CN213459716U

CN213459716U - IC chip easy to radiate heat

Info

Publication number: CN213459716U
Application number: CN202023107994.7U
Authority: CN
Inventors: 陈菊花; 黄勇强
Original assignee: Shenzhen Haorui Technology Co ltd
Current assignee: Shenzhen Haorui Technology Co ltd
Priority date: 2020-12-21
Filing date: 2020-12-21
Publication date: 2021-06-15
Anticipated expiration: 2030-12-21

Abstract

The utility model relates to the technical field of integrated circuit, the utility model discloses an easy radiating IC chip, including the chip body, the package shell, pin and radiator, the package shell is long cubic structure setting, the chip body sets up in the package shell, the protruding lower extreme wall setting of locating the package shell of the vertical parallel of pin, and the pin is connected with chip body electricity respectively, radiator detachable sets up on the lateral wall of package shell, the inside wall of radiator sets up with the lateral wall butt of package shell, the protruding a plurality of fin that are equipped with of lateral wall interval of radiator, and the fin is parallel concave a plurality of radiating grooves that extend along the direction of height respectively that are equipped with at interval. The technical scheme of the utility model can improve the heat dispersion of chip, effectively avoid the chip to move the too high problem of intensification for a long time, and the chip integrated level is high, and the peripheral circuit is simple, and the reliability is high, and the practicality is strong.

Description

IC chip easy to radiate heat

Technical Field

The utility model relates to an integrated circuit technical field, in particular to easy radiating IC chip.

Background

An integrated circuit (integrated circuit) is a type of microelectronic device or component. The transistor, diode, resistance, capacitance and inductance elements and wiring required in a circuit are interconnected together by adopting a certain process, manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and then packaged in a tube shell to form a micro structure with the required circuit function; all the components are structurally integrated, so that the electronic components are greatly miniaturized, low in power consumption and high in reliability.

However, the existing IC chip has a problem of unsatisfactory heat dissipation effect, which causes an excessive operating temperature of the IC chip for a long time, and affects performance stability and service life of the IC chip, and further improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims at providing an easy radiating IC chip, aim at solving the not ideal technical problem inadequately of current IC chip radiating effect.

In order to achieve the above object, the utility model provides an easy radiating IC chip, including chip body, packaging shell, pin and radiator, packaging shell is long cubic structure setting, the chip body set up in the packaging shell, the protruding of the vertical parallel of pin is located packaging shell's lower extreme wall sets up, just the pin respectively with chip body electricity is connected, radiator detachable set up in on packaging shell's the lateral wall, the inside wall of radiator with packaging shell's lateral wall butt sets up, the lateral wall spaced protruding of radiator is equipped with a plurality of fin, just the fin separates parallel concave a plurality of radiating grooves that extend along the direction of height respectively.

Further, still include fastening screw, the both ends of encapsulation shell are concave respectively and are equipped with a U-shaped groove, the both ends of radiator are concave respectively and are equipped with a screw hole, fastening screw wears to locate respectively the U-shaped groove, and revolve in threaded hole sets up, the radiator passes through fastening screw and U-shaped groove with fixed connection can be dismantled to the encapsulation shell.

Furthermore, the packaging shell is made of plastic materials.

Furthermore, the packaging shell is made of ceramic materials.

Further, the radiator is made of an aluminum alloy material.

Furthermore, the pins are all formed by oxygen-free copper materials, and the peripheral walls of the pins are all plated with a metal nickel layer respectively.

Adopt the technical scheme of the utility model, following beneficial effect has: the technical scheme of the utility model, set up in packaging shell through the chip body, the protruding lower extreme wall setting of locating packaging shell of the vertical parallel of pin, and the pin is connected with chip body electricity respectively, radiator detachable sets up on packaging shell's lateral wall, the inside wall of radiator and packaging shell's lateral wall butt set up, the lateral wall spaced protruding of radiator is equipped with a plurality of fin, and the fin is parallel concave a plurality of radiating grooves that extend along the direction of height that are equipped with respectively at interval, the radiating groove is convenient for the gas flow, accelerate the heat dissipation, the radiator can be with the quick distribution away of heat, the heat dispersion of chip has been improved, effectively avoid the chip to move the problem of intensification height for a long time, and the chip integrated level is high, peripheral circuit is simple, high reliability, therefore.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic diagram of an overall structure of an IC chip easy to dissipate heat according to an embodiment of the present invention;

fig. 2 is a schematic view of another perspective of an IC chip with easy heat dissipation according to an embodiment of the present invention;

fig. 3 is an exploded schematic view of an IC chip with easy heat dissipation according to an embodiment of the present invention.

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides an IC chip easy for heat dissipation.

As shown in fig. 1 to fig. 3, in an embodiment of the present invention, the IC chip easy to dissipate heat includes a chip body (not shown), a package housing 101, pins 102 and a heat sink 103, the package housing 101 is configured in a rectangular structure, the chip body is disposed in the package housing 101, the pins 102 are disposed in a protruding manner in a vertical parallel manner on the lower end wall of the package housing 101, and the pins 102 are respectively electrically connected to the chip body, the heat sink 103 is detachably disposed on the side wall of the package housing 101, the inner side wall of the heat sink 103 is disposed in a abutting manner on the side wall of the package housing 101, a plurality of heat dissipation fins 1031 are disposed on the outer side wall of the heat sink 103 in a protruding manner, and the heat dissipation fins 1031 are respectively disposed in a recessed manner in a parallel manner in a spaced manner and have a plurality of heat dissipation grooves.

Specifically, still include fastening screw 104, the both ends of encapsulation shell 101 are equipped with a U-shaped groove 1011 concavely respectively, the both ends of radiator 103 are equipped with a screw hole 1033 concavely respectively, fastening screw 104 wears to locate respectively U-shaped groove 1011, and revolve in set up in the screw hole 1033, radiator 103 passes through fastening screw 104 and U-shaped groove 1011 with fixed connection can be dismantled to encapsulation shell 101.

Specifically, the package housing 101 is formed by using a plastic material.

Specifically, the package housing 101 is formed of a ceramic material.

Specifically, the heat sink 103 is formed of an aluminum alloy.

Specifically, the pins 102 are all made of oxygen-free copper materials, and the peripheral walls of the pins 102 are respectively plated with a metal nickel layer.

Specifically, the utility model discloses a chip body sets up in packaging shell, the protruding lower extreme wall setting of locating packaging shell of the vertical parallel of pin, and the pin is connected with chip body electricity respectively, radiator detachable sets up on packaging shell's lateral wall, the inside wall of radiator and packaging shell's lateral wall butt set up, the lateral wall spaced protruding of radiator is equipped with a plurality of fin, and the fin is parallel concave a plurality of radiating grooves that extend along the direction of height that are equipped with respectively at interval, the radiating groove is convenient for the gas flow, accelerate the heat dissipation, the radiator can be with the quick distribution away of heat, the heat dispersion of chip has been improved, effectively avoid the chip to move the problem of intensification height for a long time, and the chip integrated level is high, peripheral circuit is simple, high reliability, therefore, the clothes.

The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. The utility model provides an easy radiating IC chip, its characterized in that, includes chip body, encapsulation shell, pin and radiator, the encapsulation shell is long cubic structure setting, the chip body set up in the encapsulation shell, the protruding of the vertical parallel of pin is located the lower terminal wall setting of encapsulation shell, just the pin respectively with the chip body electricity is connected, radiator detachable set up in on the lateral wall of encapsulation shell, the inside wall of radiator with the lateral wall butt setting of encapsulation shell, the protruding a plurality of fin that are equipped with of lateral wall interval of radiator, just the fin is parallel concave a plurality of radiating grooves that extend along the direction of height that are equipped with at interval respectively.

2. The IC chip easy to dissipate heat according to claim 1, further comprising a fastening screw, wherein a U-shaped groove is recessed at each of two ends of the package housing, a threaded hole is recessed at each of two ends of the heat sink, the fastening screw is inserted into the U-shaped groove and screwed into the threaded hole, and the heat sink is detachably and fixedly connected to the package housing through the fastening screw and the U-shaped groove.

3. The IC chip with easy heat dissipation as recited in claim 1, wherein the package housing is formed of a plastic material.

4. The IC chip with easy heat dissipation as recited in claim 1, wherein the package housing is formed of a ceramic material.

5. An IC chip easy to dissipate heat as recited in claim 1 wherein said heat spreader is formed of an aluminum alloy.

6. The IC chip of claim 1, wherein the leads are formed of an oxygen-free copper material, and the peripheral walls of the leads are plated with a nickel metal layer, respectively.