CN214956834U - High-speed semiconductor device based on 5G network communication - Google Patents
High-speed semiconductor device based on 5G network communication Download PDFInfo
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- CN214956834U CN214956834U CN202121622874.2U CN202121622874U CN214956834U CN 214956834 U CN214956834 U CN 214956834U CN 202121622874 U CN202121622874 U CN 202121622874U CN 214956834 U CN214956834 U CN 214956834U
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Abstract
The utility model discloses a high-speed semiconductor device based on 5G network communication, including the casing, the casing upper end is inlayed and is equipped with the heat-conducting plate, heat-conducting plate upper end fixedly connected with slot, and the slot interpolation is established at the picture peg, all is equipped with the draw-in groove on the picture peg, and the joint has semiconductor chip in the draw-in groove, and the picture peg passes through fixed establishment fixed connection with the slot, and the cooling mechanism that is used for reducing the heat-conducting plate temperature is installed to the heat-conducting plate lower extreme, and the bottom installation is useful to be used for the radiating mechanism with higher speed of heat-conducting plate in the casing. The utility model discloses a set up fixed establishment, cooling mechanism, pump liquid mechanism and radiating mechanism etc. with higher speed, convenient and fast during the semiconductor installation, semiconductor chip laminates with the heat-conducting plate mutually, the heat dissipation of the semiconductor of being convenient for, and the coolant liquid constantly is semiconductor chip cooling, and radiator fan produces the scattered hot-blast simultaneously, semiconductor chip's heat dissipation for semiconductor chip maintains in normal temperature range, guarantees its normal operating.
Description
Technical Field
The utility model relates to a network communication technology field especially relates to a high-speed semiconductor device based on 5G network communication.
Background
With the rapid development and popularization of 5G network technology, semiconductor chips are also used in 5G network communication devices, and semiconductor chips based on 5G network communication have a faster operation speed than conventional semiconductor chips, but certain disadvantages are generated at the same time, and the heat generation of semiconductors is more serious under high-speed operation, and if the serious heat generation problem cannot be handled in time, the service life of semiconductors is greatly lost.
The existing semiconductor chip generally adopts an aluminum profile radiator, utilizes natural convection to radiate heat, and can ensure that the semiconductor chip can stably work in an ideal working temperature range, but for the semiconductor chip based on the high-speed operation of 5G network communication, the radiating performance of the existing radiator is not enough to process the heat radiated by the existing radiator, so the temperature of the semiconductor chip easily exceeds the normal range.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art, and provides a high-speed semiconductor device based on 5G network communication.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a high-speed semiconductor device based on 5G network communication, includes the casing, the casing upper end inlays and is equipped with the heat-conducting plate, heat-conducting plate upper end fixedly connected with slot, the slot interpolation is established at the picture peg, all be equipped with the draw-in groove on the picture peg, the joint has semiconductor chip in the draw-in groove, the picture peg passes through fixed establishment fixed connection with the slot, the heat-conducting plate lower extreme is installed and is used for reducing the cooling mechanism of heat-conducting plate temperature, the bottom installation is useful in doing in the casing the heat-conducting plate is radiating mechanism with higher speed, casing lower extreme fixedly connected with stock solution room, the stock solution indoor packing has the coolant liquid.
Preferably, the fixing mechanism comprises a fixing pin rod and a spring, a first pin hole and a second pin hole are formed in the corresponding positions of the slot and the side wall of the plug board respectively, the fixing pin rod is inserted in the first pin hole and the second pin hole in sequence, and the spring is elastically connected between the end part of the fixing pin rod and the side wall of the slot.
Preferably, cooling mechanism includes snakelike condenser pipe, snakelike recess has been seted up to the heat-conducting plate lower extreme, snakelike condenser pipe inlays to be established in the snakelike recess, install in the stock solution room and be used for the coolant liquid pump income the pump liquid mechanism of snakelike condenser pipe.
Preferably, the pump liquid mechanism includes the pump machine, pump machine fixed mounting in the bottom in the stock solution room, the pump machine output pass through the feed liquor pipe with snakelike condenser pipe input is linked together, snakelike condenser pipe output pass through the back flow with the stock solution room intercommunication.
Preferably, the accelerated heat dissipation mechanism comprises a pair of heat dissipation fans, and the pair of heat dissipation fans are fixedly installed at the bottom in the shell.
The utility model discloses following beneficial effect has:
1. by arranging the fixing mechanism, the slot and the inserting plate, the inserting plate can be fixed in the slot only by pulling the fixing pin rod when the semiconductor chip is installed, the installation is convenient and rapid, the semiconductor chip can be attached to the heat conducting plate, and the heat radiation of the semiconductor chip is facilitated;
2. through setting up cooling mechanism, pump liquid mechanism and heat dissipation mechanism with higher speed, in semiconductor chip operation process, the pump machine constantly with coolant pump income snakelike condenser pipe for the coolant liquid forms the circulation in snakelike condenser pipe and stock solution room and flows, thereby constantly be heat-conducting plate cooling, and meanwhile, radiator fan produces the scattered hot-blast, continuously blows the heat-conducting plate bottom, thereby heat dissipation with higher speed heat-conducting plate and semiconductor chip, make the semiconductor chip maintain in normal temperature range, guarantee its normal operating.
Drawings
Fig. 1 is a schematic structural diagram of a high-speed semiconductor device based on 5G network communication according to the present invention;
FIG. 2 is an enlarged view of the structure at A in FIG. 1;
fig. 3 is a schematic view of a bottom structure of the heat conducting plate according to the present invention;
fig. 4 is a top view of a high-speed semiconductor device based on 5G network communication according to the present invention.
In the figure: 1. a housing; 2. a heat conducting plate; 3. a slot; 4. inserting plates; 5. a card slot; 6. a semiconductor chip; 7. a serpentine groove; 8. a serpentine condenser tube; 9. a heat radiation fan; 10. a liquid storage chamber; 11. a pump machine; 12. a liquid inlet pipe; 13. a return pipe; 14. fixing the pin rod; 15. a first pin hole; 16. a second pin hole; 17. a spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-4, a high-speed semiconductor device based on 5G network communication includes a casing 1, a heat conducting plate 2 is embedded in the upper end of the casing 1, a slot 3 is fixedly connected to the upper end of the heat conducting plate 2, the slot 3 is inserted in a plug board 4, a slot 5 is arranged on the plug board 4, a semiconductor chip 6 is clamped in the slot 5, a liquid storage chamber 10 is fixedly connected to the lower end of the casing 1, and a cooling liquid is filled in the liquid storage chamber 10.
The inserting plate 4 is fixedly connected with the inserting groove 3 through a fixing mechanism, the fixing mechanism comprises a fixing pin rod 14 and a spring 17, a first pin hole 15 and a second pin hole 16 are formed in the corresponding positions of the side walls of the inserting groove 3 and the inserting plate 4 respectively, the fixing pin rod 14 is inserted into the first pin hole 15 and the second pin hole 16 in sequence, and the spring 17 is elastically connected between the end portion of the fixing pin rod 14 and the side wall of the inserting groove 3.
The cooling mechanism that is used for reducing the 2 temperatures of heat-conducting plate is installed to 2 lower extremes of heat-conducting plate, and cooling mechanism includes snakelike condenser pipe 8, and snakelike recess 7 has been seted up to 2 lower extremes of heat-conducting plate, and snakelike condenser pipe 8 inlays to be established in snakelike recess 7, installs the pump liquid mechanism that is used for going into snakelike condenser pipe 8 with the coolant liquid pump in the stock solution room 10.
The pump liquid mechanism includes pump 11, and pump 11 fixed mounting is in stock solution room 10 bottom, and pump 11 output is linked together through feed liquor pipe 12 and 8 input ends of snakelike condenser pipe, and 8 output ends of snakelike condenser pipe are passed through back flow 13 and are linked together with stock solution room 10.
An accelerating heat dissipation mechanism for accelerating heat dissipation of the heat conduction plate 2 is mounted at the bottom in the shell 1, the accelerating heat dissipation mechanism comprises a pair of heat dissipation fans 9, and the pair of heat dissipation fans 9 are fixedly mounted at the bottom in the shell 1.
It should be noted that, the above-mentioned electric control and power supply technology of the pump 11 and the cooling fan 9 is the existing mature technology, belongs to the technical means commonly used by the technical personnel in the field, and is not the technical point of the utility model, and the description is not done more here.
The utility model discloses in, when semiconductor chip 6 was in under the high-speed operation state, start radiator fan 9 and pump 11, pump 11 constantly goes into snakelike condenser pipe 8 with the coolant pump, and the coolant liquid in snakelike condenser pipe 8 flows back to in the stock solution room 10 through back flow 13 for the coolant liquid forms the circulation in snakelike condenser pipe 8 and stock solution room 10 and flows, thereby constantly be the cooling of heat-conducting plate 2, and then constantly takes away the heat that semiconductor chip 6 produced.
Meanwhile, the heat dissipation fan 9 generates heat dissipation air to continuously blow the bottom end of the heat conduction plate 2, so that the heat dissipation of the heat conduction plate 2 and the semiconductor chip 6 is accelerated, the semiconductor chip 6 is maintained in a normal temperature range, and the normal operation of the semiconductor chip is ensured.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A high-speed semiconductor device based on 5G network communication comprises a housing (1), it is characterized in that a heat conducting plate (2) is embedded at the upper end of the shell (1), an inserting groove (3) is fixedly connected at the upper end of the heat conducting plate (2), the inserting grooves (3) are inserted in the inserting plates (4), the inserting plates (4) are provided with clamping grooves (5), a semiconductor chip (6) is clamped in the clamping groove (5), the inserting plate (4) is fixedly connected with the inserting groove (3) through a fixing mechanism, the lower end of the heat conducting plate (2) is provided with a cooling mechanism for reducing the temperature of the heat conducting plate (2), an accelerated heat dissipation mechanism for accelerating heat dissipation of the heat conduction plate (2) is arranged at the bottom in the shell (1), the lower end of the shell (1) is fixedly connected with a liquid storage chamber (10), and cooling liquid is filled in the liquid storage chamber (10).
2. The high-speed semiconductor device based on 5G network communication according to claim 1, wherein the fixing mechanism comprises a fixing pin rod (14) and a spring (17), a first pin hole (15) and a second pin hole (16) are respectively formed at the corresponding positions of the side walls of the slot (3) and the plug board (4), the fixing pin rod (14) is sequentially inserted into the first pin hole (15) and the second pin hole (16), and the spring (17) is elastically connected between the end part of the fixing pin rod (14) and the side wall of the slot (3).
3. The high-speed semiconductor device based on 5G network communication according to claim 1, wherein the cooling mechanism comprises a serpentine condenser tube (8), a serpentine groove (7) is formed in the lower end of the heat conducting plate (2), the serpentine condenser tube (8) is embedded in the serpentine groove (7), and a liquid pumping mechanism for pumping a cooling liquid into the serpentine condenser tube (8) is installed in the liquid storage chamber (10).
4. A high-speed semiconductor device based on 5G network communication according to claim 3, wherein the liquid pumping mechanism comprises a pump (11), the pump (11) is fixedly installed at the bottom inside the liquid storage chamber (10), the output end of the pump (11) is communicated with the input end of the serpentine condenser pipe (8) through a liquid inlet pipe (12), and the output end of the serpentine condenser pipe (8) is communicated with the liquid storage chamber (10) through a return pipe (13).
5. A high-speed semiconductor device based on 5G network communication according to claim 1, wherein the accelerated heat dissipation mechanism comprises a pair of heat dissipation fans (9), and the pair of heat dissipation fans (9) is fixedly installed at the bottom in the housing (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121622874.2U CN214956834U (en) | 2021-07-16 | 2021-07-16 | High-speed semiconductor device based on 5G network communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121622874.2U CN214956834U (en) | 2021-07-16 | 2021-07-16 | High-speed semiconductor device based on 5G network communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214956834U true CN214956834U (en) | 2021-11-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121622874.2U Active CN214956834U (en) | 2021-07-16 | 2021-07-16 | High-speed semiconductor device based on 5G network communication |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214956834U (en) |
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2021
- 2021-07-16 CN CN202121622874.2U patent/CN214956834U/en active Active
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