CN213519882U - Chip assembling mechanism - Google Patents
Chip assembling mechanism Download PDFInfo
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- CN213519882U CN213519882U CN202022762240.9U CN202022762240U CN213519882U CN 213519882 U CN213519882 U CN 213519882U CN 202022762240 U CN202022762240 U CN 202022762240U CN 213519882 U CN213519882 U CN 213519882U
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- push away
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Abstract
A chip assembly mechanism comprising: the chip feeding component is connected with the first chip carrying mechanism, the first chip carrying mechanism is connected with the chip positioning mechanism, the chip positioning mechanism is connected with the second chip carrying mechanism, the second chip carrying mechanism is connected with the shell tray, and the shell tray is connected with the chip assembling mechanism. Compared with the prior art, the utility model, can only carry out the automation installation to the chip installation behind the increase draw-in groove through manually operation's problem, design complete mechanical assembly mechanism.
Description
Technical Field
The utility model relates to an rigging equipment, concretely relates to chip assembly devices.
Background
With the development of modernization, for example, the number of parts required by the automobile industry is increasing day by day, and the pursuit of high-quality products is always the purpose of various automobile suppliers, for some automobile sensors, one of the methods for improving the accuracy of the sensors is to provide a better fixing mode for the induction chip, but the requirement of automation equipment is improved due to the change, and the production efficiency is seriously reduced because the products are put into the initial stage and only depend on manual production.
In order to solve the above problems, we have made a series of improvements.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a chip assembly devices to overcome the above-mentioned shortcoming and not enough that prior art exists.
A chip assembly mechanism comprising: chip feed part, first chip transport mechanism, chip positioning mechanism, second chip transport mechanism, casing tray and chip equipment mechanism, chip feed part is connected with first chip transport mechanism, first chip transport mechanism is connected with chip positioning mechanism, chip positioning mechanism is connected with second chip transport mechanism, second chip transport mechanism is connected with the casing tray, the casing tray is connected with chip equipment mechanism.
Further, the chip feed part includes: chip charging tray, chip batcher, first support component, material area guiding mechanism and material area are cuted the mechanism, the centre bore and the chip batcher hub connection of chip charging tray, chip batcher, material area guiding mechanism and material area are cuted the mechanism and are fixed in on the first support component, chip batcher and material area guiding mechanism are connected, material area guiding mechanism bottom is equipped with the material area and cuts the mechanism.
Further, the first chip handling mechanism includes: horizontal cylinder, vertical cylinder and sucking disc grasping element, horizontal cylinder passes through the mounting and is connected with first support part, vertical cylinder is connected with horizontal cylinder one side, sucking disc grasping element is connected bottom vertical cylinder.
Further, the chip positioning mechanism includes: the chip carrying device comprises an X-direction positioning clamping jaw, a Y-direction positioning pull rod, a support component and a chip existence sensor, wherein the X-direction positioning clamping jaw is fixed in the middle of the support component, the Y-direction positioning pull rod is fixed on one side of the support component, the other side of the support component is connected with a second chip carrying mechanism, and the chip existence sensor is connected with the X-direction positioning clamping jaw.
Further, the second chip handling mechanism includes: the servo mechanism comprises a transverse servo mechanism, a longitudinal servo mechanism and a second support component, wherein the transverse servo mechanism is connected with the top of the second support component, the transverse servo mechanism is connected with the longitudinal servo mechanism, and the longitudinal servo mechanism is connected with a chip assembling mechanism.
Further, the chip assembly mechanism includes: chip sucking disc, push away dress cylinder, mounting panel and chip push away the dress piece, the chip sucking disc pushes away the dress piece with the chip and is connected, chip push away the dress piece with push away the dress cylinder and be connected, push away the dress cylinder and be connected with the mounting panel, the mounting panel is connected with vertical servo mechanism.
The utility model has the advantages that:
compared with the prior art, the utility model, can only carry out the automation installation to the chip installation behind the increase draw-in groove through manually operation's problem, design complete mechanical assembly mechanism.
Description of the drawings:
fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is another perspective view of the present invention.
Fig. 3 is a schematic structural diagram of the chip positioning mechanism of the present invention.
Fig. 4 is a schematic structural diagram of a second chip carrying mechanism according to the present invention.
Fig. 5 is a schematic structural diagram of the chip assembling mechanism of the present invention.
Reference numerals:
a chip feeding part 100, a chip tray 110, a chip feeder 120, a first frame part 130, a tape guide mechanism 140, and a tape shearing mechanism 150.
A first chip handling mechanism 200, a transverse air cylinder 210, a longitudinal air cylinder 220, and a suction cup gripping member 230.
A chip positioning mechanism 300, an X-direction positioning jaw 310, a Y-direction positioning pull rod 320, a carriage assembly 330, and a chip presence sensor 340.
A second chip handling mechanism 400, a lateral servo mechanism 410, a longitudinal servo mechanism 420, and a second rack assembly 430.
A shell tray 500, a chip assembling mechanism 600, a chip sucker 610, a pushing cylinder 620, a mounting plate 630 and a chip pushing sheet 640.
Detailed Description
The present invention will be further described with reference to the following examples. It should be understood that the following examples are illustrative only and are not intended to limit the scope of the present invention.
Fig. 1 is a schematic structural diagram of the present invention. Fig. 2 is another perspective view of the present invention. Fig. 3 is a schematic structural diagram of the chip positioning mechanism of the present invention. Fig. 4 is a schematic structural diagram of a second chip carrying mechanism according to the present invention. Fig. 5 is a schematic structural diagram of the chip assembling mechanism of the present invention.
Example 1
As shown in fig. 1 to 5, a chip mounting mechanism includes: the chip feeding component 100, the first chip carrying mechanism 200, the chip positioning mechanism 300, the second chip carrying mechanism 400, the shell tray 500 and the chip assembling mechanism 600, wherein the chip feeding component 100 is connected with the first chip carrying mechanism 200, the first chip carrying mechanism 200 is connected with the chip positioning mechanism 300, the chip positioning mechanism 300 is connected with the second chip carrying mechanism 400, the second chip carrying mechanism 400 is connected with the shell tray 500, and the shell tray 500 is connected with the chip assembling mechanism 600.
The chip feed unit 100 includes: the chip feeding device comprises a chip feeding disc 110, a chip feeding machine 120, a first support part 130, a material belt guiding mechanism 140 and a material belt shearing mechanism 150, wherein a central hole of the chip feeding disc 110 is connected with the chip feeding machine 120 through a shaft, the chip feeding machine 120, the material belt guiding mechanism 140 and the material belt shearing mechanism 150 are fixed on the first support part 130, the chip feeding machine 120 is connected with the material belt guiding mechanism 140, and the material belt shearing mechanism 150 is arranged at the bottom of the material belt guiding mechanism 140.
The first chip handling mechanism 200 includes: the suction cup type robot comprises a transverse air cylinder 210, a longitudinal air cylinder 220 and a suction cup grabbing part 230, wherein the transverse air cylinder 210 is connected with the first frame part 130 through a fixing part, the longitudinal air cylinder 220 is connected with one side of the transverse air cylinder 210, and the suction cup grabbing part 230 is connected with the bottom of the longitudinal air cylinder 220.
The chip positioning mechanism 300 includes: the chip carrying device comprises an X-direction positioning clamping jaw 310, a Y-direction positioning pull rod 320, a support part 330 and a chip existence sensor 340, wherein the X-direction positioning clamping jaw 310 is fixed in the middle of the support part 330, the Y-direction positioning pull rod 320 is fixed on one side of the support part 330, the other side of the support part 330 is connected with a second chip carrying mechanism 400, and the chip existence sensor 340 is connected with the X-direction positioning clamping jaw 310.
The second chip handling mechanism 400 includes: the chip assembling mechanism comprises a transverse servo mechanism 410, a longitudinal servo mechanism 420 and a second support part 430, wherein the transverse servo mechanism 410 is connected with the top of the second support part 430, the transverse servo mechanism 410 is connected with the longitudinal servo mechanism 420, and the longitudinal servo mechanism 420 is connected with the chip assembling mechanism 600.
The utility model discloses the principle is, chip feeder 120 conveys the material to chip transport position, and first chip transport mechanism 200 is with material transport to chip positioning mechanism 300, and second chip transport mechanism 400 is in carrying the material to casing tray 500 again after the location is accomplished, and later chip equipment mechanism 600 pushes the chip in the casing for the chip is blocked to the draw-in groove, reaches the effect of fixed chip. The whole process is completely automated, and the working efficiency is greatly improved.
Specifically, the internal gear of the chip feeder 120 rotates to push the material belt forward to a position, so that a chip is placed under the sucker of the sucker grabbing component 230, the longitudinal cylinder 220 extends downward, the sucker of the sucker grabbing component 230 is attached to the chip, the chip is sucked and then is withdrawn through the longitudinal cylinder 220, the chip is grabbed from the material belt, and the transverse cylinder 210 extends out to convey the chip to the position above the chip positioning mechanism 300. The tape guide 140 feeds the tape to the tape shear 150, which shears the tape.
After the chip is placed in the suction cup grabbing part 230, the X-direction positioning clamping jaw 310 and the Y-direction positioning pull rod 320 act simultaneously to position the chip on the XY position, so as to ensure the position consistency in grabbing in the future. The chip suction cup 610 may then be turned over to hold the chip, and the X-direction positioning clamp 310 and the Y-direction positioning pull rod 320 may release the chip and the chip may be removed using the chip suction cup 610.
The lateral servo mechanism 410 and the longitudinal servo mechanism 420 move in a combined manner to take the chip from the chip positioning mechanism 300 with the chip assembling mechanism 600, then the chip is carried to the upper side of the shell tray 500 through the combined movement, and then the longitudinal servo mechanism 420 extends the chip into the sensor shell of the shell tray 500 to prepare for assembling the chip. The tray of the shell tray 500 is responsible for bearing the shell, the tray rotates to arrive at the station along with the turntable, the sensor in the tray checks the existence of the shell, the second chip carrying mechanism 400 grabs the chip, the chip is transported into the shell through the chip assembling mechanism 600, the chip is pushed by the pushing cylinder 620 after being in place, the chip pushing sheet 640 pushes the chip to be clamped into the shell, the pushing cylinder 620 withdraws, and the whole assembly is completed.
The above description has been made of the embodiments of the present invention, but the present invention is not limited thereto, and various changes may be made without departing from the spirit of the present invention.
Claims (6)
1. A chip mounting mechanism, comprising: chip feed part (100), first chip transport mechanism (200), chip positioning mechanism (300), second chip transport mechanism (400), casing tray (500) and chip equipment mechanism (600), chip feed part (100) is connected with first chip transport mechanism (200), first chip transport mechanism (200) is connected with chip positioning mechanism (300), chip positioning mechanism (300) is connected with second chip transport mechanism (400), second chip transport mechanism (400) is connected with casing tray (500), casing tray (500) is connected with chip equipment mechanism (600).
2. The chip mounting mechanism according to claim 1, wherein: the chip feed block (100) includes: chip charging tray (110), chip batcher (120), first support component (130), material area guiding mechanism (140) and material area shear mechanism (150), the centre bore and the chip batcher (120) hub connection of chip charging tray (110), chip batcher (120), material area guiding mechanism (140) and material area shear mechanism (150) are fixed in on first support component (130), chip batcher (120) are connected with material area guiding mechanism (140), material area guiding mechanism (140) bottom is equipped with material area shear mechanism (150).
3. The chip mounting mechanism according to claim 2, wherein: the first chip handling mechanism (200) comprises: the device comprises a transverse air cylinder (210), a longitudinal air cylinder (220) and a sucker grabbing part (230), wherein the transverse air cylinder (210) is connected with a first support part (130) through a fixing part, the longitudinal air cylinder (220) is connected with one side of the transverse air cylinder (210), and the sucker grabbing part (230) is connected with the bottom of the longitudinal air cylinder (220).
4. The chip mounting mechanism according to claim 1, wherein: the chip positioning mechanism (300) includes: x direction location clamping jaw (310), Y direction location pull rod (320), support part (330) and chip exist sensor (340), X direction location clamping jaw (310) are fixed in the middle of support part (330), Y direction location pull rod (320) are fixed in support part (330) one side, support part (330) opposite side is connected with second chip handling mechanism (400), chip exists sensor (340) and is connected with X direction location clamping jaw (310).
5. The chip mounting mechanism according to claim 1, wherein: the second chip handling mechanism (400) includes: the chip assembling mechanism comprises a transverse servo mechanism (410), a longitudinal servo mechanism (420) and a second support component (430), wherein the transverse servo mechanism (410) is connected with the top of the second support component (430), the transverse servo mechanism (410) is connected with the longitudinal servo mechanism (420), and the longitudinal servo mechanism (420) is connected with a chip assembling mechanism (600).
6. The chip mounting mechanism according to claim 5, wherein: the chip assembly mechanism (600) includes: chip sucking disc (610), push away dress cylinder (620), mounting panel (630) and chip push away dress piece (640), chip sucking disc (610) are connected with chip push away dress piece (640), chip push away dress piece (640) and push away dress cylinder (620) and be connected, push away dress cylinder (620) and be connected with mounting panel (630), mounting panel (630) are connected with vertical servo (420).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022762240.9U CN213519882U (en) | 2020-11-25 | 2020-11-25 | Chip assembling mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022762240.9U CN213519882U (en) | 2020-11-25 | 2020-11-25 | Chip assembling mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213519882U true CN213519882U (en) | 2021-06-22 |
Family
ID=76425536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022762240.9U Active CN213519882U (en) | 2020-11-25 | 2020-11-25 | Chip assembling mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213519882U (en) |
-
2020
- 2020-11-25 CN CN202022762240.9U patent/CN213519882U/en active Active
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