CN213513696U

CN213513696U - LED multilayer line light source

Info

Publication number: CN213513696U
Application number: CN202022371792.7U
Authority: CN
Inventors: 罗建华; 张小斌
Original assignee: Toyo Industry Guangdong Co ltd
Current assignee: Toyo Industry Guangdong Co ltd
Priority date: 2020-10-22
Filing date: 2020-10-22
Publication date: 2021-06-22
Anticipated expiration: 2030-10-22

Abstract

The utility model discloses a LED multilayer line light source, which comprises a heat conducting substrate and a bonding pad, wherein a circuit board is arranged at the top of the heat conducting substrate; double-sided circuit board is installed at the circuit board top, the guide way has been seted up to double-sided circuit board one side, the spread groove has been seted up to the guide way side, is close to the guide way LED wafer is installed at the circuit board top, spread groove internal connection has the conductive metal filling block, conductive metal filling block one side is connected with blocks the piece, guide way internal connection has the box dam. This LED multilayer circuit light source is provided with traditional circuit board because the panel heat conductivity is high, and the bonding wire is more difficult when leading to lamps and lanterns installation, and the weld time is too long easily, easily leads to light source welding quality hidden danger, and two-sided circuit board adopts the thermoelectric separation overall arrangement, and bonding wire operating position adopts the resin material for the colloid, and the thermal resistance is high, and the flatiron temperature is difficult for scattering and disappearing, and the bonding wire is fast, and welding quality is high, does not have bonding quality hidden danger.

Description

LED multilayer line light source

Technical Field

The utility model relates to a LED lamp technical field specifically is a LED multilayer circuit light source.

Background

With the rise of intelligent lighting applications, the demand of variable color lamps is increasingly wide. The light source of the color-changeable lamp realizes the color-changing mode by integrating various LEDs inside the light source for packaging and molding, and realizes the change of the light output color of the light source by driving the LED wafers with different colors to work. Because the LED wafer has a small light-emitting angle and high light-emitting intensity, the LED light sources with different light colors are not easy to realize uniform light distribution, and the experience is poorer compared with the traditional monochromatic light source lighting effect. Practice shows that the compactness of the LED wafer arrangement and the symmetry of the LED wafer arrangement with different light colors are the precondition for uniform light emission. Because multicolor LEDs need to be controlled independently, circuits are more and more complex, wire jumping is realized in a traditional mode through a gold wire welding mode, the physical strength of a gold wire is low, and the reliability is poor; the need to reserve bond pads does not further increase the density.

The LED multilayer circuit light source on the market at present has many defects, the welding time is longer, the assembly is inconvenient, and the box dam is easy to fall off, so that the technology capable of improving the LED multilayer circuit light source structure is urgently needed on the market to perfect the equipment.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED multilayer line light source to solve the LED multilayer line light source on the existing market that above-mentioned background art provided and have many defects, welding time is longer, inconvenient equipment, the problem that the box dam drops easily.

In order to achieve the above object, the utility model provides a following technical scheme: an LED multilayer circuit light source comprises a heat-conducting substrate and a bonding pad, wherein a circuit board is mounted at the top of the heat-conducting substrate;

double-sided circuit board is installed at the circuit board top, the guide way has been seted up to double-sided circuit board one side, the spread groove has been seted up to the guide way side, is close to the guide way the LED wafer is installed at the circuit board top, spread groove internal connection has the conductive metal filling block, conductive metal filling block one side is connected with blocks the piece, guide way internal connection has the box dam, is close to the LED wafer the box dam internal connection has the colloid, the pad is installed at double-sided circuit board top.

Preferably, the guide groove and the box dam are cylindrical, and the diameter of the guide groove is the same as the diameter of the box dam.

Preferably, the connecting grooves, the conductive metal filling blocks and the blocking blocks are provided with six groups, and the six groups of connecting grooves, the conductive metal filling blocks and the blocking blocks are distributed on one side of the guide grooves in an array mode.

Preferably, the colloid is cylindrical and is made of resin.

Compared with the prior art, the beneficial effects of the utility model are that: this LED multilayer circuit light source:

1. the traditional circuit board is provided with the defects that the welding wire is difficult to weld when the lamp is installed due to high heat conductivity of the board, the welding time is easy to overlook, and the hidden danger of the welding quality of a light source is easy to cause;

drawings

Fig. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic side view of the cross-sectional structure of the present invention;

fig. 3 is an enlarged schematic view of part a of the present invention.

In the figure: 1. a heat conductive substrate; 2. a circuit board; 3. an LED wafer; 4. a double-sided circuit board; 5. a guide groove; 6. connecting grooves; 7. a conductive metal filling block; 8. a blocking block; 9. a box dam; 10. a pad; 11. and (3) colloid.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an LED multilayer circuit light source comprises a heat-conducting substrate 1, a circuit board 2, an LED wafer 3, a double-sided circuit board 4, a guide groove 5, a connecting groove 6, a conductive metal filling block 7, a blocking block 8, a dam 9, a bonding pad 10 and a colloid 11, wherein the circuit board 2 is mounted at the top of the heat-conducting substrate 1;

the double-sided circuit board 4 is installed at the top of the circuit board 2, a guide groove 5 is formed in one side of the double-sided circuit board 4, the guide groove 5 and the box dam 9 are cylindrical, the diameter of the guide groove 5 is the same as the diameter of the box dam 9, the box dam 9 can be in butt joint with the guide groove 5 when being pulled, the box dam 9 can slide with the guide groove 5 when being pressed, a connecting groove 6 is formed in the side face of the guide groove 5, six groups of the connecting groove 6, a conductive metal filling block 7 and a blocking block 8 are arranged, the six groups of the connecting groove 6, the conductive metal filling block 7 and the blocking block 8 are distributed on one side of the guide groove 5 in an array mode, the box dam 9 can extrude the blocking block 8 when the box dam 9 is connected with the guide groove 5, the blocking block 8 can be deformed by self rubber materials when being extruded, and the friction force between the blocking block 8 and the box, be close to guide way 5 LED wafer 3 is installed at 2 tops of circuit board, 6 internal connection in spread groove has conductive metal filling block 7, 7 one side in conductive metal filling block are connected with and block piece 8, 5 internal connection in guide way have box dam 9, are close to LED wafer 3 box dam 9 internal connection has colloid 11, colloid 11 is cylindric, and colloid 11 is the resin material, and double-sided circuit board 4 adopts the thermoelectric separation overall arrangement, and bonding wire operating position adopts the resin material for colloid 11, and the thermal resistance is high, and the flatiron temperature is difficult for scattering and disappearing, and the bonding wire is fast, and welding quality is high, no bonding wire quality hidden danger, pad 10 is installed at double-sided circuit board 4 tops.

The working principle is as follows: when using this LED multilayer circuit light source, at first need simply know LED multilayer circuit light source, arrange multiunit flip-chip welding LED wafer 3 during the use on heat conduction base plate 1 and circuit board 2, every group LED chip is connected with circuit board 2 realization electricity through heat conduction base plate 1 to reserve the BIN foot that the upper and lower circuit becomes to lead to the electricity, because LED wafer 3 cross arrangement, density is also high, the circuit can only realize that LED wafer 3 electricity is connected this moment, can't accomplish the cluster and control output. The jumper wire and series-parallel output of the LED wafer 3 are realized by adhering the circuit board 2 and the double-sided circuit board 4, the double-sided circuit board 4 and the heat conducting substrate 1 are electrically connected through the conductive metal filling block 7 in the connecting groove 6, and the content which is not described in detail in the description belongs to the prior art which is well known to a person skilled in the art.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. An LED multilayer line light source, including heat conduction base plate (1) and pad (10), its characterized in that: the top of the heat conducting substrate (1) is provided with a circuit board (2);

double-sided circuit board (4) are installed at circuit board (2) top, guide way (5) have been seted up to double-sided circuit board (4) one side, spread groove (6) have been seted up to guide way (5) side, are close to guide way (5) LED wafer (3) are installed at circuit board (2) top, spread groove (6) internal connection has conductive metal filling block (7), conductive metal filling block (7) one side is connected with and blocks piece (8), guide way (5) internal connection has dam (9), is close to LED wafer (3) dam (9) internal connection has colloid (11), install at double-sided circuit board (4) top pad (10).

2. An LED multilayer line light source as claimed in claim 1, wherein: the guide groove (5) and the box dam (9) are cylindrical, and the diameter of the guide groove (5) is the same as that of the box dam (9).

3. An LED multilayer line light source as claimed in claim 1, wherein: the connecting groove (6), the conductive metal filling block (7) and the blocking block (8) are provided with six groups, and the six groups of connecting grooves (6), the conductive metal filling block (7) and the blocking block (8) are distributed on one side of the guide groove (5) in an array mode.

4. An LED multilayer line light source as claimed in claim 1, wherein: the colloid (11) is cylindrical, and the colloid (11) is made of resin.