CN213483716U

CN213483716U - Semiconductor wafer coating film instrument

Info

Publication number: CN213483716U
Application number: CN202022388421.XU
Authority: CN
Inventors: 程淑雅
Original assignee: Zhijiang Jicheng Electronics Co ltd
Current assignee: Zhijiang Jicheng Electronics Co ltd
Priority date: 2020-10-24
Filing date: 2020-10-24
Publication date: 2021-06-18
Anticipated expiration: 2030-10-24

Abstract

The utility model provides a semiconductor wafer coating film appearance relates to semiconductor wafer technical field, including centre gripping case, bracing piece and roof, the fixed center of centre gripping roof face is inlayed and is had the case of breathing in, and the suction hole has been seted up to the top surface of case of breathing in, the first electric putter of central fixedly connected with of roof top surface, first electric putter's output fixedly connected with connecting plate, the equal fixedly connected with piston pipe in both ends of connecting plate top surface, the equal fixedly connected with second electric putter of top surface of two piston pipes, the equal fixedly connected with piston board of output of two second electric putter. This semiconductor wafer coating film appearance through setting up piston tube, second electric putter, piston plate, gas-supply pipe, gasbag, breathing pipe, pressfitting piece, case and the suction hole of breathing in, has effectually promoted the laminating effect between dry film and the wafer to promote the stability of wafer pressfitting in-process, and effectively improved the pad pasting quality of wafer.

Description

Semiconductor wafer coating film instrument

Technical Field

The utility model relates to a semiconductor wafer technical field specifically is a semiconductor wafer coating film appearance.

Background

The wafer refers to a substrate (also called a substrate) for manufacturing a semiconductor transistor or an integrated circuit, and is called a wafer because it is a crystalline material having a circular shape, and the substrate material is silicon, germanium, GaAs, InP, GaN, or the like, and is a silicon wafer because silicon is most commonly used, if the crystalline material is not particularly specified.

At present, in the production process of a semiconductor wafer, finished products need to be subjected to film pasting treatment, but the pressing effect of an existing film pasting mechanism on a dry film is poor, the problem that local parts are poorly attached to the dry film exists due to uneven stress at all parts of the wafer, and the wafer is prone to deviation in the pressing process, so that the film pasting quality is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a semiconductor wafer coating film appearance has solved the problem of proposing among the background art.

Technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a semiconductor wafer coating apparatus comprises a clamping box, bracing piece and roof, the fixed case of breathing in of inlaying in center of centre gripping roof face, the suction hole has been seted up to the top surface of case of breathing in, the first electric putter of center fixedly connected with of roof top surface, first electric putter's output fixedly connected with connecting plate, the equal fixedly connected with piston tube in both ends of connecting plate top surface, the equal fixedly connected with second electric putter of top surface of two piston tubes, the equal fixedly connected with piston plate of output of two second electric putter, the equal fixed intercommunication in top of two piston tube surfaces has the breathing pipe, the one end that the piston tube was kept away from to two breathing pipes communicates with the external surface mounting of case of breathing in respectively, the equal fixed intercommunication in bottom of two piston tube surfaces has the gas-supply pipe, the center fixedly connected with pressfitting piece of connecting plate bottom surface, the bottom surface fixedly connected with.

The improved structure is characterized in that a third electric push rod is fixedly connected to the front face of the clamping box, a movable plate is fixedly connected to the output end of the third electric push rod, two chutes are formed in the movable plate, slide rods are connected to the inner portions of the two chutes in a sliding mode, the two slide rods can slide in the inner portions of the chutes by arranging the chutes, and the two slide rods can be far away from each other or approach each other.

The improvement is that, two the equal fixedly connected with gangbar of top surface of slide bar, the equal fixedly connected with grip block of top surface of two gangbars, the equal fixedly connected with limiting plate in bottom surface of two slide bars through setting up the limiting plate, carries on spacingly with the limiting plate to the slide bar, promotes the stability that the slide bar removed in the chute.

The further improvement does, the equal fixedly connected with gag lever post in both ends of movable plate bottom surface, the inner diapire of centre gripping case set up with the spacing groove of gag lever post looks adaptation, through setting up gag lever post and spacing groove, drive the inside slip of gag lever post at the spacing groove with the chute, promote the stability that the chute removed.

The improved structure is characterized in that two symmetrical guide holes are formed in the connecting plate, the connecting plate is connected with the supporting rod in a sliding mode through the guide holes, the connecting plate slides on the supporting rod through the guide holes, and the moving stability of the connecting plate is improved.

The wafer clamping device is further improved in that a moving groove is formed in the top surface of the clamping box, the two linkage rods are connected with the moving groove in a sliding mode, and the linkage rods drive the clamping blocks to move through the linkage rods, so that wafers can be fixedly clamped.

The further improvement does, two the piston board respectively with two piston pipe sliding connection, the output of two second electric putter and the department of running through of two piston pipe top surfaces all are equipped with the sealing ring, through setting up the sealing ring, seal the department of running through between the output of second electric putter and the top surface of piston pipe, promote the leakproofness of piston pipe.

1. This semiconductor wafer coating film appearance, through setting up the piston tube, second electric putter, the piston board, the gas-supply pipe, the gasbag, the breathing pipe, the pressfitting piece, case and the suction hole of breathing in, it slides at the inside of piston tube to drive the piston board with second electric putter's output, and make the inside of the air extrusion of piston board below to the gasbag in the piston tube, and make the gasbag carry out pressfitting again between dry film and the wafer, make the piston board bleed through the breathing pipe in the suction box simultaneously, carry out convulsions through the bottom surface of suction hole pair wafer, thereby fix the wafer, the effectual laminating effect that has promoted between dry film and the wafer, and the stability of wafer pressfitting in-process has been promoted, the pad pasting quality of wafer has been improved.

2. This semiconductor wafer coating film appearance, through setting up the chute, can slide two slide bars in the inside of chute, realize that two slide bars keep away from the motion each other or be close to the motion each other, through setting up the limiting plate, carry on the limiting plate to the slide bar spacingly, promote the stability that the slide bar removed in the chute, through setting up gag lever post and spacing groove, drive the gag lever post with the chute and slide in the inside of spacing groove, promote the stability that the chute removed, through setting up the guiding hole, make the connecting plate slide on the bracing piece, promote the stability that the connecting plate removed, through setting up the gangbar, drive the grip block with the gangbar and remove, thereby can fix the centre gripping to the wafer, through setting up the sealing ring, seal up the department of running through between the output of second electric putter and the top surface of piston tube, promote.

Drawings

FIG. 1 is a cross-sectional view of the clamping box of the present invention;

FIG. 2 is a front view of the clamping box of the present invention;

fig. 3 is a perspective view of the moving plate of the present invention;

fig. 4 is a perspective view of the clamping block of the present invention.

In the figure, the reference number is 1, a clamping box; 2. a support bar; 3. a top plate; 4. a first electric push rod; 5. a connecting plate; 6. a piston tube; 7. a second electric push rod; 8. a piston plate; 9. a gas delivery pipe; 10. an air bag; 11. an air intake duct; 12. a third electric push rod; 13. moving the plate; 14. a chute; 15. a limiting rod; 16. a limiting groove; 17. a slide bar; 18. a limiting plate; 19. a linkage rod; 20. a clamping block; 21. an air suction box; 22. a suction hole; 23. and (5) pressing the blocks.

Detailed Description

As shown in FIGS. 1-4, an embodiment of the present invention provides a semiconductor wafer coating apparatus, which comprises a clamping box 1, a supporting rod 2 and a top plate 3, wherein a third electric push rod 12 is fixedly connected to the front surface of the clamping box 1, a moving plate 13 is fixedly connected to the output end of the third electric push rod 12, two chutes 14 are formed in the moving plate 13, slide rods 17 are slidably connected to the insides of the two chutes 14, the two slide rods 17 can slide in the chutes 14 by arranging the chutes 14, so as to realize the mutual moving away or approaching movement of the two slide rods 17, linkage rods 19 are fixedly connected to the top surfaces of the two slide rods 17, clamping blocks 20 are fixedly connected to the top surfaces of the two linkage rods 19, moving grooves are formed in the top surface of the clamping box 1, the two linkage rods 19 are slidably connected to the moving grooves, and by arranging the linkage rods 19, the linkage rods 19 drive the clamping blocks, thereby can fix the centre gripping to the wafer, the equal fixedly connected with limiting plate 18 in bottom surface of two slide bars 17, through setting up limiting plate 18, it is spacing to slide bar 17 with limiting plate 18, promote the stability that slide bar 17 removed in chute 14, the equal fixedly connected with gag lever post 15 in both ends of movable plate 13 bottom surface, the spacing groove 16 with gag lever post 15 looks adaptation is seted up to the inner diapire of centre gripping case 1, through setting up gag lever post 15 and spacing groove 16, drive gag lever post 15 with chute 14 and slide in the inside of spacing groove 16, promote the stability that chute 14 removed.

The center of the top surface of the clamping box 1 is fixedly embedded with an air suction box 21, the top surface of the air suction box 21 is provided with an air suction hole 22, the center of the top surface of the top plate 3 is fixedly connected with a first electric push rod 4, the output end of the first electric push rod 4 is fixedly connected with a connecting plate 5, two symmetrical guide holes are arranged inside the connecting plate 5, the connecting plate 5 is in sliding connection with the support rod 2 through the guide holes, the connecting plate 5 slides on the support rod 2 by arranging the guide holes, the moving stability of the connecting plate 5 is improved, both ends of the top surface of the connecting plate 5 are fixedly connected with piston tubes 6, the top surfaces of the two piston tubes 6 are fixedly connected with second electric push rods 7, the first electric push rod 4 adopts an XTL100 type electric push rod, the second electric push rod 7 and the third electric push rod 12 adopt an XTL25 type electric push rod, the output ends of the two second electric, two piston plates 8 respectively with two piston tubes 6 sliding connection, the output of two second electric putter 7 all is equipped with the sealing ring with the department of running through of two piston tubes 6 top surfaces, through setting up the sealing ring, seal the department of running through between the output of second electric putter 7 and the top surface of piston tube 6, promote the leakproofness of piston tube 6, the top of two piston tubes 6 surfaces is all fixed the intercommunication has breathing pipe 11, the one end that piston tube 6 was kept away from to two breathing pipes 11 respectively with the fixed surface intercommunication of breathing box 21, the bottom of two piston tubes 6 surfaces is all fixed the intercommunication has gas-supply pipe 9, the center fixedly connected with pressfitting piece 23 of connecting plate 5 bottom surfaces, the bottom surface fixedly connected with gasbag 10 of pressfitting piece 23.

The utility model discloses the theory of operation as follows:

electrically connecting a first electric push rod 4, a second electric push rod 7 and a third electric push rod 12 with an external power supply, placing a wafer on a clamping box 1, starting the third electric push rod 12, driving a movable plate 13 to move by an output end of the third electric push rod 12, enabling the movable plate 13 to drive a limiting rod 15 to slide in a limiting groove 16, enabling two slide bars 17 to slide in two inclined grooves 14, enabling two linkage bars 19 to approach each other, fixing the wafer in a crack between two clamping blocks 20, limiting the slide bars 17 in the inclined grooves 14 through a limiting plate 18, placing a dry film on the wafer, starting the first electric push rod 4, enabling an output end of the first electric push rod to extend out, enabling a connecting plate 5 to slide on a supporting rod 2, enabling a pressing block 23 to be pressed with the wafer through a dry film, starting the second electric push rod 7, enabling an output end of the second electric push rod to drive a piston plate 8 to slide downwards in a piston tube 6, and make the inside of 8 below air extrusion to gasbag 10 of piston plate in the piston pipe 6, and make gasbag 10 carry out pressfitting again between dry film and the wafer, make piston plate 8 bleed in the suction box 21 through breathing pipe 11 simultaneously, carry out convulsions to the bottom surface of wafer through suction hole 22, thereby fix the wafer, the effectual laminating effect that has promoted between dry film and the wafer, and promoted the stability of wafer pressfitting in-process, improved the pad pasting quality of wafer.

Claims

1. The utility model provides a semiconductor wafer coating film appearance, includes centre gripping case (1), bracing piece (2) and roof (3), its characterized in that: the center of the top surface of the clamping box (1) is fixedly embedded with an air suction box (21), the top surface of the air suction box (21) is provided with an air suction hole (22), the center of the top surface of the top plate (3) is fixedly connected with a first electric push rod (4), the output end of the first electric push rod (4) is fixedly connected with a connecting plate (5), two ends of the top surface of the connecting plate (5) are both fixedly connected with piston tubes (6), the top surfaces of the two piston tubes (6) are both fixedly connected with second electric push rods (7), the output ends of the two second electric push rods (7) are both fixedly connected with piston plates (8), the tops of the outer surfaces of the two piston tubes (6) are both fixedly communicated with air suction pipes (11), one ends of the two air suction pipes (11) far away from the piston tubes (6) are respectively fixedly communicated with the outer surface of the air suction box (21), and the, the center of the bottom surface of the connecting plate (5) is fixedly connected with a pressing block (23), and the bottom surface of the pressing block (23) is fixedly connected with an air bag (10).

2. The semiconductor wafer coating apparatus according to claim 1, wherein: the front face of the clamping box (1) is fixedly connected with a third electric push rod (12), the output end of the third electric push rod (12) is fixedly connected with a movable plate (13), two chutes (14) are formed in the movable plate (13), and sliding rods (17) are connected to the inner portions of the two chutes (14) in a sliding mode.

3. The semiconductor wafer coating apparatus according to claim 2, wherein: two the equal fixedly connected with gangbar (19) of top surface of slide bar (17), the equal fixedly connected with grip block (20) of top surface of two gangbar (19), the equal fixedly connected with limiting plate (18) of bottom surface of two slide bars (17).

4. The semiconductor wafer coating apparatus according to claim 2, wherein: both ends of the bottom surface of the moving plate (13) are fixedly connected with limiting rods (15), and the inner bottom wall of the clamping box (1) is provided with limiting grooves (16) matched with the limiting rods (15).

5. The semiconductor wafer coating apparatus according to claim 1, wherein: two symmetrical guide holes are formed in the connecting plate (5), and the connecting plate (5) is connected with the supporting rod (2) in a sliding mode through the guide holes.

6. The semiconductor wafer coating apparatus according to claim 1, wherein: the top surface of the clamping box (1) is provided with a moving groove, and the two linkage rods (19) are both connected with the moving groove in a sliding manner.

7. The semiconductor wafer coating apparatus according to claim 1, wherein: the two piston plates (8) are respectively connected with the two piston pipes (6) in a sliding mode, and sealing rings are arranged at the positions, penetrating through the top surfaces of the two piston pipes (6), of the output ends of the two second electric push rods (7).