CN210489589U - Automatic material loading wafer pad pasting device - Google Patents
Automatic material loading wafer pad pasting device Download PDFInfo
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- CN210489589U CN210489589U CN201921083839.0U CN201921083839U CN210489589U CN 210489589 U CN210489589 U CN 210489589U CN 201921083839 U CN201921083839 U CN 201921083839U CN 210489589 U CN210489589 U CN 210489589U
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- 239000000463 material Substances 0.000 title claims abstract description 10
- 230000007246 mechanism Effects 0.000 claims abstract description 37
- 239000000428 dust Substances 0.000 claims abstract description 17
- 210000001503 joint Anatomy 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 230000001174 ascending effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 89
- 230000005540 biological transmission Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Abstract
The utility model discloses an automatic material loading wafer pad pasting device, including the sticking film machine main part, the feed inlet department of sticking film machine main part is equipped with wafer automatic feeding mechanism, wafer automatic feeding mechanism includes the support of carrying with the feed inlet butt joint of sticking film machine main part, the inside both sides of support are equipped with the drive pulley area, be equipped with the bottom plate main part that a plurality of equidistance set up on the drive pulley area, the bottom plate main part comprises a plurality of banding bottom plates through connecting vice the connection, the top of bottom plate main part is equipped with the wafer fixed plate, the top of wafer fixed plate is equipped with the positioning groove who agrees with mutually with the wafer, be equipped with a pair of dust removal roller on the support, be equipped with the pile layer on the axial plane of every dust removal roller. The utility model discloses improve work efficiency effectively, increased the yields.
Description
Technical Field
The utility model relates to a wafer processing technology field specifically is an automatic material loading wafer pad pasting device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions. In the process of wafer production, the wafer after production needs to be protected by film pasting, and with the wide application of automatic assembly production in the electronic industry, in the production and manufacturing process, manual feeding is utilized, so that the manual efficiency is low, and the defective rate is high. Therefore, an automatic loading wafer film pasting device is provided.
Disclosure of Invention
For solving the defect that prior art exists, the utility model provides an automatic material loading wafer pad pasting device.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model relates to an automatic material loading wafer pad pasting device, including the sticking film machine main part, the feed inlet department of sticking film machine main part is equipped with wafer automatic feeding mechanism, wafer automatic feeding mechanism include with the delivery support of the feed inlet butt joint of sticking film machine main part, the inside both sides of delivery support are equipped with the drive pulley area, be equipped with the bottom plate main part that a plurality of equidistance set up on the drive pulley area, the bottom plate main part comprises a plurality of banding bottom plates through connecting vice the connection, the top of bottom plate main part is equipped with the wafer fixed plate, the top of wafer fixed plate is equipped with the positioning groove who agrees with mutually with the wafer, be equipped with a pair of dust removal roller on the delivery support, be equipped with the pile layer on the axial plane of every dust.
As an optimal technical scheme of the utility model, be equipped with positioning groove in the bottom plate main part, wafer fixed plate top is equipped with the positioning lug with positioning groove matched with.
As an optimal technical scheme of the utility model, the feed end of delivery support is equipped with wafer feed mechanism, wafer feed mechanism is including setting up the chassis on the delivery support lateral wall, the top of chassis is equipped with the crane, be equipped with first telescopic cylinder between crane and the chassis, it gets the mechanism to be equipped with on the crane and correspond the wafer clamp with the wafer fixed plate, the wafer clamp is got the mechanism and is included the bedplate that sets up on the crane, the bedplate top slides and is provided with the sliding plate, be equipped with first clamping jaw on the bedplate, be equipped with on the sliding plate with first clamping jaw complex second clamping jaw, be equipped with the telescopic cylinder of second between bedplate and the sliding plate.
As an optimal technical scheme of the utility model, the top of bedplate is equipped with ascending reference column, be equipped with on the sliding plate with reference column complex spout, the top and the reference column of the flexible cylinder of second are connected, the afterbody and the sliding plate of the flexible cylinder of second are connected.
As an optimized technical scheme of the utility model, be equipped with the buffer layer in the positioning groove, the buffer layer is pile layer or rubber layer.
The utility model has the advantages that:
1. the utility model effectively improves the working efficiency by arranging the automatic wafer feeding mechanism at the feed inlet of the film sticking machine main body and sending the wafer into the film sticking machine main body for film sticking by using the automatic wafer feeding mechanism, wherein the automatic wafer feeding mechanism comprises a conveying bracket butted with the feed inlet of the film sticking machine main body, the two inner sides of the conveying bracket are provided with the transmission wheel belts, a plurality of bottom plate main bodies arranged at equal intervals are arranged on the transmission wheel belts, the bottom plate main body is formed by connecting a plurality of strip-shaped bottom plates through a connecting pair, the top of the bottom plate main body is provided with the wafer fixing plate, the top of the wafer fixing plate is provided with the positioning groove matched with the wafer, the wafer fixing plate is sent into the film sticking machine main body by using the transmission wheel belts to stick the film on the wafer fixing plate, wherein the bottom plate main body does periodic motion along the transmission wheel belts, and a pair of dust removing rollers is arranged on the conveying support, and a plush layer is arranged on the axial surface of each dust removing roller to clean and remove dust on the surface of the wafer.
2. The utility model provides a be equipped with the recess in the bottom plate main part, wafer fixed plate top be equipped with recess matched with location lug, be convenient for dismantle and install wafer fixed plate.
3. The utility model provides a wafer feed mechanism comes to dock the wafer fixed plate of placing the wafer with the bottom plate main part through the cooperation of first clamping jaw and second clamping jaw, carries out the feed, stretches out and draws back through first telescopic cylinder and comes to carry out lift adjustment to the crane, and then carries out lift adjustment to first clamping jaw and second clamping jaw, and is convenient for carry out the feed.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of an automatic loading wafer film pasting device according to the present invention;
fig. 2 is a schematic structural view of an automatic wafer feeding mechanism of an automatic wafer film laminating device according to the present invention;
fig. 3 is a schematic view of a part of the structure of an automatic wafer feeding mechanism of an automatic wafer film laminating device according to the present invention;
fig. 4 is a schematic structural diagram of a bottom plate main body of an automatic loading wafer film pasting device according to the present invention;
fig. 5 is a schematic structural diagram of a wafer fixing plate of the automatic loading wafer film pasting device of the present invention.
FIG. 6 is a schematic structural view of a first telescopic cylinder of an automatic feeding wafer film pasting device
In the figure: 1. a film sticking machine main body; 2. a wafer automatic feeding mechanism; 3. a delivery stent; 4. a drive pulley belt; 5. a base plate main body; 6. a wafer fixing plate; 7. a dust removal roller; 8. a groove; 9. positioning the bump; 10. a wafer feeding mechanism; 11. a chassis; 12. a lifting frame; 13. a first telescopic cylinder; 14. a wafer clamping mechanism; 15. a seat plate; 16. a sliding plate; 17. a first jaw; 18. a second jaw; 19. a second telescopic cylinder; 20. a positioning column; 21 chute.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Example (b): as shown in fig. 1, fig. 2, fig. 3, fig. 4, fig. 5 and fig. 6, the utility model relates to an automatic material loading wafer pad pasting device, including sticking film machine main part 1, the feed inlet department of sticking film machine main part 1 is equipped with wafer automatic feeding mechanism 2, wafer automatic feeding mechanism 2 includes the transport support 3 with the feed inlet butt joint of sticking film machine main part 1, the inside both sides of transport support 3 are equipped with driving wheel area 4, be equipped with the bottom plate main part 5 that a plurality of equidistances set up on driving wheel area 4, bottom plate main part 5 comprises a plurality of banding bottom plates through connecting vice connection, the top of bottom plate main part 5 is equipped with wafer fixed plate 6, the top of wafer fixed plate 6 is equipped with the positioning groove who agrees with mutually with the wafer, be equipped with a pair of dust removal roller 7 on the transport support 3, be equipped with the pile layer on every dust removal roller 7's the.
The utility model discloses a feed inlet department at laminator main part 1 is equipped with wafer automatic feeding mechanism 2, utilizes wafer automatic feeding mechanism 2 to send the wafer into laminator main part 1 and carry out the pad pasting, has improved work efficiency effectively, wherein wafer automatic feeding mechanism 2 includes the transport support 3 with the feed inlet butt joint of laminator main part 1, the inside both sides of transport support 3 are equipped with driving pulley 4, be equipped with the bottom plate main part 5 that a plurality of equidistance set up on driving pulley 4, bottom plate main part 5 comprises a plurality of strip bottom plates through connecting pair connection, the top of bottom plate main part 5 is equipped with wafer fixed plate 6, the top of wafer fixed plate 6 is equipped with the positioning groove that agrees with the wafer, utilizes driving pulley 4 to send wafer fixed plate 6 into the laminator main part, comes to carry out the pad pasting to the wafer placed on wafer fixed plate 6, wherein, the bottom plate main body 5 does periodic motion along the transmission wheel belt 4, better carries out the material loading, be equipped with a pair of dust removal roller 7 on the transport support, be equipped with the pile layer on the axial plane of every dust removal roller 7, clean the dust removal to the surface of wafer.
The bottom plate main body 5 is provided with a groove 8, and the top of the wafer fixing plate 6 is provided with a positioning bump 9 matched with the groove 8, so that the wafer fixing plate 6 can be conveniently detached and installed.
Wherein, the feed end of the conveying bracket 3 is provided with a wafer feeding mechanism 10, the wafer feeding mechanism 10 comprises a bottom frame 11 arranged on the side wall of the conveying bracket 3, a lifting frame 12 is arranged above the bottom frame 11, a first telescopic cylinder 13 is arranged between the lifting frame 12 and the bottom frame 11, a wafer clamping mechanism 14 corresponding to the wafer fixing plate 6 is arranged on the lifting frame 12, the wafer clamping mechanism 14 comprises a seat plate 15 arranged on the lifting frame 12, a sliding plate 16 is arranged above the seat plate 15 in a sliding manner, a first clamping jaw 17 is arranged on the seat plate 15, a second clamping jaw 18 matched with the first clamping jaw 17 is arranged on the sliding plate 16, a second telescopic cylinder 19 is arranged between the seat plate 15 and the sliding plate 16, the wafer fixing plate 6 provided with the wafer is butted with the bottom plate main body 5 through the matching of the first clamping jaw 17 and the second clamping jaw 18, so as to, the lifting frame 12 is adjusted in a lifting way through the expansion of the first telescopic cylinder 13, and then the first clamping jaw 17 and the second clamping jaw 18 are adjusted in a lifting way, so that feeding is facilitated.
The top of the seat plate 15 is provided with an upward positioning column 20, the sliding plate 16 is provided with a sliding chute 21 matched with the positioning column 20, the top of the second telescopic cylinder 19 is connected with the positioning column 20, and the tail of the second telescopic cylinder 19 is connected with the sliding plate 16.
The positioning groove is internally provided with a buffer layer which is a plush layer or a rubber layer, so that the wafer is protected.
When the automatic film sticking machine works, the automatic wafer feeding mechanism 2 is arranged at the feed inlet of the film sticking machine main body 1, wafers are fed into the film sticking machine main body 1 by the automatic wafer feeding mechanism 2 to be stuck with films, so that the working efficiency is effectively improved, wherein the automatic wafer feeding mechanism 2 comprises a conveying support 3 butted with the feed inlet of the film sticking machine main body 1, transmission wheel belts 4 are arranged on two inner sides of the conveying support 3, a plurality of bottom plate main bodies 5 arranged at equal intervals are arranged on the transmission wheel belts 4, each bottom plate main body 5 is formed by connecting a plurality of strip-shaped bottom plates through connecting pairs, a wafer fixing plate 6 is arranged at the top of each bottom plate main body 5, a positioning groove matched with the wafers is arranged at the top of each wafer fixing plate 6, the wafer fixing plates 6 are fed into the film sticking machine main body by the transmission wheel belts 4 to stick with the wafers placed on the wafer fixing plates 6, wherein, the bottom plate main body 5 does periodic motion along the transmission wheel belt 4, better carries out the material loading, be equipped with a pair of dust removal roller 7 on the transport support, be equipped with the pile layer on the axial plane of every dust removal roller 7, clean the dust removal to the surface of wafer.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. The utility model provides an automatic material loading wafer pad pasting device, includes sticking film machine main part (1), its characterized in that: the utility model discloses a wafer automatic feeding mechanism, including wafer automatic feeding mechanism (2), the feed inlet department of sticking film machine main part (1) is equipped with wafer automatic feeding mechanism (2), wafer automatic feeding mechanism (2) include with conveying support (3) of the feed inlet butt joint of sticking film machine main part (1), the inside both sides of conveying support (3) are equipped with driving wheel area (4), be equipped with bottom plate main part (5) that a plurality of equidistance set up on driving wheel area (4), bottom plate main part (5) are connected through connecting the pair by a plurality of banding bottom plates and are constituted, the top of bottom plate main part (5) is equipped with wafer fixed plate (6), the top of wafer fixed plate (6) is equipped with the positioning groove who agrees with mutually with the wafer, be equipped with a pair of dust removal roller (7) on conveying support (3), be equipped with the pile.
2. The automatic loading wafer pad pasting device of claim 1, characterized in that: the bottom plate main body (5) is provided with a groove (8), and the top of the wafer fixing plate (6) is provided with a positioning bump (9) matched with the groove (8).
3. The automatic loading wafer pad pasting device of claim 1, characterized in that: a wafer feeding mechanism (10) is arranged at the feeding end of the conveying support (3), the wafer feeding mechanism (10) comprises a bottom frame (11) arranged on the side wall of the conveying support (3), a lifting frame (12) is arranged above the bottom frame (11), a first telescopic cylinder (13) is arranged between the lifting frame (12) and the bottom frame (11), the lifting frame (12) is provided with a wafer clamping mechanism (14) corresponding to the wafer fixing plate (6), the wafer clamping mechanism (14) comprises a seat plate (15) arranged on the lifting frame (12), a sliding plate (16) is arranged above the seat plate (15) in a sliding manner, a first clamping jaw (17) is arranged on the seat plate (15), a second clamping jaw (18) matched with the first clamping jaw (17) is arranged on the sliding plate (16), a second telescopic cylinder (19) is arranged between the seat plate (15) and the sliding plate (16).
4. An automatic loading wafer film laminating device as claimed in claim 3, wherein: the top of bedplate (15) is equipped with ascending reference column (20), be equipped with on sliding plate (16) with reference column (20) complex spout (21), the top and reference column (20) of second telescopic cylinder (19) are connected, the afterbody and the sliding plate (16) of second telescopic cylinder (19) are connected.
5. The automatic loading wafer pad pasting device of claim 1, characterized in that: the positioning groove is internally provided with a buffer layer which is a plush layer or a rubber layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921083839.0U CN210489589U (en) | 2019-07-11 | 2019-07-11 | Automatic material loading wafer pad pasting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921083839.0U CN210489589U (en) | 2019-07-11 | 2019-07-11 | Automatic material loading wafer pad pasting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210489589U true CN210489589U (en) | 2020-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921083839.0U Active CN210489589U (en) | 2019-07-11 | 2019-07-11 | Automatic material loading wafer pad pasting device |
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| Country | Link |
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| CN (1) | CN210489589U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113327878A (en) * | 2021-08-03 | 2021-08-31 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
-
2019
- 2019-07-11 CN CN201921083839.0U patent/CN210489589U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113327878A (en) * | 2021-08-03 | 2021-08-31 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
| CN113327878B (en) * | 2021-08-03 | 2021-10-08 | 四川明泰微电子有限公司 | Wafer loading device and wafer film pasting device |
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Address after: 201506 No. 61, Lane 818, Xianing Road, Jinshan District, Shanghai Patentee after: Mifan Technology (Shanghai) Co.,Ltd. Address before: 201506 No. 61, Lane 818, Xianing Road, Jinshan District, Shanghai Patentee before: Shanghai Power sail Electronic Technology Co.,Ltd. |