CN213366587U - Lead protection mechanism based on microelectronic packaging - Google Patents
Lead protection mechanism based on microelectronic packaging Download PDFInfo
- Publication number
- CN213366587U CN213366587U CN202022710817.1U CN202022710817U CN213366587U CN 213366587 U CN213366587 U CN 213366587U CN 202022710817 U CN202022710817 U CN 202022710817U CN 213366587 U CN213366587 U CN 213366587U
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- CN
- China
- Prior art keywords
- pin
- plastic package
- embedded
- lead
- chip
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The utility model discloses a lead protection mechanism based on microelectronic packaging, which comprises a substrate, a chip mounted on the substrate and a plastic package shell, wherein the chip is connected with a pin through a gold thread, and the pin is composed of an embedded bonding pin and an external lead, the utility model adopts a pin structure with a segmented structure design, the pin part connected with the gold thread and the pin part extending to the outside of the plastic package shell are arranged at an included angle, so that the pin structure has the effect of certain deformation and stress absorption under the structure, and the pin part bonded with the gold thread is fixed in position in an embedded manner, thereby avoiding transverse displacement, a lower pressure plate matched with the embedded pin structure is added on the original structure of the plastic package shell, the lower pressure plate is utilized to fully and longitudinally limit the embedded pin structure, thereby effectively improving the stability of the gold thread bonding position, the condition that the bonding position is desoldered due to external stress and the stress effect of the substrate is avoided.
Description
Technical Field
The utility model belongs to the technical field of the electron and specifically relates to a lead wire protection mechanism based on microelectronic package is related to.
Background
Microelectronic packaging generally includes wire bonding and plastic package processes, the wire bonding is to connect a chip and a lead by using a gold wire, and the lead has a stress transfer effect relative to the chip because the lead internally and externally penetrates through a plastic package shell of the chip.
The traditional lead fixing mode is mainly characterized in that the lead is fixed on a substrate in an adhesive mode, and due to the fact that glue has a stress transfer effect, the lead is likely to slightly move due to stress of the substrate and external acting force, so that the bonding position is detached, and the condition that electric signal drift is unstable is caused.
SUMMERY OF THE UTILITY MODEL
The utility model discloses an it is not enough to overcome above-mentioned condition, aims at providing the technical scheme that can solve above-mentioned problem.
A lead protection mechanism based on microelectronic packaging comprises a substrate, a chip and a plastic package shell, wherein the chip is attached to the substrate and is connected with a lead in a bonding mode through a gold wire;
the outer lead pin and the embedded bonding pin are in an integrated structure, and the outer lead pin extends outwards to the outer side of the embedded groove and extends towards one side far away from the chip;
the bottom surface of the plastic package shell is provided with a containing cavity, the plastic package shell covers the outer side of the chip through the containing cavity, the edge position of the bottom surface of the plastic package shell and the upper surface of the substrate are fixed in a sealing mode, and the bottom edge of the plastic package shell is provided with a notch through which an external lead pin penetrates;
a plurality of lower pressing plates are integrally formed on the inner top surface of the plastic package shell, the lower pressing plates and the embedded bonding pins are arranged in a one-to-one correspondence manner, and the lower pressing plates press the corresponding embedded bonding pins downwards; the pin structure adopts a segmented structure design, the embedded bonding pins connected with gold wires are embedded and fixed in a manner of presetting embedded grooves on a substrate, and meanwhile, a lower pressing plate is matched to continuously press down the embedded bonding pins, so that the embedded bonding pins can be effectively prevented from moving longitudinally or transversely, the stress effect of the substrate can also be prevented from shifting caused by the plane fixation of traditional glue even if being transmitted to the embedded bonding pins, the connection stability of the embedded bonding pins and incoming wires is fully ensured, and meanwhile, when the external lead pins are acted by external force, the external lead pins and the embedded bonding pins form certain included angles, so that the external lead pins have certain deformation buffering effect, and the influence of the external stress on bonding points effectively reduced by the split pin structure is avoided.
As a further aspect of the present invention: and a plastic packaging glue filling body formed by curing plastic packaging glue is filled in the accommodating cavity of the plastic packaging shell.
As a further aspect of the present invention: the intersection point of the embedded bonding pin and the external lead is positioned on one side of the lower pressing plate, which is far away from the chip, so that the stress effect is absorbed by the self deformation of the external lead.
The utility model has the advantages that: the utility model discloses a pin structure of segmentation structural design, the pin part that will be connected with the gold thread is the contained angle setting with extending to the outside pin part of plastic envelope casing, pin structure itself possesses the effect of certain deformation absorption stress effect under this structure like this, the pin part that will adopt the embedding with the gold thread bonding simultaneously carries out the rigidity with the form of embedding, thereby stop lateral displacement, original structural increase and embedding pin structure assorted holding down plate at the plastic envelope shell, it is vertical spacing to utilize the abundant pin structure that carries on embedding of holding down plate, thereby the stability of effectual improvement gold thread bonding position, avoid external stress and base plate stress effect to cause the bonded position to desolder the condition.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is an enlarged view of a point a shown in fig. 1 according to the present invention.
In the figure: 1-substrate, 2-chip, 3-plastic package shell, 4-plastic package glue filler, 5-gold wire, 6-embedded bonding pin, 7-external pin, 8-embedded groove and 9-lower pressing plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, in an embodiment of the present invention, a lead protection mechanism based on microelectronic package includes a substrate 1, a chip 2 attached to the substrate 1, and a plastic package housing 3, wherein the chip 2 is connected to a lead by a gold wire 5, the lead is composed of an embedded bonding lead 6 and an external lead 7, an embedded groove 8 is formed on the substrate 1, the embedded bonding lead 6 is fixed and clamped in the embedded groove 8, and the gold wire 5 is connected to the embedded bonding lead 6 by bonding;
the outer lead 7 and the embedded bonding lead 6 are in an integrated structure, and the outer lead 7 extends outwards to the outer side of the embedded groove 8 and extends towards one side far away from the chip 2;
a containing cavity is formed in the bottom surface of the plastic package shell 3, the plastic package shell 3 covers the outer side of the chip 2 through the containing cavity, the edge of the bottom surface of the plastic package shell 3 is fixed with the upper surface of the substrate 1 through glue sealing, and a notch through which an external lead pin 7 penetrates is formed in the bottom edge of the plastic package shell 3;
a plurality of lower pressing plates 9 are integrally formed on the inner top surface of the plastic package shell 3, the lower pressing plates 9 and the embedded bonding pins 6 are arranged in a one-to-one correspondence manner, and the corresponding embedded bonding pins 6 are pressed downwards by the lower pressing plates 9; the pin structure adopting the sectional structure design is adopted, the embedded bonding pin 6 connected with the gold wire 5 is embedded and fixed in a form of presetting an embedded groove 8 on the substrate 1, and meanwhile, the embedded bonding pin 6 is continuously pressed down by matching with the lower pressing plate 9, so that the embedded bonding pin 6 can be effectively prevented from moving longitudinally or transversely, the stress effect of the substrate 1 can be prevented from shifting caused by the plane fixation of the traditional glue even if being transmitted to the embedded bonding pin 6, the connection stability of the embedded bonding pin 6 and the inlet wire 5 is fully ensured, and meanwhile, when the external lead 7 is acted by external force, the external lead 7 and the embedded bonding pin 6 form a certain included angle, so that the external lead has a certain deformation buffering effect, and the influence of external stress on a bonding point, which is effectively reduced by the split pin structure, is achieved.
And a plastic package glue filling body 4 formed by curing plastic package glue is filled in the accommodating cavity of the plastic package shell 3.
The intersection point of the embedded bonding pin 5 and the external lead 7 is positioned on one side of the lower pressing plate 9, which is far away from the chip 2, so that the stress effect is absorbed by the self deformation of the external lead 7.
The utility model discloses a theory of operation is: the present case adopts segmentation structural design's pin structure, the pin part that will be connected with gold thread 5 is the contained angle setting with the pin part that extends to the outside of plastic envelope casing 3, pin structure itself possesses the effect of certain deformation absorption stress effect under this structure like this, the pin part that will bond with the gold thread simultaneously adopts the form of embedding to carry out the rigidity, thereby stop lateral displacement, original structural increase and embedding pin structure assorted holding down plate 9 at the plastic envelope shell, utilize 9 abundant vertically spacing to embedding pin structure of holding down plate, thereby the stability of effectual improvement gold thread bonding position, avoid external stress and base plate stress effect to cause the condition that the bonding position desolders.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (5)
1. A lead protection mechanism based on microelectronic packaging comprises a substrate, a chip and a plastic package shell, wherein the chip is attached to the substrate and is connected with a lead in a bonding mode through a gold wire; the outer lead pin and the embedded bonding pin are in an integrated structure, and the outer lead pin extends outwards to the outer side of the embedded groove and extends towards one side far away from the chip; the bottom surface of the plastic package shell is provided with a containing cavity, and the plastic package shell is covered on the outer side of the chip through the containing cavity; and a plurality of lower pressing plates are integrally formed on the inner top surface of the plastic package shell, the lower pressing plates and the embedded bonding pins are arranged in a one-to-one correspondence manner, and the lower pressing plates press the corresponding embedded bonding pins downwards.
2. The microelectronic package-based lead protection mechanism according to claim 1, wherein a cavity of said plastic package housing is filled with a plastic package adhesive filling body formed by curing a plastic package adhesive.
3. The microelectronic package-based lead protection mechanism according to claim 1, wherein the intersection of said embedded bond and outer leads is located on a side of the lower platen remote from the chip.
4. The microelectronic package-based lead protection mechanism according to claim 1, wherein notches are formed on a bottom edge of the plastic package casing for the external lead pins to pass through.
5. The microelectronic package-based lead protection mechanism according to claim 1, wherein the bottom edge of the plastic package housing is fixed to the top surface of the substrate by adhesive sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022710817.1U CN213366587U (en) | 2020-11-21 | 2020-11-21 | Lead protection mechanism based on microelectronic packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022710817.1U CN213366587U (en) | 2020-11-21 | 2020-11-21 | Lead protection mechanism based on microelectronic packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213366587U true CN213366587U (en) | 2021-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022710817.1U Expired - Fee Related CN213366587U (en) | 2020-11-21 | 2020-11-21 | Lead protection mechanism based on microelectronic packaging |
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| CN (1) | CN213366587U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113758512A (en) * | 2021-09-08 | 2021-12-07 | 昆山冠翔电子科技有限公司 | Sensor packaging structure and sensor packaging process |
-
2020
- 2020-11-21 CN CN202022710817.1U patent/CN213366587U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113758512A (en) * | 2021-09-08 | 2021-12-07 | 昆山冠翔电子科技有限公司 | Sensor packaging structure and sensor packaging process |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210604 Termination date: 20211121 |
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| CF01 | Termination of patent right due to non-payment of annual fee |