CN213612802U - Die bonding structure of die bonder - Google Patents
Die bonding structure of die bonder Download PDFInfo
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- CN213612802U CN213612802U CN202022590884.4U CN202022590884U CN213612802U CN 213612802 U CN213612802 U CN 213612802U CN 202022590884 U CN202022590884 U CN 202022590884U CN 213612802 U CN213612802 U CN 213612802U
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- plate
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- placing
- bevel gear
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Abstract
The utility model belongs to the technical field of gu brilliant, especially, gu brilliant structure of solid crystal machine is to placing the board surface probably stained with dust impurity to influence the bonding of wafer, bring the influence for the process of epilogue, cause the problem of unnecessary loss, the scheme is as follows now put forward, and it includes the bottom plate, the mounting groove has been seted up at the top of bottom plate, and the pillar is installed to the mounting groove internal rotation, and the top fixed mounting of pillar has the board of placing, and the top symmetry slidable mounting of bottom plate has two backup pads, and the top fixed mounting of two backup pads has same roof, and the top of roof fixed mounting has the handle, and the bottom movable mounting of roof has the top of connecting rod, and the bottom movable mounting of connecting rod has the board of wiping, wipes board slidable mounting at the top of bottom plate. The utility model discloses convenient to use can effectually clean placing the board, has ensured the clean of placing the board, has guaranteed being stained with of wafer and has tied up the effect.
Description
Technical Field
The utility model relates to a solid brilliant technical field especially relates to a solid brilliant structure of solid brilliant machine.
Background
The die bonder is mainly used for lead frame pressing plates of various gold wire ultrasonic welding equipment, various suction nozzles, ejector pins, dispensing heads, ceramic nozzles, through pins, motors, carbon brushes, encoders, transmission belts of various chip mounting equipment, various spare and accessory parts of automation equipment, instruments, meters and the like. And die bonding, namely bonding the wafer in a specified area of the placing plate through the colloid to form a thermal path or an electric path, and providing conditions for subsequent routing connection.
However, before die bonding, dust and impurities may adhere to the surface of the placing plate, which affects the bonding of the wafer, affects subsequent processes, and causes unnecessary loss.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem that the surface of the placing plate is possibly adhered with dust impurities, thereby influencing the bonding of wafers, bringing influence to the subsequent process, causing the defect of unnecessary loss, and providing the die bonding structure of the die bonder.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
gu brilliant structure of brilliant machine, comprising a base plate, the mounting groove has been seted up at the top of bottom plate, the pillar is installed to the mounting groove internal rotation, the top fixed mounting of pillar has places the board, the top symmetry slidable mounting of bottom plate has two backup pads, the top fixed mounting of two backup pads has same roof, the top fixed mounting of roof has the handle, the bottom movable mounting of roof has the top of connecting rod, the bottom movable mounting of connecting rod has the board of wiping, wipe the top of board slidable mounting at the bottom plate, rotate on the bottom plate and install the bull stick, fixed mounting has the drive plate in one of two backup pads, the one end and the pillar of bull stick rotate to be connected, the other end and the drive plate.
Preferably, two sliding grooves are symmetrically formed in the top of the bottom plate, sliding plates are arranged in the two sliding grooves in a sliding mode, and the two supporting plates are fixedly arranged on the two sliding plates respectively.
Preferably, the two sliding grooves are internally and fixedly provided with pressure springs which are fixedly connected with the two sliding plates respectively.
Preferably, one end of the rotating rod is fixedly provided with a first bevel gear, the strut is fixedly provided with a second bevel gear, and the first bevel gear is meshed with the second bevel gear.
Preferably, a gear is fixedly mounted at the other end of the rotating rod, a rack is fixedly mounted on the driving plate, and the rack is meshed with the gear.
Compared with the prior art, the utility model has the advantages of:
(1) according to the scheme, the bottom plate, the mounting groove, the supporting column, the placing plate, the sliding groove, the sliding plate, the pressure spring, the supporting plate, the top plate, the handle, the connecting rod, the wiping plate, the driving plate, the rotating rod, the first bevel gear, the rack and the second bevel gear are arranged, the top plate is driven by the handle to press downwards, the top plate drives the wiping plate to move through the connecting rod, so that impurities such as dust on the surface of the placing plate are wiped, and the use is convenient;
(2) this scheme is through having set up the bottom plate, the mounting groove, the pillar, place the board, the spout, the slide, the pressure spring, the backup pad, the roof, a handle, the connecting rod, wipe the board, the drive plate, the bull stick, first bevel gear, the rack, second bevel gear, a backup pad in two backup pads drives the drive plate simultaneously and removes, the drive plate passes through rack and gear drive bull stick rotation, the bull stick drives the pillar through first bevel gear and second bevel gear and rotates, the board rotation is placed in the pillar drive, thereby can cooperate and wipe the board and clean placing the board, the clean of placing the board has been ensured, the effect of being stained with of wafer has been guaranteed.
The utility model discloses convenient to use can effectually clean placing the board, has ensured the clean of placing the board, has guaranteed being stained with of wafer and has tied up the effect.
Drawings
Fig. 1 is a schematic structural diagram of a die bonding structure of a die bonder according to the present invention;
fig. 2 is a schematic structural view of a bottom plate, a placing plate and a mounting groove of a die bonding structure of the die bonder;
fig. 3 is a schematic structural diagram of a part a of the die bonding structure of the die bonder of the present invention.
In the figure: 1. a base plate; 2. mounting grooves; 3. a pillar; 4. placing the plate; 5. a chute; 6. a slide plate; 7. a pressure spring; 8. a support plate; 9. a top plate; 10. a handle; 11. a connecting rod; 12. wiping the board; 13. a drive plate; 14. a rotating rod; 15. a first bevel gear; 16. a gear; 17. a rack; 18. a second bevel gear.
Detailed Description
The technical solutions in the embodiments will be described clearly and completely with reference to the drawings in the embodiments, and it is obvious that the described embodiments are only a part of the embodiments, but not all embodiments.
Example one
Referring to fig. 1-3, a die bonder structure of a die bonder comprises a base plate 1, a mounting groove 2 is formed in the top of the base plate 1, a supporting column 3 is rotatably mounted in the mounting groove 2, a placing plate 4 is fixedly mounted at the top of the supporting column 3, two supporting plates 8 are symmetrically and slidably mounted at the top of the base plate 1, a same top plate 9 is fixedly mounted at the tops of the two supporting plates 8, a handle 10 is fixedly mounted at the top of the top plate 9, the bottom of the top plate 9 is movably mounted with the top end of a connecting rod 11, a wiping plate 12 is movably mounted at the bottom end of the connecting rod 11, the wiping plate 12 is slidably mounted at the top of the base plate 1, a rotating rod 14 is rotatably mounted on the base plate 1, a driving plate 13 is fixedly mounted on one supporting plate 8 of the two supporting plates.
In this embodiment, two chutes 5 have been seted up to bottom plate 1's top symmetry, and slidable mounting has slide 6 in two chutes 5, and two backup pads 8 are fixed mounting respectively on two slide 6, have guaranteed the steady slip of two backup pads 8.
In this embodiment, equal fixed mounting has pressure spring 7 in two spouts 5, two pressure springs 7 respectively with two slide 6 fixed connection for two slides can reset after losing pressure.
In this embodiment, a first bevel gear 15 is fixedly installed at one end of the rotating rod 14, a second bevel gear 18 is fixedly installed on the strut 3, and the first bevel gear 15 and the second bevel gear 18 are engaged with each other, so that the rotating rod 14 can drive the strut 3 to rotate.
In this embodiment, a gear 16 is fixedly installed at the other end of the rotating rod 14, a rack 17 is fixedly installed on the driving plate 13, and the rack 17 is engaged with the gear 16, so that the driving plate 13 can move to drive the rotating rod 14 to rotate.
Example two
Referring to fig. 1-3, solid brilliant structure of solid brilliant machine, comprising a base plate 1, mounting groove 2 has been seted up at the top of bottom plate 1, pillar 3 is installed to the internal rotation of mounting groove 2, place board 4 is installed through welded fastening in the top of pillar 3, the top symmetry slidable mounting of bottom plate 1 has two backup pads 8, the top of two backup pads 8 is installed same roof 9 through welded fastening, the top of roof 9 is installed handle 10 through welded fastening, the bottom movable mounting of roof 9 has the top of connecting rod 11, the bottom movable mounting of connecting rod 11 has wiping board 12, wipe board 12 slidable mounting at the top of bottom plate 1, rotate on the bottom plate 1 and install bull stick 14, install drive plate 13 through welded fastening in one backup pad 8 in two backup pads 8, the one end of bull stick 14 rotates with pillar 3 to be connected, the other end of bull stick 14 cooperatees with drive.
In this embodiment, two chutes 5 have been seted up to bottom plate 1's top symmetry, and slidable mounting has slide 6 in two chutes 5, and two backup pads 8 are respectively through welded fastening install on two slide 6, have guaranteed the steady slip of two backup pads 8.
In this embodiment, all there is pressure spring 7 through welded fastening in two spout 5, two pressure springs 7 respectively with two slide 6 fixed connection for two slides can reset after losing pressure.
In this embodiment, one end of the rotating rod 14 is fixedly welded with a first bevel gear 15, the pillar 3 is fixedly welded with a second bevel gear 18, and the first bevel gear 15 and the second bevel gear 18 are engaged with each other, so that the rotating rod 14 can drive the pillar 3 to rotate.
In this embodiment, a gear 16 is fixedly welded to the other end of the rotating rod 14, a rack 17 is fixedly welded to the driving plate 13, and the rack 17 is engaged with the gear 16, so that the rotating rod 14 can be driven to rotate by the movement of the driving plate 13.
In this embodiment, before solid crystal structure solid crystal, because influence such as processing environment, it has impurity such as dust to probably be stained with on placing board 4, influence the effect of being stained with of wafer, handle 10 is held this moment, push handle 10 downwards, handle 10 drives roof 9 and removes, roof 9 drives through connecting rod 11 and wipes board 12 and removes, wipe board 12 and wipe the surface of placing board 4 through removing, roof 9 drives two backup pads 8 and removes simultaneously, one backup pad 8 in two backup pads 8 drives drive plate 13 and removes, drive plate 13 drives bull stick 14 through rack 17 and gear 16 and rotates, bull stick 14 drives pillar 3 through first bevel gear 15 and second bevel gear 18 and rotates, board 4 rotation is placed in the drive of pillar 3, thereby effectual the efficiency of wiping of placing board 4 that has improved, the effect of being stained with of wafer is guaranteed.
The above descriptions are only preferred embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the scope of the present invention, and the technical solutions and the utility model concepts of the present invention are equivalent to, replaced or changed.
Claims (5)
1. The die bonding structure of the die bonder comprises a base plate (1) and is characterized in that a mounting groove (2) is formed in the top of the base plate (1), a supporting column (3) is rotatably mounted in the mounting groove (2), a placing plate (4) is fixedly mounted at the top of the supporting column (3), two supporting plates (8) are symmetrically and slidably mounted at the top of the base plate (1), the same top plate (9) is fixedly mounted at the tops of the two supporting plates (8), a handle (10) is fixedly mounted at the top of the top plate (9), the bottom of the top plate (9) is movably mounted at the top end of a connecting rod (11), a wiping plate (12) is movably mounted at the bottom end of the connecting rod (11), the wiping plate (12) is slidably mounted at the top of the base plate (1), a rotating rod (14) is rotatably mounted on the base plate (1), a driving plate (13), one end of the rotating rod (14) is rotatably connected with the support post (3), and the other end of the rotating rod (14) is matched with the driving plate (13).
2. The die bonding structure of a die bonder according to claim 1, wherein the top of the bottom plate (1) is symmetrically provided with two sliding grooves (5), the two sliding grooves (5) are internally provided with sliding plates (6), and the two supporting plates (8) are respectively and fixedly arranged on the two sliding plates (6).
3. The die bonding structure of the die bonder according to claim 2, wherein the two sliding grooves (5) are fixedly provided with compression springs (7), and the two compression springs (7) are respectively and fixedly connected with the two sliding plates (6).
4. The die bonding structure of the die bonder according to claim 1, wherein a first bevel gear (15) is fixedly mounted at one end of the rotating rod (14), a second bevel gear (18) is fixedly mounted on the strut (3), and the first bevel gear (15) is meshed with the second bevel gear (18).
5. The die bonding structure of the die bonder according to claim 1, wherein a gear (16) is fixedly mounted at the other end of the rotating rod (14), a rack (17) is fixedly mounted on the driving plate (13), and the rack (17) is meshed with the gear (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022590884.4U CN213612802U (en) | 2020-11-10 | 2020-11-10 | Die bonding structure of die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022590884.4U CN213612802U (en) | 2020-11-10 | 2020-11-10 | Die bonding structure of die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213612802U true CN213612802U (en) | 2021-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022590884.4U Active CN213612802U (en) | 2020-11-10 | 2020-11-10 | Die bonding structure of die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213612802U (en) |
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2020
- 2020-11-10 CN CN202022590884.4U patent/CN213612802U/en active Active
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| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 516000 8th and 9th floors of plant 24, Tonghu innovation town, Tonghu ecological wisdom zone, Lilin Town, Zhongkai high tech Zone, Huizhou City, Guangdong Province Patentee after: HUIZHOU DONGJUN LIGHT SOURCE TECHNOLOGY Co.,Ltd. Address before: 516000 No.91 Longhe East Road, Dongxing community, Shuikou sub district office, Huicheng District, Huizhou City, Guangdong Province (factory a) Patentee before: HUIZHOU DONGJUN LIGHT SOURCE TECHNOLOGY Co.,Ltd. |
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| CP02 | Change in the address of a patent holder |