electric cabinet (120).

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