CN213638375U - Intelligence circuit board for temperature humidity control - Google Patents

Abstract

The utility model discloses a circuit board for intelligent temperature and humidity adjustment, which comprises a base plate, the through-hole has been seted up in the four corners department of base plate through, the inside of through-hole has been run through to the sleeve, the sleeve top is still overlapped and is equipped with the apical ring, the top face edge of sleeve bonds there is the spacing ring, the spacing ring is connected with the inner wall laminating of apical ring, the bottom of sleeve still is formed with the bellied bulge loop to the outside, the bottom face of base plate is in the right angle inboard that the bulge loop formed with the sleeve, the bottom face edge of apical ring has seted up the ring channel, the inboard card of this ring channel has been gone into the damping ring, the bottom of damping ring bulges the ring channel to the outside of apical ring; through the sleeve and the apical ring of design, can in use, replace through-hole and outside bolt to fix, this structure can be changed simultaneously, is convenient for in the timely change in the damage that appears to and the damping ring of design, can in use, reduce the extrusion force that causes the base plate in apical ring and bolted connection.

Description

Intelligence circuit board for temperature humidity control

Technical Field

The utility model belongs to the technical field of the circuit board, concretely relates to circuit board for intelligence temperature humidity control.

Background

The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed circuit board etc. the circuit board makes the circuit miniaturation, visualizes, plays important role to fixed circuit's batch production and optimization with electrical apparatus overall arrangement, in intelligent device is to temperature and humidity regulation, also need use the circuit board.

The existing circuit board needs to be connected through bolt fastening in the installation, but in the installation, in case the excessive phenomenon of power appears, the bolt can extrude the base plate, leads to the cracked phenomenon to appear in the base plate, influences the use in later stage, and it is great to maintain the degree of difficulty simultaneously, and the cost is higher, therefore has great limitation in the in-service use, has the space that can improve.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board for intelligent temperature humidity control to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an intelligence circuit board for temperature and humidity control, includes the base plate, the four corners department of base plate runs through and has seted up the through-hole, the inside of through-hole is run through and is had the sleeve, telescopic top is still overlapped and is equipped with the apical ring, telescopic top face edge bonding limit ring, the limit ring is connected with the inner wall laminating of apical ring, telescopic bottom still is formed with the bellied bulge loop in the outside, the bottom face of base plate is in the right angle inboard that bulge loop and sleeve formed.

Preferably, the bottom end face edge of top ring has seted up the ring channel, and the damping ring has been gone into to the inboard card of this ring channel, the bottom protrusion ring channel of damping ring to the outside of top ring, the bottom of damping ring is connected with the laminating of the top face of base plate.

Preferably, the bottom end face of base plate equidistance has seted up the radiating groove, the cross section of radiating groove is the cuboid structure, the longitudinal section of radiating groove is the arc structure.

Preferably, a bottom hole is formed in the middle position of the top of each heat dissipation groove, and the top of each bottom hole extends towards the inside of the substrate.

Preferably, a plurality of electronic components are mounted on the surface of the substrate, and the thickness of the substrate is two millimeters.

Preferably, the sleeve and the top ring are both metal components, and the inner wall of the sleeve is provided with threads connected with an external bolt.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the sleeve and the top ring can replace a through hole to be fixed with an external bolt in use, meanwhile, the structure can be replaced, and the structure is convenient to replace in time when damage occurs;

2. through the radiating groove and the bottom hole of design, can in use, improve radiating efficiency to reduce the damage that the base plate caused because of self high temperature, guarantee the stability in use of base plate and improve heat dispersion.

Drawings

Fig. 1 is a top view of the present invention;

fig. 2 is a cross-sectional view of the present invention;

FIG. 3 is a cross-sectional view of the sleeve and the top ring according to the present invention;

fig. 4 is a bottom view of the present invention;

in the figure: 1. a through hole; 2. a substrate; 3. a sleeve; 4. a heat sink; 5. a shock-absorbing ring; 6. a top ring; 7. a limiting ring; 8. a convex ring; 9. a bottom hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 4, the present invention provides a technical solution: the utility model provides an intelligence circuit board for temperature and humidity control, which comprises a substrate 2, base plate 2's four corners department runs through and has seted up through-hole 1, through-hole 1's inside is run through there is sleeve 3, sleeve 3's top still cover is equipped with apical ring 6, sleeve 3 and apical ring 6 through the design, can in use, replace through-hole 1 and outside bolt to fix, this structure can be changed simultaneously, be convenient for in the damage timely change appears, and the damping ring 5 of design, can in use, reduce the extrusion force that causes base plate 2 in apical ring 6 and the bolted connection, sleeve 3's top face edge bonding has spacing ring 7, spacing ring 7 is connected with the inner wall laminating of apical ring 6, sleeve 3's bottom still is formed with the bellied bulge loop 8 in the outside, base plate 2's bottom face is in the right angle inboard that bulge loop 8 and sleeve 3 formed.

In this embodiment, preferably, an annular groove is formed in the edge of the bottom end face of the top ring 6, the damping ring 5 is clamped into the inner side of the annular groove, the bottom of the damping ring 5 protrudes out of the annular groove to the outside of the top ring 6, and the bottom of the damping ring 5 is attached to the top end face of the base plate 2.

In this embodiment, it is preferred, radiating groove 4 has been seted up to the equidistance on the bottom face of base plate 2, radiating groove 4's cross section personally submits the cuboid structure, radiating groove 4's longitudinal section is the arc structure, through radiating groove 4 and the bottom outlet 9 of design, can in use, improve radiating efficiency, thereby reduce base plate 2 because of the too high damage that causes of self temperature, guarantee base plate 2's stability in use and improvement heat dispersion, bottom outlet 9 has all been seted up to every radiating groove 4 top mid point position department, the top of bottom outlet 9 extends to base plate 2's inside.

In this embodiment, it is preferable that a plurality of electronic components are mounted on the surface of the substrate 2, and the thickness of the substrate 2 is two millimeters.

In this embodiment, preferably, the sleeve 3 and the top ring 6 are both made of metal material, and the inner wall of the sleeve 3 is provided with a thread connected with an external bolt.

The utility model discloses a theory of operation and use flow: when the utility model is used, the top end of the sleeve 3 is firstly penetrated through the through hole 1 from the bottom end surface of the base plate 2, then the top ring 6 is sleeved on the top of the sleeve 3, during the sleeving, the inner wall of the top ring 6 and the limiting ring 7 are extruded, at the moment, the inner wall of the top ring 6 is tightly attached through the deformation of the limiting ring 7, the installation is completed, the convex ring 8 is attached to the bottom end surface of the base plate 2, at the moment, a distance exists between the bottom end surface of the base plate 2 and the installation surface, and then the sleeve 3 is penetrated through a bolt, during penetration, the top of the bolt will press the top ring 6, at this time the top ring 6 is tightly attached to the upper surface of the base plate 2, in the bonding state, the damping ring 5 is used for buffering and damping to avoid the top ring 6 and the substrate 2 from generating serious extrusion, in use, heat generated by the substrate 2 is discharged through the heat dissipation groove 4 and the bottom hole 9, so that damage to the substrate 2 due to over-high temperature of the substrate is avoided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides an intelligence circuit board for temperature and humidity control, includes base plate (2), through-hole (1), its characterized in that have been seted up in the four corners department of base plate (2) run through: the utility model discloses a sleeve, including through-hole (1), top face edge, spacing ring (7), the inner wall laminating of spacing ring (7) and top ring (6), the inside of through-hole (1) is run through and is had sleeve (3), the top of sleeve (3) still overlaps and is equipped with top ring (6), the top face edge of sleeve (3) bonds spacing ring (7), spacing ring (7) are connected with the inner wall laminating of top ring (6), the bottom of sleeve (3) still is formed with outside bellied bulge loop (8), the bottom face of base plate (2) is in the right angle inboard that bulge loop (8) and sleeve (3) formed.

2. The circuit board for intelligent temperature and humidity adjustment according to claim 1, wherein: the ring channel has been seted up to the bottom face edge of apical ring (6), and damping ring (5) have been gone into to the inboard card of this ring channel, the bottom protrusion ring channel of damping ring (5) to the outside of apical ring (6), the bottom of damping ring (5) is connected with the laminating of the top face of base plate (2).

3. The circuit board for intelligent temperature and humidity adjustment according to claim 1, wherein: radiating groove (4) have been seted up to equidistant on the bottom face of base plate (2), the transversal cuboid structure of personally submitting of radiating groove (4), the longitudinal section of radiating groove (4) is the arc structure.

4. The circuit board for intelligent temperature and humidity adjustment according to claim 3, wherein: bottom holes (9) are formed in the middle points of the tops of the heat dissipation grooves (4), and the tops of the bottom holes (9) extend towards the inside of the base plate (2).

5. The circuit board for intelligent temperature and humidity adjustment according to claim 1, wherein: the surface of the substrate (2) is provided with a plurality of electronic elements, and the thickness of the substrate (2) is two millimeters.

6. The circuit board for intelligent temperature and humidity adjustment according to claim 2, wherein: the sleeve (3) and the top ring (6) are both metal components, and the inner wall of the sleeve (3) is provided with threads connected with external bolts.

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