CN213582047U - Heat radiator with internal circulation structure - Google Patents
Heat radiator with internal circulation structure Download PDFInfo
- Publication number
- CN213582047U CN213582047U CN202022670684.XU CN202022670684U CN213582047U CN 213582047 U CN213582047 U CN 213582047U CN 202022670684 U CN202022670684 U CN 202022670684U CN 213582047 U CN213582047 U CN 213582047U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- metal panel
- component
- circulation component
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation device with an internal circulation structure, which relates to the technical field of chip heat dissipation and comprises a metal panel, an internal circulation component and a heat dissipation component, wherein the metal panel is provided with an opening, one end of the metal panel is provided with a slot, the internal circulation component is arranged at the opening of the metal panel, one end of the internal circulation component is clamped and fixed at the slot on the metal panel, and the heat dissipation component is arranged at the end of the internal circulation component, which is far away from the metal panel and is provided with a slot; the heat dissipation assembly and the inner circulation component are combined through vacuum brazing, the inner circulation component and the metal panel are combined through vacuum brazing, superconducting liquid is injected into the inner circulation component, and then conduction of the heat absorption area and heat dissipation of the heat dissipation area are conducted, so that a complete inner circulation heat dissipation solution is formed.
Description
Technical Field
The utility model belongs to the technical field of the chip heat dissipation technique and specifically relates to a heat abstractor of inner loop structure is related to.
Background
The CPU and other parts of the computer generate heat in the high-speed operation process, and the heat dissipation is a heat transfer process, so that the heat generated by the CPU is carried to other media, and the temperature of the CPU is controlled within a stable range. According to the environment of our lives, the heat of the CPU is ultimately dissipated into the air. The process is computer heat dissipation, the heat dissipation mode of the chip in the prior art is usually air cooling heat dissipation, the mode is simple and occupies a relatively large space, the existing internal circulation heat dissipation mode is not perfect, and hardware is easily damaged.
Disclosure of Invention
An object of the utility model is to provide an inner loop structure's heat abstractor to solve the radiating mode of inner loop perfect inadequately among the prior art technical problem.
An embodiment of the utility model provides a heat abstractor of inner loop structure, including metal decking, inner loop part and radiator unit, the last opening that is equipped with of metal decking, metal decking's one end is equipped with the fluting, inner loop part installs metal decking's opening part just inner loop part's one end card is solid last fluting department of metal decking, radiator unit installs inner loop part is kept away from be equipped with grooved one end on the metal decking.
Furthermore, a liquid injection device is arranged on the inner circulation component, and the liquid injection device is installed at the end, far away from the metal panel, of the inner circulation component, provided with the groove.
Furthermore, a liquid injection port is arranged on the liquid injection device, and the top end of the liquid injection port is positioned above the liquid injection device.
Further, the area of the inner circulation part where the heat dissipation assembly is installed is a heat dissipation area, and the area of the inner circulation part where the heat dissipation assembly is not installed is a heat absorption area.
Compared with the prior art, the beneficial effects of the utility model reside in that:
one of them, the utility model discloses well radiator unit and inner loop part combine through vacuum brazing, inner loop part combines through vacuum brazing with metal panel, through pouring into superconducting liquid into in the past inner loop part, the regional conduction of rethread heat absorption and the regional heat dissipation of heat dissipation to form a perfect inner loop heat dissipation solution.
And secondly, the utility model discloses well inner loop part combines into a confined circulation system through vacuum brazing with priming device, can dispel the heat through the inside superconductive liquid that injects into of priming device to inner loop part, can pour into priming device with superconductive liquid into through annotating the liquid mouth, inside rethread priming device gets into inner loop part.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic perspective view of the present invention.
Reference numerals: the heat-radiating structure comprises a metal panel 1, an internal circulation component 2, a slot 3, a heat-radiating component 4, a liquid injection device 5, a liquid injection port 51, a heat-radiating area 6 and a heat-absorbing area 7.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention.
The components of the embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1, an embodiment of the present invention provides a heat dissipation apparatus with an internal circulation structure, including a metal panel 1, an internal circulation component 2 and a heat dissipation assembly 4, where the metal panel 1 is provided with an opening, one end of the metal panel 1 is provided with a slot 3, the internal circulation component 2 is installed at the opening of the metal panel 1, and one end of the internal circulation component 2 is clamped and fixed at the slot 3 on the metal panel 1, and the heat dissipation assembly 4 is installed at one end of the internal circulation component 2, which is far away from the end of the metal panel 1, where the slot 3 is provided; the heat dissipation assembly 4 and the inner circulation component 2 are combined through vacuum brazing, the inner circulation component 2 and the metal panel 1 are combined through vacuum brazing, superconducting liquid is injected into the inner circulation component 2, and heat is dissipated through the heat absorption area 7 and the heat dissipation area 6, so that a complete inner circulation heat dissipation solution is formed.
Preferably, a liquid injection device 5 is arranged on the inner circulation component 2, and the liquid injection device 5 is installed at one end, far away from the metal panel 1, of the inner circulation component 2, where the slot 3 is formed; the inner circulation component 2 and the liquid injection device 5 are combined into a closed circulation system through vacuum brazing, and superconducting liquid can be injected into the inner circulation component 2 through the liquid injection device 5 for heat dissipation.
Preferably, the liquid injection device 5 is provided with a liquid injection port 51, and the top end of the liquid injection port 51 is positioned above the liquid injection device 5; the superconducting liquid can be injected into the injection device 5 through the injection port 51 and then introduced into the internal circulation member 2 through the injection device 5.
Preferably, the area of the internal circulation component 2 where the heat dissipation assembly 4 is installed is a heat dissipation area 6, and the area of the internal circulation component 2 where the heat dissipation assembly 4 is not installed is a heat absorption area 7; the heat is conducted through the heat absorption area 7 to the heat dissipation area 6 for heat dissipation, so that a complete internal circulation heat dissipation solution is formed.
The working principle is as follows: the heat dissipation assembly 4 is combined with the inner circulation component 2 through vacuum brazing, the inner circulation component 2 is combined with the metal panel 1 through vacuum brazing, superconducting liquid is injected into the inner circulation component 2, and heat is dissipated through the heat absorption area 7 and the heat dissipation area 6, so that a complete inner circulation heat dissipation solution is formed; the inner circulation component 2 and the liquid injection device 5 are combined into a closed circulation system through vacuum brazing, superconducting liquid can be injected into the inner circulation component 2 through the liquid injection device 5 for heat dissipation, the superconducting liquid can be injected into the liquid injection device 5 through the liquid injection port 51, and then the superconducting liquid enters the inner circulation component 2 through the liquid injection device 5.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (4)
1. The utility model provides a heat abstractor of inner loop structure which characterized in that: the heat dissipation device comprises a metal panel (1), an inner circulation component (2) and a heat dissipation assembly (4), wherein an opening is formed in the metal panel (1), a groove (3) is formed in one end of the metal panel (1), the inner circulation component (2) is installed at the opening of the metal panel (1) and one end of the inner circulation component (2) is clamped and fixed at the groove (3) on the metal panel (1), and the heat dissipation assembly (4) is installed at one end, away from the inner circulation component (2), of the metal panel (1) and provided with the groove (3).
2. The heat dissipating device of an internal circulation structure as claimed in claim 1, wherein: and a liquid injection device (5) is arranged on the inner circulation component (2), and the liquid injection device (5) is installed at one end, away from the inner circulation component (2), of the metal panel (1) provided with the notch (3).
3. The heat dissipating device of an internal circulation structure as claimed in claim 2, wherein: be equipped with on priming device (5) and annotate liquid mouth (51), annotate liquid mouth (51) top and be located priming device (5) top.
4. The heat dissipating device of an internal circulation structure as claimed in claim 1, wherein: the heat dissipation device is characterized in that the area of the heat dissipation component (4) mounted on the inner circulation component (2) is a heat dissipation area (6), and the area of the heat dissipation component (4) not mounted on the inner circulation component (2) is a heat absorption area (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022670684.XU CN213582047U (en) | 2020-11-18 | 2020-11-18 | Heat radiator with internal circulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022670684.XU CN213582047U (en) | 2020-11-18 | 2020-11-18 | Heat radiator with internal circulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213582047U true CN213582047U (en) | 2021-06-29 |
Family
ID=76538757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022670684.XU Active CN213582047U (en) | 2020-11-18 | 2020-11-18 | Heat radiator with internal circulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213582047U (en) |
-
2020
- 2020-11-18 CN CN202022670684.XU patent/CN213582047U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20070188991A1 (en) | Liquid cooled heat sink with cold plate retention mechanism | |
| CN213582047U (en) | Heat radiator with internal circulation structure | |
| CN209946807U (en) | Auxiliary heat dissipation device for computer case | |
| CN217279471U (en) | Computer mainframe capable of circularly radiating | |
| CN212112373U (en) | Refrigerating device of server | |
| CN213818695U (en) | PCBA heat radiation component | |
| CN115379729A (en) | Heat dissipation module, device, blade server and electronic equipment | |
| CN212084098U (en) | Computer hardware heat abstractor | |
| CN213938668U (en) | Sensor with good heat dissipation effect | |
| CN212411147U (en) | Small-space high-performance heat dissipation module and tablet computer | |
| CN209784937U (en) | Heat radiator for computer host | |
| CN219246016U (en) | Graphic processing workstation | |
| CN215181860U (en) | Novel annular aluminum alloy radiating fin for server | |
| CN217085649U (en) | Water-cooled casing for computer | |
| CN211236767U (en) | Heat dissipation mainboard for computer | |
| CN220820607U (en) | Heat abstractor for microcomputer | |
| CN219919520U (en) | Big data server heat abstractor | |
| CN215269286U (en) | Built-in heat dissipation device for electronic instrument | |
| CN214956834U (en) | High-speed semiconductor device based on 5G network communication | |
| CN215181844U (en) | Multiple heat radiation structure of computer chip | |
| CN219758750U (en) | Computer heat abstractor | |
| CN216251595U (en) | Cooling device for laser | |
| CN220020233U (en) | Soaking radiator for electronic hardware | |
| CN219269333U (en) | Core board mounting structure convenient to maintain | |
| CN215008371U (en) | Shell structure for liquid cooling plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |