CN213637490U

CN213637490U - DCDC power converter

Info

Publication number: CN213637490U
Application number: CN202022890018.7U
Authority: CN
Inventors: 梁翠平; 白玉峰; 董天源; 李剑平
Original assignee: Shanghai Valeo Automotive Electrical Systems Co Ltd
Current assignee: Shanghai Valeo Automotive Electrical Systems Co Ltd
Priority date: 2020-12-04
Filing date: 2020-12-04
Publication date: 2021-07-06
Anticipated expiration: 2030-12-04
Also published as: WO2022117093A1

Abstract

The utility model relates to a DCDC power converter technical field discloses a DCDC power converter. The DCDC power converter comprises a shell assembly and a printed circuit board, wherein the shell assembly comprises an upper cover plate and a shell, and the upper cover plate is detachably mounted on the shell; a printed circuit board mounted within the housing assembly; the busbar is fixed on the back surface of the printed circuit board, and one side of the busbar, which is far away from the printed circuit board, is a shell. The utility model provides high busbar's fixed strength, and improved printed circuit board and busbar's radiating effect, and busbar outside need not mould plastics location and grafting structure, simplifies busbar manufacturing cost.

Description

DCDC power converter

Technical Field

The utility model relates to a DCDC power converter technical field especially relates to a DCDC power converter.

Background

The bus bar is a bus bar and a bus bar, the power module electric connecting part with the multilayer laminated structure can be connected with the power distribution parts of a plurality of circuits, the number of cable connections can be greatly reduced by adopting the bus bar, the problem of high-density layout of an electronic system is solved, the bus bar has the excellent characteristics of interference resistance, good high-frequency filtering effect, high reliability, space saving, simplicity and quickness in assembly and the like, and the bus bar is widely applied to a DCDC power converter.

In the prior art, the busbar is vertically inserted, that is, a stamped copper bar is made into a whole through injection molding, and an injection molding part is provided with two positioning pins or positioning holes, so that the assembly on a printed circuit board is facilitated; meanwhile, the terminal part of the busbar is welded on the upper surface of the printed circuit board through a selective wave soldering process, the production process flow of the busbar is complex, and the production cost is high. Secondly, the mounting position on the printed circuit board is limited, and the fixed position of the busbar is small, so that the mounting strength of the busbar is poor; moreover, the busbar is installed on the front of printed circuit board, can't carry out effectual heat dissipation through the casing, and the too high damage circuit of temperature in the operation process.

Accordingly, a DCDC power converter is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

Based on above, an object of the utility model is to provide a DCDC power converter, the utility model provides a high busbar's fixed strength, busbar accessible casing heat dissipation has improved printed circuit board and busbar's radiating effect, and busbar outside need not mould plastics location and grafting structure, simplifies busbar manufacturing cost.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a DCDC power converter comprising:

the shell assembly comprises an upper cover plate and a shell, and the upper cover plate is detachably arranged on the shell;

a printed circuit board mounted within the housing assembly;

the busbar is fixed on the back of the printed circuit board so as to reduce the height of the busbar, and one side of the busbar, which is far away from the printed circuit board, is a shell.

As a preferred technical solution of the DCDC power converter, the busbar is flat, and the busbar is laid on the back of the printed circuit board; or

The busbar is in an arch shape, and two ends of the busbar are fixed on the back surface of the printed circuit board.

As a preferred technical solution of the DCDC power converter, the busbar is provided with a through hole along the center of the length direction; or

And a cavity with one open end is arranged at the center of the busbar along the length direction.

As a preferable technical solution of the DCDC power converter, a heat dissipation medium is provided between the housing and the busbar.

As a preferable technical solution of the DCDC power converter, the shell is concavely provided with a communication groove, the position of the communication groove matches with the position of the busbar, and the communication groove is attached to the heat dissipation medium.

As a preferred technical solution of the DCDC power converter, the housing assembly further includes a lower cover plate, a first water pipe and a second water pipe, the first water pipe and the second water pipe are respectively communicated with the communication groove, the lower cover plate is hermetically mounted on an opening of the communication groove, and the lower cover plate is used for sealing the communication groove; a waterway channel is formed between the lower cover plate and the communicating groove, one of the first water pipe and the second water pipe is used for water inflow of the waterway channel, and the other is used for water outflow of the waterway channel.

As a preferable technical solution of the DCDC power converter, the lower cover plate is welded and fixed to an opening of the communication groove; or

The lower cover plate is detachably arranged on the opening of the communicating groove, and a sealing ring is arranged between the lower cover plate and the shell.

As a preferred solution for a DCDC power converter, the actual current-The cross sectional area is less than or equal to 10A/mm²And the cross sectional area is the radial cross sectional area of the busbar along the length direction.

As a preferred technical solution of the DCDC power converter, a solder plating layer is disposed on an outer surface of the busbar, and the busbar is soldered to the back surface of the printed circuit board by the solder plating layer through double-sided reflow soldering.

As a preferred technical solution of the DCDC power converter, the heat dissipation medium is a heat dissipation adhesive or a heat conductive insulating pad.

The utility model has the advantages that:

the printed circuit board is arranged in the shell, and because electronic components on the back of the printed circuit board are fewer, the busbar can be fixed on the back of the printed circuit board in a larger area, the fixing strength of the busbar is increased, the busbar can radiate heat through the shell, and the radiating performance of the busbar is improved. The utility model provides high busbar's fixed strength, and improved printed circuit board and busbar's radiating effect, and busbar outside need not mould plastics location and grafting structure, simplifies busbar manufacturing cost.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a DCDC power converter according to an embodiment of the present invention;

fig. 2 is an exploded view of a DCDC power converter according to an embodiment of the present invention.

The figures are labeled as follows:

1. a housing assembly; 11. an upper cover plate; 12. a housing; 121. a communicating groove; 122. a first water pipe; 123. a second water pipe; 13. a lower cover plate;

2. a printed circuit board; 21. and (4) busbar.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.

In the prior art, the production cost of the busbar is high, the busbar is vertically inserted in the front of the printed circuit board, so that the fixing strength of the busbar is poor, effective heat dissipation can not be performed through the shell, and the circuit is damaged due to overhigh temperature in the operation process.

To solve the above problem, as shown in fig. 1 and 2, the present embodiment provides a DCDC power converter including a case assembly 1, a printed circuit board 2, and a busbar 21.

Specifically, the housing assembly 1 includes an upper cover plate 11 and a housing 12, the upper cover plate 11 being detachably mounted to the housing 12; the printed circuit board 2 is mounted in the housing assembly 1; the busbar21 is fixed on the back of the printed circuit board 2, the side of the busbar21 away from the printed circuit board 2 is the housing 12, and a heat dissipation medium is arranged between the housing 12 and the busbar 21. Because the number of electronic components on the back surface of the printed circuit board 2 is small, the busbar21 can have a large area, and two ends of the busbar21 can be welded on the back surface of the printed circuit board 2, so that the fixing strength of the busbar21 is increased; and a heat dissipation medium is provided between the housing 12 and the buss bar 21. The heat generated in the operation process of the busbar21 can be transferred to the outside of the DCDC power converter through the heat dissipation medium and the shell 12, so that the heat dissipation effect of the printed circuit board 2 and the busbar21 is improved; moreover, the external part of the busbar21 does not need injection molding positioning and inserting structures, so that the production cost of the busbar21 is simplified. In this embodiment, the heat dissipation medium is preferably a heat dissipation adhesive or a thermally conductive insulating gasket.

Preferably, the busbar21 in this embodiment is flat, and the busbar21 is laid on the back of the printed circuit board 2; or the busbar21 is in the shape of an arch, and both ends of the busbar21 are fixed to the back surface of the printed circuit board 2. Moreover, the busbar21 is provided with a through hole along the center of the length direction; or the busbar21 is provided with a cavity with one open end along the center of the length direction, which can meet the use requirement.

Preferably, since part of the components on the back surface of printed circuit board 2 are higher than the height of busbar21, in order to avoid the higher components and reduce the distance between housing 12 and busbar21, housing 12 is recessed with communication groove 121, the position of communication groove 121 matches the position of busbar21, and the bottom wall of communication groove 121 is coated with a heat dissipation medium, so as to conduct the heat generated by busbar21 to the water channel and reduce the distance between housing 12 and busbar 21.

Further preferably, the housing assembly 1 further includes a lower cover plate 13, a first water pipe 122 and a second water pipe 123, the first water pipe 122 and the second water pipe 123 are respectively communicated with the communicating groove 121, the lower cover plate 13 is hermetically mounted on an opening of the communicating groove 121, and the lower cover plate 13 is used for sealing the communicating groove 121; a waterway channel is formed between the lower cover plate 13 and the communication groove 121, one of the first water pipe 122 and the second water pipe 123 is used for water inlet of the waterway channel, and the other is used for water outlet of the waterway channel. The water pump is arranged outside the DCDC power converter, water of the water pump enters the communicating groove 121 through the first water pipe 122 and is discharged through the second water pipe 123, and a cooling water path is formed in the communicating groove 121, so that the heat dissipation effect of the printed circuit board 2 and the busbar21 is improved. In this embodiment, preferably, the lower cover plate 13 is bonded or welded to the opening of the communication groove 121 to achieve the sealed assembly between the lower cover plate 13 and the communication groove 121. In other embodiments, the lower cover plate 13 may also be mounted on the opening of the communicating groove 121 in a detachable connection manner such as clamping or screw fixation, and a sealing ring is disposed between the lower cover plate 13 and the communicating groove 121 to seal the lower cover plate 13 and the communicating groove 121.

Further, in this embodiment, the length direction of the busbar21 is the axial direction, and the effective cross-sectional area of the busbar21 in the radial direction along the length direction needs to satisfy the condition that the overcurrent per unit area (mm2) is not more than 10A. In this embodiment, the maximum load current of the busbar21 in the DCDC power converter is 210A, according to the formula: actual current/cross sectional area is less than or equal to 10A/mm². In this embodiment, the effective cross-sectional area of buss bar21 is not less than 21mm 2. Further preferably, considering that the height of the busbar21 is too high to be easily punched, the width of the busbar21 is too large, the water channel has insufficient area to dissipate heat, and the length of the busbar21 is too long, so that the product has poor dimensional stability and is easy to fall off when vibrated. Therefore, in this embodiment, the length, width and height of buss bar21 are 25mm, 7mm and 3mm, respectively.

Preferably, in this embodiment, the outer surface of the busbar21 is provided with a solder plating layer, and the busbar21 is soldered to the back surface of the printed circuit board 2 by double-sided reflow soldering through the solder plating layer, so that the assembly efficiency of the busbar21 is improved compared with the assembly method in the prior art. In this embodiment, the solder plating layer is one or any combination of at least two of tin, zinc, silver, and nickel.

It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. A DCDC power converter, comprising:

a housing assembly (1) comprising an upper cover plate (11) and a housing (12), the upper cover plate (11) being removably mounted to the housing (12);

a printed circuit board (2) mounted within the housing assembly (1);

the busbar (21), the busbar (21) is fixed in the back of the printed circuit board (2), and the shell (12) is arranged on the side of the busbar (21) far away from the printed circuit board (2).

2. The DCDC power converter according to claim 1, wherein the busbar (21) is flat, the busbar (21) being tiled on the back side of the printed circuit board (2); or

The busbar (21) is in an arch shape, and two ends of the busbar (21) are fixed on the back surface of the printed circuit board (2).

3. The DCDC power converter according to claim 1, wherein the busbar (21) is centrally provided with a through hole along a length direction; or

The busbar (21) is provided with a cavity with one open end along the length direction center.

4. The DCDC power converter according to claim 1, wherein a heat-dissipating medium is provided between the housing (12) and the busbar (21).

5. The DCDC power converter according to claim 4, wherein said housing (12) is recessed with a communication groove (121), said communication groove (121) is located to match the location of said busbar (21), and said communication groove (121) is attached to said heat dissipation medium.

6. The DCDC power converter according to claim 5, wherein the housing assembly (1) further comprises a lower cover plate (13), a first water pipe (122) and a second water pipe (123), the first water pipe (122) and the second water pipe (123) are respectively communicated with the communication groove (121), the lower cover plate (13) is hermetically mounted on an opening of the communication groove (121), and the lower cover plate (13) is used for sealing the communication groove (121); a waterway channel is formed between the lower cover plate (13) and the communication groove (121), one of the first water pipe (122) and the second water pipe (123) is used for water inlet of the waterway channel, and the other is used for water outlet of the waterway channel.

7. The DCDC power converter according to claim 6, wherein said lower cover plate (13) is welded and fixed to an opening of said communication groove (121); or

The lower cover plate (13) is detachably mounted on an opening of the communicating groove (121), and a sealing ring is arranged between the lower cover plate (13) and the shell (12).

8. The DCDC power converter of claim 1, wherein the actual current/cross-sectional area is ≦ 10A/mm²The cross-sectional area is the radial cross-sectional area of the busbar (21) along the length direction.

9. The DCDC power converter according to claim 1, wherein the external surface of the busbar (21) is provided with solder plating, and the busbar (21) is soldered to the back surface of the printed circuit board (2) by double-sided reflow soldering through the solder plating.

10. The DCDC power converter of claim 4, wherein the heat dissipation medium is a heat dissipation paste or a thermally conductive insulating spacer.