CN213538126U

CN213538126U - High-precision 3D electrochemical deposition additive manufacturing device

Info

Publication number: CN213538126U
Application number: CN202021260951.XU
Authority: CN
Inventors: 徐斌
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-01
Filing date: 2020-07-01
Publication date: 2021-06-25
Anticipated expiration: 2030-07-01

Abstract

The utility model discloses a belong to vibration material disk technical field, specifically be a high accuracy 3D electrochemical deposition vibration material disk manufacturing installation, including negative pole, positive pole, plating solution, DC power supply. The cathode and the anode are opposite; the laser output end and the liquid spraying pipe are integrated on the anode, and three-degree-of-freedom positioning movement can be carried out relative to the cathode growing point; the laser output end comprises a laser light source, an optical fiber, a laser power adjusting device and a light source on-off device; the laser power adjusting device and the light source on-off device control the power and on-off of the laser output by the laser light source; the laser is focused on a cathode growing point directly or through an optical fiber, and the liquid spray pipe sprays plating solution liquid flow to realize high ion renewal rate; and carrying out high-efficiency and high-selectivity electrochemical deposition on target metal at a cathode target growth point under laser induction, so as to manufacture a target workpiece by 3D additive manufacturing. The utility model discloses the technique has advantages such as high accuracy, high surface finish, high efficiency, low cost.

Description

High-precision 3D electrochemical deposition additive manufacturing device

Technical Field

The utility model relates to a vibration material disk makes technical field, specifically is a high accuracy 3D electrochemical deposition vibration material disk manufacturing device.

Background

The additive manufacturing is also called as 3D printing, combines computer aided design, material processing and forming technology, and is a manufacturing technology for manufacturing solid objects by stacking special metal materials, non-metal materials and medical biomaterials layer by layer in modes of extrusion, sintering, melting, photocuring, spraying and the like through a software and numerical control system on the basis of a digital model file. Compared with the traditional processing mode of removing, cutting and assembling raw materials, the method is a manufacturing method through material accumulation from bottom to top, and is from top to bottom. This enables the manufacture of complex structural components that were previously constrained by conventional manufacturing methods and were not possible.

3D printing technology appears in the middle of the 90 s of the 20 th century, and is generally used for rapid forming by utilizing technologies such as photocuring and material cladding and laminating. The main process generally comprises the steps of firstly modeling through computer modeling software, then slicing the built three-dimensional model layer by layer, and then guiding a printer to print and form layer by layer, wherein the main technologies at present comprise Fused Deposition (FDM), electron beam free forming manufacturing (EBF), Direct Metal Laser Sintering (DMLS), electron beam melting forming (EBM), selective laser melting forming (SLM), Selective Heat Sintering (SHS), Selective Laser Sintering (SLS), gypsum 3D printing (PP), layered solid manufacturing (LOM), three-dimensional lithography (SLA), Digital Light Processing (DLP) and the like. Among them, the method mainly used for forming metal materials is selective melt sintering of metal powder (usually fine powder 15-53 μm for laser energy source, coarse powder 53-105 μm for electron or plasma beam energy source, and spherical shape for enhancing fluidity) with specific particle size and shape by electron beam or laser, which is usually carried out in inert gas atmosphere or vacuum environment, and thus is limited.

Electroplating, i.e. an electrochemical deposition technology, is a process of depositing a layer of other metals or alloys on the surface of a conductive material by utilizing an electrolysis principle, plating metal or other insoluble conductive materials are used as an anode, a workpiece to be plated is used as a cathode, and cations of the plating metal in a plating solution are reduced on the surface of the workpiece to be plated to form a plating layer. Mainly plays a role in improving the hardness, wear resistance, electrical conductivity, thermal conductivity, light reflection, corrosion resistance, beauty and the like of the matrix material. The deposition speed of the coating by the conventional electrochemical deposition technology is 0.1-5 mu m/min.

Laser light is a high energy density light source with excellent directivity, monochromaticity and coherence. The german Institute for noble metals (Prccious metal research Institute) succeeded in the 1980 laser electrodeposition of gold, palladium, copper, silver and nickel. However, it is required that the electrode substrate is extremely thin, the thermal conductivity is high, and an intense light beam is used to obtain a high energy density. Then researchers have carried out a series of deep researches, the deposition speed can be greatly improved after continuous or pulse laser induction, and the laser energy density in the laser irradiation micro-area can reach 10⁴-10⁵W/cm²After the illuminated cathode material absorbs the laser energy, the temperature of a local micro-area of an electrolyte-cathode interface is suddenly increased to generate a huge temperature gradient and generate strong convection of the electrolyte so as to enhance mass transfer, so that the ion mobility and the cathode reduction reaction in the local area are enhanced, and the equilibrium potential is shifted towards the positive direction, so that the deposition speed of a coating can reach nearly 10 of that of common electroplating³The size of a laser focusing spot is controlled, so that the laser electrochemical deposition has extremely high selectivity, and micron-level precision can be realized; in addition, the laser irradiation can improve the nucleation speed, so that the crystal particles of the plating layer are fine and compact, and the high-quality plating layer is obtained.

Chinese patent CN109097797 and utility model CN209162216 disclose a metal additive manufacturing device and method based on laser local electroplating, a laser generating device and a laser processing device are sequentially placed on a device bottom plate, an electrolytic cell is arranged above the laser processing device, a cathode substrate capable of moving up and down along a z axis is placed in the electrolytic cell, one end of a power supply and a cut-off controller is connected with the cathode substrate through a lead, the other end of the power supply and the cut-off controller is connected with a power supply anode through a lead, and the power supply anode is placed in the electrolytic cell to form a closed loop. The invention claims to solve the problems of poor precision and rough surface in the prior art and simultaneously meet the printing requirement of the miniature part. The patent describes that the laser is positioned at the bottom of the tank, but the problem that the laser energy is seriously attenuated due to the reflection and absorption of the tank bottom material and the absorption of the plating solution exists, meanwhile, the tank bottom is easy to deposit sediment to further influence the light transmittance along with the progress of the plating process, and in addition, the structure also has the problem that the anode material is inconvenient to be always aligned with the laser irradiation point and keep a constant distance.

Chinese patent CN105239110 discloses a three-dimensional electroforming processing method, which comprises: preparing a casting mold insulating material layer on a cathode substrate in a layering manner by using an additive manufacturing technology according to the obtained layering slice information of the solid modeling of the electroforming mold corresponding to the electroforming component; carrying out layered electroforming under the limitation of the casting mould insulating material layer to form an electroforming layer surrounded by the casting mould insulating material layer; and the layered preparation of the casting mould insulating material layer and the layered electroforming are alternately and circularly carried out until all the layered electroforming layers are stacked to form the three-dimensional electroforming part. But when the scheme is implemented, the insulating material is required to be printed in a 3D mode to limit the growth of the plating layer, and meanwhile, compared with the scheme of the invention, the electroforming process is considered as a traditional electroplating method, the plating layer deposition efficiency is extremely low, and the precision is limited by the printing precision of the insulating material; in addition, since the growth of each layer requires repeated 3D printing of the insulating material and electrodeposition of metal, and the electrodeposition needs to be performed in the plating solution, this means that the workpiece needs to be taken out and cleaned after the electroforming of the layer is completed, and then the next layer of insulating material can be printed after the workpiece is dried, thereby severely limiting the processing efficiency.

Chinese utility model patent CN 201420482471 discloses a two-dimensional array is electroplated and is piled up 3D printer belongs to 3D and prints technical field. Two-dimensional array electroplating pile 3D printer, including DC power supply, central controller, metal conductive bottom plate and the two-dimensional array microtube that is equipped with electrolyte solution, wherein: the two-dimensional array micro-tubes are positioned below the metal conductive base plate, and each micro-tube of the two-dimensional array micro-tubes is internally provided with a metal electrode block; a lifting motor is connected above the metal conductive bottom plate; and the cathode of the direct current power supply is connected with the metal conductive bottom plate, and the anode of the direct current power supply is connected to the metal electrode block in each micro tube of the two-dimensional array micro tube through the central controller. The utility model has the defects that the fine printing is difficult to realize and the efficiency is far lower than that of the invention.

Chinese invention patent CN104164683 discloses a 3D printing device of dot matrix anode type electro-reduction metal deposition parts, which comprises a computer numerical control system and the like, and is characterized in that: the anode table is provided with an anode table top in a horizontal x-axis direction and a horizontal y-axis direction lattice distribution shape, anodes are fixedly arranged at each lattice and are mutually insulated to form a lattice distribution type anode table column, all the anodes are connected in parallel and are connected with an electrochemical power supply of the anode table column, an anode infusion channel in a lattice distribution shape is further arranged in the anode table column and is communicated with a metal ion solution conveying device with pressure, and a computer numerical control system converts three-dimensional image data of a workpiece to be formed into horizontal x-axis and y-axis direction lattices and vertical stepping three-dimensional control data. All the electrode points can work simultaneously, namely parallel printing, so that the efficiency can be improved by adopting tens of thousands of electrodes to work simultaneously when 3D printing is carried out on a thick-wall or solid metal piece. However, the invention adopts an insoluble anode, so that the stability control of the plating solution becomes a great challenge, meanwhile, because the diameter of the lattice titanium wire anode is 0.5mm, the capacity expansion mouth of the anode is more in the order of several millimeters, the requirement of forming a fine metal piece is difficult to meet, and because the migration of metal ions near the cathode is mainly realized by diffusion and common convection, the deposition efficiency of the metal ions is still only at the conventional electroplating level.

Chinese patent No. CN108914177 discloses a five-axis fine liquid stream metal 3D printing device and method, which is characterized in that an insulated capillary is used as a fine nozzle, a micron platinum wire is inserted in the middle of the insulated capillary and is connected with a power supply anode, electrolyte is sprayed onto the surface of a cathode substrate to realize electrodeposition in a designated area, a constant current direct current power supply is adopted, the current density is controlled to be 100-800A/dm 2, and a required three-dimensional metal structure is deposited by controlling the movement of three axes XYZ and two rotating axes. However, the invention cannot avoid the deposition of the anode platinum wire at the position outside the cathode projection area, so that the high-precision 3D forming is still difficult to realize.

The invention Chinese patent No. 103481672 discloses a 3D printer, which is characterized by comprising an X-axis track frame, a Z-axis track frame, a Y-axis track frame, a universal numerical control bogie, a conductive bottom plate, a coaxial sleeve printing head arranged on the universal numerical control bogie, a backflow outer hose connected with an outer pipe of the coaxial sleeve printing head, a self-flowing inner hose connected with an inner pipe of the coaxial sleeve printing head, a liquid storage tank filled with electrolyte, a metal electrode block and a numerical control suction pump arranged at the tail end of the backflow outer hose and used for sucking the electrolyte back to the liquid storage tank. The metal electrode block of the 3D printer, the electrolyte solution, the conductive bottom plate and the direct-current power supply form an electrolysis device, and the electrolyte solution is used for electrolyzing the conductive bottom plate to precipitate a metal coating as a stacking printing material. US patent US2019/0017185 discloses an electrochemical 3D printing and welding device, primarily a hydrogen evolution assisted plating nozzle, comprising a nozzle tip arranged to correspond to a localized area of a substrate. The nozzle further includes an inner coaxial tube connected to a reservoir containing the electrolyte and the anode, the inner coaxial tube configured to distribute the electrolyte to the localized area of the substrate through the nozzle tip. The nozzle also includes an outer coaxial tube surrounding the inner coaxial tube and configured to draw electrolyte from a localized area of the substrate. The nozzle also includes at least one contact pin disposed in electrical contact with the conductive path on the substrate. The two inventions are mainly generated at the contact part of the gravity flow inner tube and the reflux outer tube and the cathode, and the range of the two inventions is wide, so that the two inventions can not realize fine metal deposition, and the efficiency of the two inventions is far lower than that of an electrodeposition system adopting laser enhancement.

International patent application WO2018/028000 discloses a device and method for multi-level imbibition electrodeposition 3D printing. The workpiece is processed by constructing inner and outer composite electrodes with different potentials, the outer electrode is connected with the negative pole of a power supply and has a low potential, the inner electrode is connected with the positive pole of the power supply and has a high potential, the workpiece substrate is connected with the negative pole of the power supply through an adjustable resistor and has a medium potential so as to restrict the direction of an electric field, and the middle liquid-absorbing tube electrode is adopted as a tool electrode, so that the electrodeposition liquid is gathered to the center and bubbles of a deposition layer are absorbed away, the concentration polarization is reduced, and the localization and the processing surface quality are improved. The regulation and control of the deposition area can be realized by adjusting the potential of the auxiliary electrode and the imbibition flow; and the axial feeding of the electrode is adjusted through the feedback of a suction sensor and a flowmeter so as to ensure a proper machining gap. However, in this method, since the inner electrode has a high potential and the outer electrode has a low potential, deposition of metal on the outer electrode and erosion of the inner electrode cannot be avoided, so that deformation of the tool electrode and a large change in system resistance are caused, and it is difficult to realize a long-term continuous molding process.

International patent publication WO2008/018471 discloses a partial plating method capable of performing fine hard gold plating, a laser plating apparatus capable of performing partial plating to a minute area with high positional accuracy, and a plated member. The partial plating method includes plating a region to be plated by projecting a laser beam having a wavelength of 330nm or more and 450nm or less. This method is mainly applicable to local plating of minute areas such as contact portions of connector terminals, and is not used for 3D metal molding.

The existing electrochemical deposition technology is difficult to realize the effect of high-precision and high-efficiency metal 3D additive manufacturing.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high accuracy 3D electrochemical deposition vibration material disk manufacturing device to solve the problem that current electrochemical deposition technique and the metal powder sintering technique that provide in the above-mentioned background art still all are difficult to realize the high-efficient metal 3D vibration material disk of high accuracy and make. The method is suitable for various small-size to large-size metal fine molding processing environments such as customized jewelry, industrial parts and the like, and can realize metal molding processing which is difficult to realize by the conventional metal powder selective laser melting molding (SLM) or Selective Laser Sintering (SLS) technology.

In order to achieve the above object, the utility model provides a following technical scheme: a high-precision 3D electrochemical deposition additive manufacturing device comprises a cathode, an anode, electroplating liquid and a direct current power supply, wherein the cathode and the anode are opposite in position; the anode, the laser output end and the liquid spraying pipe are connected to a three-dimensional or two-dimensional driving mechanism;

the laser output end comprises a laser light source, an optical fiber, a laser power adjusting device and a light source on-off device, the laser power adjusting device and the light source on-off device control the power and the on-off of laser output by the laser light source, the laser is focused on a cathode growing point directly or through the optical fiber, and the direct current power supply is regulated and controlled by the 3D model slice to realize the size and the on-off of current;

the cathode is kept at a constant distance from the opposite anode, the laser output end, the liquid spray pipe and a growing point on the cathode, and the cathode and the anode are immersed in the electroplating solution or are connected by the liquid flow of the spraying solution.

Preferably, the anode is a single anode or an array type integrated anode integrated by the single anode.

Preferably, the anode comprises a liquid spray structure, a laser beam light guide structure, a soluble or insoluble anode.

Compared with the prior art, the beneficial effects of the utility model are that:

compared with the common metal powder selective laser melting molding (SLM) or Selective Laser Sintering (SLS) technology, in order to avoid oxidation of metal or high-temperature powder in a molten state, the SLM or SLS needs protection of inert gas during processing, and generally, a printing chamber is vacuumized, and then filled with inert gas, and the vacuumization and the filling of inert gas are repeated for several times to obtain a relatively pure inert gas environment. The scheme of the utility model does not need the protection of inert gas or high vacuum environment, can be carried out within the temperature range from normal temperature to water boiling point (100 ℃), and the temperature range can be further expanded if a non-aqueous electrolyte system is selected, the scheme of the utility model has low requirement on the sealing performance of the printing room, only needs to avoid the splashing of the fog foam and the diffusion of the odor, and can be realized by applying slight negative pressure to the air exhaust of the printing room;

because the utility model discloses the scheme has high selectivity, therefore shaping precision can surpass SLM and SLS technique;

the scheme of the utility model can realize higher deposition speed for most metal materials which can be electroplated, thereby shortening the whole processing period;

abrasive particles such as diamond and silicon carbide can be added into the plating solution, or carbon nanotubes, graphene and the like can be added to form a composite material, which is difficult to realize by other laser sintering or melting processes;

the scheme of the utility model can obtain compact metal deposition layer under the condition of proper control of technological conditions, thereby avoiding the defects of holes, air pockets, thermal cracks, interface cracking, buckling deformation and the like in the workpiece, which are possibly caused by the selective laser melting molding (SLM) or Selective Laser Sintering (SLS) technology;

because the utility model adopts the cold processing in the low temperature solution, the stress caused by the sharp temperature change can be avoided correspondingly, and the low stress deposition layer can be obtained by reasonably controlling the components of the plating solution and the operating conditions;

because the utility model can adopt different additives and different process conditions to adjust the stress direction and the stress magnitude, workpieces with controllable stress distribution at different parts can be designed and manufactured according to some special requirements, which is difficult to realize by the existing other metal 3D forming technologies;

because the scheme of the utility model is carried out at low temperature, the preparation can be realized by taking other materials as the framework or nesting the framework and other materials without damage, for example, the coating can be deposited by 3D operation when plastic or other insulating materials are taken as the framework or nesting materials; or a coating with a specific shape can be epitaxially deposited on the basis of other metal frameworks;

because the utility model discloses the scheme is gone on at the low temperature for it is possible to imbed or implant various sensors or chips in metal work piece, thereby makes intelligent work piece, and this is also that other metal 3D forming techniques now are difficult to realize. Because the method can realize the close contact of the plating metal and the sensor or the chip, better detection sensitivity, shorter response time and better heat dissipation capability can be obtained;

for certain plating solution systems, electrodeposition of alloy coatings can be performed to achieve additive manufacturing of binary or multi-element alloy materials comprising metal-metal and metal-nonmetal;

the additive manufacturing of different metals can be realized by changing or changing the formula of the plating solution, and the transition or non-transition intermetallic interface can be realized by controlling the plating solution changing method;

because the liquid spraying head and the laser irradiation head of the scheme of the utility model can be made to be very small in size, the liquid spraying head and the laser irradiation unit can be arrayed, a plurality of electrodeposition modules work simultaneously, and the efficiency of 3D forming is further improved;

the essence of the scheme of the utility model is that the anode material is transferred to the cathode as the target workpiece through the electrolysis of the current, so the material utilization efficiency is extremely high, and the metal powder with specific granularity and shape is not needed, thereby the cost is greatly reduced;

the utility model can realize the three-dimensional forming of small-size metal workpieces and can also easily realize the three-dimensional forming of oversized metal workpieces;

the utility model discloses an above structure and the improvement in the functional design have high accuracy, high surface finish, high efficiency, low cost etc. advantage.

Drawings

FIG. 1 is a schematic structural view of a first anode unit of the present invention;

FIG. 2 is a schematic structural view of a second anode unit according to the present invention;

fig. 3 is a schematic diagram of the array layout structure of fig. 2 according to the present invention;

FIG. 4 is a schematic structural diagram of a third anode unit according to the present invention;

fig. 5 is a schematic diagram of the array layout structure of fig. 4 according to the present invention;

FIG. 6 is a schematic structural view of the anode unit of the present invention performing laser-assisted chemical deposition;

fig. 7 is a schematic structural view of an embodiment of the present invention;

fig. 8 is a schematic structural view of another embodiment of the present invention;

fig. 9 is a flow chart of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Example (b):

referring to fig. 1-8, the present invention provides a technical solution: a high-precision 3D electrochemical deposition additive manufacturing device comprises a cathode, an anode, electroplating liquid and a direct-current power supply. The cathode and the anode are opposite in position, a laser output end and a liquid spraying pipe are integrated on the anode, the cathode, the anode, the laser output end and the liquid spraying pipe are connected to a three-dimensional driving mechanism, the laser output end comprises a laser light source, an optical fiber, a laser power adjusting device and a light source on-off device, the laser power adjusting device and the light source on-off device are electrically connected with the laser light source, and the laser light source is connected with the optical fiber;

the three-dimensional driving mechanism is composed of three transverse, radial and longitudinal servo sliding tables and can drive the anode, the laser output end and the liquid spraying pipe to move in a three-dimensional mode relative to the cathode;

the method comprises the steps that a cathode keeps a constant distance with an anode, a laser output end, a liquid spraying pipe and a plating growing point on the cathode, the cathode and the anode are immersed in electroplating solution or are connected by spraying the plating solution liquid flow, a laser light source with high transmittance and high wavelength is adopted for the plating solution system, the plating growing point is focused on the cathode, electroplating current is switched on, laser output is started, plating metal can be deposited at a laser irradiation point at a high speed, relative movement scanning between the cathode and the anode is controlled, the laser light source and the electroplating current are controlled to be switched on and off according to each layer of slice patterns of a target workpiece to achieve high-speed deposition growth of the target micro-area metal, after one layer of scanning is completed, the distance between the cathode and the anode is controlled to be increased to be 3D model slice thickness, layer.

The relative movement scan between the cathode and anode was controlled in the manner described in table 1, wherein the cathode was set to be an xy-direction plane, and the z-direction was a direction perpendicular thereto.

TABLE 1

Preferably, a protective layer is arranged outside the optical fiber and can focus the guided laser beam into a micro light spot at a cathode growing point or through a lens device.

Preferably, the laser light source is used for generating a continuous or pulse laser beam, the wavelength of the laser beam is within the range of 210-1800nm, the optical fiber is used for guiding and focusing the laser beam generated by the laser light source to project on a target growth point, the optical fiber protective layer is used for protecting the side wall of the optical fiber from being damaged or eroded by a plating solution, and the laser power adjusting device is used for adjusting the output power of the laser light source; and the light source on-off device is used for controlling the output of the laser beam or interrupting the output.

Preferably, the first and second liquid crystal materials are,the laser light source comprises CO₂、Ar、He-Ne、N₂Gas lasers such as ruby, neodymium glass, Nd, YAG and other solid lasers, GaAs, InAs, InSb, CdS and other lasers and fiber lasers.

Preferably, the high-precision 3D electrochemical deposition additive manufacturing device supports conventional platable metal materials and related platable alloys thereof, and also supports composite diamond, carbon nanotubes, graphene and the like to form uniform or non-uniform composite materials with special functions.

Preferably, the high-precision 3D electrochemical deposition additive manufacturing device can control feeding or supplement of the soluble anode according to voltage change of the same current output by the direct current power supply.

Preferably, the high-precision 3D electrochemical deposition additive manufacturing device performs time integration on the current passing through each layer of plating metal to obtain the passing electric quantity of each layer, calculates the quality of the deposited plating layer and the theoretical quality of a model slice according to the deposition efficiency of the plating solution system, performs checking calculation, automatically corrects the plating current of each unit of the next layer, and realizes more accurate deposition control and higher forming precision through self-checking.

FIG. 1 is a basic anode unit, wherein 1 is an optical fiber, the end of which outputs a laser beam with a smaller diameter, or can be focused on the surface of a cathode to form a laser with a small diameter spot; 2, a protective layer with the characteristics of flexibility and bendability; 3 is a liquid spraying tube made of insulating material, which is used for spraying high-speed liquid flow to the growing point of the plating layer; 4, a soluble anode or a cage-shaped titanium basket is filled with the soluble anode and is connected with the anode of a direct current power supply;

FIG. 2 is another anode unit, in which the outer layer of the optical fiber 1 still has a protective layer 2, and is placed in a liquid spraying tube 3 made of insulating material, the liquid spraying tube 3 sprays high-speed plating liquid flow to the plating layer growing point, laser penetrates through the plating solution through the optical fiber 1 and irradiates on the plating layer growing point to cause the plating layer to grow at a high speed, and a soluble anode 4 is positioned outside the liquid spraying tube;

fig. 3 is another anode scheme of the present invention, which is an array arrangement of the units of fig. 2, so as to realize the cooperative work of multiple plating heads, and realize the simultaneous growth of multiple plating layers, thereby increasing the growth forming speed of the plating layers by multiple times, wherein 9 is a plating solution flow injection channel, 12 is a fixing plate made of an insulating material, the liquid injection pipes 3 and the optical fibers 1 can be arranged and fixed on the plate in an array, and the anode 4 can be automatically fed according to the loop voltage between the anode and the cathode through the opening on the fixing plate 12;

FIG. 4 is another illustration of the anode unit of the present invention, in which the outer layer of the optical fiber 1 still has a protective layer (not labeled), the optical fiber is placed in the liquid spraying tube 3 made of inert conductive material, and the liquid spraying tube of the present embodiment is connected to the positive electrode of the DC power supply by a wire to become an anode, which is suitable for a plating solution system using an insoluble anode;

FIG. 5 is another anode scheme of the present invention, which is an array arrangement of the units shown in FIG. 4, and is implemented by using a plate-shaped insoluble anode, forming a plurality of holes as a liquid spraying tube cavity, placing optical fibers therein, controlling each optical fiber by a control system, respectively irradiating on the growth points of the cladding layer in each region to induce the rapid growth of the cladding layer, and thus increasing the growth forming speed of the cladding layer by times, and being suitable for a plating solution system using an insoluble anode;

FIG. 6 is a schematic view of another embodiment of the present invention showing laser-assisted chemical deposition of the anode unit of FIG. 1, wherein 5 is a focused laser beam emitted from a fiber optic head; 6 is a plating layer growing point on the cathode; 7 is a cathode substrate connected with the negative pole of a direct current power supply; 8 is a work piece produced by deposition on a cathode substrate; 9 is plating solution jet flow ejected at high speed through the liquid ejecting pipe 3;

FIG. 7 is a schematic representation of an embodiment of the present invention, employing the laser induced electrodeposition workpiece of FIG. 4 anode unit, adapted for use in a plating bath system employing an insoluble anode;

fig. 8 shows an embodiment of the present invention, wherein 10 is a rotating shaft connected to the cathode substrate 7, and driven by the motor 11, and the cathode substrate 7 is connected to the negative pole of the dc power source through a carbon brush or a slip ring (not shown);

fig. 9 is a flow chart of the present invention, which is implemented by combining table 1 with specific metal types, plating solution systems, equipment types, etc.

The first embodiment is as follows: as shown in fig. 6, the method for performing high-precision 3D electrochemical deposition additive manufacturing by using the novel laser-assisted electrochemical deposition technology of the present invention includes the following main steps:

(1) operate according to the flow (fig. 9);

(2) an argon ion laser beam source was used as the laser light source: 514.5nm argon ion laser emitted by the laser light source is less absorbed by the plating solution, is suitable for locally heating a target deposition point and generating high-efficiency electrochemical deposition, and is guided into and focused on a cathode target deposition point through the optical fiber 1;

(3) the plating solution adopts a general nickel sulfamate formula system, wherein Ni²⁺The content is 100 +/-20 g/L, H₃BO₃The content of NiCl is 40 +/-15 g/L₂*6H₂O or NiBr₂*6H₂The O content is 10 +/-10 g/L, the surfactant content is 1 +/-1 g/L, the defoaming agent content is 1 +/-1 g/L, the pH of the plating solution is controlled to be 4 +/-1.0, and the temperature is controlled to be 55 +/-10 ℃;

(4) an electrolytic nickel wire is used as an anode 4, is connected with the positive pole of a direct current power supply, and is automatically fed by keeping the resistance between the cathode and the anode (the ratio of the loop voltage between the cathode and the anode of the direct current power supply to the current passing through) in a set range;

(5) the cathode substrate is made of 3 series stainless steel and is connected with the negative pole of the direct current power supply;

(6) starting a circulating pump to inject the plating solution into the liquid spraying pipe 3, so that the plating solution is sprayed to the laser beam projection point on the cathode substrate at a high speed and is connected with a circuit;

(7) scanning and moving a cathode or an anode along the xy direction of a cathode surface (an anode unit is formed by an optical fiber, a liquid spray pipe and the anode and is displaced together), and calculating whether the area needs to be deposited or not by slicing a target workpiece so as to carry out the on-off of laser;

(8) after the deposition of a layer of workpiece slices, moving the anode unit or the cathode along the z direction of the cathode surface to increase the distance between the anode unit and the cathode substrate by the thickness of one workpiece slice;

(9) repeating the steps (7) and (8) until a target workpiece is formed;

(10) turning off the direct-current power supply, the laser and the circulating liquid-jet pump, and unloading the cathode substrate and the workpiece;

(11) and separating the workpiece from the cathode substrate, cleaning, and performing local modification to obtain the finished pure nickel workpiece.

Example two: as shown in fig. 7, the method for performing high-precision 3D electrochemical deposition additive manufacturing by using the novel laser-assisted electrochemical deposition technology of the present invention includes the following main steps:

(1) operating according to the flow;

(2) a semiconductor laser with the wavelength of 330-450nm is used as a laser light source, and the emitted laser is guided into the cathode target deposition point through the optical fiber 1 and focused;

(3) the plating solution adopts a cyanide-free gold plating formula system, wherein Na is used₃Au(SO₃)₂The gold content in the form of Na is 18 +/-5 g/L₂SO₃The content is 110 plus or minus 20g/L, the content of hydroxyethylidene diphosphonic acid (HEDP) is 50 plus or minus 15g/L, the content of aminotrimethylene phosphonic Acid (ATMP) is 75 plus or minus 20g/L, the content of antimony potassium tartrate is 0.3 plus or minus 0.2g/L, the content of surfactant is 1 plus or minus 1g/L, the content of defoamer is 1 plus or minus 1g/L, the pH of plating solution is controlled at 11.5 plus or minus 1.0, and the operating temperature is controlled at 35 plus or minus 10 ℃;

(4) the method comprises adopting insoluble conductive material in plating solution system as anode 4, such as 316 stainless steel, pure titanium, platinized titanium, graphite, etc., as anode and connecting with DC power supply anode, keeping constant distance with cathode plating growing point, supplementing gold ions according to electric quantity obtained by plating current integration, and adding 4.3g Na for every 1000 coulomb of electric quantity consumed₃Au(SO₃)₂2.0g of pure gold is reduced to deposition;

(9) the current passing through each layer can be subjected to time integration to obtain the electric quantity passing through each layer, the quality of a deposited coating and the theoretical quality of a model slice are calculated according to the deposition efficiency of the plating solution system and are checked, so that the plating current applied to each unit of the next layer is automatically corrected, and more accurate deposition control and higher forming precision are realized through self-checking;

(10) repeating the steps (7) - (9) until a target workpiece is formed;

(11) turning off the direct-current power supply, the laser and the circulating liquid-jet pump, and unloading the cathode substrate and the workpiece;

(12) and separating the workpiece from the cathode substrate, cleaning, and performing local modification to obtain the finished pure gold workpiece.

Example three: as shown in fig. 8, the method for performing high-precision 3D electrochemical deposition additive manufacturing by using the novel laser-assisted electrochemical deposition technology of the present invention includes the following main steps:

(1) operating according to the flow;

(2) an XeCl excimer laser with the wavelength of 308nm is used as a laser light source, and continuous or pulse laser emitted by the laser light source is guided into a cathode target deposition point through an optical fiber 1 and focused;

(3) the plating solution adopts a general acid copper formula system, wherein CuSO₄·5H₂O content of 220 +/-20 g/L, H₂SO₄The content is 60 +/-10 g/L, Cl^-The content is 70 plus or minus 20mg/L, the surfactant content is 1 plus or minus 1g/L, the defoamer content is 1 plus or minus 1g/L, and the temperature is controlled at 28 plus or minus 5 ℃;

(4) the method comprises the following steps of adopting a copper wire with the purity of more than 99.5 percent as an anode 4, connecting the copper wire with the anode of a direct-current power supply, and automatically feeding the copper wire by keeping the ratio of the loop voltage between the anode and the cathode of the direct-current power supply to the passing current within a set range through an inter-anode resistor (the ratio of the loop voltage between the anode and the cathode of the direct;

(6) the driving motor 11 rotates at a certain speed, and the rotating axis of the cathode substrate is a basic axis for the growth of the coating;

(7) starting a circulating pump to inject the plating solution into the liquid spraying pipe 3, so that the plating solution is sprayed to the laser beam projection point on the cathode substrate at a high speed and is connected with a circuit;

(8) the cathode can rotate along the rotating shaft, the anode unit can move back and forth in the direction perpendicular to the rotating shaft so as to control the distance between the anode unit and the rotating shaft according to the workpiece model slice, and in addition, one of the anode unit and the cathode unit can also move along the rotating shaft direction;

(9) the optical fiber, the liquid spray pipe and the anode form an anode unit and move together, and the target workpiece is sliced to calculate whether the area needs to be deposited so as to carry out the on-off of laser and the adjustment of the distance between the anode unit and a cathode rotating shaft and the distance between the anode unit and a cathode substrate;

(10) adjusting the rotating speed of the motor 11 to keep the constant rotating linear speed of the growing point of the coating according to the distance between the anode unit and the cathode rotating shaft;

(11) after the deposition of a layer of workpiece slices, moving the anode unit or the cathode along the direction of the rotating shaft to increase the distance between the anode unit and the cathode substrate by the thickness of one workpiece slice;

(12) repeating the steps (9) to (11) until a target workpiece is formed;

(13) turning off the direct-current power supply, the laser and the circulating liquid-jet pump, and unloading the cathode substrate and the workpiece;

(14) and separating the workpiece from the cathode substrate, cleaning, and performing local modification to obtain the finished pure copper workpiece.

Example four: the difference from the first embodiment is that the anode units are arranged in an array as shown in fig. 3, holes are opened on the insulating fixing plate 12, the liquid spraying tube 3 and the optical fiber 1 are respectively arranged, and the anodes 4 of the units are automatically fed according to the loop voltage between the anode and the cathode. In the electrodeposition process, each arrayed anode unit has synergistic effect, and the direct current and the laser on-off of each unit are automatically controlled according to the molding requirement of a target deposition area, so that the molding efficiency is improved by times, and the ultrahigh-speed 3D electrochemical deposition additive manufacturing is realized. The other steps are the same as those in the first embodiment.

Example five: the difference from the second embodiment is that the anode units arranged in an array manner as shown in fig. 5 and fig. 3 are adopted, the insoluble anode plate 3 made of materials such as 316 stainless steel, pure titanium, platinized titanium, graphite and the like is directly adopted, holes are arrayed on the insoluble anode plate 3 to be used as the liquid spraying cavity 9, the optical fibers 1 are arranged, the integrated anode module keeps a fixed distance with the target growth point on the cathode, and the height distance between the integrated anode module and the cathode substrate 7 is increased by one slicing layer height every time as the number of slicing layers of the workpiece model is increased. In the electrodeposition process, each arrayed liquid spray and the optical fiber laser output unit act synergistically, and direct current and laser on-off of each unit are automatically controlled according to the molding requirement of a target deposition area, so that the molding efficiency is improved in multiples, and ultrahigh-speed 3D electrochemical deposition additive manufacturing is realized. The other steps are the same as those in the second embodiment.

Example six: the difference from the third embodiment is that:

(1) adopting a fiber laser with the wavelength of 400-900nm as a laser light source, and leading the emitted continuous or pulse laser into the cathode target deposition point through the optical fiber 1 and focusing the laser on the cathode target deposition point;

(2) the plating solution adopts a cyanide-free silver plating formula system, wherein AgNO₃The content is 50 +/-10 g/L, (NH)₄)S₂O₃The content of the potassium metabisulfite K is 230 +/-30 g/L₂S₂O₅The content is 45 plus or minus 10g/L, the adjuvant content is 5 plus or minus 5g/L, the surfactant content is 1 plus or minus 1g/L, the defoamer content is 1 plus or minus 1g/L, the pH of the plating solution is controlled at 5.5 plus or minus 1.0, and the operating temperature is controlled at 30 plus or minus 10 ℃;

(3) adopting the anode units arranged in an array way as shown in fig. 5 and fig. 3, directly adopting insoluble anode plates 3 made of materials such as 316 stainless steel, pure titanium, platinum-plated titanium, ruthenium-plated titanium, graphite and the like, wherein holes are arranged in an array way to be used as liquid spraying cavities 9 and optical fibers 1 are arranged on the insoluble anode plates, the integrated anode modules are parallel to a cathode substrate (vertical to a rotating shaft) and keep a fixed distance with a target growth point on the cathode, and the height distance between the integrated anode modules and the cathode substrate 7 is increased every time along with the increase of the number of slicing layers of a workpiece model;

(4) according to the application of platingThe silver ions are supplemented by the electricity obtained by the flow integration, and 1.73g of AgNO is added for each 1000 coulomb electricity consumed₃1.1g of pure silver is reduced and deposited;

(5) in the electrodeposition process, each arrayed liquid spray and the optical fiber laser output unit act synergistically, and direct current and laser on-off of each unit are automatically controlled according to the molding requirement of a target deposition area, so that the molding efficiency is improved in multiples, and ultrahigh-speed 3D electrochemical deposition additive manufacturing is realized. And obtaining a finished product of the 3D molded pure silver workpiece by the same steps as the third embodiment.

Example seven: the difference from the fourth embodiment is that the carbon nano tube is added into the plating solution, and other steps are the same as those in the first embodiment, so that the high-efficiency and high-precision forming processing of the carbon nano tube reinforced nickel composite material is realized.

Having shown and described the basic principles and principal features of the present invention and the advantages thereof, it will be apparent to those skilled in the art that the present invention is not limited to the details of the foregoing exemplary embodiments, but is capable of being embodied in other specific forms, including, without limitation, variations in process recipes, parameters, flow adjustments, etc., without departing from the spirit or essential characteristics of the invention; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not intended to be construed as limiting the claim concerned.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a high accuracy 3D electrochemical deposition vibration material disk manufacturing installation, includes negative pole, positive pole, plating solution, direct current power supply, its characterized in that: the cathode and the anode are opposite; the anode, the laser output end and the liquid spraying pipe are connected to a three-dimensional or two-dimensional driving mechanism;

2. The high precision 3D electrochemical deposition additive manufacturing apparatus of claim 1, wherein: the anode is a single anode or an array type integrated anode integrated by the single anode.

3. A high precision 3D electrochemical deposition additive manufacturing apparatus according to claim 2, wherein: the anode comprises a liquid spraying structure, a laser beam light guide structure and a soluble or insoluble anode.