CN112171771A

CN112171771A - Full-automatic punching method of inner-layer circuit board punching machine

Info

Publication number: CN112171771A
Application number: CN202011168999.2A
Authority: CN
Inventors: 霍锦充
Original assignee: Dongguan Wkk Machinery Co ltd
Current assignee: Dongguan Wkk Machinery Co ltd
Priority date: 2020-11-17
Filing date: 2020-11-17
Publication date: 2021-01-05

Abstract

The invention discloses a full-automatic punching method of an inner layer circuit board punching machine, which comprises the following components: a clapper pre-alignment workbench, a CCD pre-alignment workbench, an inner plate conveying mechanism, a die adjusting and aligning mechanism, a punching mechanism, a plate discharging and conveying system and the like. The precise punching of the inner layer circuit board is completed through six steps of starting up → placing the board → whole board → pre-alignment → alignment before punching → plate discharging, and the whole process is automated, thereby reducing the manual participation, being efficient and reducing the production cost. The method of the present invention is customized for the inner circuit board, and because the inner circuit board is flexible, very thin, and more difficult to control the precision, a machine and method different from the conventional hard board punching machine are required to complete the precise positioning and punching operation without damaging the inner circuit board.

Description

Full-automatic punching method of inner-layer circuit board punching machine

Technical Field

The invention relates to the technical field of automation equipment, in particular to a full-automatic punching method of an inner-layer circuit board punching machine.

Background

When processing a circuit board, it is necessary to bond the individual circuit boards together with high precision in order to assemble a final circuit. It has become increasingly necessary to index and punch holes in individual circuit board layers, typically by punching holes in precisely defined locations in the printed circuit board.

In the manufacturing process of domestic printed circuit boards, punching is mainly positioned by manual visual inspection. The positioning operation mode has the defects of high labor intensity, low efficiency, poor quality and poor repeatability. Such manual positioning operations are naturally costly and of low precision when a large number of punching operations with different punching specifications are required.

Particularly, the inner layer circuit board is flexible, very thin and difficult to control the precision, so that a device different from a traditional hard board punching machine is needed, for example, a punching machine for the inner layer circuit board is developed, and the feeding, positioning, punching and blanking are automatically carried out in an automatic mode.

Disclosure of Invention

In view of the above, the present invention is directed to the defects of the prior art, and the main objective of the present invention is to provide a full-automatic punching method for an inner-layer circuit board punching machine, which realizes a series of operations of feeding, positioning, punching and blanking of an inner-layer circuit board in an automatic manner.

In order to achieve the purpose, the invention adopts the following technical scheme:

a full-automatic punching method of an inner-layer circuit board punching machine is characterized by comprising the following steps: comprises the following steps

The first step is as follows: starting up

The second step is that: placing plate

Placing the inner circuit board on a clapper pre-alignment workbench or a CCD pre-alignment workbench, detecting a board signal by a system, and moving the inner circuit board to the whole board position by a roller;

the third step: whole plate

When the system senses a plate arranging signal, plate arranging action is started, plate arranging finishing signals at two sides of the clapper are detected, the clapper stops and returns, and a conveying arm grabs the plate and moves to a pre-alignment table;

the fourth step: pre-alignment

The pre-alignment has two modes, one is MAS manual pre-alignment, the second is MAS automatic pre-alignment, one of the two modes is selected, when the MAS automatic pre-alignment is adopted, the two-phase machine displays the target position and carries out position fine adjustment through an XYY alignment motor, the target position is moved to the center of the visual field, and after the pre-alignment is successful, the edge of the inner layer plate is adsorbed by two vacuum chucks through a conveying system, and the plate is dragged to be accurately conveyed to a punching workbench;

the fifth step: counterpoint before punching a hole

After the pre-alignment table sends the plate, the punching workbench detects a plate signal, a target in the inner-layer plate is identified through a 4-camera or 8-camera, and the accurate position of the target is fed back to a positioning system in a digital form; then, image processing is carried out, an image processing system of the software compares the position information fed back by the camera with a 'reference target center' position preset on the inner layer plate, and then the XYY motor is driven to drive the worktable to move to an error range allowing punching; then judging whether the workbench is aligned successfully or not, and returning to image processing if the judgment result is negative; if the judgment result is 'yes', obtaining data such as SPC, expansion and contraction values and the like;

and a sixth step: punching hole

Pressing down the upper punching die, punching a designated position of the plate by using a punching knife arranged in the upper punching die, lifting a pressing plate of a workbench after punching is finished, and dragging the plate to a plate discharging conveying system by using two vacuum suction cups to adsorb the edge of the inner layer plate through a conveying system;

the seventh step: go out board

And (3) conveying the punched inner-layer board to a rear conveying belt by using a board discharging conveying system through a vacuum chuck and a linear motor or a belt motor, so that the first board is produced, and continuously repeating the actions from the second step to the seventh step, namely continuously punching the inner-layer circuit board.

As a preferred solution, before the first step of booting, it is necessary to check the confirmation: (1) the OPE part in the machine has no foreign matter, the MAS manual or clapper pre-alignment workbench has no foreign matter, and the plate-out conveying belt has no foreign matter; (2) the reading of a pressure gauge on a pneumatic control panel behind the machine is in a normal range, so that the machine is guaranteed to be supplied with compressed air; (3) the machine shell is well covered, and the use safety is ensured.

As a preferable scheme, the punching machine for the inner-layer circuit board is provided with a clapper pre-alignment mechanism.

As a preferred scheme, the inner layer circuit board punching machine is provided with a CCD pre-alignment mechanism.

As a preferable scheme, a plate placing machine is additionally arranged at the front end of the plate shooting pre-alignment mechanism or the CCD pre-alignment mechanism.

Preferably, the inner layer circuit board punching machine is provided with an inner layer board conveying mechanism.

Preferably, the inner-layer circuit board punching machine is provided with a die adjusting and aligning mechanism.

As a preferable scheme, the inner layer circuit board punching machine is provided with a punching mechanism.

Preferably, the inner layer circuit board punching machine is provided with a board discharging conveying system.

As a preferred scheme, the inner layer circuit board punching machine is also provided with a control panel, a system display, a keyboard, a control computer, a pneumatic control panel and an electric cabinet.

Compared with the prior art, the inner-layer circuit board punching machine has the advantages and beneficial effects that the accurate punching of the inner-layer circuit board is completed through six steps of starting, placing the board, arranging the board, pre-aligning, aligning before punching, punching and discharging the board, the whole process is automated, the manual participation is reduced, the efficiency is high, and the production cost is reduced. The method is customized for the inner circuit board, and because the inner circuit board is flexible, very thin and more difficult to control the precision, the method which is different from the traditional hard board punching machine is needed, and has the advantages of multiple positioning, whole board positioning, pre-alignment positioning and no defect of alignment before punching so as to complete the precise positioning and punching operation without damaging the inner circuit board.

To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a perspective view of an inner layer circuit board punching machine according to an embodiment of the present invention.

Fig. 2 is a main view of an inner layer circuit board punching machine according to an embodiment of the present invention.

Fig. 3 is a top view of an inner layer circuit board punch of an embodiment of the present invention.

Fig. 4 is a left side view of an inner layer circuit board punch of an embodiment of the present invention.

Fig. 5 is a flowchart (one) of the inner layer circuit board puncher controlling the inner layer circuit board puncher according to the embodiment of the invention.

Fig. 6 is a flowchart of the inner layer circuit board puncher controlling the inner layer circuit board puncher according to the embodiment of the invention (ii).

Fig. 7 is a flowchart (iii) of inner layer circuit board puncher control of the embodiment of the present invention.

Fig. 8 is a flowchart (iv) of inner layer board punch control of the inner layer board punch apparatus according to the embodiment of the present invention.

The attached drawings indicate the following:

10. clapper pre-alignment mechanism 11 and roller

12. Clapper centering structure 13 and downward warping prevention structure

14. Upwarp-preventing structure 20 and CCD pre-alignment mechanism

21. Beam 22 and CCD camera

23. Air blowing pressing mechanism 30 and inner layer plate conveying mechanism

31. First vacuum chuck 32, air cushion

33. Pressing plate device 40 and mold adjusting and aligning mechanism

50. Punching mechanism 60 and plate discharging conveying mechanism

61. Second vacuum chuck 62, conveyer belt

70. Control panel 80, system display

90. Keyboard 100 and control computer

110. Pneumatically control the panel 120 electrical cabinet.

Detailed Description

Referring to fig. 1 to 4, there is shown a structure of a preferred embodiment of the present invention, which is an inner layer circuit board punching machine, the machine is mainly used for punching an etched inner layer board, the machine can punch related tool holes required for a subsequent process at one time, including positioning holes, rivet holes or pin holes, the machine mainly includes an image processing part, a die part capable of precisely and stably punching the tool holes, and system control software, and provides statistical data while producing.

The inner-layer circuit board punching machine adopts a Windows10 operating system as a platform of application software to control logic, control and image processing of the machine, and compared with the old Windows 7/2000 version software, the new version provides a better man-machine interface comprising shortcut icons, scroll bars of Windows, clicking of a mouse, event logging, error reporting records and the like, and in addition, better provides compatibility with third-party software or hardware. However, the machine is not limited to the Windows10 operating system, and other systems of lower or higher versions may be used, as long as the normal operating conditions of the device software are met.

The functional mechanism of the inner layer circuit board punching machine of the invention comprises: the automatic production line comprises a clapper pre-alignment mechanism 10, a CCD pre-alignment mechanism 20, an inner-layer board conveying mechanism 30, a die adjusting and aligning mechanism 40, a punching mechanism 50 and a board discharging conveying mechanism 60, wherein the clapper pre-alignment mechanism 10, the CCD pre-alignment mechanism 20, the inner-layer board conveying mechanism 30, the die adjusting and aligning mechanism 40, the punching mechanism 50 and the board discharging conveying mechanism 60 are sequentially arranged to form an automatic production line, and a series of full-automatic operation of placing an inner-layer circuit board (short for a board), namely, board → pre-alignment → punching → board discharging can be realized.

Structurally, the front end of the clapper pre-alignment mechanism 10 is provided with a roller 11 and a clapper alignment structure 12, when the clapper is placed on the roller 11, the roller 11 runs to match with the clapper action, and after the position of the clapper is arranged, the clapper is conveyed to a CCD pre-alignment workbench through an arm. If the trigger is additionally arranged at the front end of the clapper pre-alignment mechanism 10, the operation efficiency of the machine can be greatly improved and the manual intervention can be reduced.

And a downward warping prevention structure 13 for preventing the plate from bending downwards and being embedded into the gap of the roller 11 is arranged on the clapper pre-alignment workbench, and the downward warping prevention structure 13 is a barrier strip. And an upwarp prevention structure 14 for preventing the board from bending upwards and upwarping is arranged on the clapper pre-alignment workbench, and the upwarp prevention structure 14 is a guide plate. In some embodiments, the guide plate is designed on the cross beam 21. Due to the design of the downward-warping prevention structure 13 and the upward-warping prevention structure 14, the soft inner-layer circuit board cannot be smoothly conveyed due to warping deformation during feeding.

The CCD pre-alignment mechanism 20 is provided with two CCD cameras 22 which can move automatically, and after the CCD cameras 22 capture targets, the plates can be automatically moved to correct positions through a motor according to the sizes of the punched plates to be aligned in advance automatically. The two CCD cameras 22 have low magnification and large visual field, so that the targets on the etched inner-layer plate can be conveniently utilized to carry out automatic pre-alignment, manual alignment of operators is avoided, and the production efficiency is greatly improved. After the pre-alignment is completed, the motor automatically moves the plate to the next working table surface, namely the punching working table.

Furthermore, in order to ensure that the board is completely and flatly attached to the CCD pre-alignment workbench when the CCD camera 22 shoots, the air blowing pressing mechanism 23 is further arranged on the mounting seat of the CCD camera 22, the air blowing pressing mechanism 23 blows air downwards, the board can be pressed on the CCD pre-alignment workbench to be fixed by air pressure generated by air flow, and the board is flat, so that the problem that the target grabbing precision is not high due to poor warping and attaching degree of the soft inner-layer circuit board can be avoided.

In other embodiments, a manual pre-alignment table may be used instead of the CCD pre-alignment mechanism 20 and the clapper pre-alignment mechanism 10. The manual pre-alignment workbench (MAS) is provided with two CCD cameras 22 which can be conveniently moved to correct positions through a handle or a motor according to the size of a plate punched by a client, the two CCD cameras 22 have lower magnification and larger visual field, so that the target on the etched inner-layer plate can be conveniently used for manual rough alignment, an operator puts the inner-layer plate on the CCD pre-alignment workbench firstly, adjusts the position to display the target in the visual field of the CCD cameras 22, and the plate feeding system can automatically feed the plate to the punching workbench after pressing a 'start' button.

Structurally, there is a crossbeam 21 in this CCD counterpoint mechanism 20's top in advance, the board can be followed crossbeam 21 and transferred and pass through, two CCD cameras 22 have been installed to the crossbeam 21 left and right sides, CCD counterpoint workstation both sides in advance has light to provide the printing opacity illumination for digital camera, two CCD cameras 22 can remove the tram according to the work piece size, in addition can also install two little displays additional on crossbeam 21 and be used for showing the target position help and carry out thick location, the light source of light is in the frame of CCD counterpoint workstation below in advance. A counter capable of being reset is arranged on the side edge of the table board, so that a user can conveniently count.

The inner layer plate conveying mechanism 30 is used for conveying an inner layer plate which is as thin as 0.05mm, a linear motor or a belt motor and a first vacuum suction cup 31 are used for adsorbing the edge of the inner layer plate to drag the plate to be accurately conveyed to a punching workbench of a machine through air floatation, and the first vacuum suction cup 31 is released to retreat to a CCD pre-alignment position after the plate reaches a punching die position, so that the very thin inner layer plate can be smoothly conveyed and cannot be bent, deformed or scratched.

Specifically, the inner-layer plate conveying mechanism has the structure that: an air cushion 32 of a pre-alignment workbench, a first vacuum suction cup 31 adsorbed below a plate and a linear motor form an inner plate conveying mechanism together, and the plate can be smoothly fed into a punching position in a machine. The linear motor consists of a track and a motor rotor coil, the first vacuum sucker 31 is arranged on the rotor of the linear motor and can move back and forth on the track along with the rotor, and the cross beam 21 is provided with a pressure plate device 33 which can ensure that the plate is sucked by the sucker.

The mold adjustment alignment mechanism 40: the lower module generally contains all the sizes customized by customers, the die holder comprises a plurality of dies (or positions) with different sizes and a reference target of the machine, the die of the upper die holder which is a single position can be rapidly moved to a correct position through a tool manually or electrically according to the size of the punched plate, and then the die is locked through a very precise positioning pin, so that the precise positioning of the die can be ensured to ensure the precision of the punching position of the machine.

The punching mechanism 50: is located above the die adjustment and alignment mechanism, the punching mechanism 50 is provided with an upper die having a punch for punching the board. After a plate on a CCD pre-alignment workbench is pre-aligned and then is fed into a die punching position in a machine, a punching workbench detects a plate signal, a 4-camera or 8-camera is used for identifying a target in an inner plate and feeding back the accurate position of the target to a positioning system in a digital form, the target of the plate can be seen on a digital camera, an image processing system of software takes out the accurate position of the target on the plate according to the position, then an XYY motor is driven to drive the punching workbench of the machine to move to an error range allowing punching, the system compares the position of the target read on the plate with a reference target position on the machine, then deviation is automatically and evenly distributed, after the table surface is aligned, the machine automatically drives an upper die, and punching is started by a punch.

In some models, the mold alignment mechanism uses 4 cameras to identify the target of the board, and the 4 cameras are respectively located at four corners above the board. In other models, the mold adjusting and aligning mechanism adopts 8 cameras to identify the targets of the plate, wherein 4 cameras are respectively positioned at four corners above the plate, and the other 4 cameras are respectively positioned at four corners below the plate, so that the accurate alignment of the upper surface and the lower surface is realized.

When the size of the plate is changed, a special die adjusting tool is needed to move the upper die to an accurate position and then the upper die is locked by the positioning pin. The lower mold is full-sized, which means that all required dimensions are already included without changing the position, and a reference target and a light bar for providing illumination are provided on the lower molds on the left and right sides, respectively. The middle part of the upper cover of the machine is provided with a light source and a light source regulator. In some high-power distribution models, the light source brightness is automatically adjusted by software analog quantity, and part of models are adjusted by manual knobs. The punching workbench can be driven by an XYY motor to carry out alignment adjustment after being pressed down by the pressing plate.

The plate discharging and conveying mechanism 60 conveys the punched inner-layer plate to the rear conveying belt 62 through the second vacuum chuck 61 and the linear motor or the belt motor, a required plate collecting machine or a cleaning machine can be connected to the rear of the conveying belt 62, and after the plate punching is finished, the plate collecting operation can be achieved without manual work through a production line designed in advance by a customer, so that the production efficiency is improved.

In addition, the inner circuit board punching machine is further provided with a control panel 70, a system display 80, a keyboard 90, a control computer 100, a pneumatic control panel 110, an electric cabinet 120 and the like.

The control panel 70 is provided with an on-off button, a start button, a stop button, a reset button, an emergency switch, a selection switch (manual type) for lighting up and down, and status indicators including a main power indicator, a control power indicator, a safety lock indicator, and an emergency switch indicator, which are arranged on the side of the machine, and the manual type is also provided with a start button and a reset button right in front of a manual pre-alignment working platform (MAS) for convenient operation.

The system display 80 and keyboard 90 are mounted on a height adjustable swivel arm on the right side of the machine and are adjustable to a convenient position for operation.

The machine control computer 100 is located below the pre-alignment table for controlling all actions of the machine, including moving the mold, entering and exiting the mold, aligning, punching, etc.

A pneumatic control panel 110 is mounted at the rear of the machine, and includes a pressure gauge, a pressure regulating valve, and an air bearing for controlling the mold locking mechanism, the mold positioning pin, and the mold movement, respectively, and each gauge has a suggested pressure.

The electric cabinet 120 is arranged on the right side of the machine and comprises a rotary switch, a main circuit breaker, a fuse, a power supply, a relay and the like, and the control PLC of the system is also arranged in the electric cabinet 120.

Referring to fig. 5 to 8, based on such an inner layer circuit board punching machine, a fully automatic punching method thereof can be detailed as follows:

first step, start up

Check confirmation is necessary before starting up: (1) the mold part in the machine has no foreign matters, the CCD pre-alignment workbench has no foreign matters, and the plate-out conveyer belt 62 has no foreign matters; (2) the pressure gauge reading on the pneumatic control panel 110 behind the machine is within the normal range (typically 90PSI or higher), ensuring that the machine has a compressed air supply (if the air pressure is not sufficient, it will cause the software to fail to start properly); (3) the machine shell is well covered, and the use safety is ensured. After all things are confirmed, the machine is turned on according to the following steps.

S1-1, after the selection switch On the machine electric control box 120 is rotated to the On position (clockwise selection is On, and anticlockwise selection is off), the white indicator light of the machine main power supply On the operation panel is lightened to show that the main control part circuit of the machine is electrified, and then the power supply start switch of the green button is pressed, and the green indicator light of the operation panel power supply is lightened. If the safety lock indicating lamp is turned on, it is indicated that the lower surrounding metal plate on the machine is loose or in an installation state, the safety lock indicating lamp is triggered, the front cover, the rear cover, the left cover and the right cover of the machine are checked respectively, the handle positions of the dies and the liquid level heights of compressed air and hydraulic oil are adjusted until the safety lock indicating lamp is turned off, and if the emergency stop indicating lamp is turned on, the emergency stop button is rotated to exit the emergency stop state.

S1-2, finding out the machine UPS, pressing the UPS start button O, hearing the crisp click, electrifying the UPS, and pressing the computer start button to start the computer (NOTE, the computer is a server mainboard, the start self-test time may be long, please wait patiently). Multiline software is then found and opened in the quick launch bar.

And S1-3, after the software is started, the hardware is self-checked, and if the self-check has an error, the hardware enters a hardware simulation mode. And entering a login interface when the self-checking is not wrong. And the operator inputs the account password on the login interface. And if the account password is input incorrectly, the user can stop at the login interface all the time, and enters the next interface if the account password is input correctly, and options of loading the latest configuration, loading the new configuration and creating the new configuration are popped up. When the model of the inner circuit board to be punched is the same as that of the previous batch, selecting 'loading the latest configuration'; when a match is found within the system, different from the model of the previous lot, then "load new configuration" is selected; "Create New configuration" is selected when the processed product belongs to a new lot.

After the configuration is finished, the hydraulic pump is started, another login interface is entered, the system can judge whether all the transmission and alignment motors return to zero, and when the judgment result is 'no', the system cannot control the machine to act and only can read or change the parameter file. And when the judgment result is yes, after the motor is reset to zero, the machine is controlled according to the configuration file, and the motor is moved to a corresponding position (including pre-positioning two cameras). Secondly, the system judges whether a reference target is obtained or not, and when the reference target is not obtained, the parameters are modified, and the reference target is obtained again; when the judgment result is yes, the system is started, and the staff performs the following actions:

second, placing the board

The staff (or the manipulator) etc. places the inner layer circuit board in the bat board pre-alignment mechanism 10 in a manual (or automatic) way, the system detects that there is a board signal, the roller operates, makes the inner layer circuit board move to the whole board position, then carries on the whole board action.

Third, the whole board

When the system senses a plate arranging signal, plate arranging action is started, plate arranging completion signals on two sides of the clapper are detected, the clapper stops and returns, and the conveying arm grabs the plate and moves to the pre-alignment table.

The fourth step is pre-alignment

The pre-alignment has two modes, one is MAS manual pre-alignment, the second is MAS automatic pre-alignment, when the MAS automatic pre-alignment is adopted, the two-phase machine displays the target position and carries out position fine adjustment through the XYY alignment motor, and the target position is moved to the center of the visual field. After the pre-alignment is successful, the edge of the inner plate is adsorbed by the two vacuum chucks 31 through the conveying system, and the plate is precisely conveyed to the punching workbench by dragging.

Fifthly, aligning before punching

After the pre-alignment table sends the plate, the punching workbench detects a plate signal, the target in the inner-layer plate is identified through the 4-camera or 8-camera, and the accurate position of the target is fed back to the positioning system in a digital form. And then, the system carries out image processing, the image processing system of the software compares the position information fed back by the camera with a preset 'reference target center' position of the inner plate, and then the XYY motor is driven to drive the worktable to move to an error range allowing punching. Then, the system judges whether the workbench is aligned successfully, and if the judgment result is 'no', the system returns to the image processing; if the judgment result is 'yes', the data such as SPC, harmomegathus value and the like are obtained.

Sixth step, punching

And (3) pressing down the upper punching die, punching the designated position of the plate by using a punching knife arranged in the upper punching die, lifting a press plate of a workbench after punching is finished, and dragging the plate to a plate discharging conveyor belt by using the edges of two vacuum suction cups 31 for adsorbing the inner layer plate through a conveying system.

Seventh step, go out board

The punched inner layer board is conveyed to the rear conveyer belt 62 by the board discharging conveyer mechanism 60 through the vacuum suction cup 31 and the linear motor or the belt motor, so that the first board is produced, and the actions from the second step to the seventh step are repeated continuously, namely, the inner layer circuit board is punched continuously.

The inner-layer circuit board punching machine has the advancement of the industry.

(1) An advanced and automated inner layer plate post-etching precision punching system OPTILINE PE/ATP is applied, which mainly comprises a plate conveying system, a visual alignment system and a set of high-precision dies capable of repeatedly punching.

(2) ATP 1000 has the capability of processing ultrathin plates down to 2Mil in thickness, with the fastest processing speeds even exceeding 10 Panel/Min. The ATP 1000 is manually entered into the plate and the plate is positioned by the operator substantially on the pre-alignment table. Changing the panel size (moving the Punch Block and Die Block into the correct position) is usually done manually or by a special adjustment tool to coordinate the safe and quick movement.

(3) The ATP autoloading is designed to deliver a 002"/0.05mm thick sheet, replacing the traditional belt drive system, using a linear motor conveyor system, with two vacuum chucks 31 to grab the leading edge of the inner sheet and pull it into the machine. Once in the machine, the inner plate is released and the suction cups return to the pre-alignment table position. The inner plate in the machine is positioned and punched out and the second set of suction cups carries it out of the outfeed table. By redesigning the carrying structure of the suction cups, the sheet can be passed through the machine without bending or damaging it. To facilitate transport and to prevent damage, the inner plies are transported on air flotation, the machine table providing a gentle air flotation during the ply transfer. All series OPTILINE PE/ATP machines use the same vision, algorithm and localization system as standards.

(4) Several fiducial marks of OPTILINE PE, which are part of the etched image, are used to locate the inner layer relative to the punch hole. Two or four or eight digital cameras are used to identify the target in the field of view and feed back digital information of its precise position to the positioning system. The microprocessor directs an X, Y, Y stage to position the target at a predetermined "reference target center" of the inner plate in the video system. Any target position deviations due to material dimensional changes are averaged and the system automatically segments the differences. And after the action of the alignment table is finished, the punching is automatically executed.

(5) The full size lower die is standard for all OPTILINE PE/ATP machines.

The bottom module contains all the required punching positions to accommodate the plate size covered by the machine (up to 24 "x 28(610mm x 711mm) in a standard opetp) or more. This design has a dual purpose. In ATP-1000, the plate size mold is automated and the full size lower mold eliminates the need to move the bottom mold. It also provides a flat continuous surface intended to help transport the sheet to the (0.002 "/0.05mm thick) OPE deck, eliminating any openings or holes at the bottom that could cause feed or discharge problems.

(6) Automatic punch block adjustment criteria ATP 3000/7800

The bottom mold assembly integrates all the required plate dimensions. The die will include a plurality of punch locations and a master reference target. The top punch die is a single die and can be automatically moved to the correct position based on the plate size. The compressed air achieves the air floatation effect through the design air path so as to reduce the abrasion during movement. The punching die is easy to disassemble, easy to maintain, and allows interchangeability in punching thick plates. The plate size information is input to the machine by operator input at the console, and the punch and camera are automatically positioned to the correct plate size by the stepper motor. Once in the approximate position, the mold mechanical locating pins are automatically inserted into the precision Casting plate size corresponding positions. This combination of motor positioning and mechanical cooperation provides fast switching, but still ensures positioning accuracy.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.

Claims

1. A full-automatic punching method of an inner-layer circuit board punching machine is characterized by comprising the following steps: comprises the following steps

The first step is as follows: starting up

The second step is that: placing plate

Placing the inner-layer circuit board on a clapper pre-alignment workbench, detecting a board signal by a system, and moving the roller to the whole board position;

the third step: whole plate

the fourth step: pre-alignment

The pre-alignment has two modes, one mode is manual pre-alignment of a CCD pre-alignment workbench, the second mode is automatic pre-alignment of the CCD pre-alignment workbench, one mode is selected, when the CCD pre-alignment workbench is adopted for pre-alignment, a two-phase machine displays the position of a target and carries out position fine adjustment through an XYY alignment motor, the target is moved to the center of a visual field, and after the pre-alignment is successful, the edge of an inner layer plate is adsorbed by two vacuum chucks through a conveying system to drag the plate to be accurately conveyed to a punching workbench;

the fifth step: counterpoint before punching a hole

and a sixth step: punching hole

Pressing down the upper punching die, punching a designated position of the plate by using a punching knife arranged in the upper punching die, lifting a pressing plate of a workbench after punching is finished, and dragging the plate to a plate conveying system by using two vacuum chucks to adsorb the edge of the inner-layer plate through a conveying system;

the seventh step: go out board

2. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: checking and confirming before the first step of starting up: (1) the mould part in the machine has no foreign matter, the pre-alignment workbench or the clapper pre-alignment workbench has no foreign matter, and the plate-out conveying belt has no foreign matter; (2) the reading of a pressure gauge on a pneumatic control panel behind the machine is in a normal range, so that the machine is guaranteed to be supplied with compressed air; (3) the machine shell is well covered, and the use safety is ensured.

3. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: the inner-layer circuit board punching machine is provided with a clapper pre-alignment mechanism (10).

4. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: the inner layer circuit board punching machine is provided with a CCD pre-alignment mechanism (20).

5. The full-automatic punching method of the inner layer circuit board punching machine according to claim 3 or 4, characterized in that: the plate placing machine is additionally arranged at the front end of the plate beating pre-alignment mechanism (10) or the CCD pre-alignment mechanism (20).

6. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: the inner layer circuit board punching machine is provided with an inner layer board conveying mechanism (30).

7. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: the inner layer circuit board punching machine is provided with a die adjusting and aligning mechanism (40).

8. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: the inner layer circuit board punching machine is provided with a punching mechanism (50).

9. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: the inner layer circuit board punching machine is provided with a board discharging and conveying system (60).

10. The full-automatic punching method of the inner layer circuit board punching machine according to claim 1, characterized in that: the inner circuit board punching machine is also provided with a control panel (70), a system display (80), a keyboard (90), a control computer (100), a pneumatic control panel (110) and an electric cabinet (120).