CN213603032U

CN213603032U - Cooling device of power converter and power converter

Info

Publication number: CN213603032U
Application number: CN202022889892.9U
Authority: CN
Inventors: 梁翠平; 白玉峰; 董天源; 金英
Original assignee: Shanghai Valeo Automotive Electrical Systems Co Ltd
Current assignee: Shanghai Valeo Automotive Electrical Systems Co Ltd
Priority date: 2020-12-04
Filing date: 2020-12-04
Publication date: 2021-07-02
Anticipated expiration: 2030-12-04

Abstract

The utility model discloses a power converter's cooling device and power converter belongs to power converter technical field. The cooling device of the power converter comprises a shell and a lower cover plate, wherein a communicating groove and an installation cavity are formed in the shell, openings of the communicating groove and the installation cavity face opposite directions, and a flow guide rib is arranged on the communicating groove to separate the communicating groove; the lower cover plate is arranged on the shell, the lower cover plate and the communicating groove form a waterway channel, and the diversion ribs separate the waterway channel into a diversion channel. The power converter comprises the cooling device of the power converter. The utility model discloses a power converter's cooling device and power converter sets up the water conservancy diversion muscle through the intercommunication inslot and reduces coolant liquid flow blind spot, sets up the radiating part in the installation cavity, and the heat-conduction between cooling element and the rivers passageway is treated in the improvement to cooling efficiency has been improved.

Description

Cooling device of power converter and power converter

Technical Field

The utility model relates to a power converter technical field especially relates to a power converter's cooling device and power converter.

Background

Current power converter adopts the water-cooled cooling that carries out inside components and parts, and power converter includes a straight-through water pipe, and water pipe and casing assembly are in the same place, and the heat that inside components and parts produced is through the coolant liquid cooling in the water pipe, but the coolant liquid can appear circulating the not smooth condition in the water pipe, and the coolant liquid velocity of flow is too big to cause the impact to the lateral wall of water pipe easily, also appears the coolant liquid flow blind spot simultaneously easily, and the cooling effect is poor.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a power converter's cooling device improves cooling efficiency.

To achieve the purpose, the utility model adopts the following technical proposal:

a cooling apparatus of a power converter, comprising:

the device comprises a shell, wherein a communicating groove and an installation cavity are formed in the shell, the openings of the communicating groove and the installation cavity face opposite directions, and a flow guide rib is arranged on the communicating groove to separate the communicating groove;

the lower cover plate is arranged on the shell, the lower cover plate and the communicating groove form a waterway channel, and the diversion ribs divide the waterway channel into diversion channels.

Optionally, the communication groove is provided with at least two flow guiding ribs, the cross-sectional area of any one of the flow dividing channels is S1, and the cross-sectional areas of the other flow dividing channels are S2, wherein S1/S2 is not less than 0.8 and not more than 1.2.

Optionally, the flow guiding ribs are smooth curved plates or flat plates, so that water in the waterway channel flows along the flow guiding ribs.

Optionally, one end of the flow guiding rib, which is far away from the bottom of the communication groove, is abutted against the lower cover plate.

Optionally, a heat dissipation portion is arranged in the mounting cavity, the element to be cooled is arranged on the heat dissipation portion, the heat dissipation portion is matched with the appearance of the element to be cooled, and a heat dissipation adhesive layer or a heat conduction insulating gasket is arranged between the heat dissipation portion and the element to be cooled.

Optionally, the component to be cooled includes a printed circuit board, the printed circuit board is provided with a capacitor and a busbar, and the heat dissipation portion at least includes:

the first heat dissipation part is matched with the appearance of the capacitor;

the second heat dissipation part is of a plane structure, and the busbar is arranged on the second heat dissipation part.

Optionally, the flow guiding rib and the shell are of an integrally formed structure or a split structure.

Optionally, the flow guiding ribs are perpendicular to the bottom of the communicating groove.

Optionally, the lower cover plate is welded to the housing.

Another object of the present invention is to provide a power converter, which improves the cooling efficiency.

a power converter comprises the cooling device of the power converter.

The utility model has the advantages that:

the utility model provides a pair of power converter's cooling device, installation cavity are for waiting that cooling element provides installation fixed point and installation space. The waterway channel is arranged opposite to the mounting cavity and used for cooling the element to be cooled, so that a water pipe is not arranged independently, and the structure is simplified; the water guide ribs arranged in the communicating grooves enable the waterway channel to be divided into the shunting channels, the cooling liquid circulates in the shunting channels, flowing dead zones of the cooling liquid in the waterway channel are reduced, smoothness of circulation of the cooling liquid is improved, and accordingly heat dissipation efficiency is improved. And through the reposition of redundant personnel of reposition of redundant personnel passageway, reduced the velocity of flow of coolant liquid in waterway passageway, made the velocity of flow more even, reduced the impact of coolant liquid to waterway passageway wall. Be provided with the radiating part in the installation cavity, treat that cooling element passes through the heat transfer that radiating part will produce to waterway, improved and treated the heat-conduction between cooling element and the waterway to carry out the heat exchange through the coolant liquid, further improved the radiating efficiency.

The utility model provides a pair of power converter through the cooling device who adopts foretell power converter, has improved cooling efficiency.

Drawings

Fig. 1 is a schematic diagram illustrating a first view angle of a power converter according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a first view angle of a housing according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a second view angle of the housing according to an embodiment of the present invention;

fig. 4 is an exploded view of a power converter provided in an embodiment of the present invention;

fig. 5 is a schematic diagram illustrating a second view angle of a power converter according to an embodiment of the present invention;

FIG. 6 is a schematic structural view of a connector and a housing according to an embodiment of the present invention;

FIG. 7 is a schematic view of a connector according to an embodiment of the present invention;

fig. 8 is an exploded view of a power converter according to an embodiment of the present invention.

In the figure:

1. a printed circuit board; 11. busbar;

2. a connector assembly; 21. a first plug; 211. a first power terminal; 2111. a wiring stud; 212. a signal terminal; 213. a first body; 22. a second plug; 221. a second power terminal; 2211. a differential mode inductance terminal; 2212. a common mode capacitance terminal; 222. a second body; 2221. a semicircular rib; 23. a magnetic ring;

3. a housing assembly; 31. an upper cover plate; 32. a housing; 321. retaining walls; 3211. a screw hole; 322. a communicating groove; 3221. a flow guiding rib; 323. a first water pipe; 324. a second water pipe; 325. a mounting cavity; 3251. a first heat sink portion; 3252. a second heat sink member; 3253. a third heat sink portion; 33. a lower cover plate; 34. and (6) sealing the adhesive layer.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solutions adopted by the present invention and the technical effects achieved by the present invention clearer, the following will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by the skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The present embodiment provides a power converter, as shown in fig. 1-8, which includes a housing assembly 3, a printed circuit board 1, and a connector assembly 2. Specifically, the housing assembly 3 includes a housing 32, and an upper cover plate 31 and a lower cover plate 33 which are arranged on the housing 32, the housing 32 is provided with an installation cavity 325 and a communication groove 322, the upper cover plate 31 and the installation cavity 325 form an accommodation space, the printed circuit board 1 is arranged in the accommodation space, the lower cover plate 33 and the communication groove 322 form a water channel, and cooling liquid is introduced into the water channel for cooling the printed circuit board 1 in the accommodation space; the connector 2 is detachably mounted on the housing 32, and one end of the connector 2 is electrically connected to an external harness of the power converter and the other end is electrically connected to the printed circuit board 1.

The housing 32 and the lower cover plate 33 form a water channel for cooling, the housing 32 and the upper cover plate 31 form an accommodating space for providing a fixing point and an installation space for the printed circuit board 1, and the housing assembly 3 integrally sets the water channel, the printed circuit board 1 and the connector 2, so that the structural integration level is improved, the structural volume is reduced, the structure is simplified, and the cost is reduced. In order to further improve the reliability of the power converter, the following is specific:

referring to the prior art, the lower cover plate 33 can be mounted on the opening of the communicating groove 322 in a detachable connection manner such as clamping or screw fixation, and a sealing ring or a metal gasket is arranged between the lower cover plate 33 and the communicating groove 322 to seal the lower cover plate 33 and the communicating groove 322. In order to simplify the structure, improve the cooling performance of the power converter and reduce the risk of cooling water leakage, optionally, the lower cover plate 33 is welded on the shell 32, so that the connection is reliable, the risk of leakage of a water channel is reduced, and the reliability of the cooling device is improved, and the lower cover plate 33 and the shell 32 are welded and connected, so that the process is simple and reliable; specifically, the lower cover plate 33 and the housing 32 may be made of the same material or different materials, and in this embodiment, the lower cover plate 33 is preferably bonded or welded to the opening of the communication groove 322 to achieve the sealing assembly between the lower cover plate 33 and the communication groove 322. Specifically, the lower cover plate 33 and the housing 32 are welded by friction stir welding, so as to facilitate connection between the lower cover plate 33 and the housing 32 which are made of the same material or different materials; optionally, the lower cover plate 33 and the housing 32 are made of metal.

In order to further simplify the structure, the cooling performance of the power converter is improved, and the risk of cooling water leakage is reduced. Specifically, as shown in fig. 1 and 2, a first water pipe 323 and a second water pipe 324 are further disposed on the housing 32, the first water pipe 323 and the second water pipe 324 are respectively disposed in communication with the communication groove 322, one of the first water pipe 323 and the second water pipe 324 is used for water inlet of the water channel, and the other is used for water outlet of the water channel, so as to realize circulation of the cooling liquid in the water channel; specifically, the outside of the power converter is provided with a water pump, water of the water pump enters the communicating groove 322 through the first water pipe 323 and is discharged through the second water pipe 324, and a cooling water path is formed in the communicating groove 322 to improve the heat dissipation effect. Specifically, the first water pipe 323 and the second water pipe 324 are integrally formed with the housing 32, so that the structure is simplified, the assembly process steps are reduced, the leakage risk at the joint is reduced, and the reliability of the cooling device is further improved.

Since the water pipes occupy a large space, when the first and

second water pipes

323 and 324 are disposed at both sides of the housing 32, both sides need to occupy a large space, resulting in a low space utilization ratio. Optionally, the first water pipe 323 and the second water pipe 324 are on the same side of the housing 32, so that the space on the other side of the housing 32 is saved, and the space utilization rate is improved; the first water pipe 323 and the second water pipe 324 are symmetrically arranged, and the appearance of the cooling device is improved.

In the existing design, the cooling liquid easily has flowing dead zone when flowing in the water pipe, resulting in poor cooling effect. In order to solve the above problem, in this embodiment, as shown in fig. 2 and fig. 3, a flow guiding rib 3221 is disposed on the communication groove 322 to partition the communication groove 322, the flow guiding rib 3221 partitions the water channel into a branch channel, and the coolant circulates in the branch channel, so that a dead flowing area of the coolant in the water channel is reduced, smoothness of coolant circulation is improved, and further, heat dissipation efficiency is improved.

According to flow equation 1 and bernoulli equation 2,

q ═ Sv ═ constant (1)

P+(12)ρv²+ρgh＝C (2)

Wherein the content of the first and second substances,

q is the flow, S is the cross-sectional area, and v is the water velocity;

p is the pressure of a certain point in the fluid, v is the flow velocity of the fluid at the point, ρ is the density of the fluid, g is the gravitational acceleration, h is the height of the point, and C is a constant.

According to the Bernoulli equation, the smaller the pressure difference value in each flow dividing channel is, the smaller the flow velocity difference value is, and the better the cooling effect is; according to the flow formula, as the flow is a fixed value provided by the whole vehicle cooling system, the smaller the flow velocity difference is, the smaller the difference of the cross-sectional areas of the respective flow dividing channels is, so that the closer the cross-sectional areas of the respective flow dividing channels are deduced, the better the cooling effect of the cooling device is.

Optionally, the communication groove 322 is provided with at least two flow guiding ribs 3221, a cross-sectional area of any one of the flow dividing channels is S1, and cross-sectional areas of other flow dividing channels are S2, where S1/S2 is greater than or equal to 0.8 and less than or equal to 1.2, so that a volume of each flow dividing channel is substantially equal, pressures of the flow dividing channels are substantially equal in this range, pressure loss is reduced, a flow velocity difference in different flow dividing channels is reduced, heat dissipation efficiency is improved, uniformity of flow velocity of cooling liquid in each flow dividing channel is improved, and impact on a wall surface of the flow dividing channel is reduced.

Optionally, the flow guiding ribs 3221 are smooth curved plates or flat plates, and the specific shape may be set according to the shape of the waterway channel, so that water in the waterway channel flows along the flow guiding ribs 3221, resistance generated by the flow guiding ribs 3221 to the coolant during flowing is reduced, and a circulation effect is improved. Specifically, the flow guiding ribs 3221 are adapted to the groove wall of the communicating groove 322 in shape, so as to avoid a large included angle formed between the flow guiding ribs 3221 and the groove wall of the communicating groove 322 from affecting the circulation of the cooling liquid. Specifically, the flow guiding ribs 3221 may be set through fluid simulation analysis, specifically, a certain flow rate may be given to the coolant in the waterway channel, and when a vortex is formed at a certain position, the flow guiding ribs 3221 are added at the vortex position; giving a certain flow rate to the cooling liquid again, and adjusting the number of the flow guide ribs 3221 and twisting or disconnecting the structure of the flow guide ribs 3221 when a vortex is generated; the above process is repeated in this way to eliminate the effect of eddy currents.

In this embodiment, as shown in fig. 2, 7 flow guiding ribs 3221 are disposed in the communicating groove 322, the cross-sectional area of each flow dividing channel is substantially the same, the flow velocity is uniform, the cooling effect is improved, and the flow velocity is less than 5m/s, so that the impact force is reduced; specifically, the calculation can be performed according to the fluid simulation, and the pressure difference between the flow dividing channels is reversely deduced according to the required cooling efficiency to obtain a preset pressure difference, so that the cooling requirement can be met when the pressure difference is smaller than the preset pressure difference; and then deducing the relation among the cross-sectional areas of the shunt channels according to the pressure difference. Preferably, S1 is equal to S2, the difference between the cross-sectional areas of the respective branch channels reaches a minimum value, and v1 is equal to v2, at this time, the pressures at the points in the water channel are equal, the flow rates of the respective branch channels through the cross-sections are the same, and the cooling efficiency is the highest.

Optionally, one end of the flow guiding rib 3221, which is away from the bottom of the communication groove 322, abuts against the lower cover plate 33, that is, the height of the flow guiding rib 3221 is flush with the lower cover plate 33, so that the flow dividing effect of the flow dividing channel on the cooling liquid is improved. Optionally, the thickness of the flow guiding rib 3221 is 2.5mm to 3.5mm, so that the volume of the diversion channel is prevented from being reduced due to too large thickness of the flow guiding rib 3221, and structural strength is also prevented from being insufficient due to too small thickness of the flow guiding rib 3221, and preferably, the thickness of the flow guiding rib 3221 is 3 mm.

Optionally, the flow guiding ribs 3221 are perpendicular to the bottom of the communication groove 322, so as to facilitate processing and forming. In this embodiment, the flow guiding ribs 3221 and the housing 32 are integrally formed, so that the structure is simplified, the assembly process steps are reduced, and the reliability of structural connection is further improved. In other embodiments, the airflow guiding rib 3221 and the housing 32 are a split structure, specifically, the airflow guiding rib 3221 may be adhered or welded to the housing 32, and the airflow guiding rib 3221 may also be detachably connected to the housing 32 by a fastener.

Optionally, the printed circuit board 1 is provided with a power device and a control device, the housing 32 is provided with a retaining wall 321, the printed circuit board 1 is installed in the housing 32, and the printed circuit board 1 abuts against the retaining wall 321. After connector 2 is connected with printed circuit board 1, the during operation produces the radiation interference, and the barricade 321 encloses and locates the 2 outsides of connector, and the height that highly is higher than 2 connection ports of connector of barricade 321 keeps apart power device and control device and connector 2, and the connection site that completely obstructs the radiation interference through connector 2 in the space is inside or outside transmission, plays the shielding effect that can be fine to improve electromagnetic compatibility's radiation harassment performance.

Preferably, the retaining wall 321 is provided with a screw hole 3211, the printed circuit board 1 is provided with a fixing hole, and the screw penetrates through the fixing hole and is screwed in the screw hole 3211, so that the printed circuit board 1 is fixed above the retaining wall 321. Moreover, the common mode noise on the printed circuit board 1 can be conducted to the housing 32 through the metal screws and the retaining wall 321, so as to better eliminate the common mode noise. In other embodiments, the top surface of the retaining wall 321 is provided with a soldering pin, the printed circuit board 1 is provided with a soldering hole, the soldering pin can penetrate through the soldering hole, and the soldering pin is soldered to the soldering hole.

Further preferably, the retaining wall 321 and the housing 32 are made of metal, and the retaining wall 321 and the housing 32 are integrally formed through a casting process. The cast aluminum material has a good electromagnetic interference isolation effect, and no gap exists between the retaining wall 321 and the shell 32, so that the emission of common mode noise is improved. Of course, in other embodiments, the retaining wall 321 and the housing 32 may be separate structures. In the present embodiment, the retaining wall 321 and the housing 32 are preferably made of cast aluminum, so as to save the processing cost and meet the performance requirement. In other embodiments, the metal can also be other metals such as stainless steel, common cold-rolled sheet, aluminum plate, hot-dip galvanized steel plate, aluminum alloy plate, sandwich color steel plate and the like.

Optionally, the socket connector 2 comprises a first plug 21 and a second plug 22, wherein the first plug 21 is provided with a first power terminal 211, a first end of the first power terminal 211 is connected to an external wiring harness, the first end of the first power terminal 211 is provided with a wiring stud 2111, and the first end of the first power terminal 211 is connected to the external wiring harness through the wiring stud 2111. Preferably, in this embodiment, the first plug 21 further includes a signal terminal 212, one end of the signal terminal 212 is connected to an external signal harness, and the other end is connected to the printed circuit board 1, so as to implement signal transmission. The second plug 22 is disposed below the printed circuit board 1, the second plug 22 is provided with a second power terminal 221, the second end of the first power terminal 211 is fixed and electrically connected to the second power terminal 221, and the first power terminal 211 is electrically connected to the printed circuit board 1 through the second power terminal 221, so as to implement circuit connection. In the embodiment of the present invention, the connector 2 is a split structure, which reduces the volume of the terminal in the connector 2 and simplifies the mold structure, and the first plug 21 and the second plug 22 have a reduced volume of the internal terminal, and the product design is simple and the mold structure is simplified; two independent plugs, the volume is less, and the plastics parcel area on the copper bar is little, is difficult to the fracture and produces the leakage.

Preferably, in the present embodiment, the first power terminal 211 and the second power terminal 221 are connected by welding, wherein the welding manner is a brazing connection. In other embodiments, the first power terminal 211 and the second power terminal 221 are connected by a screw. By the mode, not only is the fixed connection between the two realized, but also the power-on connection between the two is realized.

In this embodiment, the first plug 21 includes a first body 213, the first power terminal 211 and the signal terminal 212 are disposed in the first body 213, the first body 213 is made of plastic, and the first body 213, the first power terminal 211 and the signal terminal 212 are integrally formed by an injection mold. The second plug 22 includes a second body 222, the second power terminal 221 is disposed in the second body 222, the second body 222 is made of plastic, and the second body 222 and the second power terminal 221 are integrally formed through an injection mold.

In the prior art, the structure of a terminal in the connector is complex, and due to the problem of the manufacturing process of an injection mold, the terminal is difficult to be made into a compact structure and cannot be connected with a differential mode inductor so as to reduce the electromagnetic interference of the connector on an external device. In this embodiment, the terminal structure in the second plug 22 is simple, so that the differential mode inductance terminal 2211 can be disposed on the second power terminal 221, and the differential mode inductance can be disposed on the printed circuit board 1. The differential mode inductor terminal 2211 is electrically connected to the differential mode inductor on the printed circuit board 1 to reduce the electromagnetic interference of the connector 2 to the external device.

Optionally, the connector 2 further includes a magnetic ring 23, and the magnetic ring 23 is adhered to the second plug 22.

Specifically, the second body 222 of the second plug 22 is provided with a mounting location, the magnetic ring 23 is mounted in the mounting location, and the magnetic ring 23 is annularly disposed outside the differential mode inductance terminal 2211. The arrangement of the magnetic ring 23 can inhibit the transmission of electromagnetic radiation inwards or outwards, and the electromagnetic compatibility is improved. Further preferably, the mounting locations are mounting ribs. In the present embodiment, the magnetic ring 23 is an EMC magnetic ring.

Preferably, in this embodiment, the mounting ribs are at least two semicircular ribs 2221 that are arranged oppositely, and the magnetic ring 23 is bonded between the semicircular ribs 2221 by dispensing. In other embodiments, the magnetic ring 23 can be snapped into the mounting ribs. Alternatively, the magnetic ring 23 is mounted between the mounting ribs, the mounting ribs are provided with threaded holes, and the bolts are connected to the threaded holes in a threaded manner so that the end faces of the bolts abut against the magnetic ring 23.

In this embodiment, the differential mode inductor terminal 2211 includes a plurality of differential mode inductor terminals arranged in a circle having a diameter not greater than 17 mm; and the distance between every two of the terminals of the differential mode inductors is not less than 3mm, so that the requirement of HTE (Hazardous Thermal Event) is met, and the internal short circuit between the terminals of the differential mode inductors is prevented. In this embodiment, there are three differential mode inductance terminals, which are 12V differential mode inductance terminal, 48V differential mode inductance terminal and grounding differential mode inductance terminal, respectively, the distance between the 48V differential mode inductance terminal and the grounding differential mode inductance terminal is 5mm, and the distance between the grounding differential mode inductance terminal and the 12V differential mode inductance terminal is 3.3 mm. In this embodiment, the inner diameter of the magnetic ring 23 is 19mm, and the outer diameter of the magnetic ring 23 is 38 mm. Further preferably, the outer surface of the magnetic ring 23 is further provided with an insulating coating, and the insulating coating is made of a high polymer material (gum, rubber or animal glue), epoxy resin, or the like, so as to prevent short circuit caused by breakage of the magnetic ring 23.

Further, the second power terminal 221 is further provided with a common mode capacitor terminal 2212, the printed circuit board 1 is provided with a common mode capacitor, and the common mode capacitor terminal 2212 is electrically connected to the common mode capacitor on the printed circuit board 1, so that the circuit connection line is shortest.

It should be noted that, in this embodiment, each of the first power terminal 211 and the second power terminal 221 includes three corresponding terminals, and the three terminals are a 12V terminal, a ground terminal, and a 48V terminal, respectively. In order to meet the welding requirement, the surface of the terminal is plated, and the plating is one or any combination of at least two of tin, zinc, silver and nickel. Each first power terminalThe first ends of the sub-terminals 211 are each provided with a wiring stud 2111 for connection to an external power harness. Each second power terminal 221 has a differential mode inductance terminal 2211 and a common mode capacitance terminal 2212 disposed thereon. In order to satisfy the peak energization current of 210A, the cross-sectional area of the second power terminal 221 is designed to be 21mm²。

Alternatively, as shown in fig. 5 and 8, the printed circuit board 1 includes a busbar11, the busbar11 is fixed to the back surface of the printed circuit board 1, and the side of the busbar11 away from the printed circuit board 1 is the housing 32. Since there are few electronic components on the back of printed circuit board 1, busbar11 can be horizontally disposed and soldered at both ends to the back of printed circuit board 1, increasing the fixing strength of busbar 11.

Alternatively, the busbar11 is flat, and the busbar11 is laid on the back of the printed circuit board 1; or the busbar11 is in the shape of an arch, and both ends of the busbar11 are fixed to the back surface of the printed circuit board 1. Moreover, the busbar11 is provided with a through hole along the center of the length direction; or the busbar11 is provided with a cavity with one open end along the center of the length direction, which can meet the use requirement.

Preferably, since part of the components on the back surface of the printed circuit board 1 are higher than the height of the busbar11, in order to avoid the higher components and reduce the distance between the housing 32 and the busbar11, the housing 32 is concavely provided with the communication groove 322, the position of the communication groove 322 is matched with the position of the busbar11, and the bottom wall of the communication groove 322 is coated with a heat dissipation medium so as to conduct the heat generated by the busbar to the water channel and reduce the distance between the housing 32 and the busbar 11.

Further, in this embodiment, the longitudinal direction of the busbar11 is axial, and the effective cross-sectional area of the busbar11 in the radial direction along the longitudinal direction needs to satisfy a unit area (mm)²) The overcurrent is not more than 10A. In this embodiment, the maximum load current of the busbar11 in the power converter is 210A, according to the formula: actual current/cross sectional area is less than or equal to 10A/mm². In this embodiment, the effective cross-sectional area of busbar11 is not less than 21mm². Further preferably, considering that the height of the busbar11 is too high to be easily punched, the width of the busbar11 is too large to have enough area for heat dissipation, the length of the busbar11 is too long to be processed, and the dimensional stability of the product is not goodGood, easy to fall off when vibrating. Therefore, in this embodiment, the length, width and height of buss bar11 are 25mm, 7mm and 3mm, respectively.

Preferably, in this embodiment, the outer surface of the busbar11 is provided with a solder plating layer, and the busbar11 is soldered to the back surface of the printed circuit board 1 by double-sided reflow soldering through the solder plating layer, so that the assembly efficiency of the busbar11 is improved compared with the assembly method in the prior art. In this embodiment, the solder plating layer is one or any combination of at least two of tin, zinc, silver, and nickel.

Optionally, electronic components such as a capacitor and an inductor are further disposed on the printed circuit board 1, and the electronic components are soldered to the printed circuit board 1 through a double-sided reflow soldering process. Specifically, the printed circuit board 1 is fixed to the housing 32 with bolts to stabilize the structural mounting. The waterway channel can reduce the heat generated by electronic elements such as an inductor, a capacitor and the like, the service life of the electronic elements is prolonged, and the service life of the power converter is further prolonged.

In order to improve the cooling effect, specifically, a first cavity of the installation cavity 325 for installing the inductor is sunk between the communication grooves 322, so that the communication grooves 322 are divided into a first communication groove and a second communication groove, the first communication groove and the second communication groove are communicated, and the first communication groove and the second communication groove are arranged on two sides of the first cavity; when the printed circuit board 1 is arranged in the mounting cavity 325, the cooling water in the first communicating groove and the second communicating groove on the two sides of the first cavity cools the inductor in the first cavity simultaneously, so that the cooling effect is improved.

Because printed circuit board 1's heat when direct lead to pipe conduction, the radiating efficiency is lower, for example, also only be limited to the bottom to the heat dissipation of paster electric capacity and scribble the heat dissipation and glue, can lead to the calorific capacity of electric capacity to transmit away in time, for this reason, optionally, be provided with the radiating part in the installation cavity 325, printed circuit board 1 sets up on the radiating part, printed circuit board 1 passes through the radiating part on with the heat transfer to waterway, the heat-conduction between printed circuit board 1 and the waterway has been improved, so that carry out the heat exchange through the coolant liquid, further improve the radiating efficiency. Optionally, the heat dissipation part is matched with the appearance of the printed circuit board 1, a heat dissipation adhesive layer is arranged between the heat dissipation part and the printed circuit board 1, the heat dissipation adhesive layer improves heat conduction between the printed circuit board 1 and the heat dissipation part, and the cooling effect is improved.

In this embodiment, as shown in fig. 5 and 8, the printed circuit board 1 is provided with electronic components such as a buss bar11 and a capacitor, the heat dissipation portion at least includes a first heat dissipation portion 3251 and a second heat dissipation portion 3252, specifically, as shown in fig. 3, the first heat dissipation portion 3251 is adapted to the shape of the capacitor, in this embodiment, the capacitor is cylindrical, the first heat dissipation portion 3251 is arc-shaped, the arc-shaped first heat dissipation portion 3251 can be matched with the cylindrical capacitor, so as to increase the contact area between the capacitor and the heat dissipation adhesive layer, further improve the heat conduction between the capacitor and the first heat dissipation portion 3251, and improve the heat dissipation effect. Specifically, a heat dissipation adhesive layer is formed by coating heat dissipation adhesive between the first heat dissipation part 3251 and the capacitor, so that the heat dissipation effect between the capacitor and the first heat dissipation part 3251 is further improved; similarly, in the embodiment, the busbar11 is arranged on the second heat sink portion 3252, the contact surface of the busbar11 and the second heat sink portion 3252 is of a planar structure, so that the contact area between the busbar11 and the second heat sink portion 3252 is increased, and further the heat conduction is increased, and thus the heat dissipation effect is increased, specifically, the heat dissipation glue is coated between the second heat sink portion 3252 and the busbar11, and further the heat dissipation effect between the busbar11 and the second heat sink portion 3252 is increased; similarly, in this embodiment, the heat dissipation portion further includes a third heat dissipation portion 3253, the printed circuit board 1 is further provided with a high-power mosfet structure besides the capacitor and the busbar11, and the high-power mosfet corresponds to the third heat dissipation portion 3253 and is coated with a heat dissipation adhesive layer, so that the heat dissipation effect is improved.

Be provided with the heat dissipation glue film on installation cavity 325, specifically, the heat dissipation is glued and is filled between printed circuit board 1 and casing 32, the heat conduction that the heat dissipation glued the electronic component during operation on printed circuit board 1 gived off gives casing 32, play the heat dissipation effect, in order to improve printed circuit board 1 to casing 32 transmission heat, waterway lets in behind the cooling water, the cooling water flows and takes away the heat that the heat dissipation glue film conducts, avoid the electronic component on printed circuit board 1 to lose efficacy because of the high function that leads to of high temperature, thereby power converter's cooling efficiency has been improved. Optionally, the housing 32 is a metal housing, which has good heat dissipation performance.

In the same way, optionally, a heat-conducting insulating gasket can be arranged between the heat dissipation part and the printed circuit board 1, so that the heat conduction between the printed circuit board 1 and the heat dissipation part is improved through the heat-conducting insulating gasket, and the cooling effect is improved. The heat-conducting insulating gasket is directly arranged between the first heat dissipation part 3251 and the capacitor, so that the heat dissipation effect between the capacitor and the first heat dissipation part 3251 is improved; the thermal conductive insulating gasket is directly mounted between the second heat sink member 3252 and the busbar11, which improves the heat dissipation effect between the second heat sink member 3252 and the busbar 11. The heat-conducting insulating gasket is directly arranged between the third heat dissipation part 3253 and the printed circuit board 1 corresponding to the high-power mosfets, so that the heat dissipation effect between the third heat dissipation part 3253 and the high-power mosfets is improved. The heat dissipation glue or the heat conduction insulating gasket can be selected according to the actual situation, and is not limited.

In this embodiment, the heat dissipation portion is integrally formed with the housing 32, so that the structure is simplified, and the reliability of structural connection is further improved. In other embodiments, the heat sink is a separate structure from the housing 32.

Optionally, the upper cover plate 31 is detachably connected to the housing 32, and the upper cover plate 31 is used to protect the printed circuit board 1 in the mounting cavity 325 from being impacted by foreign objects, so as to avoid damage and short circuit of electronic components, thereby improving reliability of the printed circuit board 1. Optionally, the upper cover plate 31 is a stamping cover plate, a mounting hole is formed in the stamping cover plate, a corresponding connecting hole is formed in the housing 32, and the stamping cover plate and the housing 32 are detachably connected through a fastener penetrating through the mounting hole and the connecting hole.

Optionally, a sealant layer 34 is disposed between the upper cover plate 31 and the housing 32 to prevent liquid or solid particles from entering the interior of the product and damaging the structure of the printed circuit board 1, which results in electrical failure of the printed circuit board 1, specifically, the sealant is coated on the edge of the housing 32, and then the upper cover plate 31 is mounted on the edge of the housing 32, which is simple and convenient to operate and has good sealing reliability.

Optionally, the casing 32 is provided with a ventilation plug, which has dustproof and waterproof functions, and can effectively keep the exchange of internal and external gases, so as to ensure that harmful gases do not affect the normal operation of the electronic component, thereby further improving the use reliability of the power converter.

It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A cooling apparatus for a power converter, comprising:

the air conditioner comprises a shell (32), wherein a communication groove (322) and an installation cavity (325) are formed in the shell (32), openings of the communication groove (322) and the installation cavity (325) face opposite directions, and a flow guide rib (3221) is arranged on the communication groove (322) to separate the communication groove (322);

the lower cover plate (33) is arranged on the shell (32), the lower cover plate (33) and the communication groove (322) form a waterway channel, and the diversion ribs (3221) divide the waterway channel into branch channels.

2. The cooling device of the power converter according to claim 1, wherein the communication groove (322) is provided with at least two flow guiding ribs (3221), the cross-sectional area of any one of the branch channels is S1, and the cross-sectional area of the other branch channels is S2, wherein 0.8 ≤ S1/S2 ≤ 1.2.

3. The cooling device of the power converter according to claim 1, wherein the flow guiding rib (3221) is a smooth curved plate or a flat plate, so that water in the water channel flows along the flow guiding rib (3221).

4. The cooling device of the power converter according to claim 1, wherein an end of the air guiding rib (3221) away from the bottom of the communication groove (322) abuts on the lower cover plate (33).

5. The cooling device for a power converter according to any one of claims 1 to 4, wherein a heat dissipation portion is disposed in the mounting cavity, the element to be cooled is disposed on the heat dissipation portion, the heat dissipation portion is adapted to the shape of the element to be cooled, and a heat dissipation adhesive layer or a heat conductive insulating gasket is disposed between the heat dissipation portion and the element to be cooled.

6. The cooling apparatus for a power converter according to claim 5, wherein the component to be cooled comprises a printed circuit board (1), a capacitor and a busbar (11) are disposed on the printed circuit board (1), and the heat dissipation portion comprises at least:

a first heat sink member (3251) that conforms to the external shape of the capacitor;

a second heat sink member (3252) having a planar structure, the busbar (11) being disposed on the second heat sink member.

7. The cooling device of the power converter according to any one of claims 1 to 4, wherein the air guiding rib (3221) and the housing (32) are of an integral structure or a split structure.

8. The cooling device of a power converter according to any one of claims 1 to 4, wherein the flow guiding ribs (3221) are perpendicular to the groove bottom of the communication groove (322).

9. Cooling arrangement for a power converter according to any of claims 1-4, characterized in that the lower cover plate (33) is welded to the housing (32).

10. A power converter characterized by comprising a cooling apparatus of the power converter according to any one of claims 1 to 9.