CN213644962U

CN213644962U - Automatic frequency divider

Info

Publication number: CN213644962U
Application number: CN202021965193.1U
Authority: CN
Inventors: 谢尚平; 刘兴波
Original assignee: Zhuhai Dongjin Quartz Technology Co ltd
Current assignee: Zhuhai Dongjin Quartz Technology Co ltd
Priority date: 2020-09-10
Filing date: 2020-09-10
Publication date: 2021-07-09
Anticipated expiration: 2030-09-10

Abstract

The utility model discloses an automatic frequency divider aims at providing one kind and saves the cost of labor, improves production efficiency and the high automatic frequency divider of the test accuracy. The utility model discloses a workbench, be provided with the charging tray subassembly on the workbench, the one end of charging tray subassembly is provided with feed divider, the charging tray subassembly with be provided with electrode testing device between the feed divider, be provided with the location camera directly over the charging tray and get the material camera, the charging tray subassembly with be provided with the transport manipulator between the electrode testing device, the last stepping manipulator that is provided with of feed divider, still be provided with MCU control system on the workbench, the charging tray subassembly feed divider electrode testing device the location camera get the material camera the transport manipulator with the stepping manipulator all with MCU control system electric connection. The utility model discloses be applied to in the technical field of the processing equipment of wafer.

Description

Automatic frequency divider

Technical Field

The utility model relates to an automatic frequency divider, in particular to an automatic frequency divider applied to a subminiature quartz wafer.

Background

The quartz crystal wafer is a substrate for manufacturing the quartz crystal component, and the quartz crystal component has the advantages of excellent frequency stability, high quality factor and low cost; the accurate measurement and sorting of the frequency of the quartz crystal wafer is an important process for improving the quality and the production efficiency of quartz crystal components; the existing wafer frequency divider is easy to superpose the wafer at the edge during feeding and cannot be identified by a camera, so that the subsequent testing procedure cannot be carried out and manual treatment is needed; in addition, the appearance of the existing wafer needs to be checked after frequency division detection is finished, defects such as edge breakage, scratches and bright spots of the wafer are detected and selected, and the working efficiency is greatly reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide one kind and saved the cost of labor, improved production efficiency and the high automatic frequency divider of the test accuracy.

The utility model adopts the technical proposal that: the utility model discloses a workbench, be provided with the charging tray subassembly on the workbench, the one end of charging tray subassembly is provided with feed divider, the charging tray subassembly with be provided with electrode testing device between the feed divider, be provided with the location camera directly over the charging tray and get the material camera, the charging tray subassembly with be provided with the transport manipulator between the electrode testing device, the last stepping manipulator that is provided with of feed divider, still be provided with MCU control system on the workbench, the charging tray subassembly feed divider electrode testing device the location camera get the material camera the transport manipulator with the stepping manipulator all with MCU control system electric connection.

Furthermore, the charging tray subassembly include the rotating electrical machines and with the raw materials dish that the rotating electrical machines is connected, the outer edge of raw materials dish is equipped with annular groove, the lower extreme of annular groove is provided with the wafer drawer, be equipped with on the annular groove with the through-hole that the wafer drawer is linked together.

Further, the upper end of raw materials dish is provided with feeding device, feeding device is including rotating motor, storage cylinder and funnel, rotate the motor with the storage cylinder is connected, be equipped with the screw thread baffle box in the storage cylinder, the storage cylinder is located the top of raw materials dish, the funnel is located the export of storage cylinder with between the raw materials dish.

Furthermore, the electrode testing device comprises a testing turntable, a plurality of testing carriers are arrayed on the testing turntable, lower electrodes are arranged at the lower ends of the testing carriers, and an upper electrode assembly is arranged at one end of the testing turntable.

Furthermore, the feed divider includes the branch charging tray, the branch charging tray be equipped with the breach of test carousel looks adaptation, the outer lane array of branch charging tray has a plurality of magazine.

Furthermore, the stepping manipulator is installed on the circle center of the stepping plate, two stepping suction heads are arranged at the tail end of the stepping manipulator and located above the material box, and the distance between the two stepping suction heads is equal to the distance between two adjacent test carriers.

Furthermore, the location camera is the inspection outward appearance location camera, it fixes a position the camera for discernment wafer to get the material camera, inspection outward appearance location camera with the below of discernment wafer location camera all is provided with the light source reflector.

Further, the MCU control system comprises an MCU controller, and a display screen, a keyboard, a mouse, an alarm lamp and an on-off key which are all electrically connected with the MCU controller.

The utility model has the advantages that: because the utility model comprises a workbench, a material tray assembly is arranged on the workbench, one end of the material tray assembly is provided with a material distributing device, an electrode testing device is arranged between the material tray assembly and the material distributing device, a positioning camera and a material taking camera are arranged right above the material tray, a carrying manipulator is arranged between the material tray assembly and the electrode testing device, a stepping manipulator is arranged on the material distributing device, an MCU control system is also arranged on the workbench, the material tray assembly, the material distributing device, the electrode testing device, the positioning camera, the material taking camera, the carrying manipulator and the stepping manipulator are all electrically connected with the MCU control system, so the utility model can detect and select defects such as edge breakage, scratch, bright spots and the like of wafers through the positioning camera, unqualified products are transferred through the carrying manipulator, and the qualified wafers are subjected to image acquisition through the material taking camera, the wafer taking image processing module is used for analyzing the wafer scattering condition, so that the position information of a single wafer which can be taken is determined, then the wafer is transferred to the electrode testing device through the carrying manipulator for testing, the testing result is transmitted to the MCU control system, and finally the wafer is transferred to the material box on the material distributing device through the grading manipulator, so that the whole work is coherent, and the work efficiency is high.

Drawings

Fig. 1 is a plan view of the present invention.

Detailed Description

As shown in fig. 1, in this embodiment, the utility model discloses a workstation 1, be provided with charging tray subassembly 2 on the workstation 1, the one end of charging tray subassembly 2 is provided with feed divider 3, charging tray subassembly 2 with be provided with electrode testing device 4 between the feed divider 3, be provided with location camera 5 directly over the charging tray and get material camera 6, charging tray subassembly 2 with be provided with transport manipulator 7 between the electrode testing device 4, be provided with stepping manipulator 8 on the feed divider 3, still be provided with MCU control system on the workstation 1, charging tray subassembly 2 feed divider 3 electrode testing device 4 location camera 5 get material camera 6 transport manipulator 7 with stepping manipulator 8 all with MCU control system electric connection.

In this embodiment, the tray assembly 2 includes a rotating motor and a raw material tray 21 connected to the rotating motor, the raw material tray 21 is made of a special aluminum material, an annular groove 22 is formed on an outer edge of the raw material tray 21, a wafer drawer is disposed at a lower end of the annular groove 22, a through hole 23 communicated with the wafer drawer is formed in the annular groove 22, since the raw material tray 21 needs to be rotated back and forth during loading for the wafers to be stacked, the wafers can be uniformly scattered on the raw material tray 21, in order to prevent the wafers from falling out of the raw material tray 21 during scattering, the annular groove 22 is newly added to solve the problem, the wafers on the annular groove 22 finally fall into the wafer drawer under the back and forth rotating effect, and the wafer drawer can be rewound into the raw material tray 21 again when collecting a certain amount, the upper end of raw materials dish 21 is provided with feeding device 9, feeding device 9 is including rotating motor 91, storage cylinder 92 and funnel 93, rotate motor 91 with storage cylinder 92 is connected, be equipped with the screw thread baffle box in the storage cylinder 92, storage cylinder 92 is located raw materials dish 21's top, funnel 93 is located storage cylinder 92's export with between the raw materials dish 21, funnel 93 prevents that reinforced in-process wafer from splashing, and this project organization has abandoned vibration material loading form, adopts storage cylinder 92 at the uniform velocity to rotate bulk cargo mode, can effectively prevent that the wafer is damaged, eliminates electrostatic interference.

In this embodiment, the electrode testing apparatus 4 includes a testing turntable 41, a plurality of testing carriers 42 are arrayed on the testing turntable 41, lower electrodes are disposed at lower ends of the testing carriers 42, and an upper electrode assembly 43 is disposed at one end of the testing turntable 41.

In this embodiment, the upper electrode assembly 43 includes a testing jig, an X-axis fine adjustment mechanism is disposed on the testing jig, a Y-axis fine adjustment mechanism is disposed on the X-axis fine adjustment mechanism, a lifting upper electrode probe is disposed on the Y-axis fine adjustment mechanism, the lifting upper electrode probe is a solid upper electrode, a micro CCD camera is disposed at one end of the lifting upper electrode probe, and since the lower electrode is larger than the wafer in size, image acquisition is performed on the wafer in the lower electrode by the micro CCD camera, and then fine adjustment is performed on the lifting upper electrode probe by the X-axis fine adjustment mechanism and the Y-axis fine adjustment mechanism, so that the lifting upper electrode probe can accurately position a measuring position, and measurement is more accurate.

In this embodiment, feed divider 3 is including dividing charging tray 31, divide charging tray 31 be equipped with the breach 32 of test carousel 41 looks adaptation, divide charging tray 31's outer lane array to have a plurality of magazine 33, all can have different frequency numerical value on every magazine 33, divide charging tray 31's both sides lower extreme to be provided with guide rail plate 34, divide charging tray 31's lower extreme be provided with the slider of guide rail plate 34 looks adaptation, the end of guide rail plate is provided with die clamping cylinder 35, divide charging tray 31's both sides upper end to be provided with handle 36, this project organization is favorable to after frequency division work, can take out fast and divide charging tray 31, right wafer in the magazine 33 is collected.

In this embodiment, the stepping manipulator 8 is installed in the center of the circle of the material distribution plate 31, the end of the stepping manipulator 8 is provided with two stepping suction heads 81, the stepping suction heads 81 are located above the material box 33, the distance between the two stepping suction heads 81 is equal to the distance between two adjacent test carriers 42, the two stepping suction heads 81 are used for definite time, the sorting speed of the wafer is remarkably improved, and the sorting speed can reach 5000pcs/H

In this embodiment, location camera 5 is inspection outward appearance location camera 5, inspection outward appearance location camera can be broken the flaw such as limit, mar, bright spot to the wafer and detect and select, it fixes a position the camera for discernment wafer to get material camera 6, discernment wafer location camera carries out image acquisition to the wafer on the raw materials dish 21, gets piece image processing module, and the analysis wafer situation of scattering to confirm the single positional information who can take the wafer, inspection outward appearance location camera with the below of discernment wafer location camera all is provided with the light source reflector, the light source reflector utilizes light reflection and refraction principle, eliminates the shade of camera lens.

In this embodiment, the MCU control system includes an MCU controller, and a display screen, a keyboard 10, a mouse 11, an alarm lamp and an on/off switch all electrically connected to the MCU controller.

In this embodiment, the utility model discloses the course of work does: the rotary motor 91 drives the material storage cylinder 92 to rotate, so that the wafers are output through the thread material guide groove, the funnel stably enters the raw material disc 21, due to the fact that the wafers are small in size and easy to overlap, the wafers are not overlapped when the raw material disc 21 is driven by the rotary motor to rotate bulk materials, then the appearance positioning inspection camera 5 can detect and select defects such as edge breakage, scratch and bright spots of the wafers, unqualified products are removed in advance, then the wafers on the raw material disc 21 are subjected to image acquisition through the identification wafer positioning camera, a wafer taking image processing module is carried out, the wafer scattering condition is analyzed, so that the position information of a single wafer which can be taken is determined, then the carrying manipulator 7 is used for the lower electrode, and the wafer is rotated to the upper electrode assembly 43 through the test turntable 41 for testing, and then the test result is transmitted to an MCU control system, and finally the MCU control system controls the grading manipulator 8 to grade the wafer.

The utility model discloses be applied to the technical field of the processing equipment of wafer.

While the embodiments of the present invention have been described in terms of practical embodiments, they are not intended to limit the scope of the invention, and modifications of the embodiments and combinations with other embodiments will be apparent to those skilled in the art in light of the present description.

Claims

1. An automatic frequency divider is characterized in that: it comprises a workbench (1), a charging tray component (2) is arranged on the workbench (1), a material distribution device (3) is arranged at one end of the material tray component (2), an electrode testing device (4) is arranged between the material tray component (2) and the material distribution device (3), a positioning camera (5) and a material taking camera (6) are arranged right above the material tray, a carrying manipulator (7) is arranged between the material tray component (2) and the electrode testing device (4), the material distributing device (3) is provided with a gear shifting manipulator (8), the workbench (1) is also provided with an MCU control system, the material tray assembly (2), the material distribution device (3), the electrode testing device (4), the positioning camera (5), the material taking camera (6), the carrying manipulator (7) and the grading manipulator (8) are all electrically connected with the MCU control system.

2. The automatic frequency divider of claim 1, wherein: the charging tray subassembly (2) include the rotating electrical machines and with raw materials dish (21) that the rotating electrical machines is connected, the outer edge of raw materials dish (21) is equipped with annular groove (22), the lower extreme of annular groove (22) is provided with the wafer drawer, be equipped with on annular groove (22) with through-hole (23) that the wafer drawer is linked together.

3. The automatic frequency divider of claim 2, wherein: the upper end of former charging tray (21) is provided with feeding device (9), feeding device (9) are including rotating motor (91), storage cylinder (92) and funnel (93), rotate motor (91) with storage cylinder (92) are connected, be equipped with the screw thread baffle box in storage cylinder (92), storage cylinder (92) are located the top of former charging tray (21), funnel (93) are located the export of storage cylinder (92) with between former charging tray (21).

4. The automatic frequency divider of claim 1, wherein: the electrode testing device (4) comprises a testing turntable (41), a plurality of testing carriers (42) are arrayed on the testing turntable (41), lower electrodes are arranged at the lower ends of the testing carriers (42), and an upper electrode assembly (43) is arranged at one end of the testing turntable (41).

5. The automatic frequency divider of claim 4, wherein: the material distributing device (3) comprises a material distributing disc (31), the material distributing disc (31) is provided with a notch (32) matched with the test turntable (41), and a plurality of material boxes (33) are arranged on an outer ring array of the material distributing disc (31).

6. The automatic frequency divider of claim 5, wherein: stepping manipulator (8) install in on the centre of a circle of stepping dish (31), the end of stepping manipulator (8) is provided with two stepping suction heads (81), stepping suction head (81) are located the top of magazine (33), and two distance between stepping suction head (81) equals with the distance between two adjacent test carriers (42).

7. The automatic frequency divider of claim 1, wherein: location camera (5) are for examining the outward appearance location camera, get material camera (6) and fix a position the camera for discernment wafer, examine outward appearance location camera with the below of discernment wafer location camera all is provided with the light source reflector.

8. The automatic frequency divider of claim 1, wherein: the MCU control system comprises an MCU controller, and a display screen, a keyboard (10), a mouse (11), an alarm lamp and an on-off key which are all electrically connected with the MCU controller.